CUDFN6 1.6X1.6, 0.5P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
CUDFN6, 1.6x1.6
CASE 505AE−01
ISSUE B
DATE 11 MAY 2010
SCALE 4:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.30mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
0.10 C
2X
D
6
A B
2X
4
0.10 C
q
d
E
DIM
A
A1
A3
b
D
d
D2
E
E2
e
K
L
q
A
1
3
A1
TOP VIEW
DETAIL A
DETAIL A
0.08 C
A3
0.05 C
NOTE 4
C
SIDE VIEW
0.10
SEATING
PLANE
END VIEW
MOUNTING FOOTPRINT
6X
1.20
C A B
M
MILLIMETERS
MIN
MAX
0.55
0.65
0.00
0.05
0.20 REF
0.15
0.25
1.60 BSC
--0.10
1.00
1.20
1.60 BSC
0.40
0.60
0.50 BSC
0.20
--0.35
0.25
45
105
0.52
D2
1
3
0.60
E2
K
0.10
6X
6
L
4
e
BOTTOM VIEW
6X
M
1.90
C A B
1
b
0.10
M
C A
0.05
M
C
B
NOTE 3
0.50
PITCH
6X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON42014E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 1 OFXXX
2
CUDFN6 1.6X1.6, 0.5P
1
DOCUMENT NUMBER:
98AON42014E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
14 JUL 2009
A
CHANGED ISOMETRIC IMAGE FROM BLACK TO WHITE TO REFLECT A CLEAR
PACKAGE. REQ. BY D. TRUHITTE.
09 FEB 2010
B
REMOVED PIN 1 INDICATOR AS PACKAGE IS CLEAR MOLDED. REQ. BY B.
KIRK.
11 MAY 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2010
May, 2010 − Rev. 01B
Case Outline Number:
505AE
Similar pages