CUDFN8, 2x2, 0.5P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
CUDFN8, 2x2, 0.5P
CASE 505AF−01
ISSUE O
DATE 20 JAN 2011
SCALE 4:1
D
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.10 AND 0.20mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
A B
E
D1
TOP VIEW
DIM
A
A1
A3
b
D
D1
D2
E
E2
e
K
L
M
END VIEW
M
DETAIL A
0.10 C
A3
A
A1
0.08 C
NOTE 4
DETAIL A C
SIDE VIEW
D2
1
8X
L
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.55
0.65
0.00
0.05
0.20 REF
0.15
0.25
2.00 BSC
1.80 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.50 BSC
0.20
--0.25
0.35
--10 5
RECOMMENDED
MOUNTING FOOTPRINT*
8X
1.70
4
0.52
E2
1.00
K
8
5
e
e/2
8X
2.30
b
0.10 C A
0.05 C
B
1
NOTE 3
BOTTOM VIEW
0.50
PITCH
8X
0.27
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON54888E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
CUDFN8 2X2, 0.5P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON54888E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
20 JAN 2011
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 01O
Case Outline Number:
505AF
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