D2PAK, 3 LEAD, NON-CROPPED

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
D2PAK
CASE 418AF
ISSUE E
DATE 15 SEP 2015
SCALE 1:1
T
C
A
K
S
B
T
C
OPTIONAL
CHAMFER
ES
V
H
2
U
ED
OPTIONAL
CHAMFER
1
TERMINAL 4
DETAIL C
DETAIL C
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
6. SINGLE GAUGE DESIGN WILL BE SHIPPED
AFTER FPCN EXPIRATION IN OCTOBER 2011.
J
F
G
SIDE VIEW
D
0.010 (0.254)
3X
TOP VIEW
N
M
R
SIDE VIEW
SINGLE GAUGE
CONSTRUCTION
DUAL GAUGE
CONSTRUCTION
T
M
T
SEATING
PLANE
L
P
BOTTOM VIEW
BOTTOM VIEW
DETAIL C
OPTIONAL CONSTRUCTIONS
SOLDERING FOOTPRINT*
10.490
DIM
A
B
C
D
ED
ES
F
G
H
J
K
L
M
N
P
R
S
U
V
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.018
0.026
0.051 REF
0.100 BSC
0.539
0.579
0.125 MAX
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
0_
8_
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
0.457
0.660
1.295 REF
2.540 BSC
13.691 14.707
3.175 MAX
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
0_
8_
2.946 REF
5.080 MIN
6.350 MIN
GENERIC
MARKING DIAGRAM*
XX
XXXXXXXXX
AWLYYWWG
8.380
16.155
3X
3.504
3X
1.016
2.540
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON21981D
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
http://onsemi.com
D2PAK, 3 LEAD, NON−CROPPED
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
11
DOCUMENT NUMBER:
98AON21981D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY A. NOAH.
13 FEB 2006
A
ADDED SOLDERING FOOTPRINT. REQ. BY M. FILLION.
18 JUN 2007
B
ADDED SINGLE AND DUAL GAUGE SIDE VIEWS AND BOTTOM VIEW. REQ. BY
J. KREMMER.
08 NOV 2011
C
CORRECTED SOLDERING FOOTPRINT TO VERSION FROM ISSUE A. REQ. BY
J. KREMMER.
13 APR 2012
D
CORRECTED SOLDERING FOOTPRINT BACK TO VERSION FROM ISSUE B.
REQ. BY J. KREMMER.
24 MAY 2012
E
REVISED DIMENSION R FROM 5 DEGREES REFERENCE TO 0 & 8 DEGREES
MIN & MAX. REQ. BY K. MUSTAFA.
15 SEP 2015
ON Semiconductor and
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http://onsemi.com
© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. E
2
Case Outline Number:
418AF
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