DFN6, 3x3.3x0.9mm, 0.95mm Pitch

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN6 3x3.3 MM, 0.95 PITCH
CASE 506AX−01
ISSUE O
1
SCALE 2:1
DATE 20 JAN 2006
A
D
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 mm
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
B
PIN 1
REFERENCE
2X
0.15 C
2X
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.15 C
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
TOP VIEW
0.10 C
A
6X
0.08 C
SEATING
PLANE
(A3)
SIDE VIEW
MILLIMETERS
MIN
NOM MAX
0.80
−−−
0.90
0.00
−−−
0.05
0.20 REF
0.30
−−−
0.40
3.00 BSC
1.90
−−−
2.10
3.30 BSC
1.10
−−−
1.30
0.95 BSC
0.20
−−−
−−−
0.40
−−−
0.60
0.00
−−−
0.15
C
A1
SOLDERING FOOTPRINT*
D2
4X
6X
3.60
e
L
1
K
3
1.35
6X
0.50
1
E2
2.15
6X
L1
6
0.95
PITCH
4
6X
BOTTOM VIEW
b
(NOTE 3)
0.10 C A B
0.05 C
6X
0.83
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON21930D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN6 3X3.3 MM, 0.95 PITCH 1
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON21930D
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. LOFTS.
DATE
20 JAN 2006
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 01O
Case Outline Number:
506AX