DFN8 3x3, 0.65P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8, 3x3, 0.65P
CASE 506DB
ISSUE O
1
SCALE 2:1
DATE 21 OCT 2014
A
B
D
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
PIN ONE
REFERENCE
2X
0.10 C
0.10 C
2X
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
ÏÏÏ
ÏÏ
ÏÏÏ
ÎÎÎ ÏÏ
ÎÎ
EXPOSED Cu
TOP VIEW
DETAIL B
0.05 C
(A3)
A
MOLD CMPD
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.05 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
D2
DETAIL A
4
1
8X
E2
b1
8
5
e/2
8X
b
0.10 C A B
e
0.05 C
NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
3.30
2.05
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.25
0.35
0.20
0.30
3.00 BSC
1.65
1.85
3.00 BSC
1.40
1.60
0.65 BSC
0.65 REF
0.30
0.50
0.00
0.15
GENERIC
MARKING DIAGRAM*
1
L
e1
4X
A3
DIM
A
A1
A3
b
b1
D
D2
E
E2
e
e1
L
L1
XXXXX
XXXXX
ALYWG
G
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
8X
0.63
PACKAGE
OUTLINE
1.64 3.30
0.65
PITCH
1
0.65
PITCH
12X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON92252F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8, 3X3, 0.65P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON92252F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY I. MARIANO.
DATE
21 OCT 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
October, 2014 − Rev. O
Case Outline Number:
506DB
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