QFN20 5x5, 0.65P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN20 5x5, 0.65P
CASE 485DB
ISSUE O
1 20
SCALE 2:1
PIN ONE
REFERENCE
ÉÉ
ÉÉ
A B
D
L
L1
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
0.15 C
0.15 C
L
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. OPTIONAL FEATURES.
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
TOP VIEW
A
(A3)
DETAIL B
0.10 C
DATE 02 APR 2013
DETAIL B
0.08 C
A1
NOTE 5
NOTE 4
ALTERNATE
CONSTRUCTION
C
SIDE VIEW
0.10
DETAIL A
6
D2
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
C A B
20X L
M
1
0.10
M
XXXXXXXX
XXXXXXXX
AWLYYWWG
G
C A B
11
E2
1
16
e
BOTTOM VIEW
20X
b
0.10
M
C A B
0.05
M
C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
5.30
3.30
20X
0.78
3.30
PACKAGE
OUTLINE
MILLIMETERS
MIN
MAX
0.80
1.00
−−−
0.05
0.20 REF
0.25
0.35
5.00 BSC
3.05
3.25
5.00 BSC
3.05
3.25
0.65 BSC
0.45
0.65
−−−
0.15
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
5.30
0.65
PITCH
20X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON88183E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN20 5x5, 0.65P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON88183E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. I. MARIANO.
DATE
02 APR 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. O
Case Outline Number:
485DB