8 Pin Fllip-Chip

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
8 PIN FLIP−CHIP
CASE 499AM−01
ISSUE O
DATE 17 FEB 2005
1
SCALE 4:1
D
4X
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
0.10 C
TERMINAL A1
LOCATOR
E
DIM
A
A1
A2
D
E
b
e
E1
TOP VIEW
A2
A1
0.10 C
A
0.05 C
SIDE VIEW
C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.700
−−−
0.210
0.270
0.380
0.430
1.270 BSC
1.970 BSC
0.290
0.340
0.700 BSC
1.400 BSC
GENERIC
MARKING DIAGRAM*
e
XXXXAYWW
e/2
8X
b
0.05 C A B
0.03 C
E
D
C
B
A
e
1 2 3
e/2
E1
XXXX
A
Y
WW
G or G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
BOTTOM VIEW
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
98AON20414D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
8 PIN FLIP−CHIP, 1.970*1.270,, 10.700 LEAD PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON20414D
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY A. TAM.
DATE
17 FEB 2005
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2005
February, 2005 − Rev. 01O
Case Outline Number:
499AM
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