DFN8, 2.2x2, 0.5P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8, 2.2x2, 0.5P
CASE 506BL−01
ISSUE O
8
DATE 05 NOV 2008
1
SCALE 4:1
A
B
D
PIN ONE
REFERENCE
2X
0.10 C
2X
ÏÏÏ
ÏÏÏ
0.10 C
E
NOTE 5
END VIEW
ÎÎ
ÏÏ
ÎÎ
DETAIL B
A
A1
A3
SIDE VIEW
C
EXPOSED Cu
9X
0.08 C
MOLD CMPD
DETAIL B
SEATING
PLANE
OPTIONAL
CONSTRUCTION
0.10 C A B
DETAIL A
1
4
L1
E2
0.10 C A B
8
5
e
8X
DETAIL A
1
OPTIONAL
CONSTRUCTIONS
0.05 C
XX MG
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Device
b
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.10 C A B
e/2
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.15
0.25
2.20 BSC
0.34
0.54
2.00 BSC
0.60
0.80
0.50 BSC
0.20
−−−
0.30
0.50
−−−
0.15
GENERIC
MARKING DIAGRAM*
L
D2
L
K
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
TOP VIEW
0.10 C
NOTE 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. EXPOSED ENDS OF THE TERMINALS ARE
ELECTRICALLY ACTIVE.
NOTE 3
BOTTOM VIEW
SOLDERING FOOTPRINT*
(0.28)
(0.825)
8X
0.90
0.24
0.55
(0.20)
(0.50)
8X
4X
(0.25)
2.30
0.62
0.80
AUXILIARY BOTTOM VIEW
(FOR REFERENCE ONLY)
1
PACKAGE
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON35711E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8, 2.2X2.0, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON35711E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY A. TAM.
DATE
05 NOV 2008
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2008
November, 2008 − Rev. 01O
Case Outline Number:
506BL
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