Data Sheet

BGX7220
Dual receiver down mixer
Rev. 1 — 8 August 2012
Product data sheet
1. General description
The BGX7220 device combines a pair of high performance, high linearity down-mixers for
use in receivers having a common local oscillator, for instance having main and diversity
paths. The device covers the frequency range from 700 MHz to 950 MHz. Each mixer
provides an input 1 dB compression point (ICP1dB) above 13 dBm, with an input
third-order intercept point (IP3i) of 26 dBm. The small-signal Noise Figure (NF) is below
10 dB whereas under large signal blocking conditions the Noise Figure is typically 20 dB.
Isolation between mixers is typically 55 dB.
2. Features and benefits











700 MHz to 950 MHz frequency operating range
Conversion gain 8 dB in the 900 MHz band
13 dBm input power at 1 dB input compression point
26 dBm input third-order intercept point
10 dB typical small signal noise figure
Integrated active biasing
5 V single supply operation
Independent power-down hardware control pins per mixer
Low bias current in Power-down mode
Matched 50  single-ended RF and LO input impedance
ESD protection at all pins
3. Applications
 Mobile network infrastructure
 RF and IF applications
 Communication systems and radars
 Microwave and broadband
 Industrial applications
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
BGX7220HN
HVQFN36
plastic thermal enhanced very thin quad flat package; no leads; 36
terminals; body 6  6  0.85 mm
SOT1092-2
BGX7220
NXP Semiconductors
Dual receiver down mixer
5. Functional diagram
RF_A
1
MIXER A
33
32
LO_IN
IF_OUT_P_A
IF_OUT_N_A
27
BGX7220
RF_B
14
9
13
MIXER B
IF_OUT_N_B
IF_OUT_P_B
aaa-002507
Fig 1.
Functional block diagram
Each mixer, A and B employs a transformer to convert the single-ended RF input into a
differential signal to drive the passive MOS mixer. The MOS mixer directly drives the IF
amplifier. Its open-collector outputs deliver the differential signal into an external
transformer load, referenced to the 5 V supply for maximum signal swing. Each mixer can
be independently powered-off by a combination of POFF_1 and POFF_2 (see Table 3.)
The dual paths allow diversity operation with a common LO path. A transformer at the LO
input converts the single-ended RF into a differential signal to drive the LO buffer chain.
The plastic package has an under-side heat-sink paddle which serves as a good RF
ground.
6. Pinning information
6.1 Pinning
Viewing the device from the top (see Figure 2), the 2 RF input ports are at the left, the
common LO input at the right, with IF outputs at the top and bottom. Multiple power and
ground pins allow for independent supply domains to improve isolation between blocks.
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
2 of 26
BGX7220
NXP Semiconductors
28 n.c.
29 n.c.
30 VCC(IF)(A)
31 IF_GND_A
32 IF_OUT_N_A
33 IF_OUT_P_A
34 IF_GND_A
terminal 1
index area
35 n.c.
36 VCC(RF)(A)
Dual receiver down mixer
RF_A
1
27 LO_IN
RF_GND_A
2
26 LO_GND
RF_GND_A
3
25 LO_GND
VCC(LO)
4
LO_GND
5
VCC(LO)
6
22 POFF_1
RF_GND_B
7
21 VCC(REG)
RF_GND_B
8
20 n.c.
RF_B
9
19 n.c.
24 POFF_2
n.c. 18
n.c. 17
23 n.c.
VCC(IF)(B) 16
IF_GND_B 15
IF_OUT_N_B 14
IF_OUT_P_B 13
IF_GND_B 12
n.c. 11
VCC(RF)(B) 10
BGX7220
aaa-002508
Transparent top view
Fig 2.
Pinning diagram
6.2 Pin description
BGX7220
Product data sheet
Table 2.
Pin description
Symbol
Pin
Type [1]
Description
RF_A
1
I
receiver mixer single-ended RF input; mixer A
RF_GND_A
2
G
RF ground; mixer A
RF_GND_A
3
G
RF ground; mixer A
VCC(LO)
4
P
LO power supply
LO_GND
5
G
LO ground
VCC(LO)
6
P
LO power supply
RF_GND_B
7
G
RF ground; mixer B
RF_GND_B
8
G
RF ground; mixer B
RF_B
9
I
receiver mixer single-ended RF input; mixer B
VCC(RF)(B)
10
P
RF mixer power supply; mixer B
n.c.
11
-
not connected; to be tied to ground
IF_GND_B
12
G
IF ground; mixer B
IF_OUT_P_B
13
O
symmetrical IF output signal; mixer B
IF_OUT_N_B
14
O
symmetrical IF output signal; mixer B
IF_GND_B
15
G
IF amplifier ground; mixer B
VCC(IF)(B)
16
P
IF amplifier power supply; mixer B
n.c.
17
-
not connected; to be tied to ground
n.c.
18
-
not connected; to be tied to ground
n.c.
19
-
not connected; to be tied to ground
n.c.
20
-
not connected; to be tied to ground
VCC(REG)
21
P
internal regulator power supply
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Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
3 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
Table 2.
Pin description …continued
Symbol
Pin
Type [1]
Description
POFF_1
22
I
logic input to power-off mixer
n.c.
23
-
not connected; to be tied to ground
POFF_2
24
I
logic input to power-off mixer
LO_GND
25
G
LO ground
LO_GND
26
G
LO ground
LO_IN
27
I
single-ended local oscillator positive input
n.c
28
-
not connected; to be tied to ground
n.c
29
-
not connected; to be tied to ground
VCC(IF)(A)
30
P
IF amplifier power supply; mixer A
IF_GND_A
31
G
IF amplifier mixer; mixer A
IF_OUT_N_A
32
O
symmetrical IF negative output; mixer A
IF_OUT_P_A
33
O
symmetrical IF positive output; mixer A
IF_GND_A
34
G
IF ground; mixer A
n.c.
35
-
not connected; to be tied to ground
VCC(RF)(A)
36
P
RF power supply; mixer A
Exposed paddle
-
G
exposed paddle; must be connected to RF and DC
ground
[1]
G: ground; I: input; O: output; P: power.
7. Functional description
7.1 Power-up control
Table 3.
Mode
Shutdown control
Description
Function
POFF_1
POFF_2
Active
mixers A and B fully active
shutdown disabled
0
0
Idle
mixers A and B fully off; current supplied shutdown enabled
to LO buffer
1
0
Main
mixer A active; mixer B off
partial shutdown
0
1
Diversity
mixer B active; mixer A off
partial shutdown
1
1
Power-up enable pins to allow each mixer to be placed in Power-down mode. These pins
also enable the dedicated LO buffers for individual signal paths. A common LO input
stage remains active whatever the state of the power off control inputs, in order to
maintain good LO port matching. The time required to pass between active and inactive
states is less than 10 s. If the pins are left open or tied to ground, both mixers will be in
active state.
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
4 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VCC
supply voltage
Pi(RF)
RF input power
-
20
dBm
Ptot
total power dissipation
-
1.96
W
Tmb
mounting base temperature
40
+85
C
Tj
junction temperature
-
150
C
Tstg
storage temperature
VESD
electrostatic discharge voltage
continuous
Min
Max
Unit
0.3
5.5
V
65
+150
°C
EIA/JESD22-A114 (HBM)
-2500
+2500
V
EIA/JESD22-C101 (FCDM)
-650
+650
V
9. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
thermal resistance from junction to mounting base
[1]
8
C/W
Rth(j-mb)
[1]
Defined according to the conditions described in the Application Note AN11132.
10. Static characteristics
Table 6.
Static characteristics
Zs = ZL = 50 ; POFF _1 = VIL and POFF _2 = VIL (shutdown disabled). Typical values at VCC = 5 V. Tmb = 25 C, unless
otherwise specified.
Symbol
Parameter
Conditions
VCC
supply voltage
ICq
quiescent collector current
Min
Typ
Max
Unit
4.75
5.0
5.25
V
[1]
-
60
-
mA
LOW-level input voltage
[1]
0
-
0.5
V
HIGH-level input voltage
[1]
2
-
5
V
LOW-level input current
[1]
-
1
-
A
HIGH-level input current
[1]
-
50
-
A
IF output; per package pin
Shutdown digital input voltage
VIL
VIH
All digital inputs current
IIL
IIH
[1]
VCC = 4.75 V to 5.25 V, Tmb = 40 C to +85 C.
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
5 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
11. Dynamic characteristics
Table 7.
Dynamic characteristics
Typical application values: POFF _1 = VIL and POFF _2 = VIL (shutdown disabled); RF and LO ports driven by 50  sources;
Pi(RF) = 5 dBm; fi(RF) = 850 MHz; Tmb = 40 C to +85 C; VCC = 4.75 V to 5.25 V. Typical values at VCC = 5 V; Tmb = 25 C;
Pi(RF) = 5 dBm; Pi(lo) = 0 dBm; fi(RF) = 850 MHz; fIF = 150 MHz. All parameters are guaranteed by design and
characterization, unless otherwise specified.
Symbol
Parameter
Conditions
ICC
supply current
both mixers in active mode
Min[1] Typ[2] Max[1] Unit
flo = 500 MHz
-
285
330
mA
flo = 850 MHz
-
300
345
mA
flo = 1150 MHz
-
310
355
mA
RF input frequency
[3]
700
-
950
MHz
flo
local oscillator frequency
signal from frequency generator;
fIF = 50 MHz to 200 MHz
[3]
500
-
1150
MHz
Pi(lo)
local oscillator input power
signal from frequency generator
[3]
3
-
+3
dBm
Gconv
conversion gain
at Tmb = 25 C; fi(RF) = 700 MHz to
950 MHz
7.5
8.2
9
dB
G/T
gain variation with
temperature
Tmb = 40 C to +85 C
-
0.007 -
dB/C
G
gain deviation
fi(RF) = 700 MHz to 715 MHz;
flo = 560 MHz or flo = 855 MHz
[4][7]
-
0.15
-
dB
fi(RF) = 750 MHz to 760 MHz;
flo = 605 MHz or flo = 905 MHz
[4][7]
-
0.4
-
dB
fi(RF) = 780 MHz to 795 MHz;
flo = 640 MHz or flo = 940 MHz
[4][7]
-
0.15
-
dB
fi(RF) = 815 MHz to 860 MHz;
flo = 690 MHz or flo = 985 MHz
[4][7]
-
0.3
-
dB
fi(RF) = 880 MHz to 915 MHz;
flo = 750 MHz or flo = 1045 MHz
[4][7]
-
0.15
-
dB
[6]
10.5
13
-
dBm
[4]
24.5
26
-
dBm
57
63
-
dBc
-
9.5
12
dB
-
20
-
dB
fi(RF)
ICP1dB
1 dB input compression
point
IP3i
input third-order intercept
point
fi(RF)1 to fi(RF)2 = 1 MHz;
Pi(RF) = 5 dBm per tone
2RF-2LO
second-order spurious
rejection
2 tone inputs at Pi(RF) = 10 dBm;
fi(RF) = 850 MHz; fi(LO) = 950 MHz;
fi(SPUR) = 900 MHz
NFSSB
single sideband noise figure
[4]
[7]
NFB
noise figure under blocking
conditions
input in-band blocker +8 dBm;
fo = 100 MHz
L(RF)lo
local oscillator RF leakage
at RF input port;
LO input power = 0 dBm
-
-
35
dBm
L(IF)lo
local oscillator IF leakage
at IF output port;
LO input power = 0 dBm
-
-
35
dBm
isol
isolation
between mixer A and B;
Pi(RF) = 10 dBm; measured at
unwanted IF port
45
55
-
dB
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
6 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
Table 7.
Dynamic characteristics …continued
Typical application values: POFF _1 = VIL and POFF _2 = VIL (shutdown disabled); RF and LO ports driven by 50  sources;
Pi(RF) = 5 dBm; fi(RF) = 850 MHz; Tmb = 40 C to +85 C; VCC = 4.75 V to 5.25 V. Typical values at VCC = 5 V; Tmb = 25 C;
Pi(RF) = 5 dBm; Pi(lo) = 0 dBm; fi(RF) = 850 MHz; fIF = 150 MHz. All parameters are guaranteed by design and
characterization, unless otherwise specified.
Symbol
Parameter
Conditions
Min[1] Typ[2] Max[1] Unit
S11_RF
RF input return loss
fi(RF) = 700 MHz to 950 MHz
-
12
-
dB
S11_LO
LO input return loss
flo = 500 MHz to 1150 MHz
-
12
-
dB
S22_IF
IF output return loss
fIF = 50 MHz to 200 MHz
-
14
-
dB
[1]
For all minimum and maximum values the conditions are: Pi(RF) = 5 dBm; Pi(lo) = 0 dBm; fi(RF) = 850 MHz; fIF = 150 MHz; Tmb = 40 °C
to +85 °C; VCC = 4.75 V to 5.25 V. Unless otherwise specified in the conditions.
[2]
For all typical values, the conditions are: Pi(RF) = 5 dBm; Plo = 0 dBm; fi(RF) = 850 MHz; fIF = 150 MHz; Tmb = 25 °C; VCC = 5 V. Unless
otherwise specified in the conditions.
[3]
Operation outside this range is possible but parameters are not guaranteed.
[4]
Class A operation.
[5]
fIF is variable.
[6]
Maximum reliable continuous input power applied to the RF or IF port of this device is 12 dBm from a 50  source.
[7]
NFB can be improved by 1 dB per dB as a function of the Pi(lo).
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
7 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
12. Application information
VCC
VCC
BLM18AG102SN1
VCC
47 pF
1 nF
35
36
34
33
15 nF
32 31
30
n.c.
18 pF
n.c.
VCC(IF)(A)
IF_GND_A
IF_OUT_N_A
IF_OUT_P_A
150 pF
IF_GND_A
n.c.
VCC(RF)(A)
100 nF
29
28
RF_A 1
RF_GND_A
RF_GND_A
VCC
VCC(LO)
100 nF
47 pF
LO_GND
VCC(LO)
RF_GND_B
TC4-1W-G2+
150
pF
BLM18AG102SN1
27 LO_IN
MIXER A
2
26
BGX7220
3
25
4
24
5
23
6
22
7
21
RF_GND_B
8
RF_B 9
20
MIXER B
19
LO_GND
VCC
S2
POFF_2
n.c.
VCC
S1
POFF_1
VCC(REG)
n.c.
VCC
100 nF
47 pF
n.c.
18
n.c.
17
n.c.
VCC(IF)(B)
14 15 16
IF_GND_B
IF_OUT_N_B
13
IF_OUT_P_B
VCC(RF)(B)
12
IF_GND_B
11
n.c.
10
LO_GND
VCC
47 pF
150 pF
100 nF
1 nF
BLM18AG102SN1
VCC
BLM18AG102SN1
VCC
150
pF
TC4-1W-G2+
15 nF
18 pF
aaa-002509
Fig 3.
Application diagram
Figure 3 shows a typical wideband application circuit. Both RF and RF reference pins
need to be AC coupled. The inputs are internally DC biased in order to provide good ESD
protection, and to support large input signals without clamping. The output matching
requires a transformer to cope with the DC at the output.
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
8 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
13. Test information
Parameters for the following drawings: VCC = 5 V; Tmb = 25 C; Pi(RF) = 5 dBm;
Pi(lo) = 0 dBm; fIF = 150 MHz; unless otherwise specified.
aaa-004183
10
Gconv
(dB)
(1)
(2)
(3)
9
8
7
6
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 4.
Gconv versus fRF (high side LO) and Tmb
aaa-004184
10
Gconv
(dB)
aaa-004185
10
Gconv
(dB)
9
(1)
(2)
(3)
9
8
8
(1)
(2)
(3)
7
7
6
700
800
900
RF (MHz)
6
700
1000
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 5.
Gconv versus fRF (high side LO) and Pi(lo)
BGX7220
Product data sheet
Fig 6.
800
900
RF (MHz)
1000
Gconv versus fRF (high side LO) and VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
9 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004186
29
IP3I
(dBm)
(1)
(2)
(3)
27
25
23
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 7.
IP3i versus fRF (high side LO) and Tmb
aaa-004187
29
IP3I
(dBm)
aaa-004188
29
IP3I
(dBm)
(1)
(2)
(3)
27
(1)
(2)
(3)
27
25
25
23
700
800
900
RF (MHz)
23
700
1000
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 8.
IP3i versus fRF (high side LO) and Pi(lo)
BGX7220
Product data sheet
Fig 9.
800
900
RF (MHz)
1000
IP3i versus fRF (high side LO) and VCC
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Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
10 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004189
14
NF
(dB)
12
(3)
(1)
10
(2)
8
6
700
800
900
RF (MHz)
1000
(1) Tmb= +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 10. NF versus fRF (high side LO) and Tmb
aaa-004190
14
NF
(dB)
NF
(dB)
(1)
(2)
(3)
12
12
10
10
8
8
6
700
800
900
RF (MHz)
1000
6
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 11. NF versus fRF (high side LO) and Pi(lo)
BGX7220
Product data sheet
aaa-004191
14
(1)
(2)
(3)
800
900
RF (MHz)
1000
Fig 12. NF versus fRF (high side LO) and VCC
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Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
11 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004193
15
lCP1dB
(dBm)
(3)
14
(1)
13
(2)
12
11
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 13. ICP1dB versus fRF (high side LO) and Tmb
aaa-004194
15
lCP1dB
(dBm)
lCP1dB
(dBm)
14
13
14
(1)
(2)
(3)
12
800
900
RF (MHz)
1000
11
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 14. ICP1dB versus fRF (high side LO) and Pi(lo)
BGX7220
Product data sheet
(1)
(2)
(3)
13
12
11
700
aaa-004195
15
800
900
RF (MHz)
1000
Fig 15. ICP1dB versus fRF (high side LO) and VCC
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Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
12 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004196
85
2RF-2LO
(dBc)
(1)
(2)
(3)
75
65
55
45
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 16. 2RF-2LO response versus fRF (high side LO) and Tmb
aaa-004197
85
2RF-2LO
(dBc)
2RF-2LO
(dBc)
75
75
(1)
(2)
(3)
65
65
55
55
45
700
800
900
RF (MHz)
1000
45
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 17. 2RF-2LO response versus fRF (high side LO)
and Pi(lo)
BGX7220
Product data sheet
aaa-004198
85
(1)
(2)
(3)
800
900
RF (MHz)
1000
Fig 18. 2RF-2LO response versus fRF (high side LO)
and VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
13 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004199
70
αisol
(dB)
(1)
(2)
(3)
60
50
40
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 19. isol versus fRF (high side LO) and Tmb
aaa-004200
70
αisol
(dB)
αisol
(dB)
(1)
(2)
(3)
60
50
800
900
RF (MHz)
1000
40
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 20. isol versus fRF (high side LO) and Pi(lo)
BGX7220
Product data sheet
(1)
(2)
(3)
60
50
40
700
aaa-004201
70
800
900
RF (MHz)
1000
Fig 21. isol versus fRF (high side LO) and VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
14 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004202
10
Gconv
(dB)
9
(2)
(1)
(3)
8
7
6
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 22. Gconv versus fRF (low side LO) and Tmb
aaa-004203
10
Gconv
(dB)
Gconv
(dB)
(1)
(2)
(3)
9
8
7
7
800
900
RF (MHz)
1000
6
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 23. Gconv versus fRF (low side LO) and Pi(lo)
BGX7220
Product data sheet
(1)
(2)
(3)
9
8
6
700
aaa-004204
10
800
900
RF (MHz)
1000
Fig 24. Gconv versus fRF (low side LO) and VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
15 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004205
29
IP3I
(dBm)
(1)
(2)
(3)
27
25
23
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 25. IP3i versus fRF (low side LO) and Tmb
aaa-004206
29
IP3I
(dBm)
IP3I
(dBm)
(1)
(2)
(3)
27
25
800
900
RF (MHz)
1000
23
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 26. IP3i versus fRF (low side LO) and Pi(lo)
BGX7220
Product data sheet
(1)
(2)
(3)
27
25
23
700
aaa-004207
29
800
900
RF (MHz)
1000
Fig 27. IP3i versus fRF (low side LO) and VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
16 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004208
14
NF
(dB)
12
(3)
(1)
10
(2)
8
6
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 28. NF versus fRF (low side LO) and Tmb
aaa-004209
14
NF
(dB)
aaa-004210
14
NF
(dB)
12
12
(1)
(2)
(3)
(1)
(2)
(3)
10
10
8
8
6
700
800
900
RF (MHz)
1000
6
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 29. NF versus fRF (low side LO) and Pi(lo)
BGX7220
Product data sheet
800
900
RF (MHz)
1000
Fig 30. NF versus fRF (low side LO) and VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
17 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004211
15
ICP1dB
(dBm)
14
(3)
13
(1)
(2)
12
11
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 31. ICP1dB versus fRF (low side LO) and Tmb
aaa-004212
15
ICP1dB
(dBm)
aaa-004213
15
ICP1dB
(dBm)
14
14
(1)
(2)
(3)
(1)
(2)
(3)
13
13
12
12
11
700
800
900
RF (MHz)
1000
11
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 32. ICP1dB versus fRF (low side LO) and Pi(lo)
BGX7220
Product data sheet
800
900
RF (MHz)
1000
Fig 33. ICP1dB versus fRF (low side LO) and VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
18 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004214
85
2RF-2LO
(dBc)
(1)
(2)
(3)
75
65
55
45
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 34. 2RF-2LO response versus fRF (low side LO) and Tmb
aaa-004215
85
2RF-2LO
(dBc)
2RF-2LO
(dBc)
(1)
(2)
(3)
75
75
65
65
55
55
45
700
800
900
RF (MHz)
1000
45
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 35. 2RF-2LO response versus fRF (low side LO)
and Pi(lo)
BGX7220
Product data sheet
aaa-004216
85
(1)
(2)
(3)
800
900
RF (MHz)
1000
Fig 36. 2RF-2LO response versus fRF (low side LO)
and VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
19 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
aaa-004217
70
αisol
(dB)
60
(1)
(2)
(3)
50
40
700
800
900
RF (MHz)
1000
(1) Tmb = +25 C.
(2) Tmb = 40 C.
(3) Tmb = +85 C.
Fig 37. isol versus fRF (low side LO) and Tmb
aaa-004218
70
αisol
(dB)
60
αisol
(dB)
60
(1)
(2)
(3)
50
40
700
aaa-004219
70
(1)
(2)
(3)
50
800
900
RF (MHz)
1000
40
700
(1) Pi(lo) = 0 dBm.
(1) VCC = 5 V.
(2) Pi(lo) = 3 dBm.
(2) VCC = 4.75 V.
(3) Pi(lo) = +3 dBm.
(3) VCC = 5.25 V.
Fig 38. isol versus fRF (low side LO) and Pi(lo)
BGX7220
Product data sheet
800
900
RF (MHz)
1000
Fig 39. isol versus fRF (low side LO) and VCC
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
20 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
14. Package outline
HVQFN36: plastic thermal enhanced very thin quad flat package; no leads;
36 terminals; body 6 x 6 x 0.85 mm
A
B
D
SOT1092-2
terminal 1
index area
E
A
A1
c
detail X
e1
e
10
18
C
C A B
C
v
w
b
y1 C
y
L
19
9
e
e2
Eh
1
27
terminal 1
index area
36
28
X
Dh
0
2.5
Dimensions
Unit
mm
5 mm
scale
A(1)
A1
b
max 1.00 0.05 0.30
nom 0.85 0.02 0.21
min 0.80 0.00 0.18
c
D(1)
Dh
E(1)
Eh
e
e1
e2
L
v
0.2
6.1
6.0
5.9
4.05
3.90
3.75
6.1
6.0
5.9
4.05
3.90
3.75
0.5
4
4
0.65
0.55
0.45
0.1
w
y
0.05 0.05
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
SOT1092-2
References
IEC
JEDEC
JEITA
---
---
sot1092-2_po
European
projection
Issue date
09-02-23
09-02-24
Fig 40. Package outline SOT1092-2 (HVQFN36)
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
21 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
15. Abbreviations
Table 8.
Abbreviations
Acronym
Description
AC
Alternating Current
DC
Direct Current
ESD
ElectroStatic Discharge
FCDM
Field-induced Charged-Device Model
HBM
Human Body Model
IF
Intermediate Frequency
LO
Local Oscillator
MOS
Metal-Oxide Semiconductor
PCB
Printed-Circuit Board
RF
Radio Frequency
16. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGX7220 v.1
20120808
Product data sheet
-
-
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
22 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGX7220
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
23 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
24 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
19. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Ordering information . . . . . . . . . . . . . . . . . . . . .1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .3
Shutdown control . . . . . . . . . . . . . . . . . . . . . . . .4
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .5
Thermal characteristics . . . . . . . . . . . . . . . . . . .5
Table 6.
Table 7.
Table 8.
Table 9.
Static characteristics . . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22
20. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Fig 19.
Fig 20.
Fig 21.
Fig 22.
Fig 23.
Fig 24.
Fig 25.
Fig 26.
Fig 27.
Fig 28.
Fig 29.
Fig 30.
Fig 31.
Fig 32.
Fig 33.
Fig 34.
Fig 35.
Fig 36.
Fig 37.
Fig 38.
Fig 39.
Fig 40.
Functional block diagram . . . . . . . . . . . . . . . . . . . .2
Pinning diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Application diagram . . . . . . . . . . . . . . . . . . . . . . . .8
Gconv versus fRF (high side LO) and Tmb . . . . . . . .9
Gconv versus fRF (high side LO) and Pi(lo) . . . . . . . .9
Gconv versus fRF (high side LO) and VCC . . . . . . . .9
IP3i versus fRF (high side LO) and Tmb . . . . . . . .10
IP3i versus fRF (high side LO) and Pi(lo) . . . . . . . .10
IP3i versus fRF (high side LO) and VCC . . . . . . . .10
NF versus fRF (high side LO) and Tmb . . . . . . . . . 11
NF versus fRF (high side LO) and Pi(lo) . . . . . . . . 11
NF versus fRF (high side LO) and VCC . . . . . . . . . 11
ICP1dB versus fRF (high side LO) and Tmb . . . . . .12
ICP1dB versus fRF (high side LO) and Pi(lo) . . . . .12
ICP1dB versus fRF (high side LO) and VCC . . . . . .12
2RF-2LO response versus fRF (high side LO)
and Tmb . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
2RF-2LO response versus fRF (high side LO)
and Pi(lo) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
2RF-2LO response versus fRF (high side LO)
and VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
aisol versus fRF (high side LO) and Tmb . . . . . . . .14
aisol versus fRF (high side LO) and Pi(lo) . . . . . . . .14
aisol versus fRF (high side LO) and VCC . . . . . . . .14
Gconv versus fRF (low side LO) and Tmb . . . . . . . .15
Gconv versus fRF (low side LO) and Pi(lo) . . . . . . .15
Gconv versus fRF (low side LO) and VCC . . . . . . . .15
IP3i versus fRF (low side LO) and Tmb . . . . . . . . .16
IP3i versus fRF (low side LO) and Pi(lo) . . . . . . . . .16
IP3i versus fRF (low side LO) and VCC . . . . . . . . .16
NF versus fRF (low side LO) and Tmb . . . . . . . . . .17
NF versus fRF (low side LO) and Pi(lo) . . . . . . . . .17
NF versus fRF (low side LO) and VCC . . . . . . . . .17
ICP1dB versus fRF (low side LO) and Tmb . . . . . . .18
ICP1dB versus fRF (low side LO) and Pi(lo) . . . . . .18
ICP1dB versus fRF (low side LO) and VCC . . . . . .18
2RF-2LO response versus fRF (low side LO)
and Tmb . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
2RF-2LO response versus fRF (low side LO)
and Pi(lo) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
2RF-2LO response versus fRF (low side LO)
and VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
aisol versus fRF (low side LO) and Tmb . . . . . . . . .20
aisol versus fRF (low side LO) and Pi(lo). . . . . . . . .20
aisol versus fRF (low side LO) and VCC . . . . . . . . .20
Package outline SOT1092-2 (HVQFN36) . . . . . .21
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
25 of 26
BGX7220
NXP Semiconductors
Dual receiver down mixer
21. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
11
12
13
14
15
16
17
17.1
17.2
17.3
17.4
18
19
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Power-up control . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Application information. . . . . . . . . . . . . . . . . . . 8
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22
Legal information. . . . . . . . . . . . . . . . . . . . . . . 23
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Contact information. . . . . . . . . . . . . . . . . . . . . 24
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 August 2012
Document identifier: BGX7220
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