Chinese (simplified)/English

技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
PrimePACK™2模块采用第四代沟槽栅/场终止IGBT4和发射极控制二极管
PrimePACK™2modulewithTrench/FieldstopIGBT4andEmitterControlleddiode
初步数据/PreliminaryData
VCES = 1200V
IC nom = 900A / ICRM = 1800A
典型应用
• 大功率变流器
• 电机传动
• 风力发电机
TypicalApplications
• Highpowerconverters
• Motordrives
• Windturbines
电气特性
• 高短路能力
• 高冲击电流能力
• 高电流密度
• 低开关损耗
• Tvjop=150°C
• VCEsat带正温度系数
ElectricalFeatures
• Highshort-circuitcapability
• Highsurgecurrentcapability
• Highcurrentdensity
• Lowswitchinglosses
• Tvjop=150°C
• VCEsatwithpositivetemperaturecoefficient
机械特性
• 4kV交流1分钟绝缘
• 封装的CTI>400
• 高爬电距离和电气间隙
• 集成NTC温度传感器
• 符合RoHS
• 预涂导热介质
MechanicalFeatures
• 4kVAC1mininsulation
• PackagewithCTI>400
• Highcreepageandclearancedistances
• IntegratedNTCtemperaturesensor
• RoHScompliant
• Pre-appliedThermalInterfaceMaterial
ModuleLabelCode
BarcodeCode128
DMX-Code
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
ContentoftheCode
Digit
ModuleSerialNumber
ModuleMaterialNumber
ProductionOrderNumber
Datecode(ProductionYear)
Datecode(ProductionWeek)
1-5
6-11
12-19
20-21
22-23
ULapproved(E83335)
1
技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
初步数据
PreliminaryData
IGBT,逆变器/IGBT,Inverter
最大额定值/MaximumRatedValues
集电极-发射极电压
Collector-emittervoltage
Tvj = 25°C
VCES
1200
V
连续集电极直流电流
ContinuousDCcollectorcurrent
TH = 60°C, Tvj max = 175°C
IC nom 900
A
集电极重复峰值电流
Repetitivepeakcollectorcurrent
tP = 1 ms
ICRM
1800
A
VGES
+/-20
V
栅极-发射极峰值电压
Gate-emitterpeakvoltage
特征值/CharacteristicValues
集电极-发射极饱和电压
Collector-emittersaturationvoltage
min.
IC = 900 A, VGE = 15 V
IC = 900 A, VGE = 15 V
IC = 900 A, VGE = 15 V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
VCE sat
typ.
max.
1,75
2,05
2,10
2,10
2,45
2,50
V
V
V
5,80
6,40
V
栅极阈值电压
Gatethresholdvoltage
IC = 33,0 mA, VCE = VGE, Tvj = 25°C
栅极电荷
Gatecharge
VGE = -15 V ... +15 V
QG
6,40
µC
内部栅极电阻
Internalgateresistor
Tvj = 25°C
RGint
1,2
Ω
输入电容
Inputcapacitance
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V
Cies
54,0
nF
反向传输电容
Reversetransfercapacitance
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V
Cres
3,00
nF
集电极-发射极截止电流
Collector-emittercut-offcurrent
VCE = 1200 V, VGE = 0 V, Tvj = 25°C
ICES
5,0
mA
栅极-发射极漏电流
Gate-emitterleakagecurrent
VCE = 0 V, VGE = 20 V, Tvj = 25°C
IGES
400
nA
VGEth
开通延迟时间(电感负载)
Turn-ondelaytime,inductiveload
IC = 900 A, VCE = 600 V
VGE = ±15 V
RGon = 1,5 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
上升时间(电感负载)
Risetime,inductiveload
IC = 900 A, VCE = 600 V
VGE = ±15 V
RGon = 1,5 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
关断延迟时间(电感负载)
Turn-offdelaytime,inductiveload
IC = 900 A, VCE = 600 V
VGE = ±15 V
RGoff = 1,5 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
下降时间(电感负载)
Falltime,inductiveload
IC = 900 A, VCE = 600 V
VGE = ±15 V
RGoff = 1,5 Ω
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
开通损耗能量(每脉冲)
Turn-onenergylossperpulse
IC = 900 A, VCE = 600 V, LS = 45 nH
Tvj = 25°C
VGE = ±15 V, di/dt = 5700 A/µs (Tvj = 150°C) Tvj = 125°C
RGon = 1,3 Ω
Tvj = 150°C
关断损耗能量(每脉冲)
Turn-offenergylossperpulse
5,20
0,20
0,22
0,22
µs
µs
µs
0,11
0,12
0,13
µs
µs
µs
0,66
0,75
0,79
µs
µs
µs
0,09
0,14
0,15
µs
µs
µs
Eon
55,0
70,0
80,0
mJ
mJ
mJ
IC = 900 A, VCE = 600 V, LS = 45 nH
Tvj = 25°C
VGE = ±15 V, du/dt = 3200 V/µs (Tvj = 150°C) Tvj = 125°C
RGoff = 1,5 Ω
Tvj = 150°C
Eoff
85,0
120
130
mJ
mJ
mJ
短路数据
SCdata
VGE ≤ 15 V, VCC = 900 V
VCEmax = VCES -LsCE ·di/dt
ISC
3600
A
???
Thermalresistance,junctiontoheatsink
每个IGBT/perIGBT
validwithIFXpre-appliedthermalinterfacematerial
在开关状态下温度
Temperatureunderswitchingconditions
tP ≤ 10 µs, Tvj = 150°C
td on
tr
td off
tf
RthJH
Tvj op
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
2
48,1 K/kW
-40
150
°C
技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
初步数据
PreliminaryData
二极管,逆变器/Diode,Inverter
最大额定值/MaximumRatedValues
反向重复峰值电压
Repetitivepeakreversevoltage
Tvj = 25°C
连续正向直流电流
ContinuousDCforwardcurrent
正向重复峰值电流
Repetitivepeakforwardcurrent
tP = 1 ms
I2t-值
I²t-value
VR = 0 V, tP = 10 ms, Tvj = 125°C
VR = 0 V, tP = 10 ms, Tvj = 150°C
VRRM 1200
V
IF
900
A
IFRM
1800
A
I²t
91,0
88,0
特征值/CharacteristicValues
min.
kA²s
kA²s
typ.
max.
VF
1,90
1,85
1,80
2,40
2,35
2,30
IF = 900 A, - diF/dt = 5700 A/µs (Tvj=150°C) Tvj = 25°C
VR = 600 V
Tvj = 125°C
VGE = -15 V
Tvj = 150°C
IRM
500
660
710
A
A
A
恢复电荷
Recoveredcharge
IF = 900 A, - diF/dt = 5700 A/µs (Tvj=150°C) Tvj = 25°C
VR = 600 V
Tvj = 125°C
VGE = -15 V
Tvj = 150°C
Qr
90,0
150
195
µC
µC
µC
反向恢复损耗(每脉冲)
Reverserecoveryenergy
IF = 900 A, - diF/dt = 5700 A/µs (Tvj=150°C) Tvj = 25°C
VR = 600 V
Tvj = 125°C
VGE = -15 V
Tvj = 150°C
Erec
40,0
80,0
90,0
mJ
mJ
mJ
???
Thermalresistance,junctiontoheatsink
每个二极管/perdiode
validwithIFXpre-appliedthermalinterfacematerial
RthJH
正向电压
Forwardvoltage
IF = 900 A, VGE = 0 V
IF = 900 A, VGE = 0 V
IF = 900 A, VGE = 0 V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
反向恢复峰值电流
Peakreverserecoverycurrent
在开关状态下温度
Temperatureunderswitchingconditions
Tvj op
V
V
V
87,2 K/kW
-40
150
°C
负温度系数热敏电阻/NTC-Thermistor
特征值/CharacteristicValues
min.
typ.
max.
额定电阻值
Ratedresistance
TNTC = 25°C
R100偏差
DeviationofR100
TNTC = 100°C, R100 = 493 Ω
耗散功率
Powerdissipation
TNTC = 25°C
B-值
B-value
R2 = R25 exp [B25/50(1/T2 - 1/(298,15 K))]
B25/50
3375
K
B-值
B-value
R2 = R25 exp [B25/80(1/T2 - 1/(298,15 K))]
B25/80
3411
K
B-值
B-value
R2 = R25 exp [B25/100(1/T2 - 1/(298,15 K))]
B25/100
3433
K
R25
∆R/R
5,00
-5
P25
根据应用手册标定
Specificationaccordingtothevalidapplicationnote.
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
3
kΩ
5
%
20,0
mW
技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
初步数据
PreliminaryData
模块/Module
绝缘测试电压
Isolationtestvoltage
RMS, f = 50 Hz, t = 1 min.
VISOL 4,0
kV
Cu
模块基板材料
Materialofmodulebaseplate
内部绝缘
Internalisolation
基本绝缘(class1,IEC61140)
basicinsulation(class1,IEC61140)
Al2O3
爬电距离
Creepagedistance
端子至散热器/terminaltoheatsink
端子至端子/terminaltoterminal
33,0
33,0
mm
电气间隙
Clearance
端子至散热器/terminaltoheatsink
端子至端子/terminaltoterminal
19,0
19,0
mm
> 400
相对电痕指数
Comperativetrackingindex
CTI
min.
杂散电感,模块
Strayinductancemodule
模块引线电阻,端子-芯片
Moduleleadresistance,terminals-chip
TH=25°C,每个开关/perswitch
储存温度
Storagetemperature
18
nH
RCC'+EE'
0,30
mΩ
-40
TBPmax
模块安装的安装扭距
Mountingtorqueformodulmounting
螺丝M5根据相应的应用手册进行安装
ScrewM5-Mountingaccordingtovalidapplicationnote
M
端子联接扭距
Terminalconnectiontorque
螺丝M4根据相应的应用手册进行安装
ScrewM4-Mountingaccordingtovalidapplicationnote
螺丝M8根据相应的应用手册进行安装
ScrewM8-Mountingaccordingtovalidapplicationnote
M
重量
Weight
G
Lagerung und Transport von Modulen mit TIM: siehe AN2012-07
Storage and shipment of modules with TIM: see AN2012-07
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
4
max.
LsCE
Tstg
最高基板工作温度
Maximumbaseplateoperationtemperature
typ.
3,00
125
°C
125
°C
6,00
Nm
1,8
-
2,1
Nm
8,0
-
10
Nm
825
g
技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
初步数据
PreliminaryData
输出特性IGBT,逆变器(典型)
outputcharacteristicIGBT,Inverter(typical)
IC=f(VCE)
VGE=15V
输出特性IGBT,逆变器(典型)
outputcharacteristicIGBT,Inverter(typical)
IC=f(VCE)
Tvj=150°C
1800
1800
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
1600
1200
1200
1000
1000
IC [A]
1400
IC [A]
1400
800
800
600
600
400
400
200
200
0
0,0
0,5
1,0
VGE = 19V
VGE = 17V
VGE = 15V
VGE = 13V
VGE = 11V
VGE = 9V
1600
1,5
2,0
VCE [V]
2,5
3,0
0
3,5
传输特性IGBT,逆变器(典型)
transfercharacteristicIGBT,Inverter(typical)
IC=f(VGE)
VCE=20V
0,0
0,5
1,0
1,5
2,0
2,5 3,0
VCE [V]
3,5
4,0
4,5
5,0
开关损耗IGBT,逆变器(典型)
switchinglossesIGBT,Inverter(typical)
Eon=f(IC),Eoff=f(IC)
VGE=±15V,RGon=1.3Ω,RGoff=1.5Ω,VCE=600V
1800
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
1600
Eon, Tvj = 125°C
Eon, Tvj = 150°C
Eoff, Tvj = 125°C
Eoff, Tvj = 150°C
250
1400
200
1200
E [mJ]
IC [A]
1000
800
150
100
600
400
50
200
0
5
6
7
8
9
VGE [V]
10
11
0
12
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
5
0
200
400
600
800 1000 1200 1400 1600 1800
IC [A]
技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
初步数据
PreliminaryData
开关损耗IGBT,逆变器(典型)
switchinglossesIGBT,Inverter(typical)
Eon=f(RG),Eoff=f(RG)
VGE=±15V,IC=900A,VCE=600V
瞬态热阻抗IGBT,逆变器
transientthermalimpedanceIGBT,Inverter
ZthJH=f(t)
450
100
Eon, Tvj = 125°C
Eon, Tvj = 150°C
Eoff, Tvj = 125°C
Eoff, Tvj = 150°C
400
ZthJH : IGBT
350
10
ZthJH [K/kW]
E [mJ]
300
250
200
150
1
100
i:
1
2
3
4
ri[K/kW]: 3,56
14,3
20,8 9,45
τi[s]:
0,000916 0,0315 0,124 0,877
50
0
0,0
1,0
2,0
3,0
4,0
RG [Ω]
5,0
6,0
7,0
0,1
0,001
8,0
反偏安全工作区IGBT,逆变器(RBSOA)
reversebiassafeoperatingareaIGBT,Inverter(RBSOA)
IC=f(VCE)
VGE=±15V,RGoff=1.5Ω,Tvj=150°C
0,01
0,1
t [s]
1
10
正向偏压特性二极管,逆变器(典型)
forwardcharacteristicofDiode,Inverter(typical)
IF=f(VF)
2000
1800
IC, Modul
IC, Chip
1800
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
1600
1600
1400
1400
1200
1200
IF [A]
IC [A]
1000
1000
800
800
600
600
400
400
200
200
0
0
200
400
600
800
VCE [V]
1000
1200
0
1400
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
6
0,0
0,5
1,0
1,5
VF [V]
2,0
2,5
3,0
技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
初步数据
PreliminaryData
开关损耗二极管,逆变器(典型)
switchinglossesDiode,Inverter(typical)
Erec=f(IF)
RGon=1.3Ω,VCE=600V
开关损耗二极管,逆变器(典型)
switchinglossesDiode,Inverter(typical)
Erec=f(RG)
IF=900A,VCE=600V
120
120
Erec, Tvj = 125°C
Erec, Tvj = 150°C
110
100
100
90
90
80
70
70
E [mJ]
E [mJ]
80
60
60
50
50
40
40
30
30
20
20
10
10
0
Erec, Tvj = 125°C
Erec, Tvj = 150°C
110
0
200
400
600
0
800 1000 1200 1400 1600
IF [A]
瞬态热阻抗二极管,逆变器
transientthermalimpedanceDiode,Inverter
ZthJH=f(t)
0,0
1,0
2,0
3,0
4,0
RG [Ω]
5,0
6,0
7,0
8,0
安全工作区二极管,逆变器(SOA)
safeoperationareaDiode,Inverter(SOA)
IR=f(VR)
Tvj=150°C
100
2000
ZthJH : Diode
IR, Modul
1800
1600
1400
10
IR [A]
ZthJH [K/kW]
1200
1000
800
1
600
400
i:
1
2
3
4
ri[K/kW]: 9,03
24,7
39
14,5
τi[s]:
0,000749 0,0231 0,103 0,879
0,1
0,001
0,01
0,1
t [s]
1
200
0
10
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
7
0
200
400
600
800
VR [V]
1000
1200
1400
技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
初步数据
PreliminaryData
负温度系数热敏电阻温度特性
NTC-Thermistor-temperaturecharacteristic(typical)
R=f(T)
100000
Rtyp
R[Ω]
10000
1000
100
0
20
40
60
80
100
TNTC [°C]
120
140
160
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
8
技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
初步数据
PreliminaryData
接线图/Circuitdiagram
封装尺寸/Packageoutlines
154
restricted area for Thermal Interface Material
60
6,5
1
36 0,2
screwing depth
max. 16 (4x)
18 0,2 (2x)
22 +- 0,6
0
3 0,1
36,5 0,3
screwing depth
max. 8 (7x)
A
172 0,5
150
113
103
recommeded design height
lower side PCB to baseplate
92
76
58
8 0,1 (7x)
25,9 0,25
+
5,5 - 00,1
0,25 A B C
(10x)
10
20 0,1
37,7 0,25
B
recommeded design height
lower side bus bar to baseplate
28 0,1
5,5
17 0,1
0,6 A B C
(4x)
C
39
64
78
117
156
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
9
M8
5,5
4,3
24,5 0,5
14
39
25
21,5 0,3
10
45,5 0,5
21 0,3
M4
0,6 A B C
(7X)
12,3 0,3
89 0,5
73
0,4 A
(7x)
1 MAX
技术信息/TechnicalInformation
IGBT-模块
IGBT-Module
FF900R12IE4P
初步数据
PreliminaryData
Publishedby
InfineonTechnologiesAG
81726München,Germany
©InfineonTechnologiesAG2015.
AllRightsReserved.
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(“Beschaffenheitsgarantie”).Withrespecttoanyexamples,hintsoranytypicalvaluesstatedhereinand/oranyinformationregardingthe
applicationoftheproduct,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithout
limitationwarrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty.
Inaddition,anyinformationgiveninthisdocumentissubjecttocustomer’scompliancewithitsobligationsstatedinthisdocumentandany
applicablelegalrequirements,normsandstandardsconcerningcustomer’sproductsandanyuseoftheproductofInfineonTechnologies
incustomer’sapplications.
Thedatacontainedinthisdocumentisexclusivelyintendedfortechnicallytrainedstaff.Itistheresponsibilityofcustomer’stechnical
departmentstoevaluatethesuitabilityoftheproductfortheintendedapplicationandthecompletenessoftheproductinformationgivenin
thisdocumentwithrespecttosuchapplication.
Forfurtherinformationontheproduct,technology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon
Technologiesoffice(www.infineon.com).
WARNINGS
Duetotechnicalrequirementsproductsmaycontaindangeroussubstances.Forinformationonthetypesinquestionpleasecontactyour
nearestInfineonTechnologiesoffice.
ExceptasotherwiseexplicitlyapprovedbyInfineonTechnologiesinawrittendocumentsignedbyauthorizedrepresentativesofInfineon
Technologies,InfineonTechnologies’productsmaynotbeusedinanyapplicationswhereafailureoftheproductoranyconsequencesof
theusethereofcan
reasonablybeexpectedtoresultinpersonalinjury.
preparedby:SM
dateofpublication:2016-03-31
approvedby:RN
revision:V2.0
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