PANASONIC MN101C78

MN101C78 Series
Type
Internal ROM type
MN101C78A
MN101CF78A
Mask ROM
FLASH
ROM (byte)
32K
RAM (byte)
1.5K
Package (Lead-free)
Minimum Instruction
Execution Time
TQFP048-P-0707B
0.100 µs (at 3.0 V to 3.6 V, 10 MHz)
0.118 µs (at 2.7 V to 3.6 V, 8.5 MHz)
0.235 µs (at 1.8 V to 3.6 V, 4.25 MHz)*
62.5 µs (at 1.8 V to 3.6 V, 32 kHz)*
*: The lower limit for operation guarantee for flash memory built-in type is 2.2 V.
 Interrupts
RESET. Watchdog. External 0 to 2. External 4 (key interrupt dedicated). Timer 0 to 3. Timer 6. Timer 7 (2 systems). Timer 8 (2 systems).
Time base. Serial 0 (2 systems). Serial 1 (2 systems). Serial 3. Serial 4. A/D conversion finish
 Timer Counter
8-bit timer × 5
Timer 0 ..................Square-wave/8-bit PWM output. Event count. Remote control carrier output. Simple pulse width measurement.
Added pulse (2-bit) type PWM output. Real time output control. Square-wave/PWM output to large current
terminal P50 possible
Timer 1 ..................Square-wave output. Event count. Synchronous output event
Timer 2 ..................Square-wave output. Added pulse (2-bit) type PWM output. PWM output. Serial transfer clock output. Real time
output control. Event count. Synchronous output event. Simple pulse width measurement. Square-wave/PWM
output to large current terminal P52 possible
Timer 3 ..................Square-wave output. Event count. Remote control carrier output. Serial 0 baud rate timer
Timer 6 ..................8-bit freerun timer
Timer 0, 1 can be cascade-connected
Timer 2, 3 can be cascade-connected
16-bit timer × 2
Timer 7 ..................Square-wave output. 16-bit PWM output (cycle/duty continuous variable). Event count. Synchronous output
event. Pulse width measurement. Input capture. Real time output control. High performance IGBT output. Squarewave/PWM output to large current terminal P51 possible
Timer 8 ..................Square-wave/16-bit PWM output (duty continuous variable). Event count. Pulse width measurement. Input
capture. Square-wave/PWM output to large current terminal P53 possible
Timer 7, 8 can be cascade-connected: Square-wave output, PWM, input capture, pulse width measurement is possible as a 32-bit
timer
Time base timer: One-minute count setting
Watchdog timer × 1
 Serial interface
Synchronous type/UART (full-duplex) × 2: Serial 0, 1
Synchronous type/Single-master I2C × 1: Serial 3
I2C slave × 1: Serial 4
Serial 4...................I2C high-speed transfer mode. 7-bit/10-bit address setting. General call
 I/O Pins
I/O
39 : Common use. Specified pull-up resistor available. Input/output selectable (bit unit)
 A/D converter
10-bit × 7 channels (with S/H)
 Display control function
LCD: 12 segments × 4 commons (Static, 1/2, 1/3, or 1/4 duty)
Usable if VLCD ≤ VDD
 Special Ports
Buzzer output. Inverted buzzer output. Remote control carrier output. High-current drive port
MAD00039GEM
MN101C78A, MN101CF78A
 Electrical Charactreistics (Supply current)
Parameter
Operating supply current
Supply current at HALT
Supply current at STOP
Symbol
Condition
min
Limit
Unit
typ
max
0.6(1.3) 1.1(2.2) mA
IDD1
fosc = 4.25 MHz (fs = fosc/2). VDD = 3 V
IDD2
fx = 32 kHz (fs = fx/2). VDD = 3 V
4(46) 15(90)
µA
IDD3
fx = 32 kHz. VDD = 3 V. Ta = 25 °C
2(3)
5(13)
µA
IDD4
fx = 32 kHz. VDD = 3 V. Ta = -40 °C to +85 °C
10(40)
µA
IDD5
VDD = 3 V. Ta = 25 °C
2(3)
µA
IDD6
VDD = 3 V. Ta = -40 °C to +85 °C
8(30)
µA
Note) ( ): Flash memory built-in type
 Pin Assignment
36
35
34
33
32
31
30
29
28
27
26
25
SEG4, P73, KEY3
SEG5, P72, KEY2
SEG6, P71, KEY1, TM3IO
SEG7, P70, KEY0, TM1IO
SEG8, P17, SBT1A, TM2OB
SEG9, P16, TM2IO, RXD1A, SBI1A
SEG10, P15, TM0OB, TXD1A, SBO1A
SEG11, P14, TM0IO, RMOUT
NBUZZER, P13, TM7IO, CLKOUT
BUZZER, P12, TM8IO
P56, IRQ2
P55, IRQ1, ACZ1
TQFP048-P-0707B
37
38
39
40
41
42
43
44
45
46
47
48
24
23
22
21
20
19
18
17
16
15
14
13
TM0OA, LED0, P50
TM7O, LED1, P51
TM2OA, LED2, P52
TM8O, LED3, P53
VSS
OSC2
OSC1
VDD
XI, P90
XO
MMOD
NRST, P27
1
2
3
4
5
6
7
8
9
10
11
12
SEG3, P74, KEY4
SEG2, P75, KEY5, TXD0B, SBO0B
SEG1, P76, KEY6, RXD0B, SBI0B, SDA4B
SEG0, P77, KEY7, SBT0B, SCL4B
COM0, P30
COM1, P31, SBI3
COM2, P32, SBT3, SCL3
COM3, P33, SB03, SDA3
P34, VLC3
P35, VLC2
P36, VLC1
P37
MAD00039GEM
P54, IRQ0, ACZ0
VDD
SBT1B, PA6, AN6
TXD1B, SBO1B, PA5, AN5
RXD1B, SBI1B, PA4, AN4
PA3, AN3
SBT0A, PA2, AN2
RXD0A, SBI0A, PA1, AN1
TXD0A, SBO0A, PA0, AN0
VREF+
P11, SCL4A
P10, SDA4A
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20080805