Data Sheet

Freescale Semiconductor
Technical Data
Document Number: MMRF1315N
Rev. 0, 7/2014
RF Power LDMOS Transistor
N--Channel Enhancement--Mode Lateral MOSFET
MMRF1315NR1
Designed for wideband defense, industrial and commercial applications with
frequencies up to 1000 MHz. The high gain and broadband performance of
this device are ideal for large--signal, common--source amplifier applications in
28 V RF systems.
500--1000 MHz, 60 W CW, 28 V
BROADBAND
RF POWER LDMOS TRANSISTOR
 Typical Single--Carrier N--CDMA Performance @ 880 MHz, VDD = 28 Vdc,
IDQ = 450 mA, Pout = 14 W Avg., IS--95 CDMA (Pilot, Sync, Paging,
Traffic Codes 8 Through 13) Channel Bandwidth = 1.2288 MHz. PAR =
9.8 dB @ 0.01% Probability on CCDF.
Power Gain — 21.1 dB
Drain Efficiency — 33%
ACPR @ 750 kHz Offset — --45.7 dBc in 30 kHz Channel Bandwidth
 Capable of Handling 10:1 VSWR, @ 32 Vdc, 880 MHz, 3 dB Overdrive,
Designed for Enhanced Ruggedness
GSM EDGE Application
TO--270--2
PLASTIC
 Typical GSM EDGE Performance: VDD = 28 Vdc, IDQ = 500 mA,
Pout = 21 W Avg., Full Frequency Band (920--960 MHz)
Power Gain — 20 dB
Drain Efficiency — 46%
Spectral Regrowth @ 400 kHz Offset = --62 dBc
Spectral Regrowth @ 600 kHz Offset = --78 dBc
EVM — 1.5% rms
GSM Application
 Typical GSM Performance: VDD = 28 Vdc, IDQ = 500 mA, Pout = 60 W, Full
Frequency Band (920--960 MHz)
Power Gain — 20 dB
Drain Efficiency — 63%
Features




Characterized with Series Equivalent Large--Signal Impedance Parameters
Integrated ESD Protection
225C Capable Plastic Package
In Tape and Reel. R1 Suffix = 500 Units, 24 mm Tape Width, 13--inch Reel.
1 Drain
Gate 2
(Top View)
Note: The backside of the package is the
source terminal for the transistor.
Figure 1. Pin Connections
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
Drain--Source Voltage
VDSS
-- 0.5, +66
Vdc
Gate--Source Voltage
VGS
-- 0.5, + 12
Vdc
Maximum Operation Voltage
VDD
32, +0
Vdc
Storage Temperature Range
Tstg
-- 65 to +150
C
Case Operating Temperature
TC
150
C
Operating Junction Temperature (1,2)
TJ
225
C
Symbol
Value (2,3)
Unit
Table 2. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 80C, 60 W CW
Case Temperature 78C, 14 W CW
RJC
0.77
0.88
C/W
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Tools (Software & Tools)/Calculators to access MTTF calculators
by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
 Freescale Semiconductor, Inc., 2014. All rights reserved.
RF Device Data
Freescale Semiconductor, Inc.
MMRF1315NR1
1
Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22--A114)
1B
Machine Model (per EIA/JESD22--A115)
A
Charge Device Model (per JESD22--C101)
IV
Table 4. Moisture Sensitivity Level
Test Methodology
Per JESD 22--A113, IPC/JEDEC J--STD--020
Rating
Package Peak Temperature
Unit
3
260
C
Table 5. Electrical Characteristics (TC = 25C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
Zero Gate Voltage Drain Leakage Current
(VDS = 66 Vdc, VGS = 0 Vdc)
IDSS
—
—
10
Adc
Zero Gate Voltage Drain Leakage Current
(VDS = 28 Vdc, VGS = 0 Vdc)
IDSS
—
—
1
Adc
Gate--Source Leakage Current
(VGS = 5 Vdc, VDS = 0 Vdc)
IGSS
—
—
10
Adc
Gate Threshold Voltage
(VDS = 10 Vdc, ID = 200 A)
VGS(th)
1
2.2
3
Vdc
Gate Quiescent Voltage
(VDD = 28 Vdc, ID = 450 mAdc, Measured in Functional Test)
VGS(Q)
2
3
4
Vdc
Drain--Source On--Voltage
(VGS = 10 Vdc, ID = 1.5 Adc)
VDS(on)
0.05
0.27
0.4
Vdc
Reverse Transfer Capacitance
(VDS = 28 Vdc  30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Crss
—
1.1
—
pF
Output Capacitance
(VDS = 28 Vdc  30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Coss
—
33
—
pF
Input Capacitance
(VDS = 28 Vdc, VGS = 0 Vdc  30 mV(rms)ac @ 1 MHz)
Ciss
—
109
—
pF
Characteristic
Off Characteristics
On Characteristics
Dynamic Characteristics
Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 450 mA, Pout = 14 W Avg., f = 880 MHz, Single--Carrier
N--CDMA, 1.2288 MHz Channel Bandwidth Carrier. ACPR measured in 30 kHz Channel Bandwidth @ 750 kHz Offset. PAR = 9.8 dB @
0.01% Probability on CCDF
Power Gain
Gps
20
21.1
23
dB
Drain Efficiency
D
30.5
33
—
%
ACPR
—
--45.7
--44
dBc
IRL
—
--18
--9
Adjacent Channel Power Ratio
Input Return Loss
dB
(continued)
MMRF1315NR1
2
RF Device Data
Freescale Semiconductor, Inc.
Table 5. Electrical Characteristics (TC = 25C unless otherwise noted) (continued)
Characteristic
Symbol
Min
Typ
Max
Unit
Typical GSM EDGE Performances (In Freescale GSM EDGE Test Fixture Optimized for 920--960 MHz, 50 ohm system) VDD = 28 Vdc,
IDQ = 500 mA, Pout = 21 W Avg., f = 920--960 MHz, GSM EDGE Signal
Power Gain
Gps
—
20
—
dB
Drain Efficiency
D
—
46
—
%
Error Vector Magnitude
EVM
—
1.5
—
%
Spectral Regrowth at 400 kHz Offset
SR1
—
--62
—
dBc
Spectral Regrowth at 600 kHz Offset
SR2
—
--78
—
dBc
Typical CW Performances (In Freescale GSM Test Fixture Optimized for 920--960 MHz, 50 ohm system) VDD = 28 Vdc, IDQ = 500 mA,
Pout = 60 W, f = 920--960 MHz
Power Gain
Gps
—
20
—
dB
Drain Efficiency
D
—
63
—
%
IRL
—
--12
—
dB
P1dB
—
67
—
W
Input Return Loss
Pout @ 1 dB Compression Point
(f = 940 MHz)
Typical Performances (In Freescale Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 450 mA, 865--900 MHz Bandwidth
Video Bandwidth @ 60 W PEP Pout where IM3 = --30 dBc
(Tone Spacing from 100 kHz to VBW)
IMD3 = IMD3 @ VBW frequency -- IMD3 @ 100 kHz <1 dBc (both
sidebands)
VBW
MHz
—
3
—
Gain Flatness in 35 MHz Bandwidth @ Pout = 14 W Avg.
GF
—
0.27
—
dB
Gain Variation over Temperature
(--30C to +85C)
G
—
0.011
—
dB/C
P1dB
—
0.088
—
dBm/C
Output Power Variation over Temperature
(--30C to +85C)
MMRF1315NR1
RF Device Data
Freescale Semiconductor, Inc.
3
B2
B1
R1
VBIAS
+
+
C9
RF
INPUT
R4
R2
C7
C15
R3
C8
Z2
Z3
Z4
Z5
Z6
L1
Z7
Z8
C6
Z11
Z12
C1
C3
Z1
Z2
Z3
Z4
Z5
Z6
Z7
Z8
+
C16
C17
C19
C4
Z13
C5
0.215 x 0.065 Microstrip
0.221 x 0.065 Microstrip
0.500 x 0.100 Microstrip
0.460 x 0.270 Microstrip
0.040 x 0.270 Microstrip
0.280 x 0.270 x 0.530 Taper
0.087 x 0.525 Microstrip
0.435 x 0.525 Microstrip
DUT
Z9
Z10
Z11
Z12
Z13
Z14
Z15
PCB
C12
C13
C18
RF
Z15 OUTPUT
Z14
Z9
C10
C2
+
C11 L2
Z10
Z1
+
VSUPPLY
C14
0.057 x 0.525 Microstrip
0.360 x 0.270 Microstrip
0.063 x 0.270 Microstrip
0.360 x 0.065 Microstrip
0.170 x 0.065 Microstrip
0.880 x 0.065 Microstrip
0.260 x 0.065 Microstrip
Taconic RF--35 0.030, r = 3.5
Figure 2. MMRF1315NR1 Test Circuit Schematic
Table 6. MMRF1315NR1 Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
B1
Ferrite Bead
2743019447
Fair Rite
B2
Ferrite Bead
274021447
Fair Rite
C1, C8, C14, C15
47 pF Chip Capacitors
ATC100B470JT500XT
ATC
C2, C4, C13
0.8--8.0 pF Variable Capacitors, Gigatrim
2729152
Johanson
C3
3.0 pF Chip Capacitor
ATC100B3R0JT500XT
ATC
C5, C6
15 pF Chip Capacitors
ATC100B150JT500XT
ATC
C7, C16, C17
10 F, 35 V Tantalum Capacitors
T491D106K035AT
Kemet
C9
100 F, 50 V Electrolytic Capacitor
MCHT101M1HB--1017--RH
Multicomp
C10, C11
12 pF Chip Capacitors
ATC100B120JT500XT
ATC
C12
4.3 pF Chip Capacitor
ATC100B4R3JT500XT
ATC
C18
0.56 F Chip Capacitor
ATC700A561MT150XT
ATC
C19
470 F, 63 V Electrolytic Capacitor
EKME630ELL471MK255
Multicomp
L1, L2
12.5 nH Inductor
A04T--5
Coilcraft
R1
1 k, 1/4 W Chip Resistor
CRCW12061001FKEA
Vishay
R2
560 k, 1/4 W Chip Resistor
CRCW12065600FKEA
Vishay
R3
12 , 1/4 W Chip Resistor
CRCW120612R0FKEA
Vishay
R4
27 Ω, 1/4 W Chip Resistor
CRCW120627R0FKEA
Vishay
MMRF1315NR1
4
RF Device Data
Freescale Semiconductor, Inc.
C7
VGG
R2
R1
C19
B1
R3
C8
C15
C9
C2
C3
C5
R4
C18
L2
CUT OUT AREA
C6
L1
C1
VDD
C16 C17
B2
C11
C10
C12
C13
C14
C4
TO--270/272
Surface /
Bolt down
Figure 3. MMRF1315NR1 Test Circuit Component Layout
MMRF1315NR1
RF Device Data
Freescale Semiconductor, Inc.
5
D
30
Gps
19
18
IRL
17
--30
--40
ACPR
16
15
14
20
VDD = 28 Vdc, Pout = 14 W (Avg.)
IDQ = 450 mA, N--CDMA IS--95
Pilot, Sync, Paging, Traffic Codes 8
Through 13
--50
--60
ALT1
820
860
840
880
900
920
940
960
--70
980
0
ACPR (dBc), ALT1 (dBc)
Gps, POWER GAIN (dB)
20
--5
--10
--15
--20
IRL, INPUT RETURN LOSS (dB)
40
21
D, DRAIN
EFFICIENCY (%)
TYPICAL CHARACTERISTICS
f, FREQUENCY (MHz)
D
18
17
40
VDD = 28 Vdc, Pout = 28 W (Avg.)
IDQ = 450 mA, N--CDMA IS--95
Pilot, Sync, Paging, Traffic Codes 8
Through 13
IRL
16
--20
--30
ACPR
15
14
13
50
Gps
--40
--50
ALT1
820
840
860
880
900
920
940
960
--60
980
0
ACPR (dBc), ALT1 (dBc)
Gps, POWER GAIN (dB)
19
--5
--10
--15
--20
IRL, INPUT RETURN LOSS (dB)
60
20
D, DRAIN
EFFICIENCY (%)
Figure 4. Single--Carrier N--CDMA Broadband Performance
@ Pout = 14 Watts Avg.
f, FREQUENCY (MHz)
Figure 5. Single--Carrier N--CDMA Broadband Performance
@ Pout = 28 Watts Avg.
21
--10
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
IDQ = 675 mA
550 mA
Gps, POWER GAIN (dB)
20
450 mA
350 mA
19
225 mA
18
17
VDD = 28 Vdc, f1 = 880 MHz, f2 = 880.1 MHz
Two--Tone Measurements
16
10
1
100
Pout, OUTPUT POWER (WATTS) PEP
Figure 6. Two--Tone Power Gain versus
Output Power
200
VDD = 28 Vdc, f1 = 880 MHz, f2 = 880.1 MHz
Two--Tone Measurements
--20
--30
IDQ = 225 mA
--40
350 mA
--50
675 mA
450 mA
550 mA
--60
1
10
100
200
Pout, OUTPUT POWER (WATTS) PEP
Figure 7. Third Order Intermodulation Distortion
versus Output Power
MMRF1315NR1
6
RF Device Data
Freescale Semiconductor, Inc.
--10
IMD, INTERMODULATION DISTORTION (dBc)
IMD, INTERMODULATION DISTORTION (dBc)
TYPICAL CHARACTERISTICS
VDD = 28 Vdc, IDQ = 450 mA
f1 = 880 MHz, f2 = 880.1 MHz
Two--Tone Measurements
--20
--30
--40
--50
3rd Order
--60
5th Order
--70
--80
7th Order
1
100
10
200
0
VDD = 28 Vdc, Pout = 60 W (PEP)
IDQ = 450 mA, Two--Tone Measurements
(f1 + f2)/2 = Center Frequency of 880 MHz
--10
--20
--30
IM3--U
IM3--L
--40
--50
IM7--U
IM7--L
--60
--70
IM5--U
IM5--L
1
0.1
10
80
Pout, OUTPUT POWER (WATTS) PEP
TWO--TONE SPACING (MHz)
Figure 8. Intermodulation Distortion Products
versus Output Power
Figure 9. Intermodulation Distortion Products
versus Tone Spacing
58
Pout, OUTPUT POWER (dBm)
Ideal
P6dB = 51.31 dBm (135.21 W)
57
56
55
P3dB = 50.39 dBm (109.4 W)
54
53
P1dB = 49.41 dBm
(87.3 W)
52
51
Actual
50
VDD = 28 Vdc, IDQ = 450 mA
Pulsed CW, 12 sec(on)
1% Duty Cycle, f = 880 MHz
49
48
27
29
28
30
31
32
33
34
35
36
37
Pin, INPUT POWER (dBm)
65
60
55
50
45
40
35
30
25
20
15
10
5
0
VDD = 28 Vdc, IDQ = 450 mA
f = 880 MHz, N--CDMA IS--95
Pilot, Sync, Paging, Traffic Codes
8 Through 13
ACPR
Gps
D
ALT1
1
10
--15
--20
--25
25_C
--30
85_C
--35
--30_C
--40
25_C
--45
--30_C
85_C --50
--55
--30_C --60
--65
85_C
--70
25_C
--75
--80
100
TC = --30_C
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
ALT1, CHANNEL POWER (dBc)
D, DRAIN EFFICIENCY (%), Gps, POWER GAIN (dB)
Figure 10. Pulsed CW Output Power versus
Input Power
Pout, OUTPUT POWER (WATTS) AVG.
Figure 11. Single--Carrier N--CDMA ACPR, ALT1, Power Gain
and Drain Efficiency versus Output Power
MMRF1315NR1
RF Device Data
Freescale Semiconductor, Inc.
7
TYPICAL CHARACTERISTICS
TC = --30_C
Gps
25_C
Gps, POWER GAIN (dB)
20
85_C
19
25_C
18
85_C
70
60
50
40
17
30
16
20
VDD = 28 Vdc
IDQ = 450 mA
f = 880 MHz
D
15
1
10
20
19
18
28 V
32 V
17
10
VDD = 24 V
0
200
100
IDQ = 450 mA
f = 880 MHz
21
Gps, POWER GAIN (dB)
--30_C
D DRAIN EFFICIENCY (%)
21
14
22
80
22
16
0
20
40
60
80
100
120
Pout, OUTPUT POWER (WATTS) CW
Pout, OUTPUT POWER (WATTS) CW
Figure 12. Power Gain and Drain Efficiency
versus CW Output Power
Figure 13. Power Gain versus Output Power
140
MTTF (HOURS)
108
107
106
105
90
110
130
150
170
190
210
230
250
TJ, JUNCTION TEMPERATURE (C)
This above graph displays calculated MTTF in hours when the device
is operated at VDD = 28 Vdc, Pout = 14 W Avg., and D = 32.5%.
MTTF calculator available at http:/www.freescale.com/rf. Select Tools
(Software & Tools)/Calculators to access MTTF calculators by product.
Figure 14. MTTF versus Junction Temperature
MMRF1315NR1
8
RF Device Data
Freescale Semiconductor, Inc.
N--CDMA TEST SIGNAL
--10
100
--20
--30
1
--40
--50
0.1
IS--95 CDMA (Pilot, Sync, Paging, Traffic Codes 8
Through 13) 1.2288 MHz Channel Bandwidth
Carriers. ACPR Measured in 30 kHz Bandwidth @
750 kHz Offset. ALT1 Measured in 30 kHz
Bandwidth @ 1.98 MHz Offset. PAR = 9.8 dB @
0.01% Probability on CCDF.
0.01
0.001
(dB)
PROBABILITY (%)
10
--70
--80
--90
0.0001
0
2
4
6
--60
8
PEAK--TO--AVERAGE (dB)
Figure 15. Single--Carrier CCDF N--CDMA
10
1.2288 MHz
Channel BW
.. ..................................................
. . . .
............
..
..
..
..
..
..
.
..
...
.
..
.
--ALT1 in 30 kHz
+ALT1 in 30 kHz
.
..
.
Integrated BW
Integrated BW
......................
.........
..........
.....
..........
. ..............
...... ... ..
.
.
.
.
.
.
.
..............
.....
............
.........
.......... .
...
......
......
........
..........
.
.
.
.
.
.
.
.
.
.........
............. .
.
.
.
....... --ACPR in 30 kHz
.
.
.
.
..
....
.
.
+ACPR in 30 kHz ...................
.......
.. ............
.
.
...........
...
................
.
.
.
.
.
.
Integrated BW
Integrated BW
..
........
......
..........
......
............
...........
--100
--110
--3.6 --2.9 --2.2
--1.5
--0.7
0
0.7
1.5
2.2
2.9
3.6
f, FREQUENCY (MHz)
Figure 16. Single--Carrier N--CDMA Spectrum
MMRF1315NR1
RF Device Data
Freescale Semiconductor, Inc.
9
Zo = 5 
f = 910 MHz
Zsource
f = 910 MHz
Zload
f = 850 MHz
f = 850 MHz
VDD = 28 Vdc, IDQ = 450 mA, Pout = 14 W Avg.
f
MHz
Zsource

Zload

850
0.44 -- j0.20
2.28 + j0.23
865
0.44 -- j0.07
2.18 + j0.33
880
0.45 + j0.50
2.20 + j0.47
895
0.48 + j0.18
2.15 + j0.61
910
0.52 + j0.29
2.00 + j0.68
Zsource = Test circuit impedance as measured from
gate to ground.
Zload
= Test circuit impedance as measured
from drain to ground.
Output
Matching
Network
Device
Under
Test
Input
Matching
Network
Z
source
Z
load
Figure 17. Series Equivalent Source and Load Impedance
MMRF1315NR1
10
RF Device Data
Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
MMRF1315NR1
RF Device Data
Freescale Semiconductor, Inc.
11
MMRF1315NR1
12
RF Device Data
Freescale Semiconductor, Inc.
MMRF1315NR1
RF Device Data
Freescale Semiconductor, Inc.
13
PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following resources to aid your design process.
Application Notes
 AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages
 AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Engineering Bulletins
 EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
 Electromigration MTTF Calculator
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software
& Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
0
July 2014
Description
 Initial Release of Data Sheet
MMRF1315NR1
14
RF Device Data
Freescale Semiconductor, Inc.
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E 2014 Freescale Semiconductor, Inc.
MMRF1315NR1
Document
Number:
RF Device
DataMMRF1315N
Rev.
0, 7/2014Semiconductor,
Freescale
Inc.
15