UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 Future Technology Devices International Datasheet UMFT230XA USB to Basic UART Development Module UMFT230XA is a USB to Basic UART DIP module with a 0.3” row pitch. 1 Introduction The UMFT230XA is a development module for FTDI’s FT230XQ, one of the devices from FTDI’s range of USB interface bridging integrated circuit devices. FT230X is a USB to UART interface with a battery charger detection feature, which can allow batteries to be charged with a higher current from a dedicated charger port (without the FT230X being enumerated). In addition, asynchronous and synchronous bit bang interface modes are available. The internally generated clock (6MHz, 12MHz and 24MHz) can be brought out of the on one of the CBUS pin to be used to drive a microprocessor or external logic. The UMFT230XA is a module which is designed to plug into a standard 0.3” wide 16 pin DIP socket. All components used, including the FT230XQ are Pb-free (RoHS compliant). 1.1 Features The UMFT230XA is fitted with a FT230XQ; all the features of the FT230X can be utilized with the UMFT230XA. For a full list of the FT230X’s features please see the FT230X datasheet which can be found by clicking here. In addition to the features listed in the FT230X datasheet, the UMFT230XA has the following features: Small PCB assembly module designed to fit a standard 7.62mm (0.3”) wide 16 pin DIP socket. Pins are on a 2.54mm (0.1”) pitch. On board USB ‘mini-B’ socket allows module to be connected to a PC via a standard A to mini-B USB cable. Functionally configurable using solder links. The default solder links setup enables the module to function without peripheral wires or application board. Other configurations enable external power supply options and variation of logic reference levels. N either the whole nor any part of the information c ontained in, or the product desc ribed in this manual, may be adapted or re produced in any material or electronic form without the prior written cons ent of the copyright hold er. This product and its documentation are s upplied on an as-is basis and no warranty as to their s uitability for any partic ular purpose is either made or implied. Future T ec hnology D evices International L td will not accept any claim for damages hows oever aris ing as a res ult of us e or failure of this produc t. Y our s tatutory rights are not affec ted. T his produc t or any variant of it is not intended for use in any medical appliance, device or sys tem in whic h the failure of the produc t might reasonably be expec ted to res ult in personal injury. T his doc ument provides preliminary information that may be s ubjec t to c hange without notice. N o freedom to us e patents or other intellec tual property rights is implied by the public ation of this document. Future Tec hnology Devic es I nternational Ltd, U nit 1 , 2 Seaward P lace, C enturion Business Park, G las gow, G 4 1 1 HH, U nited Kingdom. Sc otland Registered N umber: SC136640 Copyright © Future Technology Devices International Limited UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 Table of Contents 1 Introduction ................................................................. 1 1.1 Features ................................................................................ 1 2 Driver Support .............................................................. 3 3 Ordering Information & TID .......................................... 4 4 UMFT230XA Signals and Configurations ......................... 5 4.1 UMFT230XA Pin Out ............................................................... 5 4.2 Signal Descriptions ................................................................ 6 4.3 CBUS Signal Options............................................................... 7 5 Module Configurations .................................................. 8 5.1 Solder Link Configuration Options........................................... 8 5.2 Solder Link Modifications........................................................ 8 5.3 Bus Power Configuration ........................................................ 9 5.4 Self Powered Configuration ...................................................10 5.5 USB Bus Powered with Power Switching Configuration ...........11 5.6 Variable IO Voltage Supply ....................................................12 5.7 3.3V Voltage Supply ..............................................................13 5.8 Configuring the MTP ROM ......................................................14 5.9 Module Dimensions ...............................................................14 5.10 IC Package Markings .............................................................15 6 UMFT230XA Module Circuit Schematic ......................... 16 7 Internal MTPROM Configuration .................................. 17 8 Contact Information .................................................... 18 Appendix A – References ................................................. 19 Document References ...................................................................19 Acronyms and Abbreviations .........................................................19 Appendix B – List of Figures and Tables............................ 20 List of Figures ...............................................................................20 List of Tables ................................................................................20 Appendix C – Revision History.......................................... 21 Copyright © Future Technology Devices International Limited 2 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 2 Driver Support Royalty-Free VIRTUAL COM PORT (VCP) DRIVERS for: Royalty-Free D2XX Direct Drivers (USB Drivers + DLL S/W Interface): Windows 10 32, 64 bit Windows 10 32, 64 bit Windows 8 and 8.1 32,64-bit Windows 8 and 8.1 32,64-bit Windows 7 32,64-bit Windows 7 32,64-bit Windows Vista Windows Vista Windows XP 32,64-bit Windows XP 32,64-bit Windows XP Embedded Windows XP Embedded. Windows CE.NET 4.2 , 5.0 and 6.0 Windows CE.NET 4.2, 5.0 and 6.0 MAC OS OS-X MAC OS OS-X Linux 3.0 and greater Linux 3.0 and greater Android Android The drivers listed above are all available to download for free from www.ftdichip.com. Various 3rd Party Drivers are also available for various other operating systems - visit www.ftdichip.com for details. Copyright © Future Technology Devices International Limited 3 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 3 Ordering Information & TID Module Code Utilised IC Code TID Description UMFT201XA-01 FT201XQ 40001460 USB to I2C evaluation module , Pin length: 5.6mm. UMFT201XA-02 FT201XQ 40001460 USB to I2C evaluation module , Pin length: 4.6mm. UMFT220XA-01 FT220XQ 40001461 USB to 4-bit SPI/FT1248 evaluation module, Pin length: 5.6mm. UMFT220XA-02 FT220XQ 40001461 USB to 4-bit SPI/FT1248 evaluation module, Pin length: 4.6mm. UMFT221XA-01 FT221XQ 40001462 USB to 8-bit SPI/FT1248 evaluation module, Pin length: 5.6mm. UMFT221XA-02 FT221XQ 40001462 USB to 8-bit SPI/FT1248 evaluation module, Pin length: 4.6mm. UMFT230XA-01 FT230XQ 40001463 USB to Basic UART evaluation module, Pin length: 5.6mm. UMFT230XA-02 FT230XQ 40001463 USB to Basic UART evaluation module, Pin length: 4.6mm. UMFT231XA-01 FT231XQ 40001464 USB to Full-Handshake UART evaluation module, Pin length: 5.6mm. UMFT231XA-02 FT231XQ 40001464 USB to Full-Handshake UART evaluation module, Pin length: 4.6mm. UMFT240XA-01 FT240XQ 40001466 USB to 8-bit 245 FIFO evaluation module , Pin length: 5.6mm. UMFT240XA-02 FT240XQ 40001466 USB to 8-bit 245 FIFO evaluation module, Pin length: 4.6mm. TID is the test identification code. Note that this TID is for revision D silicon. Copyright © Future Technology Devices International Limited 4 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 4 UMFT230XA Signals and Configurations 4.1 UMFT230XA Pin Out J2-1 – SLD VBUS VCC GND – J1-1 3V3OUT VCCIO CBUS3 RESET# CBUS2 CTS# CBUS1 RTS# CBUS0 RXD J2-8 – GND TXD – J1-8 Figure 4.1 – Module Pin Out Figure 4.1 illustrates the signals available on the DIL pins. The LHS shows the pinout when the module is viewed from the bottom. The RHS shows what signals are available (on the pins below) when viewed from the top. The pins do not go completely through the PCB. Copyright © Future Technology Devices International Limited 5 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 4.2 Signal Descriptions Pin No. J1-1, J2-8 Name GND Type PWR Power J1-2 3V3OUT Input/ Output Description Module Ground Supply Pins 3.3V output from integrated LDO regulator. This pin is decoupled with a 100nF capacitor to ground on the PCB module. The prime purpose of this pin is to provide the 3.3V supply that can be used internally. For power supply configuration details see section 5. Power +1.8V to +3.3V supply to the UART Interface and CBUS I/O pins. For power supply Input configuration details see section 5. J1-3 VC CIO J1-4 RESET# Input J1-5 C TS# Input C lear To Send C ontrol Input / Handshake Signal. J1-6 RTS# Output Request to Send Control Output / Handshake Signal. J1-7 RXD Input Receiving Asynchronous Data Input. J1-8 TXD Output Transmit Asynchronous Data Output. J2-1 SLD GND USB C able Shield. Connected to GND via a 0ohm resistor. FT230X active low reset line. Configured with an on board pull-up and recommended filter capacitor. 5V Power output from the USB bus. For a low power USB bus powered design, up to J2-2 Power VBUS Output 100mA can be sourced from the 5V supply and applied to the USB bus. A maximum of 500mA can be sourced from the USB bus in a high power USB bus powered design. C urrents up to 1A can be sourced from a dedicated charger and applied to the USB bus. Power J2-3 VC C J2-4 C BUS3 I/O J2-5 C BUS2 I/O J2-6 C BUS1 I/O J2-7 C BUS0 I/O Input 5V power input for FT230X. For power supply configuration details see section 5. C onfigurable CBUS I/O Pin. Function of this pin is configured in the device internal MTP ROM. . See C BUS Signal Options, Table 4.2. C onfigurable CBUS I/O Pin. Function of this pin is configured in the device internal MTP ROM.. See CBUS Signal Options, Table 4.2. C onfigurable CBUS I/O Pin. Function of this pin is configured in the device internal MTP ROM.. See CBUS Signal Options, Table 4.2. C onfigurable CBUS I/O Pin. Function of this pin is configured in the device internal MTP ROM. See CBUS Signal Options, Table 4.2. Table 4.1 – Module Pin Out Description Copyright © Future Technology Devices International Limited 6 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 4.3 CBUS Signal Options The following options can be configured on the CBUS I/O pins. These options are all configured in the internal MTP ROM using the utility software FT_PROG, which can be downloaded from the www.ftdichip.com. The default configuration is described in DS_UMFT231XA. CBUS Signal Option Available On CBUS Pin Description Tristate C BUS0-C BUS3 IO Pad is tristated TXDEN C BUS0-C BUS3 Enable transmit data for RS485 DRIVE_1 C BUS0-C BUS3 Output a constant 1 DRIVE_0 C BUS0-C BUS3 Output a constant 0 PWREN# C BUS0-C BUS3 Output is low after the device has been configured by USB, then high during USB suspend mode. This output can be used to control power to exte rnal logic P-C hannel logic level MOSFET switch. NOTE: This function is driven by an open-drain to ground with no internal pull-up; this is specially designed to aid battery charging applications. UMFT230XA connects an on-board 47K pull-up to each CBUS and DBUS pin. TXLED# C BUS0-C BUS3 Transmit data LED drive – open drain pulses low when transmitting data via USB. RXLED# C BUS0-C BUS3 Receive data LED drive – open drain pulses low when receiving data via USB. TX&RXLED# C BUS0-C BUS3 LED drive – open drain pulses low when transmitting or receiving data via USB. SLEEP# C BUS0-C BUS3 Goes low during USB suspend mode. Typically used to power down an external logic to RS232 level converter IC in USB to RS232 converter designs. C ancel SLEEP# option for when connected to a dedicated charger port, this can be selected when configuring the MTP ROM. When this option is enabled SLEEP# is driven high when FT230X is connected to a Dedicated Charger Port. C LK24MHz C BUS0-C BUS3 24 MHz C lock output.** C LK12MHz C BUS0-C BUS3 12 MHz C lock output.** C LK6MHz C BUS0-C BUS3 6 MHz C lock output.** GPIO C BUS0-C BUS3 C BUS bit bang mode option. Allows up to 4 of the C BUS pins to be used as general purpose I/O. Configured individually for CBUS0, CBUS1, CBUS2 and C BUS3 in the internal MTP ROM. A separate application note, AN232R-01, available from FTDI website (www.ftdichip.com) describes in more detail how to use C BUS bit bang mode. BC D_C harger C BUS0-C BUS3 Battery C harge Detect indicates when the device is connected to a dedicated battery charger host. Active high output. NOTE: Requires a 10K pull-down to remove power up toggling. BC D_C harger# C BUS0-C BUS3 Active low BCD Charger, driven by an open drain to ground with no internal pull-up (4.7K on board pull-up present). BitBang_WR# C BUS0-C BUS3 Synchronous and asynchronous bit bang mode WR# strobe output. BitBang_RD# C BUS0-C BUS3 Synchronous and asynchronous bit bang mode RD# strobe output. VBUS Sense C BUS0-C BUS3 Input to detect when VBUS is present. Time Stamp C BUS0-C BUS3 Toggle signal which changes state each time a USB SOF is received Keep_Awake# C BUS0-C BUS3 Active Low input, prevents the chip from going into suspend. Table 4.2 – CBUS Signal Options **When in USB suspend mode the outputs clocks are also suspended . Copyright © Future Technology Devices International Limited 7 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 5 Module Configurations 5.1 Solder Link Configuration Options Solder Link No. JP1 JP1 Setting Status Description Shorted Default C onnects internal 3.3V regulator to VCCIO. This restricts signal drive to only 3.3V level signals. Opened NonDefault Disconnects internal 3.3V regulator connection to VCCIO. This mode allows for the supply of 1.8V-3.3V power from an external power supply, thus allows the processing of signals with logic levels between 1.8V and 3.3V. VCCIO can be adjusted to match the interface requirements of external circuitry. Table 5.1 – Solder Links JP1 Pin Description Solder Link No. Setting Status Description JP2 Shorted Default C onnects VBUS to VCC. This mode is known as “BUS-Powered” mode. JP2 Opened NonDefault Disconnects VBUS to VCC. This allows the supply of power form an external power supply. This mode is known as “Self-Powered” mode. Table 5.2 – Solder Links JP2 Pin Description Note: There should never be more than one power output supplied to the same net. Failure to properly remove solder from JP1 and JP2 can cause a direct short between two different power supplies (when a self-powered set-up is applied and the USB bus is connected) resulting in damage to the UMFT230XA module and the target circuit. 5.2 Solder Link Modifications The UMFT230XA has two solder links fixed to the top side of the PCB. These solder link can be adjusted by removing the solder linking the two PADs to produce an open o r by placing a solder bridge to produce a short. By default the UMFT230XA has both solder links shorting their pads. To allow for enhanced flexibility of this module remove both solder links and wire the header pins according to the power setup required. Copyright © Future Technology Devices International Limited 8 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 5.3 C learance N o.: FT DI# 2 6 9 Bus Power Configuration GND Alternative connection VCCIO VCC 3V3OUT VBUS Alternative connection Current Flow GND Self-Sourced 3V3 TTL Mode Solder Link JP1 - Closed Bus Powered Mode Solder Link JP2 - Closed Viewing pins thourgh the board from the top. Figure 5.1 – Bus Powered Configuration A bus powered configuration draws its power from the USB host/hub. The UMFT230XA is configured by default to be in bus powered mode. Figure 5.1illustrates the UMFT230XA module in a typical USB bus powered design configuration. By default solder bridge connections link VCCIO to 3V3OUT, and VCC to VBUS. (Note that Figure 5.1 is for illustration only and that the pins do not actually go all the way through the PCB For a bus power configuration power is supplied from the USB VBUS: +5V VBUS power is sourced from the USB bus and is connected to the FT230X power input (VCC) +3.3V power is sourced from the FT230X’s voltage regulator output and is connected to the FT230X IO port’s power input (VCCIO). Interfacing the UMFT230XA module to a microcontroller (MCU), or other logic devices for bus powered configuration is done the same way as a self powered configuration (see Section 3), except that it is possible for the MCU or external device to take its power supply from the USB bus (either the 5V from the USB pin, or 3.3V from the 3V3OUT pin). Copyright © Future Technology Devices International Limited 9 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 5.4 C learance N o.: FT DI# 2 6 9 Self Powered Configuration Vcc = 1.8V – 3.3V Vcc = 5V VIO TXD MCU TXD RXD RXD RTS# RTS# CTS# CTS# VCCIO VCC 3V3OUT VBUS GND Self Power Variable TTL Mode Viewing pins thourgh the board Mode Solder Link JP2 - Open from the top. Solder Link JP1 - Open Figure 5.2 – Self-Powered Configuration A self-powered configuration operates on the principle of drawing power from an external power supply, as oppose to drawing power from the USB host. In this configuration no current is drawn from the USB bus. Figure 5.2 illustrates the UMFT230XA in a typical USB self-powered configuration. In this case the solder links connection of JP1 is removed, which allows 5V power to be supplied to the module VCC pins from an external source. VCCIO can to be powered from 3V3OUT or the VCC of an external source. (Note that Figure 5.2 is for illustration only and that the pins do not actually go all the way through the PCB) For a self-powered configuration it is necessary to prevent current from flowing back to the USB data lines when the connected USB host or hub has powered down. To carry out this function the UMFT230XA uses an on-board voltage divider network connected to the USB power bus and RESET# pin. This operates on the principle that when no power is supplied to the VBUS line , the FT230X will automatically be held in reset by a weak pull-down, when power is applied the voltage divider will apply a weak 3.3V pull-up. Driving a level to the RESET# pin of the UMFT230XA will override the effect of this voltage divider. When the FT230X is in reset the USB DP signal pull-up resistor connected to the data lines is disconnected and no current can flow down the USB lines. An example of interfacing the FT230X with a Microcontroller’s UART interface is also illustrated in Figure 5.2. This example shows the wire configuration of the transfer and handshake lines. This example also illustrates that a voltage other than 3.3V can be supplied to the FT230X’s IO port, this feature is described further and for bus powered mode in Section 5.6. Alternatively both the FT230X’s IO port and MCU can be powered from the 3V3OUT pin; this approach is described in Section 5.5. Copyright © Future Technology Devices International Limited 10 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 5.5 C learance N o.: FT DI# 2 6 9 USB Bus Powered with Power Switching Configuration 5V P-Channel Power MOSFET s d VCC TXD 0.1uF 10K RXD TXD RTS# Soft Start Circuit CBUSx PWREN# RXD CTS# 0.1uF g 1K RTS# MCU CTS# VCCIO VCC 3V3OUT VBUS GND Self-Sorced 3.3V TTL Mode Solder Link JP1 - Closed Bus Powered Mode Solder Link JP2 - Closed Viewing pins thourgh the board from the top. Figure 5.3 – Bus Powered with Power Switching Configuration USB bus powered mode is introduced in Section 5.3. This section describes how to use this mode with a power switch. USB bus powered circuits are required by USB compliance standards to consume less than 2.5mA (and less than 100mA when not enumerated and not suspended) when connected to a host or hub when in USB suspend mode. The PWREN# CBUS function can be used to remove power from external circuitry whenever the FT230X is not enumerated. (Note: It is impossible to be in suspended mode when enumerated.) (Note that Figure 5.3 is for illustration only and that the pins do not actually go all the way through the PCB) To implement a power switch using PWREN#, configure a P -Channel Power MOSFET to have a soft start by fitting a 10K pull-up, a 1K series resistor and a 100nF cap as shown in Figure 5.3. The time constant Connecting the source of the P-Channel MOSFET to 3V3OUT instead of VBUS can allow external logic to source 3.3V power from the FT230X without breaking USB compliancy. In this setup it is important that the VCCIO is not sourced from the drain of this MOSFET, this is because the power used to drive the gate of this transistor is sourced from VCCIO. VCCIO should be connected directly to 3V3OUT for this setup to function effectively. It is also important that the external logic must and IO core of the FT230X must not draw more that 50mA, this is because the current limit of the internal 3.3V regulator is 50mA. Copyright © Future Technology Devices International Limited 11 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 5.6 C learance N o.: FT DI# 2 6 9 Variable IO Voltage Supply Vcc = 1.8V – 3.3V TXD MCU TXD RXD RXD RTS# RTS# CTS# CTS# VCCIO VCC 3V3OUT VBUS GND Solder Link JP1 - Open Solder Link JP2 - Closed Viewing pins thourgh the board from the top. Figure 5.4 – USB Bus Powered 3.3V Logic Drive The FT230X can process signals at CMOS/TTL logic levels in the range of 1.8V to 3.3V. This section describes how to utilise this feature. Figure 5.4 shows a configuration where the FT230X is interfaced to a device with IOs operating in the range of 1.8V – 3.3V. The IO ports of this module need to be powered with a voltage level that is equal to the level of the signals it is processing. Since the FT230X’s embedded voltage regulator only outputs 3V3 the IO ports will need to be powered from another power source when operating at voltage levels other than 3.3V. (Note that Figure 5.4 is for illustration only and that the pins do not actually go all the way through the PCB) By default, a short is present between 3V3OUT (embedded voltage regulator) and VCCIO (IO port’s power input) by solder links JP1. If an external power supply is used to power the IO ports this solder links needs to be open. This can be done by removing the solder linking the tw o pads of the solder links. The configuration described in this section can be implemented in either bus -powered mode or selfpowered mode. Note 1: The CBUS and DBUS pins are 5V tolerant; however these signals cannot drive signals at 5V TTL/CMOS. VCCIO is not 5V tolerant; applying 5V to VCCIO will damage the chip. Copyright © Future Technology Devices International Limited 12 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 Note 2: If power is applied to VCCIO and no power is applied to VCC all Ios will be at an unknown state, this however will not damage the chip. The FT230X also has protective circuitry to prevent the chip being damaged by a voltage discrepancy between VCCIO and the level of the signal being processed . Note 3: When using VCCIO less than 3V3 on a chip from FTDI’s X -chip range, it is recommended to uses pull up resistors (47K) to VCCIO on the da ta lines, all of the UMFT2xxXA devices include an on-board pull-up for these lines. 5.7 3.3V Voltage Supply Vcc = 3.3V Vcc = 3.3V TXD MCU TXD RXD RXD RTS# RTS# CTS# CTS# VCCIO VCC 3V3OUT VBUS GND Solder Links JP2 - Open Solder Links JP1 - Closed Viewing pins thourgh the board from the top. Figure 5.5 – USB Self Powered 3.3V Logic Drive The FT230X can be powered from a single 3.3V supply. This feature is an alternative to having the FT230X powered at 5V in standard self-powered configuration. The 3.3V Self Powered configuration is illustrated in Figure 5.5. Note that the 3.3V input is connected to VCC, VCCIO and 3V3OUT. (Note that Figure 5.5 is for illustration only and that the pins do not actually go all the way through the PCB) Copyright © Future Technology Devices International Limited 13 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 5.8 C learance N o.: FT DI# 2 6 9 Configuring the MTP ROM The FT230X contains an embedded MTP ROM. This can be used to configure the functions of each CBUS pin, the current drive on each signal pin, current limit for the USB bus and the other descriptors of the device. For details on using the MTP ROM/EEPROM programming utility FT_PROG, please see the FT_PROG User Guide and FT201X datasheet. When programming the MTP ROM please note: i) One of the CBUS Pins can be configured as PWREN# in the internal MTP ROM. This can be used to switch the power supply to the external circuitry. ii) The Max Bus Power setting of the MTP ROM should specify the maximum current to be drawn from the USB host/hub when enumerated. For high-powered USB devices the current limit when enumerated is between 100mA and 500mA, for low -powered USB devices the current limit is 100mA. 5.9 Module Dimensions 2.54 28.32 7.62 12.2 2.4 7.6 30.1 2.2 L -01 L = 5.6mm -02 L = 4.6mm Figure 5.6 – UMFT230XA Module Dimensions All dimensions are given in millimetres. The UMFT230XA module exclusively uses lead free components, and is fully compliant with European Union directive 2002/95/EC. Copyright © Future Technology Devices International Limited 14 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 5.10 IC Package Markings 1 FTDI I XXXXXXXXXX 12 FT230XQ YYWW-D 5 8 The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number. This is followed by the revision letter. The code XXXXXXX is the manufacturing LOT code. Copyright © Future Technology Devices International Limited 15 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 UMFT230XA Module Circuit Schematic Figure 6.1 – Module Circuit Schematic Copyright © Future Technology Devices International Limited 16 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 7 Internal MTPROM Configuration Following a power-on reset or a USB reset the FT230X will scan its internal MTP ROM and read the USB configuration descriptors stored there. The default values programmed into the internal MTP ROM in the FT230XQ used on the UMFT230XA are shown in Table 8.1. Parameter Value USB Vendor ID (VID) 0403h FTDI default VID (hex) USB Product UD (PID) 6015h FTDI default PID (hex) Serial Number Enabled? Notes Yes Serial Number See Note A unique serial number is generated and programmed into the, TP ROM during final test of the module. Pull down I/O Pins in USB Suspend Disabled Enabling this option will make the device pull down on the UART interface lines when the power is shut off (PWREN# is high). Manufacturer Name FTDI Product Description UMFT230XA Max Bus Power C urrent Power Source 90mA Bus Powered Device Type FT230X USB Version 0200 Returns USB 2.0 device description to the host. Note: The device is a USB 2.0 Full Speed device (12Mb/s) as opposed to a USB 2.0 High Speed device (480Mb/s). Remote Wake Up Enabled Taking RI# low will wake up the USB host controller from suspend. High C urrent I/Os Disabled Enables the high drive level on the UART and CBUS I/O pins. Load VC P Driver Enabled Makes the device load the CVP driver interface for the device. C BUS0 GPIO C BUS1 GPIO C BUS2 GPIO C BUS3 GPIO Invert UART Disabled Signal on this pin becomes TXD# if enable. Table 7.1 – Default Internal MTP ROM Configuration The internal MTP ROM in the FT230X can be programmed over USB using the utility program FT_PROG. FT_PROG can be downloaded from the www.ftdichip.com. Users who do not have their own USB vendor ID but who would like to use a unique Product ID in their des ign can apply to FTDI for a free block of unique PIDs. Contact FTDI Support ([email protected]) for this service , also see TN_100 and TN_101. Copyright © Future Technology Devices International Limited 17 UMFT230XA Datasheet Version 1.4 D oc ument Reference N o.: FT _000519 C learance N o.: FT DI# 2 6 9 8 Contact Information Head Office – Glasgow, UK Branch Office – Tigard, Oregon, USA Future Technology Devices International Limited Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 Future Technology Devices International Limited (USA) 7130 SW Fir Loop Tigard, OR 97223-8160 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) E-mail (Sales) E-mail (Support) E-mail (General Enquiries) [email protected] [email protected] [email protected] [email protected] [email protected] [email protected] Branch Office – Taipei, Taiwan Branch Office – Shanghai, China Future Technology Devices International Limited (Taiwan) 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan , R.O.C. 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Sc otland Registered Company N umber: SC136640 Copyright © Future Technology Devices International Limited 18 UMFT230XA D oc ument Reference N o.: FT _000519 Datasheet Version 1.4 C learance N o.: FT DI# 2 6 9 Appendix A – References Document References DS_FT201x DS_FT220X DS_FT221X DS_FT230X DS_FT231X DS_FT240X DS_UMFT230XA AN232R-01 AN_124 User Guide for FT Prog TN_100 USB VID-PID Guidelines TN_101 Guide to Debugging Customers Failed Driver Installation Acronyms and Abbreviations Terms Description DIP Dual In-line Package DLL Dynamic Link Library IC Integrated Circuit I²C Inter Integrated Circuit OS Operating System PCB Printed Circuit Board ROM Read Only Memory USB Universal Serial Bus VCP Virtual COM Ports Copyright © Future Technology Devices International Limited 19 UMFT230XA D oc ument Reference N o.: FT _000519 Datasheet Version 1.4 C learance N o.: FT DI# 2 6 9 Appendix B – List of Figures and Tables List of Figures Figure 4.1 – Module Pin Out ................................................................................................................... 5 Figure 5.1 – Bus Powered Configuration.................................................................................................. 9 Figure 5.2 – Self-Powered Configuration ............................................................................................... 10 Figure 5.3 – Bus Powered with Power Switching Configuration .............................................................. 11 Figure 5.4 – USB Bus Powered 3.3V Logic Drive .................................................................................... 12 Figure 5.5 – USB Self Powered 3.3V Logic Drive ................................................................................... 13 Figure 6.1 – UMFT230XA Module Dimensions ........................................................................................ 14 Figure 8.1 – Module Circuit Schematic .................................................................................................. 16 List of Tables Table 4.1 – Module Pin Out Description................................................................................................... 6 Table 4.2 – CBUS Signal Options ............................................................................................................ 7 Table 5.1 – Solder Links JP1 Pin Description ........................................................................................... 8 Table 5.2 – Solder Links JP2 Pin Description ........................................................................................... 8 Table 9.1 – Default Internal MTP ROM Configuration ............................................................................. 17 Copyright © Future Technology Devices International Limited 20 UMFT230XA D oc ument Reference N o.: FT _000519 Datasheet Version 1.4 C learance N o.: FT DI# 2 6 9 Appendix C – Revision History Document Title: UMFT230XA USB to Basic UART Development Module Document Reference No.: FT_000519 Clearance No.: FTDI# 269 Product Page: http://www.ftdichip.com/FT-X.htm Document Feedback: Send Feedback Revision Changes Date 1.0 Initial Release 2012-02-09 1.0 Added links, references to silicon revision, TID and logos 2012-06-13 1.2 Added a section for package marking and changed TIDs 2013-01-29 1.3 Added - 02 details 2013—11-08 1.4 Added ordering information and support for Win 10 2016-04-13 Copyright © Future Technology Devices International Limited 21