DS1650B 01

RT1650B
Wireless Power Receiver Compliant with WPC
General Description
The RT1650B is a wireless power receiver compliant
with WPC V1.1 standard. The RT1650B integrates a
synchronous full-bridge rectifier, a low dropout
regulator, and a Micro Controller Unit (MCU) for control
and communication. The device receives AC power
from a WPC compatible wireless transmitter and
provides output power up to 7.5W, which could be used

High Accurate Received Power Calculation for
FOD Function
 10-bit ADC for Voltage/Current Measurement
 Coil Power Loss Modeling for Optimized
Compensation
Adaptive Power Offset Compensation
Low Quiescent Embedded 32-bit ARM Cortex-M0


as a power supply for a charger of mobile or consumer
devices.
MCU
 32KB ROM/OTP, 1KB SRAM and 272B MTP
The MCU-based controller can support bi-direction
channel communication including Frequency Shift
Keying (FSK) demodulation for power signal from the
transmitter and Amplitude Shift Keying (ASK)
modulation for power signal to the transmitter. The
RT1650B provides Foreign Object Detection (FOD)

function to meet the requirement after WPC V1.1. It
communicates with the transmitter for the received
power to determine if a foreign object is present within
the magnetic interface. This provides a higher level of
safety.
The RT1650B provides a programmable dynamic
rectifier voltage control function to improve power
efficiency, a programmable power management control
for maximum power delivery, a programmable current
limit for suitable load setting, a programmable temperature
setting with external NTC for thermoregulation, and
proper protection functions such as UVLO, OVP, and
OTP.

Single-Chip WPC V1.1 Compliant Receiver

Integrated Synchronous Rectifier Switch
 Support Output Power up to 7.5W
 High Rectifier Efficiency up to 96%
 High System Efficiency up to 80%
 Programmable Loading for Synchronous Rectifier
Operation
Programmable Dynamic Rectifier Voltage Control
for Optimized Transient Response and Power
Efficiency
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01










April 2016
Power Transmitter
Programmable Temperature Control
Programmable Charge Status Packet
Support Alignment with Transmitter
Support Enable, Charge Complete and Fault
Control Inputs
Receiver Controlled EPT Packet
Over Current Limit
Over Voltage Protection
Thermal Shutdown
CSP 3.0mm x 3.4mm 48B (Pitch = 0.4mm)
Low Profile (0.5mm Max.)
Applications

Features


Easy Tuning for Communication and Control
Parameters
Support Bi-direction Channel Communication
 FSK Demodulation for Power Signal from
Wireless Power Transmitter
 ASK Modulation for Power Signal to Wireless




WPC Compliant Receivers
Cell Phones & Smart Phones
Digital Cameras
Power Banks
Wireless Power Embedded Batteries

Headsets
Portable Media Players

Hand-held Devices

is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
RT1650B
Ordering Information
RT1650B
(TOP VIEW)
RT1650B Version
(Refer to Product Name List)
Package Type
WSC : WL-CSP-48B 3x3.4 (BSC)
Note :
Richtek products are :

Pin Configurations
A1
A3
A4
A5
A6
PGND
PGND
PGND
BOOT1
B1
B2
B3
B4
B5
B6
AC2
AC2
AC2
AC1
AC1
AC1
C1
C2
C3
C4
C5
C6
RECT
RECT
RECT
RECT
RECT
COM1
D1
D2
D3
D4
D5
D6
OUT
OUT
OUT
OUT
OUT
CLMP1
E1
E2
E3
E4
E5
E6
GND
NC
NC
VDD1
VDD2
COM2
RoHS compliant and compatible with the current
F1
F2
F3
F4
F5
F6
requirements of IPC/JEDEC J-STD-020.
SCL
SDA
GPIO
VDD1
VDD2
CLMP2
G2
G3
G1

A2
BOOT2 PGND
Suitable for use in SnPb or Pb-free soldering
processes.
Marking Information
TS
MODE0 MODE1
G4
G5
G6
NC
NC
PGND
H1
H2
H3
H4
H5
H6
CHG
ADEN
ADD
GND
GND
PGND
WL-CSP-48B 3x3.4 (BSC)
RT1650BWSC-2
RT1650B
WSC-2
YMDNN
RT1650BWSC-2 : Product Number
YMDNN : Date Code
RT1650BWSC-3
RT1650B
WSC-3
YMDNN
RT1650BWSC-3 : Product Number
YMDNN : Date Code
RT1650BWSC-4
RT1650B
WSC-4
YMDNN
RT1650BWSC-4 : Product Number
YMDNN : Date Code
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
2
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
RT1650B Product Name List
Description
MTP
Address
Kyocera
Kyocera
Kyocera
RT1650BWSC-2 RT1650BWSC-3 RT1650BWSC-4
[7:0] = tReceived.
0x5
0x60
0x50
[7:0] = pCF_B3.
0x9
0x1E
0x48
[7:0] = VRECT_set2.
0x22
0x8A
0xD0
[7:0] = VRECT_set3.
0x23
0x8A
0xD0
[7:0] = VRECT_set4.
0x24
0x12
0x16
[7:0] = IOUT_th3.
0x27
0x32
0x32
[7:0] = TS_th.
0x2A
0x92
0xF2
[3:0] = TS_cold_MSB. [7:4]=TS_th_MSB.
0x2C
0x13
0x03
[7:0] = POWER_OFFSET.
0x5A
0x35
0x35
[7:0] = Parameter A.
0x5C
0x19
0x19
[7:0] = RCS100.
0x5E
0x91
0x91
[7:0] = Rx100.
0x5F
0xFF
0xFF
[7:0] = Interval_offset.
0x6D
0x00
0x02
[7:0] = EPT_MESSAGE_BY_GPIO.
0xCA
0x00
0x01
[7:7] = BATTFEN.
[6:0]=BATTFEN_Wtime.
0xD2
0x00
0x00
[7:7] = EPK_EN.
[6:6] = BATTERY_FULL_CS_EN
0xD5
0x00
0x00
[7:0] = FAST_CE_interval.
0xE0
0x14
0x64
[3:3] = RT_VRECT_TRACK_BY_VOUT.
[7:7]=RT_VRECT_TRACK_EN.
0xFF
0x88
0x00
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
Program all the
MTP parameter
into the OTP.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
3
RT1650B
Typical Application Circuit
Q1 PMDPB80XP
USB or
AC Adapter Input
RT1650B
ADEN
OUT
ADD
C5
1μF/10V x 1
0.1μF/10V x 1
CCLAMP1
0.47μF/50V
CCOMM1
22nF/50V
CBOOT1
10nF/50V
C
47nF/50V x 4 S
COUT
1μF/10V x 1
0.1μF/10V x 1
CLMP1
R4
1.5k
COM1
CHG
RECT
BOOT1
CRECT
10μF/16V x 2
AC1
CD
1.8nF/50V
WPC Standard
12μH Coil
D1
System
Load
SCL
CBOOT2
10nF/50V
CCOMM2
22nF/50V
CCLAMP2
0.47μF/50V
CVDD1
1μF/10V
AC2
SDA
GPIO
BOOT2
MODE0
COM2
MODE1
CLMP2
VDD1
TS
R1
33k
VDD2
CVDD2
1μF/10V
GND
PGND
NTC
NCP15WF104F03RC
100k ohm
Note : The component value and the maximum voltage rating is based on the WPC standard transmitter and 5V
adapter application. The customer should modify it depend on the different design and application.
Functional Pin Description
Pin No.
Pin Name
I/O
Pin Function
A1
BOOT2
O
A6
BOOT1
O
Bootstrap Supply for Driving the High-side FETs of Synchronous Rectifier.
Connect a 10nF ceramic capacitor from BOOT1 to AC1 and from BOOT2
to AC2.
A2 to A5
G6, H6
PGND
B1 to B3
AC2
I
B4 to B6
AC1
I
C1 to C5
RECT
O
C6
COM1
O
E6
COM2
O
Open-Drain Output for Communication with Transmitter. Connect through
a capacitor to AC1/AC2 for capacitive load modulation.
D1 to D5
OUT
O
Power Output of Regulator.
Power Ground.
AC Power Input from Receiver Coil.
Output of Synchronous Rectifier. Connect a ceramic capacitor (10F to
22F) between this pin to PGND.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
4
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
Pin No.
Pin Name
I/O
Pin Function
D6
CLMP1
O
F6
CLMP2
O
Open Drain Output for Over-voltage Clamp Protection. Connect a 0.47F
ceramic capacitor between this pin to AC1/AC2. When the RECT voltage
exceeds 11.5V, both switches will be turned on and the capacitors will act
as a low impedance to protect the IC from damage.
E1, H4,
H5
E2, E3
G4, G5
GND
Analog Ground.
NC
No Connection. Keep this pin as floating.
power input or ground.
Do not connect this pin to
E4, F4
VDD1
O
Voltage Supply for Internal Circuit. Connect a 1F ceramic capacitor
between this pin and GND.
E5, F5
VDD2
O
Voltage Supply for Internal Circuit. Connect a 1F ceramic capacitor
between this pin and GND.
F1
SCL
I
I2C Compatible Series-Clock Input for internal register/MTP access.
F2
SDA
I/O
I2C Compatible Series-Data Input/Output for internal register/MTP access.
F3
GPIO
I/O
H1
CHG
O
H2
ADEN
O
General Purpose Input/Output.
Open-Drain Indicator Output. When the output regulator is enabled, this
pin is pulled to low.
Enable Control Output for External P-FET connecting ADD and OUT. This
pin is pulled to the higher of OUT and ADD when turning off the external
FET. This voltage tracks approximately 4V below ADD when voltage is
present at ADD.
H3
ADD
I
Adapter Power Detection Input. Connect this pin to the adapter input.
When a voltage is applied to this pin, wireless power is disabled and
ADEN is pulled low. If not used, this pin should be connected to ground.
Temperature Sense Input. Connect a NTC between this pin and GND for
temperature sensing. If the temperature sensing function is desired,
connect a 24k resistor to GND. Host side can control this pin to send end
power transfer (EPT) to the transmitter: pull-low for EPT fault; pull-up for
EPT termination.
G1
TS
I
G2
MODE0
I
G3
MODE1
I
Operation Mode Control Input. These two pins are used to set power
source operation mode.
[MODE0, MODE1] = [0, 0]. Auto mode. Adapter power prior.
[MODE0, MODE1] = [0, 1]. Wireless power mode.
[MODE0, MODE1] = [1, 0]. Adapter power mode and OTG mode
[MODE0, MODE1] = [1, 1]. Disable both adapter and wireless powers.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
5
RT1650B
Functional Block Diagram
CLMP1 CLMP2
VDD1 VDD2
RECT
ADD
OTP
OVP
AC1
AC2
Regulator
Adapter
Detection
ADEN
UVLO
Synchronous
Rectifier Control
OUT
PGND
-
Clock
Generator
9MHz
BOOT1
BOOT2
+
COM1
VOUT
FSK
DeCoder
COM2
Packet
Control
ROM / OTP
32KB
ROM 4KB
(boot loader)
MTP
272B
CHG
ADC
10-bit
40kHz
VRECT
Register
Bank
I2C
Slave
VREF
GND
IOUT
TS
VTS
SCL
SDA
MCU
32-bit
SRAM
1KB
Mode
Control
MODE0
MODE1
GPIO
GPIO
Digital
Control
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
6
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
Operation
MCU Based Digital Circuit
Mode Control
RT1650B is a SoC (System on Chip) produce, which
contains system level feature to control the
communication with power transmitter, power
calculation and GPIO. The firmware can be
programmed into OTP (One Time Programmable)
memory, so that user can discuss the features with
RICHTEK, and custom some functions and GPIO
behavior. To flexibly control whole functions, this chip
embedded a MTP (Multiple Time Programmable)
memory to save various setting and parameters. The
Mode control is using for the default mode, wireless
mode, adapter mode and disable mode selection.
external host can real-time
information via I2C interface.
AC2. This information can use for the FSK (Frequency
Shift Key) decode to the WPC medium power standard.
read
some
power
Adapter Detection
In the default mode and adapter mode, adapter
detection block control the ADEN pin to follow the
VADD-5V to avoid the PMOS damaged.
FSK Decoder
This block analysis the frequency from the AC1 and
OVP (Over Voltage Protection)
This information also can use for the power loss
calculation of the resonant tank.
The OVP function using to protect the abnormal power
signal to let the RT1650B damaged. Once the VRECT
exceeds 11.5V, this block will drive the CLAMP MOS to
Packet Control
avoid the over voltage damage.
OTP (Over Temperature Protection)
The OTP function shuts down the linear regulator
operation when the junction temperature exceeds
150C. Once the junction temperature cools down by
around 20C, the receiver will automatically resume
operating.
This block build up the WPC standard 2kHz bi-phase
encoding scheme with the asynchronous serial format
and the packet structure. This block control the
open-drain MOS to achieve the ASK (Amplitude Shift
Key) communication.
Synchronous Rectifier Control
This block detect the zero-cross of the AC1 and AC2
voltage then control the high-side and low-side MOS of
the rectifier. RT1650B provide the Asynchronous,
Half-synchronous and Full-synchronous control to
optimize the rectifier efficiency.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
7
RT1650B
Absolute Maximum Ratings
(Note 1)

Supply Input Voltage, AC1, AC2, RECT, COM1, COM2, OUT, CHG ------------------------------------ 0.3V to 20V

Supply Input Voltage, ADD, ADEN-------------------------------------------------------------------------------- 0.3V to 30V

Supply Input Voltage, BOOT1, BOOT2 -------------------------------------------------------------------------- 0.3V to 26V

Input Current, AC1, AC2--------------------------------------------------------------------------------------------- 2A(rms)

Output Current, OUT ------------------------------------------------------------------------------------------------- 2A

Output Sink Current, CHG ------------------------------------------------------------------------------------------ 15mA

Output Sink Current, COM1, COM2 ------------------------------------------------------------------------------ 1A

Power Dissipation, PD @ TA = 25C
WL-CSP-48B 3x3.4 --------------------------------------------------------------------------------------------------- 3.67W

Package Thermal Resistance
(Note 2)
WL-CSP-48B 3x3.4, JA --------------------------------------------------------------------------------------------- 27.2C/W

Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------- 260C

Junction Temperature ------------------------------------------------------------------------------------------------ 150C

Storage Temperature Range --------------------------------------------------------------------------------------- 65C to 150C

ESD Susceptibility
(Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------------- 2kV
MM (Machine Model) ------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions
(Note 4)

Supply Input Voltage Range, RECT ------------------------------------------------------------------------------ 4V to 10V

Input Current, RECT -------------------------------------------------------------------------------------------------- 1.5A

Output Current, OUT ------------------------------------------------------------------------------------------------- 1.5A

Sink Current, ADEN -------------------------------------------------------------------------------------------------- 1mA

Sink Current, COM ---------------------------------------------------------------------------------------------------- 500mA

Ambient Temperature Range--------------------------------------------------------------------------------------- 40C to 85C

Junction Temperature Range -------------------------------------------------------------------------------------- 40C to 125C
Electrical Characteristics
(TA = 25C, unless otherwise specified)
Parameter
Symbol
RECT Under-voltage Lockout
Threshold
VRECT_UVLO
Test Conditions
Min
Typ
Max
Unit
VRECT Rising : 0V  3V
2.6
2.7
2.8
V
RECT UVLO Hysteresis
VRECT Falling : 3V  0V
--
250
--
mV
RECT Over-Voltage Threshold
VRECT Rising : 7V  13V
11
11.5
12
V
VRECT Falling : 13V  7V
--
150
--
mV
Input
RECT Over-Voltage
Hysteresis
VRECT_OVP
Dynamic VRECT Setting-1
VRECT_SET1
(Note 5) (VRECT_SET1 = 8’h2BC)
--
7
--
Dynamic VRECT Setting-2
VRECT_SET2
(Note 5) (VRECT_SET2 = 8’h276)
--
6.3
--
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
8
V
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Dynamic VRECT Setting-3
VRECT_SET3
(Note 5) (VRECT_SET3 = 8’h244)
--
5.8
--
Dynamic VRECT Setting-4
VRECT_SET4
(Note 5) (VRECT_SET4 = 8’h212)
--
5.3
--
V
IOUT Hysteresis for Dynamic
VRECT Settings
IOUT_TH_HYS
(Note 5)
--
5
--
%
RECT Quiescent Current
IQ
--
8
--
mA
IOUT = 1mA
4.95
5
5.05
IOUT = 1A
4.94
4.99
5.04
IOUT = 1.5A
4.90
4.96
5.02
--
100
200
mV
10
-
10
%
A
Regulator Output
OUT Regulation Voltage
Regulator Drop-out Voltage
VOUT_REG
VDROP
VRECT –VOUT, IOUT = 1A
Output Current Limit Tolerance IOUT_LIMIT
IOUT =1.5A
OUT Leakage Current
Disabled, VOUT = 5V
--
40
--
Programmable IOUT Threshold
Range to Enable
Half-Synchronous Rectifier
IOUT Rising
(Note 5)
50
--
500
Programmable IOUT Threshold
ISR_TH
Range to Enable
Full-Synchronous Rectifier
IOUT Rising
(Note 5)
150
--
750
Programmable IOUT Hysteresis
Range
IOUT Falling
(Note 5)
25
--
100
IOUT_LKG
V
Synchronous Rectifier
Rectifier Diode Voltage in
Asynchronous Mode
mA
VDIODE
IAC-VRECT = 250mA
--
0.65
--
V
TS Thermoregulation
Threshold
VTS_REG
VTS Falling (TS_th = 8’h192)
(Note 5)
--
786
--
mV
Too-Hot Protection Threshold
VTS_HOT
VTS Falling (TS_hot = 8’h8E)
(Note 5)
--
278
--
mV
VTS Rising (TS_cold = 8’h3A4)
(Note 5)
--
1.82
--
V
--
60
--
A
(Note 5)
--
150
--
(Note 5)
--
20
--
TS Sense/Control Input
Too-Cold Protection Threshold VTS_COLD
TS Output Current
ITS
Over-Temperature Protection
Over-Temperature Protection
Threshold
Over-Temperature Protection
Hysteresis
TJ
°C
CHG Indicator Output
CHG Low-Level Output
Voltage
VCHG_L
ISINK = 5mA
--
--
100
mV
CHG Leakage Current when
disabled
ICHG_LKG
VCHG = 20V
--
--
1
A
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
9
RT1650B
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
--
0.7
--

--
2
--
kHz
--
--
1
A
--
0.5
--

VADD Rising : 0V  5V
3
3.6
4
V
VADD Falling : 5V  0V
--
400
--
mV
VADD = 5V , VRECT = 0V
--
--
60
A
Pull-up Resistance from ADEN
to OUT pin when Adapter
RADD
mode is disabled
VADD = 0V, VOUT = 5V
--
275
350

ADD to ADEN Voltage when
Adapter Mode is Enabled
VADD = 5V, VADD – VADEN
3
4.25
5
V
COM Outputs
COM1, COM2 N-FET
On-Resistance
RON_COM
COM1, COM2 Signaling
Frequency
f COM
COM1, COM2 Leakage
Current
ICOM_LKG
VRECT = 2.6V
VCOM1 = VCOM2 = 20V
CLAMP Outputs
CLMP1, CLMP2 N-FET
On-Resistance
RON_CLM
Adapter Power Enable Control
ADD Detection Voltage
Threshold
VADD
ADD Detection Voltage
Hysteresis
ADD Input Leakage Current
IADD_LKG
VAD_EN
GPIO Input/Output
GPIO Input Voltage
(Logic-Low)
VIL
0
--
0.8
V
GPIO Input Voltage
(Logic-High)
VIH
2
--
5
V
GPIO Output Voltage
(Logic-Low)
VOL
--
--
0.4
V
GPIO Output Voltage
(Logic-High)
VOH
2.6
3.3
3.6
V
--
--
0.25
W
Received Power (WPC Related Measurements)
Received Power Accuracy
I2C Compatible Interface
PRX_AC
IOUT = 0A to 1A
(Note 5)
(Note 5)
Logic Input (SDA, SCL) Low
Level
VSCL_L
--
--
0.6
V
Logic Input (SDA, SCL) High
Level
VSCL_H
1.2
--
--
V
SCL Clock Frequency
f CLK
10
--
400
kHz
Output Fall Time
tFL2COUT
--
--
250
ns
Bus Free Time Between
Stop/Start
tBUF
1.3
--
--
s
Hold Time Start Condition
tHD_STA
0.6
--
--
s
Setup Time for Start Condition
tSU_STA
0.6
--
--
s
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
10
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
SCL Low Time
tLOW
1.3
--
--
s
SCL High Time
tHIGH
0.6
--
--
s
Data Setup Time
tSU_DAT
100
--
--
ns
Data Hold Time
tHD_DAT
0
--
900
ns
Setup Time for Stop Condition
tSU_STO
0.6
--
--
s
Logic Input (MODE0, MODE1)
VMODE_L
Low Level
--
--
0.6
V
Logic Input (MODE0, MODE1)
VMODE_H
High Level
1.2
--
--
V
3
5
7
kHz
Mode Control
Communication Interface
FSK Modulation Frequency
Change
f FSK
fOP = 175kHz
(Note 5)
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. JC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Specification is guaranteed by design and/or correlation with statistical process control.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
11
RT1650B
Typical Operating Characteristics
Rectifier Efficiency
100
80
95
70
90
Efficiency (%)
Efficiency (%)
System Efficiency
90
60
50
40
30
85
80
75
70
20
65
10
WPC A10 Tx
WPC A10 Tx
60
0
0
1
2
3
4
5
6
7
0
8
1
2
Output Power (W)
Receiver Efficiency
4
5
6
7
8
Rectifier Voltage
100
7.5
95
7.0
6.5
90
85
VRECT (V)
Efficiency (%)
3
Output Power (W)
80
75
70
6.0
5.5
Rising
Falling
5.0
4.5
4.0
65
3.5
WPC A10 Tx
3.0
60
0
1
2
3
4
5
6
7
0.00 0.15 0.30 0.45 0.60 0.75 0.90 1.05 1.20 1.35 1.50
8
Output Current (A)
Output Power (W)
Output Voltage vs. Output Current
Start-Up without Loading
5.010
Output Voltage (V)
5.008
5.006
5.004
5.002
VRECT
(2V/Div)
5.000
VOUT
(2V/Div)
4.998
4.996
IOUT
(500mA/Div)
4.994
0.00 0.15 0.30 0.45 0.60 0.75 0.90 1.05 1.20 1.35 1.50
Output Current (A)
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
12
IOUT = 0A, WPC A10 Tx
Time
Time (500ms/Div)
( xx μs/Div)
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
Load Transient Response
Start-Up with Loading
VRECT
(2V/Div)
VOUT
(2V/Div)
VRECT
(2V/Div)
VOUT
(2V/Div)
IOUT
(500mA/Div)
IOUT
(500mA/Div)
IOUT = 0A to 1A, WPC A10 Tx
IOUT = 1A, WPC A10 Tx
Time (500ms/Div)
Time (500ms/Div)
Load Transient Response
Synchronous Rectifier
IOUT = 1A
VRECT
(2V/Div)
VOUT
(2V/Div)
IAC1
IOUT
(500mA/Div)
(1A/Div)
IOUT = 1A to 0A, WPC A10 Tx
VAC1VAC2
(2V/Div)
Time (500ms/Div)
Time (5s/Div)
Dynamic Rectifier Voltage
Communication
VRECT
(2V/Div)
VRECT
(2V/Div)
VOUT
(2V/Div)
IOUT
(500mA/Div)
COMM1
(2V/Div)
IOUT = 150mA to 450mA
Time (500ms/Div)
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
Time (3.29ms/Div)
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
13
RT1650B
Default Mode
Battery Full Detection
VADD = 10V, MODE0 = 0, MODE1 = 0
COMM1
(5V/Div)
VRECT
(5V/Div
VRECT
(2V/Div)
VOUT
(5V/Div)
VOUT
(2V/Div)
IOUT
(100mA/Div)
IBat_full = 50mA
VADD
(5V/Div)
Time (100ms/Div)
Time (200ms/Div)
Adapter Mode
VRECT
(5V/Div)
Wireless Mode
VRECT
(5V/Div)
VOUT
(5V/Div)
VOUT
(5V/Div)
VADD
(5V/Div)
VADD = 10V, MODE0 = 1, MODE1 = 0
VADD
(5V/Div)
VADD = 10V, MODE0 = 0, MODE1 = 1
Time (200ms/Div)
Time (200ms/Div)
Disable Mode
OTG Mode
VRECT
(5V/Div)
VRECT
(5V/Div
VOUT
(5V/Div)
VOUT
(5V/Div)
VADD
(5V/Div)
VADD
(5V/Div)
VADD = 10V, MODE0 = 1, MODE1 = 1
Time (200ms/Div)
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
14
VADD = 10V, MODE0 = 1, MODE1 = 0
Time (500ms/Div)
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
Functional Description
Description of the Wireless Power System
The power transferred to power receiver is controlled
A wireless power system is composed by a power
transmitter with one or more primary coils and a power
receiver in a mobile system. Power transmitter will
transfer power via a DC-to-AC inverter to drive a
strong-coupled inductor to power receiver in a mobile
by itself. The power receiver sends communication
packets with control error voltage information to the
power transmitter for power tracking. The bit rate of the
communication link from receiver to transmitter is
2kbps.
device.
Mobile Device
Load
Sensing&
Control
Output
Power
Sensing
Power Pick-up
Communications
Control
Unit
& Control Unit
Power
Conversion
Unit
Sensing
Control
Communications
& Control Unit
Input
Power
Sensing &
Control
System Unit
Base Station
Figure 1. Wireless Power System
Start-up
Power Transfer phases
When the receiver is placed on the power pad, the
receiver coil is inductively coupled to the magnetic flux
generated by the coil in the power pad which
consequently induces a voltage in the receiver coil. The
internal synchronous rectifier feeds this voltage to the
RECT pin which has the filter capacitor. The RT1650B
communicates to the transmitter by switching on and
off the COM FETs.
There are 4 power transfer phases for the WPC V1.1.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016

Selection : As soon as the Power Transmitter applies
a Power Signal, the Power Receiver shall enter the
selection phase.

Ping : The power Receiver should send the Digital
Ping Packet to power Transmitter then into next
phase. If not, the system shall revert to the Selection
phase. The power Receiver also can send the End
Power transfer Packet to stop the power Transmitter.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
15
RT1650B

Identification & Configuration : In this phase, the
Power Receiver identifies the revision of the System
Description Wireless Power Transfer the Power

Receiver complies and configuration information
such as the maximum power that the Power Receiver
intends to provide at its output. The Power
Transmitter uses this information to create a Power
Transfer Contract.
Power Transfer : In this phase, the Power
Transmitter continues to provide power to the Power
Receiver. The power Receiver sends the Control
Error Packet for adjusting the Primary Cell current.
The Power Transmitter stops to provide power when
the Received Power Packet is too low to trigger the
FOD function or End Power Transfer Packet is sent
from power Receiver.
apply Power Signal
no response abort
Digital Ping
Ping
power transfer complete
extend Digital Ping
no Power Transfer Contract
unexpected Packet
transmission error time-out
Selection
Identification & Configuration
Power transfer
Contract established
Reconfigure
Power Transfer Contract
violation unexpected
Packet time-out
Power Transfer
power transfer complete
Figure 2. WPC V1.1 Low Power Transfer Phases
Micro Controller Unit
Memory Map
The memory mapping of MCU can be divided into 3
blocks, Code, SRAM and Peripheral. Each region has
its recommend usage, and the memory access
behavior could depend on which memory region you
table, which is a part of the program image. In OTP
version of chip, the programmable user firmware will be
stored in this area.
SRAM
The SRAM region starts from 0x2000_0000 and the
total access size is 1KB. It’s primarily used to store
are accessing to.
data, including stack.
Code
Peripheral
The size of the code region is 32KB. It is primarily used
to store program code, including the exception vector
There are 2 peripheral blocks in RT1650B, MTP and
peripheral registers. MTP (Multiple Time Programmable
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
16
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
Memory) is primarily used to save non-volatile user
setting data and part of MTP store internal factory
setting. User firmware can control some of chip
hardware behavior via peripheral registers. It also could
be an interface to communicate with external I2C via
the registers.
0x0000_0000
0x0000_7FFF
ROM / OTP
32 KB
Code
< IOUT_TH1
VRECT_SET1
IOUT_TH1 to IOUT_TH2
VRECT_SET2
MTP
272B
IOUT_TH2 to IOUT_TH3
VRECT_SET3
> IOUT_TH3
VRECT_SET4
SRAM
0x4000_01FF
reserved
0x5000_1FFF
Rectifier Voltage Target
reserved
0x4000_0000
0x5000_0000
Rectifier Voltage Control function to optimize the
transient response and power efficiency for
applications. Table 1 and Figure 4 show an example to
summarize how the rectifier behavior is dynamically
adjusted based the registers VRECT_SETx [7:0] (x = 1 to
4), which are available to be programmed by users.
Output Current, IOUT
SRAM
1 KB
0x2000_03FF
The RT1650B provides a programmable Dynamic
Table 1. Dynamic Rectifier Voltage Setting
reserved
0x2000_0000
Programmable Dynamic Rectifier Voltage Control
Peripheral
Peripheral
Register
Figure 3. Memory Map
If Ext. Charger w/ DPM
(ex. VDPM = 4.9V)
Dynamic Operation
Area
VRECT_SET1
VRECT_SET2
VRECT Tracking Stop Above
UVLO
VRECT_SET3
VRECT_SET4
Overloading
Operation Area
UVLO
OTP Triggered
VOUT
VRECT
IOUT_TH1 IOUT_TH2
IOUT_TH3
IOUT_LIMIT
I (A)
Figure 4. Dynamic Rectifier Voltage vs. Output Current
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
17
RT1650B
Thermal Management
Temperature,
Current
The RT1650B provides an external device thermal
management function with an external NTC thermistor
and a resistor connected between TS pin and GND pin
shown as Figure 5. User can use this function to control
the temperature of the coil, battery or other device.
An internal current source (60A) is provided to the
external NTC thermistor and generates a voltage at the
Regulation_temp
Temperature
Thermal regulation is active
Current-limit
Loading
Output Current
Time
TS pin. The TS voltage is detected and sent to the ADC
converter for external device thermal manage control.
The NTC thermistor should be placed as close as possible
to the device such as battery or mobile device. The
recommended NTC thermistor is NCP15WF104F03RC
ITS
TS
ADC
Figure 7. Thermoregulation Control
R1
RNTC
GND
Figure 5. NTC Circuit for Device Temperature
(tolerance ±1%, β = 4250k). The typical resistance of the
NTC is 100k at 25C. The recommended resistance for
R1 is 33k(±1%).The value of the NTC thermistor at the
desired temperature can be estimated by the following
equation.
RNTC_Reg = RO
Detection and Thermoregulation
Reg =
The thermal management function is shown as Figure
6. If the temperature is higher than Hot_temp or lower
than Cold_temp threshold, the RT1650 will send the
EPT to disable the power transfer. When the detected
temperature increases and reaches the desired
Regulation_temp, RT1650B will decrease the current
limit to reduce the output current to regulate the
temperature. When the detected temperature is lower
than the Regulation_temp, the current limit will increase
to the default value. This function is shown as Figure 7.
Temperature
Send EPT


β 1
-1
TReg T0 

e
R1  RNTC_Reg
R1+RNTC_Reg
where TReg is the desired regulation temperature
degree Kelvin. RO is the nominal resistance
temperature T0 and β is the temperature coefficient
the NTC thermistor. Req is the equivalent resistor
NTC thermistor in parallel with R1.
in
at
of
of
Figure 8 shows the equivalent resistance of the
thermistor in parallel with R1 resistor varies with
operating temperature. Figure 9 shows the VTS voltage
with operating temperature. Customer can select the
desire temperature and calculate the mapping data by
the following equation.
Hot_temp
Periodically reduce current limit to regulate temperature.
Thermal regulation is active.
Regulation_temp
Cold_temp
Send EPT
Data = (VST/2 x 1024)
If the thermal management function is not used (RNTC
= open), the resistor R1 = 24k must be connected
between the TS and GND pins
Figure 6. Thermal Management Function
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
18
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
30
turned-on, there is effectively a capacitor connected
between AC1 and AC2. The impedance seen by the
coil will be reflected in the primary as a change in
25
current.
Resistance (kΩ)
35
CS
AC1
20
Ccom
15
Coil
10
COM1
Cd
COM2
5
Ccom
0
AC2
-50
-25
0
25
50
75
100
125
150
Temperature (degree-C)
Figure 10. Capacitive Load Modulation
The RT1650B supports FSK demodulation to receive
Figure 8. Equivalent Resistance for Temperature
Sensing
2.0
1.8
1.6
VTS (V)
1.4
1.2
the power signal from the transmitter shown as Figure
11. The change in frequency between high and low
states is dependent on the operating frequency. The
power transmitter should modulate the power signal at
specific times during the Negotiation phase to avoid
interrupting communication packets from the receiver.
The FSK modulation scheme should be compliant with
WPC Volume II V0.9.
1.0
0.8
0.6
0.4
0.2
0.0
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Figure 11. FSK Modulation Power Signal
Figure 9. Thermal Sensing Voltage
Bit Encoding Scheme
Communication
The
RT1650B
supports
two
communication
modulations, Amplitude Shift Keying (ASK), Frequency
Shift Keying (FSK), to communicate with the power
transmitter. For ASK modulation, the RT1650B
provides two integrated communication N-FETs which
are connected to the COM1 and COM2 pins. These
N-FETs are used for modulating the secondary load
current which allows the RT1650B to communicate
Control Error and configuration information to the
transmitter. Figure 10 shows the RT1650B operating
with capacitive load modulation. When the N-FETs are
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
According to WPC protocol, the RT1650B uses a
differential bi-phase encoding scheme to modulate
data bits onto the Power Signal. The internal clock
signal has a frequency 2kHz. The Receiver shall
encode a ONE bit using two transitions in the Power
Signal, such that the first transition coincides with the
rising edge of the clock signal, and the second
transition coincides with the falling edge of the clock
signal. The Receiver shall encode a ZERO bit using a
single transition in the Power Signal, which coincides
with the rising edge of the clock signal. Figure 12
shows an example of the differential bi-phase encoding.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
19
RT1650B
Operation Mode Control
The RT1650B provides 2 input pins for operating mode
control. Table 4 shows an example of operating mode
Figure 12. Example of the Differential Bi-phase
Encoding
End Power Transfer Packet (WPC Header 0x02)
The End Power Transfer (EPT) packet is a special
command for the RT1650B to request the transmitter to
terminate power transfer. Table 2 specifies the reasons
coulomb and their responding data field value. The
condition column corresponds to the values sent by the
RT1650B for a given reason.
Table 2. End Power Transfer (EPT) packet
Reason
Value
0x00
VADD > 3.6V
Charge
Complete
0x01
From I2C, MODE0 = High
or VTS = High
Internal Fault
0x02
TJ > 150°C
Over
Temperature
0x03
VTS < VTS_HOT, VTS >
VTS_COLD or VTS = Low
Over Voltage
0x04
Over Current
Battery
Failure
Reconfigure
OTG mode to connect the OUT pin to power the USB
at ADD pin. If both MODE0 and MODE1 pins are pulled
Table 4. Operation Mode Control
Wireless Adapter
Mode MODE0 MODE1
OTG
Power
Power
Default 0
0
ON
ON(*)
OFF
Wireless 0
1
ON
OFF
OFF
Not Sent
Adapter 1
0
OFF
ON
Allowed
0x05
Not Sent
Disable 1
1
OFF
OFF
OFF
0x06
From I2C
0x07
Not Sent
0x08
VRECT target
converge
(*)Note: If both adapter power and wireless power are
present, adapter power is given higher priority.
doesn’t
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
20
wireless power operation only In adapter mode, the
wireless power is turned off always and ADEN is pulled
low to turn on external switch for adapter power In this
mode, it allows an external charger operating in USB
to high, the wireless power and adapter power are
disabled.
Condition
Unknown
No
Response
control for wireless power and external adapter power.
In default mode, both MODE0 and MODE1 are low, the
wireless power is enabled and the adapter power has a
higher priority. The wireless power is the normally
operation. Once the adapter power is detected, the
wireless power will be turned off and the ADEN will be
pulled low to turn on the external switch for connecting
the adapter power to system load. When the MODE1 is
pulled to high, the adapter power will be turned off by
the external switch and enters wireless mode to allow
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
I2C Interface
The RT1650B provides I2C interface to communicate
with external host device. Besides OTP firmware
programming and MTP setting programming can be
approached through the I2C interface, the external host
can also communicate with the RT1650B to achieve
more flexible applications. For example, the host can
read the ADC information via the I2C Interface. In
not fixed, the registers definition can be costumed by
firmware. If user need to read other information via I2C,
please discuss with RICHTEK firmware engineer.
I2C Slave
0100010X (in binary format)
0x44 / 0x45 (hex format, include R/W bit)
2
addition, the I C is used to read the internal status and
the power source is from the VRECT. If the wireless
function disable or in the adapter mode, the I2C can’t
be accessed. Table 3 shows the register definition. It’s
MSB
0
1
LSB
0
0
0
1
0 R/W
Table 3. RT1650B Register Definition
Address
MSB
LSB
0x64
7
0
Vrect
Vrect (4V to 8V), unit = 15.68mV
0x66
7
0
Vout
Vout (3V to 6V), unit = 11.76mV
0x67
7
0
Iout
Iout (0A to 2A), unit = 7.84mA
0x78
7
0
last CE packet
last CE packet
0x79
7
0
last RP packet
last RP packet
0x7A
7
0
Received Power [7:0] (mW)
low byte of Received Power (mW)
0x7B
6
0
Received Power [14:8] (mW)
high byte of Received Power (mW)
0x7B
7
7
Received Power updating flag
0: Received Power is valid
1: Received Power is updating, not valid
0x10
7
7
Vout enable
0: Vout is disable
1: Vout is enable
0x02
7
0
freq_cnt[7:0]
0x03
5
0
freq_cnt[13:8]
0x7C
3
0
Name
Description
Frequency = 1000 / ((freq_cnt[13:0] *
0.11) /128) KHz
WPC status
0:booting
1: ping phase
2: ID_CF phase
3: Negotiation phase
4: power transfer phase
WPC phase status
GPIO Interface
The RT1650B provides a programmable General
Purpose Input/Output (GPIO) pin. The GPIO can be
used as an input or used as a status indicator for
different application. Before use this GPIO, user should
discuss its functions with RICHTEK and then RICHTEK
code its function into firmware.
GPIO can be programmed as an output port, be a
status indicator. For example,


To indicate thermal regulation is active

To indicate battery is full or charging is complete
GPIO can be programmed as input port, to connect
external signal and inform MCU. For example,

Enable/Disable the output

Enable the End Power Packet
To control LED flashing when Rx position search
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
21
RT1650B
Option for GPIO


Internal pull-up option (pull-up to 3.3V)

Internal pull-low option
GPIO can be push-pull or open-drain architecture
when GPIO programmed as an output.
Table 5. RT1650B GPIO Specification
Symbol
Description
Min
Vil
input logic low voltage
Vih
input logic high voltage
Vol
output low voltage
Voh
output high voltage when push-pull architecture
Voh
output high voltage when open-drain
architecture
Typ
Max
0.8V
2V
5V
0.4V
Indicator Output
An open-drain output pin, CHG, is provided to indicate
the status of wireless power receiver. The CHG pin can
be connected to a LED for charge status indicator.
When the output of the RT1650B is enabled, the
open-drain N-FET at CHG pin will be pulled to low
2.6V
3.3V
Hi-Z
(OTP) feature to prevent excessive power dissipation
from overheating the device. The OTP function shuts
down the linear regulator operation when the junction
temperature exceeds 150°C. Once the junction
temperature cools down by around 20°C, the receiver
will automatically resume operating.
level.
Foreign Object Detection
Input Over-Voltage Protection
When the input voltage increases suddenly, the
RT1650B adjusts voltage-control loop to maintain
regulator output voltage and sends control error
packets to the transmitter every 30ms until the input
voltage comes back to the VRECT target level (refer to
Dynamic Rectifier Voltage Control Section). Once the
VRECT voltage exceeds its over-voltage threshold
(11.5V typ.), the RT1650B turns on the N-FETs at
CLMP1 and CLMP2 pins to shunt the input current
through external capacitors. By the way the CLAMP
function may affect the communication signal to let the
Tx re-start up.
Over-Temperature Protection
The RT1650B provides an Over Temperature Protection
CP
PTX,AC
PRX,AC
CS
AC1
The RT1650B is a WPC 1.1.1 compatible device. In
order to enable a power transmitter to monitor the
power loss across the interface as one of the possible
methods to limit the temperature rise of foreign objects,
the RT1650B reports its received power to the power
transmitter. The received power equals the power that
is available from the output of the power receiver plus
any power that is lost in producing that output power
(the power loss in the secondary coil and series
resonant capacitor, the power loss in the shielding of
the power receiver, the power loss in the rectifier). In
WPC1.1.1 specification, Foreign Object Detection
(FOD) is enforced. This means the RT1650 will send
received power information with known accuracy to the
transmitter. The received power is sensed as the
Figure 13.
RECT
M
VS
LP
POUT
PRECT
OUT
VRECT
LS
CD
Rectifier
IOUT
CRECT
Regulator
COUT
AC2
Figure 13. Received Power Sensed
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
22
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
Charge Current
Battery Charge Complete Detection
Charge Complete
The RT1650B supports battery charge complete
Delay Time
detection function. A programmable charge complete
current threshold and a programmable charge
complete delay time are provided. This function can be
used to send the Charge Status packet (0x05) to the
transmitter for indicating a full charged status 100%.
Note that this packet does not turn off the transmitter.
The charge complete current
from 0mA to 255mA and the
The charge complete time is
seconds to 2550 seconds and
seconds.
threshold is adjustable
default value is 50mA.
also adjustable from 0
the default value is 180
Charge Complete
Current Threshold
time
Figure 14. Battery Charge Complete Detection
There are 3 operation modes when the charge
complete status is detected. The first mode is to send a
CS packet (0x05) to transmitter only. The CS packet
does not turn off the transmitter. In the second mode,
the RT1650S will send a CS packet (0x05) and an EPT
packet to transmitter. In the third mode, the RT1650S
will send a CS packet (0x05) and stop communication
with the transmitter.
Charge Complete
Detection
CS Mode
1
Send CS Packet
(0x05)
2
3
Send CS Packet
(0x05)
Send CS Packet
(0x05)
Send EPT Packet
(0x02)
Stop
Communication
Figure 15. Operation Modes of Charge Complete Detection
Receiver Coil and Resonant Capacitors
According to WPC specification, the dual resonant
circuit of the power receiver comprises the receiver coil
and capacitors C1 and C2. The receiver coil design is
related to system design. Coil shape, material,
inductance and shielding need to be considered.
Shielding provides protection from interference
between wireless power system and mobile electronic
device. The recommended coil self-inductance is
between 8H to 13H. The capacitance of the resonant
capacitors can be calculated by the following equations.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
C1 =
C2 =
1
L'S   2 fS 
2
1
LS   2 fd  2
1
C1
In these equations, fs is resonant frequency with typical
value 100kHz; and fd is another resonant frequency
with typical value 1000kHz. L’s is coil self-inductance
when placed on the interface surface of a transmitter;
and LS is the self-inductance when placed away from
the transmitter.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
23
RT1650B
Firmware Setting
Please refer to another document for detailed description
of firmware setting.
16 allows the designer to see the effect of rising
ambient temperature on the maximum power
dissipation.
Maximum Power Dissipation (W) 1
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature.
The maximum power dissipation can be calculated by
the following formula :
PD(MAX) = (TJ(MAX)  TA) / JA
3.5
3.0
2.5
2.0
1.5
1.0
0.5
25
50
75
100
125
Ambient Temperature (°C)
Figure 16. Derating Curve of Maximum Power
Dissipation
For recommended operating condition specifications,
the maximum junction temperature is 125C. The
WL-CSP-48B 3x3.4 package
4.0
0
TA is the ambient temperature, and JA is the junction to
ambient thermal resistance.
PD(MAX) = (125C  25C) / (27.2C/W) = 3.67W for
Four-Layer PCB
4.5
0.0
where TJ(MAX) is the maximum junction temperature,
junction to ambient thermal resistance, JA, is layout
dependent. For WL-CSP-48B 3x3.4 package, the
thermal resistance, JA, is 27.2C/W on a standard
JEDEC 51-7 four-layer thermal test board. The
maximum power dissipation at TA = 25C can be
calculated by the following formula :
5.0
Layout Considerations
Follow the PCB layout
performance of the IC.



guidelines
for
optimal
Keep the traces of main current paths as short and
wide as possible.
Place the capacitors as close as possible to the IC.
Power ground should be as large as possible and
connected to a power plane for thermal dissipation.
The maximum power dissipation depends on the
operating ambient temperature for fixed TJ(MAX) and
thermal resistance, JA. The derating curve in Figure
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
24
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016
RT1650B
Power trace should be as short and
wide as possible.
RX2
RX1
CS1
CS2
CS3
CRECT1
CS4
CD1
CD2
CBOOT2
CRECT2
CBOOT1
PGND
PGND
PGND
PGND
BOOT1
AC2
AC2
AC2
AC1
AC1
AC1
RECT
RECT
RECT
RECT
RECT
COM1
OUT
OUT
OUT
OUT
OUT
CLMP1
PGND
NC
NC
VDD1
VDD2
COM2
SCL
SDA
GPIO
VDD1
VDD2
CLMP2
NC
NC
PGND
PGND
PGND
PGND
CCLMP1
COUT
BOOT2
CCOM1
GND
VOUT
ADEN
ADD
CCOM2
CHG
MODE0 MODE1
CCLMP2
CVDD2
CVDD1
TS
Power ground should be as large
as possible and connect to the
ground plane for thermal
dissipation.
Figure 17. PCB Layout Guide
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS1650B-01
April 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
25
RT1650B
Outline Dimension
Dimensions In Millimeters
Symbol
Dimensions In Inches
Min.
Max.
Min.
Max.
A
0.450
0.500
0.018
0.020
A1
0.170
0.230
0.007
0.009
b
0.240
0.300
0.009
0.012
D
3.350
3.450
0.132
0.136
D1
E
2.800
2.950
0.110
3.050
0.116
0.120
E1
2.000
0.079
e
0.400
0.016
48B WL-CSP 3x3.4 Package (BSC)
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume
responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and
reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
26
is a registered trademark of Richtek Technology Corporation.
DS1650B-01
April 2016