Data Sheet

Freescale Semiconductor
Technical Data
Document Number: AFT05MP075N
Rev. 1, 8/2014
RF Power LDMOS Transistors
High Ruggedness N--Channel
Enhancement--Mode Lateral MOSFETs
AFT05MP075NR1
AFT05MP075GNR1
Designed for mobile two--way radio applications with frequencies from
136 to 520 MHz. The high gain, ruggedness and broadband performance of
these devices make them ideal for large--signal, common source amplifier
applications in mobile radio equipment.
Typical Performance: 12.5 V, TA = 25C, CW
Frequency
Gps
(dB)
D
(%)
Pout
(W)
136 MHz
21.0
68.0
76
450--520 MHz (1)
14.6
65.8
75
520 MHz (2)
18.5
68.5
70
136–520 MHz, 70 W, 12.5 V
BROADBAND
RF POWER LDMOS TRANSISTORS
TO--270WB--4
AFT05MP075NR1
Load Mismatch/Ruggedness
Frequency
(MHz)
Signal
Type
520 (2)
CW
VSWR
Pin
(W)
Test
Voltage
> 65:1 at all
Phase Angles
2
(3 dB Overdrive)
17
Result
No Device
Degradation
1. Measured in 450--520 MHz UHF broadband reference circuit.
2. Measured in 520 MHz narrowband test circuit.
Features
 Characterized for Operation from 136 to 520 MHz
 Unmatched Input and Output Allowing Wide Frequency Range Utilization
 Integrated ESD Protection
 Integrated Stability Enhancements
 Wideband — Full Power Across the Band
 Exceptional Thermal Performance
 Extreme Ruggedness
 High Linearity for: TETRA, SSB, LTE
 In Tape and Reel. R1 Suffix = 500 Units, 44 mm Tape Width, 13--inch Reel.
Typical Applications
 Output Stage VHF Band Mobile Radio
 Output Stage UHF Band Mobile Radio
TO--270WBG--4
AFT05MP075GNR1
Gate A
Drain A
Gate B
Drain B
(Top View)
Note: Exposed backside of the package is
the source terminal for the transistors.
Figure 1. Pin Connections
 Freescale Semiconductor, Inc., 2013–2014. All rights reserved.
RF Device Data
Freescale Semiconductor, Inc.
AFT05MP075NR1 AFT05MP075GNR1
1
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
Drain--Source Voltage
VDSS
--0.5, +40
Vdc
Gate--Source Voltage
VGS
--6.0, +12
Vdc
Operating Voltage
VDD
17, +0
Vdc
Storage Temperature Range
Tstg
--65 to +150
C
Case Operating Temperature Range
TC
–40 to +150
C
Operating Junction Temperature Range (1,2)
TJ
–40 to +225
C
Total Device Dissipation @ TC = 25C
Derate above 25C
PD
690
3.45
W
W/C
Symbol
Value (2,3)
Unit
RJC
0.29
C/W
Table 2. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 80C, 70 W CW, 12.5 Vdc, IDQ(A+B) = 400 mA, 520 MHz
Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22--A114)
2, passes 2500 V
Machine Model (per EIA/JESD22--A115)
A, passes 250 V
Charge Device Model (per JESD22--C101)
IV, passes 2000 V
Table 4. Moisture Sensitivity Level
Test Methodology
Per JESD22--A113, IPC/JEDEC J--STD--020
Rating
Package Peak Temperature
Unit
3
260
C
Table 5. Electrical Characteristics (TA = 25C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
Zero Gate Voltage Drain Leakage Current
(VDS = 40 Vdc, VGS = 0 Vdc)
IDSS
—
—
3
Adc
Zero Gate Voltage Drain Leakage Current
(VDS = 12.5 Vdc, VGS = 0 Vdc)
IDSS
—
—
2
Adc
Gate--Source Leakage Current
(VGS = 5 Vdc, VDS = 0 Vdc)
IGSS
—
—
600
nAdc
Gate Threshold Voltage
(VDS = 10 Vdc, ID = 295 Adc)
VGS(th)
1.7
2.1
2.5
Vdc
Drain--Source On--Voltage
(VGS = 10 Vdc, ID = 3.0 Adc)
VDS(on)
—
0.14
—
Vdc
Forward Transconductance (4)
(VGS = 10 Vdc, ID = 8 Adc)
gfs
—
7.3
—
S
Characteristic
Off Characteristics
On Characteristics
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
4. Each side of device measured separately.
(continued)
AFT05MP075NR1 AFT05MP075GNR1
2
RF Device Data
Freescale Semiconductor, Inc.
Table 5. Electrical Characteristics (TA = 25C unless otherwise noted) (continued)
Characteristic
Symbol
Min
Typ
Max
Unit
Reverse Transfer Capacitance
(VDS = 12.5 Vdc  30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Crss
—
2.3
—
pF
Output Capacitance
(VDS = 12.5 Vdc  30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Coss
—
64
—
pF
Input Capacitance
(VDS = 12.5 Vdc, VGS = 0 Vdc  30 mV(rms)ac @ 1 MHz)
Ciss
—
148
—
pF
Dynamic Characteristics (1)
Functional Tests (2) (In Freescale Test Fixture, 50 ohm system) VDD = 12.5 Vdc, IDQ(A+B) = 400 mA, Pin = 1 W, f = 520 MHz
Common--Source Amplifier Output Power
Drain Efficiency
Pout
—
70
—
W
D
—
68.5
—
%
Load Mismatch/Ruggedness (In Freescale Test Fixture, 50 ohm system) IDQ(A+B) = 400 mA
Frequency
(MHz)
Signal
Type
VSWR
520
CW
> 65:1 at all Phase Angles
Pin
(W)
2
(3 dB Overdrive)
Test Voltage, VDD
Result
17
No Device Degradation
1. Each side of device measured separately.
2. Measurements made with device in straight lead configuration before any lead forming operation is applied. Lead forming is used for gull
wing (GN) parts.
AFT05MP075NR1 AFT05MP075GNR1
RF Device Data
Freescale Semiconductor, Inc.
3
TYPICAL CHARACTERISTICS
300
11
Ciss
9
IDS, DRAIN CURRENT (AMPS)
C, CAPACITANCE (pF)
100
Coss
10
8
6
5
4
10
3.25 Vdc
3
2
2.5 Vdc
3 Vdc
1
Measured with 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc
5
3.5 Vdc
7
Crss
1
0
VGS = 3.75 Vdc
TA = 25C
10
0
20
15
0
2
4
6
8
10
12
14
16
18
20
VDS, DRAIN--SOURCE VOLTAGE (VOLTS)
VDS, DRAIN--SOURCE VOLTAGE (VOLTS)
Note: Each side of device measured separately.
Note: Measured with both sides of the transistor tied together.
Figure 2. Capacitance versus Drain--Source Voltage
Figure 3. Drain Current versus Drain--Source Voltage
108
VDD = 12.5 Vdc
ID = 6.3 Amps
MTTF (HOURS)
107
7.8 Amps
106
9.4 Amps
105
104
90
110
130
150
170
190
210
230
250
TJ, JUNCTION TEMPERATURE (C)
Note: MTTF value represents the total cumulative operating time
under indicated test conditions.
MTTF calculator available at http://www.freescale.com/rf. Select
Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
Figure 4. MTTF versus Junction Temperature -- CW
AFT05MP075NR1 AFT05MP075GNR1
4
RF Device Data
Freescale Semiconductor, Inc.
520 MHz NARROWBAND PRODUCTION TEST FIXTURE
C1
B1
AFT05MP075N
Rev. 1
C4
C17 C18
C16
C15
L1
COAX1
C21
C8*
C9
L2
CUT OUT AREA
COAX2
COAX3
L3
C6
C7
C5
C22
C24
B2
C12
C14
C10
C23*
L4
COAX4
C25
C11
C20
C19
C3
C2
C26
C27 C28
C29
C13
C30
*C8 and C23 are mounted vertically.
Figure 5. AFT05MP075NR1 Narrowband Test Circuit Component Layout — 520 MHz
Table 6. AFT05MP075NR1 Narrowband Test Circuit Component Designations and Values — 520 MHz
Part
Description
Part Number
Manufacturer
B1, B2
Ferrite Beads
2743019447
Fair-Rite
C1, C11
22 F, 35 V, Tantalum Capacitors
T491X226K035AT
Kemet
C2, C12, C18, C28
0.1 F Chip Capacitors
CDR33BX104AKWS
AVX
C3, C13
220 nF Chip Capacitors
C1812C224K5RAC-TU
Kemet
C4, C14
2.2 F Chip Capacitors
C1825C225J5RAC-TU
Kemet
C5
5.1 pF Chip Capacitor
ATC100B5R1CT500XT
ATC
C6, C7
20 pF Chip Capacitors
ATC100B200JT500XT
ATC
C8
16 pF Chip Capacitor
ATC100B160JT500XT
ATC
C9
36 pF Chip Capacitor
ATC100B360JT500XT
ATC
C10
2.7 pF Chip Capacitor
ATC100B2R7BT500XT
ATC
C15, C25
240 pF Chip Capacitors
ATC100B241JT200XT
ATC
C16, C26
2.2 F Chip Capacitors
G2225X7R225KT3AB
ATC
C17, C27
0.1 F Chip Capacitors
C1812F104K1RAC--TU
Kemet
C19, C20, C29, C30
470 F, 63 V Electrolytic Capacitors
MCGPR63V477M13X26-RH
Multicomp
C21
51 pF Chip Capacitor
ATC100B510GT500XT
ATC
C22, C24
100 pF Chip Capacitors
ATC100B101JT500XT
ATC
C23
24 pF Chip Capacitor
ATC100B240JT500XT
ATC
L1, L2
5.0 nH Inductors
A02TKLC
Coilcraft
L3, L4
17.5 nH Inductors
GA3095--ALC
Coilcraft
Coax1, 2, 3, 4
25  Semi Rigid Coax, 2.4 Shield Length
UT-141C-25
Micro-Coax
PCB
0.030, r = 2.55
AD255A
Arlon
AFT05MP075NR1 AFT05MP075GNR1
RF Device Data
Freescale Semiconductor, Inc.
5
AFT05MP075NR1 AFT05MP075GNR1
6
RF Device Data
Freescale Semiconductor, Inc.
RF
INPUT Z1
COAX2
COAX1
C11
+
C5
Z16
Z3
C1
+
B2
C7
C6
C12
Z17
Z4
C2
C13
C8
Z18
Z5
C3
C9
C14
C4
L2
Z20
Z19
Z6
Z7
L1
DUT
Z22
Z9
L4
Z21
Z23
C21
Z10
Z8
L3
C25
C24
C22
C15
C26
Z24
Z11
C16
C27
Z25
C23
Z12
C17
C28
C18
0.018  0.125 Microstrip
0.135  0.125 Microstrip
0.100  0.125 Microstrip
0.430  0.740 Microstrip
0.726  0.058 Microstrip
Z3, Z16
Z4, Z17
Z5, Z18
Z6, Z19
Z7*, Z20*
* Line length includes microstrip bends
0.010  0.125 Microstrip
Z2, Z15
Description
0.366  0.082 Microstrip
Z1
Microstrip
Z14
Z13
Z12, Z25
Z11, Z24
Z10, Z23
Z9, Z22
Z8*, Z21*
Microstrip
0.100  0.082 Microstrip
0.154  0.082 Microstrip
0.010  0.230 Microstrip
0.030  0.230 Microstrip
0.590  0.230 Microstrip
0.290  0.522 Microstrip
0.672  0.150 Microstrip
Description
Table 7. AFT05MP075NR1 Narrowband Test Circuit Microstrips — 520 MHz
C19
+
C29
+
+
C30
+
C20
COAX4
COAX3
Figure 6. AFT05MP075NR1 Narrowband Test Circuit Schematic — 520 MHz
VBIAS
Z15
Z2
VBIAS
B1
VSUPPLY
Z13
VSUPPLY
C10
Z14
RF
OUTPUT
TYPICAL CHARACTERISTICS — 520 MHz
120
VDD = 13.6 Vdc, Pin = 1 W
Pout, OUTPUT POWER (WATTS)
100
VDD = 12.5 Vdc, Pin = 1 W
80
VDD = 13.6 Vdc, Pin = 0.5 W
60
VDD = 12.5 Vdc
Pin = 0.5 W
40
20
f = 520 MHz
0
0.5
0
1
1.5
2
2.5
3.5
3
4.5
4
VGS, GATE--SOURCE VOLTAGE (VOLTS)
80
20
70
19
60
Gps
50
18
17
40
Pout
D
16
30
20
15
VDD = 12.5 Vdc, IDQ(A+B) = 400 mA
f = 520 MHz
14
13
10
3
1
0.1
D, DRAIN EFFICIENCY (%)
21
Pout, OUTPUT POWER (WATTS)
Gps, POWER GAIN (dB)
Figure 7. Output Power versus Gate--Source Voltage
0
Pin, INPUT POWER (WATTS)
Figure 8. Power Gain, Output Power and Drain
Efficiency versus Input Power
VDD = 12.5 Vdc, IDQ(A+B) = 400 mA, Pout = 70 W
f
MHz
Zsource

Zload

520
0.91 + j2.37
2.56 + j0.27
Zsource = Test circuit impedance as measured from
gate to gate, balanced configuration.
Zload
50 
Input
Matching
Network
= Test circuit impedance as measured from
drain to drain, balanced configuration.
+
--
Zsource
Device
Under
Test
--
Output
Matching
Network
50 
+
Zload
Figure 9. Narrowband Series Equivalent Source and Load Impedance — 520 MHz
AFT05MP075NR1 AFT05MP075GNR1
RF Device Data
Freescale Semiconductor, Inc.
7
450--520 MHz UHF BROADBAND REFERENCE CIRCUIT
Table 8. 450--520 MHz UHF Broadband Performance (In Freescale Reference Circuit, 50 ohm system)
VDD = 12.5 Volts, IDQ(A+B) = 500 mA, TA = 25C, CW
Frequency
(MHz)
Gps
(dB)
D
(%)
Pout
(W)
450
15.9
65.8
75
485
14.6
72.9
75
520
15.1
71.1
75
Table 9. Load Mismatch/Ruggedness (In Freescale Reference Circuit)
Frequency
(MHz)
Signal
Type
485
CW
VSWR
Pin
(W)
> 65:1 at all
Phase Angles
6
(3 dB Overdrive)
Test Voltage, VDD
Result
17
No Device
Degradation
AFT05MP075NR1 AFT05MP075GNR1
8
RF Device Data
Freescale Semiconductor, Inc.
450--520 MHz UHF BROADBAND REFERENCE CIRCUIT
C15
C19
B1
C21
C23
C16
C20
C17
L1
C18
C3 C5
C22
L3
C7
C9
C11
R1
R2
C1 C2
L2
C4
Q1
C6
R3
C14*
C12
C8 C10
C24
C13
AFT05MP075N Rev. 1
*C14 is mounted vertically.
Figure 10. AFT05MP075NR1 UHF Broadband Reference Circuit Component Layout — 450--520 MHz
Table 10. AFT05MP075NR1 UHF Broadband Reference Circuit Component Designations and Values — 450--520 MHz
Part
Description
Part Number
Manufacturer
B1
Ferrite Bead
2661000101
Fair-Rite
C1, C3, C4
10 pF Chip Capacitors
ATC600F100JT250XT
ATC
C2
15 pF Chip Capacitor
ATC600F150JT250XT
ATC
C5, C6
56 pF Chip Capacitors
ATC600F560JT250XT
ATC
C7, C8
33 pF Chip Capacitors
ATC800B330JT500XT
ATC
C9, C10
30 pF Chip Capacitors
ATC800B300JT500XT
ATC
C11, C12
5.6 pF Chip Capacitors
ATC800B5R6CT500XT
ATC
C13
16 pF Chip Capacitor
ATC800B160JT500XT
ATC
C14
100 pF Chip Capacitor
ATC800B101JT500XT
ATC
C15
47 F, 16 V Tantalum Capacitor
T491D476K016AT
Kemet
C16, C21
1000 pF Chip Capacitors
ATC100B102JT50XT
ATC
C17, C20
200 pF Chip Capacitors
ATC100B201JT300XT
ATC
C18, C19
100 pF Chip Capacitors
ATC100B101JT500XT
ATC
C22
10 F Chip Capacitor
GRM55DR61H106KA88L
Murata
C23
330 F, 35 V Electrolytic Capacitor
MCGPR35V337M10X16-RH
Multicomp
C24
1.5 pF Chip Capacitor
ATC800B1R5CT500XT
ATC
L1
120 nH Chip Inductor
0805CS-121X-LB
CoilCraft
L2
2.55 nH, 3 Turn Inductor
0906-3JLC
CoilCraft
L3
6 Turns, #22 AWG, 0.125 ID
8075 Copper Magnetic Wire
Beldon
Q1
RF Power LDMOS Transistor
AFT05MP075NR1
Freescale
R1
180 , 1/10 W Chip Resistor
RR1220P-181-B-T5
Vishay
R2, R3
10 , 3/4 W Chip Resistors
CRCW201010R0FKEF
Vishay
PCB
0.030, r = 4.8
S1000-2, FR4
Shengyi
AFT05MP075NR1 AFT05MP075GNR1
RF Device Data
Freescale Semiconductor, Inc.
9
AFT05MP075NR1 AFT05MP075GNR1
10
RF Device Data
Freescale Semiconductor, Inc.
RF
INPUT Z1
VBIAS
+
C1
Z2
C15
Z7
Z6
Z9
Z8
C4
C6
Z13
Z12
Z10
Z11
C5
C3
Z15
Z14
Z17
R2
Z16
Z19
Z18
DUT
Z21 Z23
Z20 Z22
Z25
R3
Z24
C8
Z27
Z26
C7
B1
Z29
Z28
L3
C9
C20
C10
0.195  0.073 Microstrip
0.035  0.083 Microstrip
0.055  0.083 Microstrip
Z6*, Z7*
Z8, Z9
Z10, Z11
* Line length includes microstrip bends
0.054  0.064 Microstrip
0.200  0.054 Microstrip
Z4
0.060  0.050 Microstrip
Z3
Z5
0.059  0.064 Microstrip
Z2
Description
0.250  0.052 Microstrip
Z1
0.110  0.170 Microstrip
Z18, Z19
Z26, Z27
Z24, Z25
Z22, Z23
0.048  0.093 Microstrip
0.017  0.093 Microstrip
0.050  0.093 Microstrip
0.110  0.170 Microstrip
0.050  0.093 Microstrip
Z16, Z17
Z20, Z21
0.065  0.093 Microstrip
Z14, Z15
Description
0.015  0.083 Microstrip
Microstrip
Z12, Z13
Z34*, Z35*
Z39
Z38
Z37
0.200  0.054 Microstrip
0.130  0.054 Microstrip
0.470  0.054 Microstrip
0.177  0.054 Microstrip
0.109  0.073 Microstrip
Z32*, Z33*
Z36
0.030  0.083 Microstrip
0.108  0.073 Microstrip
Z30, Z31
0.075  0.083 Microstrip
C24
Z37
C23
Z28, Z29
Microstrip
C12
Z35
Z36
C22
C11
Z34
C21
Description
Z31 Z33
Z30 Z32
C19
Figure 11. AFT05MP075NR1 UHF Broadband Reference Circuit Schematic — 450--520 MHz
Z5
C18
Table 11. AFT05MP075NR1 UHF Broadband Reference Circuit Microstrips — 450--520 MHz
L2
C17
Microstrip
C2
Z4
Z3
R1
L1
C16
+
C13
C14
Z38
VSUPPLY
RF
Z39 OUTPUT
TYPICAL CHARACTERISTICS — 450--520 MHz UHF BROADBAND
REFERENCE CIRCUIT
17
72
D
16
70
15.5
68
Gps
15
100
14.5
14
13.5
13
440
66
Pout
VDD = 13.6 Vdc, Pin = 3 W
IDQ(A+B) = 500 mA
450
460
470
480
490
500
510
520
90
80
70
530
Pout, OUTPUT
POWER (WATTS)
Gps, POWER GAIN (dB)
16.5
D, DRAIN
EFFICIENCY (%)
74
f, FREQUENCY (MHz)
Figure 12. Power Gain, Drain Efficiency and Output Power versus
Frequency at a Constant Input Power — 13.6 V
17
16
15.5
15
70
68
VDD = 12.5 Vdc, Pin = 3 W
IDQ(A+B) = 500 mA
66
14.5
Gps
14
100
90
Pout
13.5
13
440
72
450
460
470
480
490
500
510
520
80
70
530
Pout, OUTPUT
POWER (WATTS)
Gps, POWER GAIN (dB)
16.5
D, DRAIN
EFFICIENCY (%)
74
D
f, FREQUENCY (MHz)
Figure 13. Power Gain, Drain Efficiency and Output Power versus
Frequency at a Constant Input Power — 12.5 V
AFT05MP075NR1 AFT05MP075GNR1
RF Device Data
Freescale Semiconductor, Inc.
11
TYPICAL CHARACTERISTICS — 450--520 MHz UHF BROADBAND
REFERENCE CIRCUIT
140
f = 485 MHz
VDD = 13.6 Vdc, Pin = 3 W
90
VDD = 13.6 Vdc, Pin = 1.5 W
Pout, OUTPUT POWER (WATTS)
Pout, OUTPUT POWER (WATTS)
120
VDD = 12.5 Vdc, Pin = 3 W
100
VDD = 12.5 Vdc
Pin = 1.5 W
80
60
Detail A
40
20
0
70
1
2
3
4
VDD = 12.5 Vdc
Pin = 3 W
60
50
VDD = 13.6 Vdc
Pin = 1.5 W
40
30
VDD = 12.5 Vdc
Pin = 1.5 W
20
10
0
0
VDD = 13.6 Vdc
Pin = 3 W
f = 485 MHz
80
0
0.5
1
1.5
2
2.5
3
3.5
VGS, GATE--SOURCE VOLTAGE (VOLTS)
5
Detail A
VGS, GATE--SOURCE VOLTAGE (VOLTS)
Figure 14. Output Power versus Gate--Source Voltage
520 MHz
485 MHz
17
450 MHz
100
520 MHz
Gps
485 MHz
80
485 MHz
16
450 MHz
15
60
450 MHz
520 MHz
40
D
14
20
Pout
13
0.05
D, DRAIN EFFICIENCY (%)
Gps, POWER GAIN (dB)
18
120
VDD = 12.5 Vdc, IDQ(A+B) = 500 mA
Pout, OUTPUT POWER (WATTS)
19
0
0.1
1
5
Pin, INPUT POWER (WATTS)
Figure 15. Power Gain, Output Power and Drain
Efficiency versus Input Power and Frequency
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RF Device Data
Freescale Semiconductor, Inc.
450--520 MHz UHF BROADBAND REFERENCE CIRCUIT
Zo = 2 
f = 530 MHz
Zsource
f = 450 MHz
f = 530 MHz
Zload
f = 450 MHz
VDD = 12.5 Vdc, IDQ(A+B) = 500 mA, Pout = 75 W
f
MHz
Zsource

Zload

450
0.55 + j0.59
0.75 + j0.30
460
0.72 + j0.81
0.82 + j0.39
470
0.79 + j0.93
0.90 + j0.42
480
0.71 + j0.86
0.92 + j0.44
490
0.62 + j0.78
0.93 + j0.41
500
0.60 + j0.74
0.89 + j0.39
510
0.64 + j0.72
0.85 + j0.39
520
0.69 + j0.78
0.79 + j0.39
530
0.70 + j1.03
0.74 + j0.43
Zsource = Test circuit impedance as measured from
gate to ground.
Zload
50 
= Test circuit impedance as measured from
drain to ground.
Input
Matching
Network
Output
Matching
Network
Device
Under
Test
Zsource
50 
Zload
Figure 16. UHF Broadband Series Equivalent Source and Load Impedance — 450--520 MHz
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RF Device Data
Freescale Semiconductor, Inc.
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PACKAGE DIMENSIONS
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Freescale Semiconductor, Inc.
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Freescale Semiconductor, Inc.
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PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
 AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages
 AN1955: Thermal Measurement Methodology of RF Power Amplifiers
 AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
 EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
 Electromigration MTTF Calculator
 RF High Power Model
 .s2p File
Development Tools
 Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the
Software & Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
Feb. 2013

1
Aug. 2014
 Tape and Reel information: corrected tape width information from 32--inch reel to 44--inch reel to reflect
actual reel size, p. 1
Initial Release of Data Sheet
 Replaced case outline TO--270WB--4, Issue D with Issue E, pp. 14–16. Added notes 9 and 10, four
exposed source tabs, and a feature control frame to E and E5 on p. 14. Removed style and pin information
from notes section on p. 16.
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RF Device Data
Freescale Semiconductor, Inc.
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Information in this document is provided solely to enable system and software
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disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
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each customer application by customer’s technical experts. Freescale does not convey
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Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off. Airfast is a trademark of Freescale Semiconductor, Inc. All
other product or service names are the property of their respective owners.
E 2013–2014 Freescale Semiconductor, Inc.
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Document
Number: AFT05MP075N
RF Device
Data
Rev. 1,Freescale
8/2014
Semiconductor,
Inc.
21