Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MMA2204KEG SENSOR 16SOICW ACCEL SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-06-14 0226A1.14 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) Yes No No e3 7c-I MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles MMA2204KEG SENSOR 16SOICW ACCEL ALL 0.609200 g EACH 3 250 C 30 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version Exemptions in this part List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Accepted Daniel Binyon 2012/51/EU 7c-I:Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Die Overcoat 0.0055 Die Overcoat Solvents, additives, and other materials Other organic Silicon Compounds - 0.00051715 g Die Overcoat Plastics/polymers Plastic: SI - Silicone Rubber - 0.00359104 g Die Overcoat Glass Silica, vitreous 60676-86-0 0.00139181 g Bonding Wire UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 94028 9.4028 848 0.0848 652916 65.2916 5894 0.5894 253056 25.3056 2284 0.2284 1000000 100 2790 0.279 1000000 100 2790 0.279 g g Metals Gold, metal 7440-57-5 0.0017 0.0017 Bonding Wire Lead Frame Plating SubstanceWeight 0.0017 Bonding Wire Bonding Wire Exemption g g Metals Gold, metal 7440-57-5 0.0017 0.0077 g g Lead Frame Plating Lead/Lead Compounds Lead 7439-92-1 0.00000154 g 200 0.02 2 0.0002 Lead Frame Plating Metals Tin, metal 7440-31-5 0.00769846 g 999800 99.98 12636 1.2636 Copper Lead Frame 0.1579 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.15220849 g 963955 96.3955 249849 24.9849 Copper Lead Frame Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00013027 g 825 0.0825 213 0.0213 Copper Lead Frame Metals Iron, metal 7439-89-6 0.00371065 g 23500 2.35 6091 0.6091 Copper Lead Frame Lead/Lead Compounds Lead 7439-92-1 0.00002684 g 170 0.017 44 0.0044 Copper Lead Frame Metals Silver, metal 7440-22-4 0.001579 g 10000 1 2591 0.2591 Copper Lead Frame Metals Tin, metal 7440-31-5 0.00004737 g 300 0.03 77 0.0077 Copper Lead Frame Metals Zinc, metal 7440-66-6 0.00019738 g 1250 0.125 323 0.0323 Die Encapsulant 0.4113 g Die Encapsulant Antimony/Antimony Compounds Antimony trioxide 1309-64-4 0.00913991 g 22222 2.2222 15003 1.5003 Die Encapsulant Flame Retardants Bromophenol, formaldehyde, epichlorohydrin polymer 68541-56-0 0.00913991 g 22222 2.2222 15003 1.5003 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00456995 g 11111 1.1111 7501 0.7501 Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.02285018 g 55556 5.5556 37508 3.7508 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.36560005 g 888889 88.8889 600153 60.0153 Epoxy Die Attach 0.0013 g Epoxy Die Attach Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00020968 g 161290 16.129 344 0.0344 Epoxy Die Attach Solvents, additives, and other materials 1-cyanoguanidine 461-58-5 0.00001398 g 10753 1.0753 22 0.0022 Epoxy Die Attach Plastics/polymers Other phenolic resins - 0.00002796 g 21505 2.1505 45 0.0045 Epoxy Die Attach Metals Silver, metal 7440-22-4 0.00104838 g 806452 80.6452 1720 0.172 Non-Conductive Epoxy/Adhesive 0.0048 g Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Siloxanes and Silicones, di-Me, Me vinyl, vinyl groupterminated 68083-18-1 0.000648 g 135000 13.5 1063 0.1063 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Siloxanes and silicones, di-Me, vinyl group-terminated 68083-19-2 0.002256 g 470000 47 3703 0.3703 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Other organic Silicon Compounds - 0.000096 g 20000 2 157 0.0157 Non-Conductive Epoxy/Adhesive Glass D4 and HMDZ treated Silicon Dioxide 68937-51-9 0.00108 g 225000 22.5 1772 0.1772 Non-Conductive Epoxy/Adhesive Glass Silica, crystalline - quartz (SiO2) 14808-60-7 0.000528 g 110000 11 866 0.0866 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00008645 g 18010 1.801 141 0.0141 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Dimethyl,methyl hydrogen siloxane 68037-59-2 0.00010555 g 21990 2.199 173 0.0173 Silicon Semiconductor Die 0.0085 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00017 g 20000 2 279 0.0279 Silicon Semiconductor Die Glass Silicon, doped - 0.00833 g 980000 98 13673 1.3673 Pb Glass Frit Semiconductor Di 0.0088 7c-I g Pb Glass Frit Semiconductor Di Lead/Lead Compounds Lead (II) titanate 12060-00-3 0.00009135 g 10381 1.0381 149 0.0149 Pb Glass Frit Semiconductor Di Glass Fibrous-glass-wool 65997-17-3 0.0000875 g 9943 0.9943 143 0.0143 Pb Glass Frit Semiconductor Di Solvents, additives, and other materials 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate 25265-77-4 0.0000875 g 9943 0.9943 143 0.0143 Pb Glass Frit Semiconductor Di Glass Silicon, doped - 0.00853365 g 969733 96.9733 14007 1.4007 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MMA2204KEG_IPC1752_v11.xml http://www.freescale.com/mcds/MMA2204KEG_IPC1752A.xml