Adhesive Peel and Stick Heat Sinks Part Number Series: BDN

CTS
®
W±0.01
With pre-applied adhesive, just peel
off the release liner and press onto the
component
Reduces assembly costs; no more
messy adhesives or greases required
Excellent mechanical bond
Thermally optimized pin fin
Omnidirectional
Adhesive shear strength at 100°C is
36psi (a one inch square heat sink would
require a 36lb. force to remove heat sink)
Applicable for BGA, PGA, PLCC,
and QFP packages
L±0.01
P±0.01
G±0.01
H±0.015
T±0.01
SIZE
PIN FIN CONFIGURATION
PART NUMBER***
(W)
BDN09-3CB/A01
(L)
P
G
FIN
MATRIX
NATURAL
CONVECTION**
FORCED
CONVECTION
@ 400 LFPM
.09
.069
.072
7x7
26.9
9.6
BDN09-6CB/A01
.605
.10
.132
.128
4x4
24.5
7.7
BDN10-3CB/A01
.355
.09
.083
.072
7x7
26.4
8.0
.555
.10
.111
.114
5x5
20.8
6.3
.355
.09
.076
.072
8x8
20.9
7.2
BDN11-6CB/A01
.605
.10
.119
.128
5x5
18.5
5.7
BDN12-3CB/A01
.355
.09
.060
.081
9x9
19.6
6.8
.555
.10
.105
.114
6x6
16.5
5.2
.355
.09
.074
.081
9x9
16.1
6.0
.555
.10
.125
.114
6x6
14.9
4.7
.355
.09
.067
.081
10x10
16.2
5.6
.605
.10
.128
.128
6x6
13.1
4.2
.355
.09
.062
.081
11x11
15.1
4.5
BDN11-3CB/A01
1.01
0.91
1.01
1.11
1.21
1.11
1.21
BDN12-5CB/A01
BDN13-3CB/A01
1.31
1.31
BDN13-5CB/A01
BDN14-3CB/A01
1.41
1.41
BDN14-6CB/A01
*Thermal resistance
BDN15-3CB/A01
of adhesive tape is
included.
BDN15-5CB/A01
.555
.10
.118
.114
7x7
11.9
3.8
BDN16-3CB/A01
.355
.09
.072
.081
11x11
13.5
4.5
.605
.10
.119
.128
7x7
10.6
3.5
.355
.09
.065
.072
13x13
11.5
3.8
.355
.09
.072
.072
13x13
10.8
3.5
.605
.10
.128
.114
8x8
8.1
2.8
**Thermal resistance
values based on
power density of
3 watts/in2
***Part numbers
listed for standard
black anodized
heat sinks with
CTS adhesive
tapes.
6
T
.355
0.91
BDN10-5CB/A01
NOTES:
(H)
THERMAL RESISTANCE CASE
TO AMBIENT* °C/WATTS
1.51
1.61
1.51
1.61
BDN16-6CB/A01
BDN17-3CB/A01
BDN18-3CB/A01
1.71
1.71
1.81
1.81
BDN18-6CB/A01
BDN19-3CB/A01
1.91
1.91
.355
.09
.069
.072
14x14
9.9
2.9
BDN21-3CB/A01
2.11
2.11
.355
.09
.064
.072
16x16
8.5
2.6
All dimensions are in inches.
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