Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MMA3202KEGR2 SENSOR 20SOICW ACCEL SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-10-09 0271K50010S111A1.11 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) Yes No No e3 7c-I MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles MMA3202KEGR2 SENSOR 20SOICW ACCEL ALL 0.760200 g EACH 3 250 C 30 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version Exemptions in this part List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Accepted Daniel Binyon 2012/51/EU 7c-I:Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Die Overcoat 0.0064 Die Overcoat Solvents, additives, and other materials Other organic Silicon Compounds - 0.00060178 g Die Overcoat Plastics/polymers Plastic: SI - Silicone Rubber - 0.00417866 g Die Overcoat Glass Silica, vitreous 60676-86-0 0.00161956 g Epoxy Die Attach Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 94028 9.4028 791 0.0791 652916 65.2916 5496 0.5496 253056 25.3056 2130 0.213 g 0.0022 g Epoxy Die Attach Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.00000001 g 3 0.0003 0 0 Epoxy Die Attach Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00030303 g 137740 13.774 398 0.0398 Epoxy Die Attach Lead/Lead Compounds Lead 7439-92-1 0.00000002 g 7 0.0007 0 0 Epoxy Die Attach Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00006667 g 30303 3.0303 87 0.0087 Epoxy Die Attach Metals Silver, metal 7440-22-4 0.00183027 g 831947 83.1947 2407 0.2407 Non-Conductive Epoxy/Adhesive 0.002 g Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Silicone gum 67762-94-1 0.00002065 g 10324 1.0324 27 0.0027 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Siloxanes and Silicones, di-Me, Me vinyl, vinyl groupterminated 68083-18-1 0.00024582 g 122911 12.2911 323 0.0323 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Siloxanes and silicones, di-Me, vinyl group-terminated 68083-19-2 0.00078662 g 393313 39.3313 1034 0.1034 Non-Conductive Epoxy/Adhesive Solvents, additives, and other materials Proprietary Material-Other siloxanes and silicones - 0.00044248 g 221239 22.1239 582 0.0582 Non-Conductive Epoxy/Adhesive Glass D4 and HMDZ treated Silicon Dioxide 68937-51-9 0.00029499 g 147493 14.7493 388 0.0388 Non-Conductive Epoxy/Adhesive Glass Silica, crystalline - quartz (SiO2) 14808-60-7 0.00018682 g 93412 9.3412 245 0.0245 Non-Conductive Epoxy/Adhesive Metals Titanium (IV) Oxide 13463-67-7 0.00002262 g 11308 1.1308 29 0.0029 Copper Lead Frame 0.2007 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.19346576 g 963955 96.3955 254493 25.4493 Copper Lead Frame Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00016558 g 825 0.0825 217 0.0217 Copper Lead Frame Metals Iron, metal 7439-89-6 0.00471645 g 23500 2.35 6204 0.6204 Copper Lead Frame Lead/Lead Compounds Lead 7439-92-1 0.00003412 g 170 0.017 44 0.0044 Copper Lead Frame Metals Silver, metal 7440-22-4 0.002007 g 10000 1 2640 0.264 Copper Lead Frame Metals Tin, metal 7440-31-5 0.00006021 g 300 0.03 79 0.0079 Copper Lead Frame Metals Zinc, metal 7440-66-6 0.00025088 g 1250 0.125 330 0.033 1000000 100 3288 0.3288 1000000 100 3288 0.3288 Bonding Wire 0.0025 Bonding Wire Bonding Wire Metals Gold, metal 7440-57-5 0.0025 0.0025 Bonding Wire Lead Frame Plating g g g Metals Gold, metal 7440-57-5 0.0025 0.0099 g g Lead Frame Plating Lead/Lead Compounds Lead 7439-92-1 0.00000198 g 200 0.02 2 0.0002 Lead Frame Plating Metals Tin, metal 7440-31-5 0.00989802 g 999800 99.98 13020 1.302 Pb Glass Frit Semiconductor Di 0.012 7c-I g Pb Glass Frit Semiconductor Di Lead/Lead Compounds Lead (II) titanate 12060-00-3 0.00012457 g 10381 1.0381 163 0.0163 Pb Glass Frit Semiconductor Di Glass Fibrous-glass-wool 65997-17-3 0.00011932 g 9943 0.9943 156 0.0156 Pb Glass Frit Semiconductor Di Solvents, additives, and other materials 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate 25265-77-4 0.00011932 g 9943 0.9943 156 0.0156 Pb Glass Frit Semiconductor Di Glass Silicon, doped - 0.01163679 g 969733 96.9733 15307 1.5307 Die Encapsulant 0.51 g Die Encapsulant Antimony/Antimony Compounds Antimony trioxide 1309-64-4 0.0152694 g 29940 2.994 20086 2.0086 Die Encapsulant Flame Retardants Bromophenol, formaldehyde, epichlorohydrin polymer 68541-56-0 0.0152694 g 29940 2.994 20086 2.0086 Die Encapsulant Plastics/polymers Other Epoxy resins - 0.0381735 g 74850 7.485 50215 5.0215 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.0025449 g 4990 0.499 3347 0.3347 Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.0152694 g 29940 2.994 20086 2.0086 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.4234734 g 830340 83.034 557074 55.7074 Pb Glass Frit Semiconductor Di 0.012 7c-I g Pb Glass Frit Semiconductor Di Lead/Lead Compounds Lead (II) titanate 12060-00-3 0.00012457 g 10381 1.0381 163 0.0163 Pb Glass Frit Semiconductor Di Glass Fibrous-glass-wool 65997-17-3 0.00011932 g 9943 0.9943 156 0.0156 Pb Glass Frit Semiconductor Di Solvents, additives, and other materials 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate 25265-77-4 0.00011932 g 9943 0.9943 156 0.0156 Pb Glass Frit Semiconductor Di Glass Silicon, doped - 0.01163679 g 969733 96.9733 15307 1.5307 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MMA3202KEGR2_IPC1752_v11.xml http://www.freescale.com/mcds/MMA3202KEGR2_IPC1752A.xml