MBRS230LT3 D

MBRS230L, NRVBS230L
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
•
•
•
•
•
•
www.onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES
30 VOLTS
Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Over−Voltage Protection
Low Forward Voltage Drop
NRVBS Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
SMB
CASE 403A
MARKING DIAGRAM
ALYW
2BL3G
G
Mechanical Characteristics
•
•
•
•
•
•
•
Case: Molded Epoxy
Epoxy Meets UL 94, V−0 @ 0.125 in.
Weight: 95 mg (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Maximum Temperature of 260°C/10 Seconds for Soldering
Available in 12 mm Tape, 2500 Units per 13″ Reel,
Add “T3” Suffix to Part Number
Cathode Polarity Band
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
MBRS230LT3G
SMB
(Pb−Free)
2500 / Tape & Reel
NRVBS230LT3G
SMB
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. 4
1
Publication Order Number:
MBRS230LT3/D
MBRS230L, NRVBS230L
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
30
V
Average Rectified Forward Current
(At Rated VR, TC = 110°C)
IO
2.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TC = 105°C)
IFRM
4.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz)
IFSM
40
A
Tstg, TC
−55 to +175
°C
TJ
−55 to +125
°C
dv/dt
10,000
V/ms
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated VR, TJ = 25°C)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
RqJL
18.6
RqJA
135
Unit
°C/W
Thermal Resistance,
Junction−to−Lead (Note 1)
Thermal Resistance,
Junction−to−Ambient (Note 1)
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2)
VF
(IF = 2.0 A)
(IF = 4.0 A)
see Figure 2
Maximum Instantaneous Reverse Current (Note 2)
IR
(VR = 30 V)
(VR = 15 V)
see Figure 4
TJ = 25°C
TJ = 125°C
0.50
0.60
0.45
0.63
TJ = 25°C
TJ = 125°C
1
0.31
75
35
V
mA
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Minimum pad size (0.108″ X 0.085″) for each lead on FR4 board.
2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
10
1
TJ = 125°C
0.1
100°C
25°C
−55°C
0.01
0
0.1
0.2
0.3
0.4
0.6
0.5
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
TJ = 125°C
1
100°C
25°C
0.1
0
Figure 1. Typical Forward Voltage
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (VOLTS)
Figure 2. Maximum Forward Voltage
www.onsemi.com
2
0.8
100E−3
TJ = 125°C
10E−3
TJ = 100°C
1E−3
100E−6
1E−6
0
10
5
15
20
25
30
FREQ = 20 kHz
Ipk/Io = p
1.5
Ipk/Io = 5.0
1.0
Ipk/Io = 10
Ipk/Io = 20
0
20
0
60
40
120
100
80
140
TC, CASE TEMPERATURE (°C)
20
15
25
30
1.8
dc
1.6
1.4
Ipk/Io = p
1.2
SQUARE
WAVE
Ipk/Io = 5.0
Ipk/Io = 10
1.0
Ipk/Io = 20
0.8
0.6
0.4
0.2
TJ = 125°C
0
0
Figure 5. Current Derating Per Leg
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
10
5
Figure 4. Maximum Reverse Current
SQUARE WAVE
0
10E−6
Figure 3. Typical Reverse Current
3.0
0.5
TJ = 25°C
VR, REVERSE VOLTAGE (VOLTS)
dc
2.0
1E−3
VR, REVERSE VOLTAGE (VOLTS)
3.5
2.5
TJ = 100°C
100E−6
TJ = 25°C
10E−6
TJ = 125°C
10E−3
PFO, AVERAGE POWER DISSIPATION (WATTS)
IR, REVERSE CURRENT (AMPS)
100E−3
IO, AVERAGE FORWARD CURRENT (AMPS)
IR, MAXIMUM REVERSE CURRENT (AMPS)
MBRS230L, NRVBS230L
0.5
1.0
1.5
2.0
2.5
3.0
3.5
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Forward Power Dissipation Per Leg
1
RqJ Lead = 18.6
0.1
RqJ Ambient = 150
0.01
0.001
0.0001
0.0001
0.001
0.01
0.1
1.0
t, TIME (s)
Figure 7. Thermal Response
www.onsemi.com
3
10
100
1000
MBRS230L, NRVBS230L
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
A
L
L1
A1
c
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MBRS230LT3/D