Technical Note TN_166 FTDI Example IC PCB Footprints Version 1.0 Issue Date: 2016-04-27 This Technical Note shows examples of FTDI IC PCB footprints which can be used as a guide for creating your own IC PCB footprints. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to defend, indemnify and hold FTDI harmless from any and all damages, claims, suits or expense resulting from such use. Future Technology Devices International Limited (FTDI) Unit 1, 2 Seaward Place, Glasgow G41 1HH, United Kingdom Tel.: +44 (0) 141 429 2777 Fax: + 44 (0) 141 429 2758 Web Site: http://ftdichip.com Copyright © Future Technology Devices International Limited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 Table of Contents 1 Introduction ............................................................ 6 1.1 Scope ............................................................................... 6 1.1.1 Unavailable Footprints ...................................................................... 6 2 All Scaled Footprints ................................................ 7 2.1 DFN Packages................................................................... 7 2.2 QFP Packages ................................................................... 7 2.3 QFN Packages .................................................................. 7 2.4 SSOP Packages ................................................................. 7 3 Packages by Product................................................ 8 3.1 DFN Packages................................................................... 8 3.2 QFP Packages ................................................................... 8 3.3 QFN Packages .................................................................. 8 3.4 SSOP Packages ................................................................. 9 4 10-pin DFN ............................................................ 10 4.1 Scaled Footprint ............................................................. 10 4.2 Annotated Footprint ....................................................... 10 5 12-pin DFN ............................................................ 11 5.1 Scaled Footprint ............................................................. 11 5.2 Annotated Footprint ....................................................... 11 6 16-pin QFN (3mm x 3mm) ..................................... 12 6.1 Scaled Footprint ............................................................. 12 6.2 Annotated Footprint ....................................................... 12 7 16-pin QFN (4mm x 4mm) ..................................... 13 7.1 Scaled Footprint ............................................................. 13 7.2 Annotated Footprint ....................................................... 13 8 16-pin SSOP-......................................................... 14 8.1 Scaled Footprint ............................................................. 14 1 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 8.2 Annotated Footprint ....................................................... 14 9 16-pin TSSOP ........................................................ 15 9.1 Scaled Footprint ............................................................. 15 9.2 Annotated Footprint ....................................................... 15 10 20-pin QFN.......................................................... 16 10.1 Scaled Footprint ........................................................... 16 10.2 Annotated Footprint ..................................................... 16 11 20-pin SSOP ........................................................ 17 11.1 Scaled Footprint ........................................................... 17 11.2 Annotated Footprint ..................................................... 17 12 24-pin QFN.......................................................... 18 12.1 Scaled Footprint ........................................................... 18 12.2 Annotated Footprint ..................................................... 18 13 24-pin SSOP ........................................................ 19 13.1 Scaled Footprint ........................................................... 19 13.2 Annotated Footprint ..................................................... 19 14 28-pin QFN.......................................................... 20 14.1 Scaled Footprint ........................................................... 20 14.2 Annotated Footprint ..................................................... 20 15 28-pin SSOP ........................................................ 21 15.1 Scaled Footprint ........................................................... 21 15.2 Annotated Footprint ..................................................... 21 16 28-pin TSSOP ...................................................... 22 16.1 Scaled Footprint ........................................................... 22 16.2 Annotated Footprint ..................................................... 22 17 28-pin WQFN....................................................... 23 17.1 Scaled Footprint ........................................................... 23 17.2 Annotated Footprint ..................................................... 23 2 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 18 32-pin LQFP ........................................................ 24 18.1 Scaled Footprint ........................................................... 24 18.2 Annotated Footprint ..................................................... 24 19 32-pin VQFN/QFN (5mm x 5mm) ......................... 25 19.1 Scaled Footprint ........................................................... 25 19.2 Annotated Footprint ..................................................... 25 20 32-pin QFN (7mm x 7mm) ................................... 26 20.1 Scaled Footprint ........................................................... 26 20.2 Annotated Footprint ..................................................... 26 21 48-pin LQFP ........................................................ 27 21.1 Scaled Footprint ........................................................... 27 21.2 Annotated Footprint ..................................................... 27 22 48-pin VQFN/WQFN (7mm x 7mm) ...................... 28 22.1 Scaled Footprint ........................................................... 28 22.2 Annotated Footprint ..................................................... 28 23 48-pin QFN (8mm x 8mm) ................................... 29 23.1 Scaled Footprint ........................................................... 29 23.2 Annotated Footprint ..................................................... 29 24 56-pin QFN (7mm x 7mm) ................................... 30 24.1 Scaled Footprint ........................................................... 30 24.2 Annotated Footprint ..................................................... 30 25 56-pin VQFN (8mm x 8mm) ................................. 31 25.1 Scaled Footprint ........................................................... 31 25.2 Annotated Footprint ..................................................... 31 26 64-pin LQFP ........................................................ 32 26.1 Scaled Footprint ........................................................... 32 26.2 Annotated Footprint ..................................................... 32 27 64-pin TQFP ........................................................ 33 3 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 27.1 Scaled Footprint ........................................................... 33 27.2 Annotated Footprint ..................................................... 33 28 64-pin QFN (8mm x 8mm) ................................... 34 28.1 Scaled Footprint ........................................................... 34 28.2 Annotated Footprint ..................................................... 34 29 64-pin QFN (9mm x 9mm) ................................... 35 29.1 Scaled Footprint ........................................................... 35 29.2 Annotated Footprint ..................................................... 35 29.2.1 Additional Information ..................................................................... 36 30 76-pin QFN.......................................................... 37 30.1 Scaled Footprint ........................................................... 37 30.2 Annotated Footprint ..................................................... 37 31 80-pin LQFP ........................................................ 38 31.1 Scaled Footprint ........................................................... 38 31.2 Annotated Footprint ..................................................... 38 32 100-pin LQFP ...................................................... 39 32.1 Scaled Footprint ........................................................... 39 32.2 Annotated Footprint ..................................................... 39 33 100-pin QFN........................................................ 40 33.1 Scaled Footprint ........................................................... 40 33.2 Annotated Footprint ..................................................... 40 34 Contact Information ............................................ 41 Appendix A – References ........................................... 42 Document References ............................................................ 42 Acronyms and Abbreviations .................................................. 42 Appendix B – List of Tables & Figures ......................... 43 List of Tables ......................................................................... 43 List of Figures ........................................................................ 43 4 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 Appendix C – Revision History .................................... 45 5 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 1 Introduction This Technical Note shows examples of FTDI IC PCB footprints which can be used as a guide for creating your own PCB footprints. The IC footprints in this document are sourced from various FTDI hardware such as deve lopment and application modules and demo hardware, using the most common and cost effective package types. Most FTDI IC footprints are included in this document; however some are missing when a package type has not been used for specific FTDI hardware. See Table 1.1 for unavailable footprints. The IC footprints in this document provide: A 1:1 scaled IC footprint An annotated IC footprint showing some key measurements All dimensions shown are in millimeters (mm). Additionally, a range of USB Interface IC solutions from FTDI Chip available through AltiumLive. To view Altium files, you need either the full version of ‘Altium Designer’, or ‘Altium Viewer’ which can be downloaded for free from Altium’s web site. http://www.ftdichip.com/Support/Documents/PCBData.htm Note that all IC footprints may not be available through AltiumLive. It is a live dBase continually being updated. 1.1 Scope These IC PCB footprints can be used as a guide to create your own IC PCB footprints with particular PCB design tools other than Altium. Please refer to the IC datasheet for full IC package parameters. Note: No guarantees can be provided in this document. These can be used as a guide only. Note: FTDI Cables and Modules are recommended for product test and development prior to custom hardware development. 1.1.1 Unavailable Footprints Table 1.1 shows that there are some footprints not included in this document as , for example, they have never been used for specific hardware developments within FTDI. Other package options for those products exist and are included in this document. Note: This is correct at the time of writing and newer products may not be included. Package Part Numbers 32-pin WQFN FT51BQ 44-pin LQFP FT51AL Table 1.1 Unavailable Footprints 6 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 2 C learance N o.: FT DI# 5 0 1 All Scaled Footprints This section shows all packages scaled to 1:1 size to show the exact package size which can help when selecting a package to use in your design. Note that not all packages are available for all products. See Section 3 ‘Packages by Product’ in this document, the product datasheet, or check the IC webpage: http://www.ftdichip.com/Products/ICs.htm 2.1 DFN Packages Figure 2.1 shown in pin count order from left to right: DFN-10, DFN-12. Figure 2.1 DFN Packages 2.2 QFP Packages Figure 2.2 shown in pin count order from left to right: LQFP-32, LQFP-48, LQFP-64, TQFP-64, LQFP-80, LQFP-100. Figure 2.2 QFP Packages 2.3 QFN Packages Figure 2.3 shown in pin count order from left to right: QFN-16 (3x3), QFN-16 (4x4), QFN-20, QFN-24, QFN-28, WQFN-28, QFN-32 (5x5), QFN-32 (7x7), QFN-48 (7x7), QFN-48 (8x8), QFN-56 (7x7), VQFN-56 (8x8), QFN-64 (8x8), QFN-64 (9x9), QFN76, QFN-100. Figure 2.3 QFN Packages 2.4 SSOP Packages Figure 2.4 shown in pin count order from left to right: SSOP-16, TSSOP-16, SSOP-20, SSOP-24, SSOP-28, TSSOP-28. Figure 2.4 SSOP Packages 7 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 3 C learance N o.: FT DI# 5 0 1 Packages by Product Package availability for FTDI products is shown in this sectio n. 3.1 DFN Packages Package Part Numbers DFN-10 FT200XD DFN-12 FT234XD Table 3.1 DFN Packages 3.2 QFP Packages Package Part Numbers LQFP-32 FT232BL, FT245BL, FT311D-32L1C, FT312D-32L1C, VNC2-32L1B LQFP-48 FT232HL, FT2232D, VNC1L-1A, VNC2-48L1B LQFP-64 FT2232HL, FT4232HL, FT313HL, VNC264L1B TQFP-64 FT313HP LQFP-80 FT905L, FT906L, FT907L, FT908L LQFP-100 FT900L, FT901L, FT902L, FT903L Table 3.2 QFP Packages 3.3 QFN Packages Package Part Numbers QFN-16 (3x3) FT121Q QFN-16 (4x4) FT201XQ, FT220XQ, FT230XQ QFN-20 FT221XQ, FT231XQ QFN-24 FT240XQ QFN-28 FT120Q, FT122Q WQFN-28 FT260Q QFN-32 (5x5) FT232RQ, FT245RQ, FT4222HQ QFN-32 (7x7) FT311D-32Q1C, FT312D-32Q1C, VNC2-32Q1B QFN-48 (7x7) FT51AQ, FT800Q, FT801Q, FT810Q, FT811Q QFN-48 (8x8) FT232HQ, VNC2-48Q1B QFN-56 (7x7) FT600Q VQFN-56 (8x8) FT2232H-56Q, FT4232H-56Q, FT812Q, FT813Q 8 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 Package Part Numbers QFN-64 (8x8) VNC2-64Q1B QFN-64 (9x9) FT2232HQ, FT4232HQ, FT313HQ QFN-76 FT601Q, FT905Q, FT906Q, FT907Q, FT908Q QFN-100 FT900Q, FT901Q, FT902Q, FT903Q C learance N o.: FT DI# 5 0 1 Table 3.3 QFN Packages 3.4 SSOP Packages Package Part Numbers SSOP-16 FT201XS, FT220XS, FT230XS TSSOP-16 FT121T SSOP-20 FT221XS, FT231XS SSOP-24 FT240XS SSOP-28 FT232RL, FT245RL, FT51CS TSSOP-28 FT120T, FT122T, FT260S Table 3.4 SSOP Packages 9 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 4 C learance N o.: FT DI# 5 0 1 10-pin DFN The 10-pin DFN is used on the following product: FT200XD This package is nominally 3.00mm x 3.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 4.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 4.1 10-pin DFN Scaled Footprint 4.2 Annotated Footprint The annotated footprint shows key measurements . Figure 4.2 10-pin DFN Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 10 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 5 C learance N o.: FT DI# 5 0 1 12-pin DFN The 12-pin DFN is used on the following product: FT234XD This package is nominally 3.00mm x 3.00mm. The solder pads are on a 0.45mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 5.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 5.1 12-pin DFN Scaled Footprint 5.2 Annotated Footprint The annotated footprint shows key measureme nts. Figure 5.2 12-pin DFN Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 11 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 6 C learance N o.: FT DI# 5 0 1 16-pin QFN (3mm x 3mm) The 16-pin QFN (3mm x 3mm) is used on the following product: FT121Q This package is nominally 3.00mm x 3.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 6.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 6.1 16-pin QFN (3mm x 3mm) Scaled Footprint 6.2 Annotated Footprint The annotated footprint shows key measurements . Figure 6.2 16-pin QFN (3mm x 3mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 12 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 7 C learance N o.: FT DI# 5 0 1 16-pin QFN (4mm x 4mm) The 16-pin QFN (4mm x 4mm) is used on the following products: FT201XQ FT220XQ FT230XQ This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.65mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 7.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 7.1 16-pin QFN (4mm x 4mm) Scaled Footprint 7.2 Annotated Footprint The annotated footprint shows key measurements . Figure 7.2 16-pin QFN (4mm x 4mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 13 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 8 C learance N o.: FT DI# 5 0 1 16-pin SSOP- The 16-pin SSOP is used on the following products: FT201XS FT220XS FT230XS This package is nominally 4.90mm x 3.91mm body (4.90mm x 5.99mm including pins). The solder pads are on a 0.635mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 8.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 8.1 16-pin SSOP Scaled Footprint 8.2 Annotated Footprint The annotated footprint shows key measurements . Figure 8.2 16-pin SSOP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 14 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 9 C learance N o.: FT DI# 5 0 1 16-pin TSSOP The 16-pin TSSOP is used on the following product: FT121T This package is nominally 5.0mm x 4.4mm body (5.0mm x 6.4mm including pins). The solder pads are on a 0.65mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 9.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 9.1 16-pin TSSOP Scaled Footprint 9.2 Annotated Footprint The annotated footprint shows key measurements . Figure 9.2 16-pin TSSOP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 15 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 10 C learance N o.: FT DI# 5 0 1 20-pin QFN The 20-pin QFN is used on the following products: FT221XQ FT231XQ This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 10.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 10.1 20-pin QFN Scaled Footprint 10.2 Annotated Footprint The annotated footprint shows key measurements . Figure 10.2 20-pin QFN Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 16 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 11 C learance N o.: FT DI# 5 0 1 20-pin SSOP The 20-pin SSOP is used on the following products: FT221XS FT231XS This package is nominally 8.66mm x 3.91mm body (8.66mm x 5.99mm including pins). The solder pads are on a 0.635mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 11.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 11.1 20-pin SSOP Scaled Footprint 11.2 Annotated Footprint The annotated footprint shows key measurements . Figure 11.2 20-pin SSOP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 17 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 12 C learance N o.: FT DI# 5 0 1 24-pin QFN The 24-pin QFN is used on the following product: FT240XQ This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 12.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 12.1 24-pin QFN Scaled Footprint 12.2 Annotated Footprint The annotated footprint shows key measurements . Figure 12.2 24-pin QFN Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 18 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 13 C learance N o.: FT DI# 5 0 1 24-pin SSOP The 24-pin SSOP is used on the following products: FT240XS This package is nominally 8.66mm x 3.91 mm body (8.66mm x 5.99mm including pins). The solder pads are on a 0.635mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 13.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 13.1 24-pin SSOP Scaled Footprint 13.2 Annotated Footprint The annotated footprint shows key measurements . Figure 13.2 24-pin SSOP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 19 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 14 C learance N o.: FT DI# 5 0 1 28-pin QFN The 28-pin QFN is used on the following products : FT120Q FT122Q This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.40mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 14.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 14.1 28-pin QFN Scaled Footprint 14.2 Annotated Footprint The annotated footprint shows key measurements. Figure 14.2 28-pin QFN Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 20 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 15 C learance N o.: FT DI# 5 0 1 28-pin SSOP The 28-pin SSOP is used on the following products: FT232RL FT245RL FT51CS This package is nominally 5.30mm x 10.20mm body (7.80mm x 10.20mm including pins). The solder pads are on a 0.65mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 15.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 15.1 28-pin SSOP Scaled Footprint 15.2 Annotated Footprint The annotated footprint shows key measurements . Figure 15.2 28-pin SSOP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers 21 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 16 C learance N o.: FT DI# 5 0 1 28-pin TSSOP The 28-pin TSSOP is used on the following products: FT120T FT122T FT260S This package is nominally 9.7mm x 4.4mm body (9.7mm x 6.4mm including pins). The solder pads are on a 0.65mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 16.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 16.1 28-pin TSSOP Scaled Footprint 16.2 Annotated Footprint The annotated footprint shows key measurements . Figure 16.2 28-pin TSSOP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 22 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 17 C learance N o.: FT DI# 5 0 1 28-pin WQFN The 28-pin WQFN is used on the following product: FT260Q This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 17.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 17.1 28-pin WQFN Scaled Footprint 17.2 Annotated Footprint The annotated footprint shows key measurements . Figure 17.2 28-pin WQFN Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 23 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 18 C learance N o.: FT DI# 5 0 1 32-pin LQFP The 32-pin LQFP is used on the following products: VNC2-32L1B FT311D-32L1C FT312D-32L1C FT232BL FT245BL This package is nominally 9.00mm x 9.00mm. The solder pads are on a 0.80mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 18.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 18.1 32-pin LQFP Scaled Footprint 18.2 Annotated Footprint The annotated footprint shows key measurements . Figure 18.2 32-pin LQFP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 24 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 19 C learance N o.: FT DI# 5 0 1 32-pin VQFN/QFN (5mm x 5mm) The 32-pin VQFN/QFN (5mm x 5mm) is used on the following products: FT232RQ FT245RQ FT4222HQ This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 19.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 19.1 32-pin VQFN/QFN (5mm x 5mm) Scaled Footprint 19.2 Annotated Footprint The annotated footprint shows key measurements . Figure 19.2 32-pin VQFN/QFN (5mm x 5mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 25 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 20 C learance N o.: FT DI# 5 0 1 32-pin QFN (7mm x 7mm) The 32-pin QFN (7mm x 7mm) is used on the following products: VNC2-32Q1B FT311D-32Q1C FT312D-32Q1C This package is nominally 7.00mm x 7.00mm. The solder pads are on a 0.65mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 20.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 20.1 32-pin QFN (7mm x 7mm) Scaled Footprint 20.2 Annotated Footprint The annotated footprint shows key measurements . Figure 20.2 32-pin QFN (7mm x 7mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 26 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 21 C learance N o.: FT DI# 5 0 1 48-pin LQFP The 48-pin LQFP is used on the following products: FT232HL FT2232D VNC1L-1A VNC2-48Q1B This package is nominally 9.00mm x 9.00mm. The solder pa ds are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 21.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 21.1 48-pin LQFP Scaled Footprint 21.2 Annotated Footprint The annotated footprint shows key measurements . Figure 21.2 48-pin LQFP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 27 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 22 C learance N o.: FT DI# 5 0 1 48-pin VQFN/WQFN (7mm x 7mm) The 48-pin VQFN/WQFN (7mm x 7mm) is used on the following products: FT800Q FT801Q FT810Q FT811Q FT51AQ This package is nominally 7.00mm x 7.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 22.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed a t 100%. Figure 22.1 48-pin VQFN/WQFN (7mm x 7mm) Scaled Footprint 22.2 Annotated Footprint The annotated footprint shows key measurements . Figure 22.2 48-pin VQFN/WQFN (7mm x 7mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 28 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 23 C learance N o.: FT DI# 5 0 1 48-pin QFN (8mm x 8mm) The 48-pin QFN (8mm x 8mm) is used on the following products: VNC2-48Q1B FT232HQ This package is nominally 8.00mm x 8.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 23.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 23.1 48-pin QFN (8mm x 8mm) Scaled Footprint 23.2 Annotated Footprint The annotated footprint shows key measurements . Figure 23.2 48-pin QFN (8mm x 8mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 29 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 24 C learance N o.: FT DI# 5 0 1 56-pin QFN (7mm x 7mm) The 56-pin QFN (7mm x 7mm) is used on the following product: FT600Q This package is nominally 7.00mm x 7.00mm. The solder pads are on a 0.40mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 24.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 24.1 56-pin QFN (7mm x 7mm) Scaled Footprint 24.2 Annotated Footprint The annotated footprint shows key measurements . Figure 24.2 56-pin QFN (7mm x 7mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. Cross-hatching designs used for less solder paste and less heat up rate required. 30 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 25 C learance N o.: FT DI# 5 0 1 56-pin VQFN (8mm x 8mm) The 56-pin VQFN (8mm x 8mm) is used on the following products: FT812Q FT813Q FT2232HQ FT4232HQ This package is nominally 8.00mm x 8.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 25.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 25.1 56-pin VQFN (8mm x 8mm) Scaled Footprint 25.2 Annotated Footprint The annotated footprint shows key measurements. Figure 25.2 56-pin VQFN (8mm x 8mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top la yer of the PCB in this area. 31 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 26 C learance N o.: FT DI# 5 0 1 64-pin LQFP The 64-pin LQFP is used on the following products: VNC2-64L1B FT313HL FT2232HL FT4232HL This package is nominally 12.00mm x 12.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 26.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 26.1 64-pin LQFP Scaled Footprint 26.2 Annotated Footprint The annotated footprint shows key measurements . Figure 26.2 64-pin LQFP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 32 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 27 C learance N o.: FT DI# 5 0 1 64-pin TQFP The 64-pin TQFP is used on the following products: FT313HP This package is nominally 9.00mm x 9.00mm. The solder pads are on a 0.40mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 27.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 27.1 64-pin TQFP Scaled Footprint 27.2 Annotated Footprint The annotated footprint shows key measurements . Figure 27.2 64-pin TQFP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 33 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 28 C learance N o.: FT DI# 5 0 1 64-pin QFN (8mm x 8mm) The 64-pin QFN (8mm x 8mm) is used on the following product: VNC2-64Q1B This package is nominally 8.00mm x 8.00mm. The solder pads are on a 0.40mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 28.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 28.1 64-pin QFN (8mm x 8mm) Scaled Footprint 28.2 Annotated Footprint The annotated footprint shows key measurements . Figure 28.2 64-pin QFN (8mm x 8mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 34 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 29 C learance N o.: FT DI# 5 0 1 64-pin QFN (9mm x 9mm) The 64-pin QFN (9mm x 9mm) is used on the following products: FT313HQ FT2232HQ FT4232HQ This package is nominally 9.00mm x 9.00mm. The solder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 29.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 29.1 64-pin QFN (9mm x 9mm) Scaled Footprint 29.2 Annotated Footprint The annotated footprint shows ke y measurements. Figure 29.2 64-pin QFN (9mm x 9mm) Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 35 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 29.2.1 C learance N o.: FT DI# 5 0 1 Additional Information This package is unique to all the other packages where there is extra strain relief between the exposed pad in the center and the IC pins at the edge of the IC. The exposed strain relief is connected to the pins so it is very important to ensure that the center exposed pad is not larger than specified, otherwise it could short all the signals together re ndering the device and PCB useless. The exposed strain relief should not be connected to the PCB in any way and this area should be marked as keep out. Only the pins at the edge of the package and the center exposed pad should be connected to the PCB. Figure 29.3 64-pin QFN (9mm x 9mm) Bottom View 36 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 30 C learance N o.: FT DI# 5 0 1 76-pin QFN The 76-pin QFN is used on the following products: FT601Q FT905Q FT906Q FT907Q FT908Q This package is nominally 9.00mm x 9.00mm. The solder pads are on a 0.40mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 30.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 30.1 76-pin QFN Scaled Footprint 30.2 Annotated Footprint The annotated footprint shows key measurements . Figure 30.2 76-pin QFN Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. Cross-hatching design used for less solders paste and less heat up rate required. 37 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 31 C learance N o.: FT DI# 5 0 1 80-pin LQFP The 80-pin LQFP is used on the following products: FT905L FT906L FT907L FT908L This package is nominally 12.00mm x 12.00mm. The solder pads are on a 0.40mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 31.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 31.1 80-pin LQFP Scaled Footprint 31.2 Annotated Footprint The annotated footprint shows key measurements . Figure 31.2 80-pin LQFP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 38 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 32 C learance N o.: FT DI# 5 0 1 100-pin LQFP The 100-pin LQFP is used on the following products: FT900L FT901L FT902L FT903L This package is nominally 16.00mm x 16.00mm. The so lder pads are on a 0.50mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 32.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 32.1 100-pin LQFP Scaled Footprint 32.2 Annotated Footprint The annotated footprint shows key measurements . Figure 32.2 100-pin LQFP Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. 39 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 33 C learance N o.: FT DI# 5 0 1 100-pin QFN The 100-pin QFN is used on the following products: FT900Q FT901Q FT902Q FT903Q This package is nominally 12.00mm x 12.00mm. The solder pads are on a 0.40mm pitch. Please see the IC Package Parameters in the IC datasheet for full information. 33.1 Scaled Footprint This 1:1 scaled footprint is the exact size when viewed or printed at 100%. Figure 33.1 100-pin QFN Scaled Footprint 33.2 Annotated Footprint The annotated footprint shows key me asurements. Figure 33.2 100-pin QFN Annotated Footprint Note: Red = top layer copper, other colors are mechanical layers. Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this area. 40 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 34 C learance N o.: FT DI# 5 0 1 Contact Information Head Office – Glasgow, UK Branch Office – Tigard, Oregon, USA Future Technology Devices International Limited Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 Future Technology Devices International Limited (USA) 7130 SW Fir Loop Tigard, OR 97223-8160 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) [email protected] [email protected] [email protected] E-Mail (Sales) E-Mail (Support) E-Mail (General Enquiries) [email protected] [email protected] [email protected] Branch Office – Taipei, Taiwan Branch Office – Shanghai, China Future Technology Devices International Limited (Taiwan) 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan , R.O.C. Tel: +886 (0) 2 8797 1330 Fax: +886 (0) 2 8751 9737 Future Technology Devices International Limited (C hina) Room 1103, No. 666 West Huaihai Road, Shanghai, 200052 C hina Tel: +86 21 62351596 Fax: +86 21 62351595 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) E-mail (Sales) E-mail (Support) E-mail (General Enquiries) [email protected] [email protected] [email protected] [email protected] [email protected] [email protected] Web Site http://ftdichip.com Distributor and Sales Representatives Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country. Sys tem and equipment manufacturers and des ig ners are responsible to ens ure that their s ystems, and any Future T ec hnology D evic es I nternational L td (FT DI) devices inc orporated in their s ystems, meet all applicable s afety, regulatory and s ystem - level performanc e requirements. A ll application-related information in this document (including application des c riptions , s ugges ted FT D I devic es and other materials ) is provided for referenc e only. While FT D I has taken c are to as s ure it is ac c urate, this information is s ubject to c ustomer c onfirmation, and FT D I dis c laims all liability for s ys tem des igns and for any applic ations as s istance provided by FTD I. U se of FT DI devices in life s upport and/or s afety applications is entirely at the us er’s ris k, a nd the us er agrees to defend, indemnify and hold harmles s FTDI from any and all damages , c laims , s uits or expens e res ulting from s uc h us e. T his doc ument is s ubject to c hange without notic e. N o freedom to us e patents or other intellectual property rights is implied by the public ation of this doc ument. N either the whole nor any part of the information c ontained in, or the produc t des c ribed in this doc ument, may be adapted or reproduc ed in any material or electronic form without the prior written c ons ent of the c opyright holder. Future T ec hnology D evic es I nternational L td , U nit 1 , 2 Seaward P lac e, C enturion Bus ines s P ark, G las gow G 4 1 1 H H , U nited Kingdom. Sc otland Regis tered C ompany N umber: SC 1 3 6 6 4 0 41 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 Appendix A – References Document References http://www.ftdichip.com/Support/Documents/PCBData.htm http://www.ftdichip.com/Products/ICs.htm Acronyms and Abbreviations Terms DFN IC LQFP Description Dual-Flat No-Leads Package Integrated Circuit Low Profile Quad Flat Package PCB Printed Circuit Board QFN Quad Flat No-Leads Package SSOP Shrink Small-Outline Package TSSOP Thin-Shrink Small Outline Package VQFN / WQFN Very Thin Quad Flat No-Lead Package 42 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 Appendix B – List of Tables & Figures List of Tables Table 1.1 Unavailable Footprints ................................................................................................... 6 Table 3.1 DFN Packages ............................................................................................................... 8 Table 3.2 QFP Packages................................................................................................................ 8 Table 3.3 QFN Packages ............................................................................................................... 9 Table 3.4 SSOP Packages ............................................................................................................. 9 List of Figures Figure 2.1 DFN Packages .............................................................................................................. 7 Figure 2.2 QFP Packages .............................................................................................................. 7 Figure 2.3 QFN Packages .............................................................................................................. 7 Figure 2.4 SSOP Packages ............................................................................................................ 7 Figure 4.1 10-pin DFN Scaled Footprint ...................................................................................... 10 Figure 4.2 10-pin DFN Annotated Footprint ................................................................................. 10 Figure 5.1 12-pin DFN Scaled Footprint ...................................................................................... 11 Figure 5.2 12-pin DFN Annotated Footprint ................................................................................. 11 Figure 6.1 16-pin QFN (3mm x 3 mm) Scaled Footprint ............................................................... 12 Figure 6.2 16-pin QFN (3mm x 3 mm) Annotated Footprint.......................................................... 12 Figure 7.1 16-pin QFN (4mm x 4 mm) Scaled Footprint ............................................................... 13 Figure 7.2 16-pin QFN (4mm x 4 mm) Annotated Footprint.......................................................... 13 Figure 8.1 16-pin SSOP Scaled Footprint .................................................................................... 14 Figure 8.2 16-pin SSOP Annotated Footprint ............................................................................... 14 Figure 9.1 16-pin TSSOP Scaled Footprint................................................................................... 15 Figure 9.2 16-pin TSSOP Annotated Footprint ............................................................................. 15 Figure 10.1 20-pin QFN Scaled Footprint..................................................................................... 16 Figure 10.2 20-pin QFN Annotated Footprint ............................................................................... 16 Figure 11.1 20-pin SSOP Scaled Footprint................................................................................... 17 Figure 11.2 20-pin SSOP Annotated Footprint ............................................................................. 17 Figure 12.1 24-pin QFN Scaled Footprint..................................................................................... 18 Figure 12.2 24-pin QFN Annotated Footprint ............................................................................... 18 Figure 13.1 24-pin SSOP Scaled Footprint................................................................................... 19 Figure 13.2 24-pin SSOP Annotated Footprint ............................................................................. 19 Figure 14.1 28-pin QFN Scaled Footprint..................................................................................... 20 Figure 14.2 28-pin QFN Annotated Footprint ............................................................................... 20 Figure 15.1 28-pin SSOP Scaled Footprint................................................................................... 21 43 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 Figure 15.2 28-pin SSOP Annotated Footprint ............................................................................. 21 Figure 16.1 28-pin TSSOP Scaled Footprint................................................................................. 22 Figure 16.2 28-pin TSSOP Annotated Footprint ........................................................................... 22 Figure 17.1 28-pin WQFN Scaled Footprint.................................................................................. 23 Figure 17.2 28-pin WQFN Annotated Footprint ............................................................................ 23 Figure 18.1 32-pin LQFP Scaled Footprint ................................................................................... 24 Figure 18.2 32-pin LQFP Annotated Footprint.............................................................................. 24 Figure 19.1 32-pin VQFN/QFN (5mm x 5mm) Scaled Footprint.................................................... 25 Figure 19.2 32-pin VQFN/QFN (5mm x 5mm) Annotated Footprint .............................................. 25 Figure 20.1 32-pin QFN (7mm x 7mm) Scaled Footprint ............................................................. 26 Figure 20.2 32-pin QFN (7mm x 7mm) Annotated Footprint ........................................................ 26 Figure 21.1 48-pin LQFP Scaled Footprint ................................................................................... 27 Figure 21.2 48-pin LQFP Annotated Footprint.............................................................................. 27 Figure 22.1 48-pin VQFN/WQFN (7mm x 7mm) Scaled Footprint................................................. 28 Figure 22.2 48-pin VQFN/WQFN (7mm x 7mm) Annotated Footprint ........................................... 28 Figure 23.1 48-pin QFN (8mm x 8mm) Scaled Footprint ............................................................. 29 Figure 23.2 48-pin QFN (8mm x 8mm) Annotated Footprint ........................................................ 29 Figure 24.1 56-pin QFN (7mm x 7mm) Scaled Footprint ............................................................. 30 Figure 24.2 56-pin QFN (7mm x 7mm) Annotated Footprint ........................................................ 30 Figure 25.1 56-pin VQFN (8mm x 8 mm) Scaled Footprint ........................................................... 31 Figure 25.2 56-pin VQFN (8mm x 8 mm) Annotated Footprint...................................................... 31 Figure 26.1 64-pin LQFP Scaled Footprint ................................................................................... 32 Figure 26.2 64-pin LQFP Annotated Footprint.............................................................................. 32 Figure 27.1 64-pin TQFP Scaled Footprint ................................................................................... 33 Figure 27.2 64-pin TQFP Annotated Footprint.............................................................................. 33 Figure 28.1 64-pin QFN (8mm x 8mm) Scaled Footprint ............................................................. 34 Figure 28.2 64-pin QFN (8mm x 8mm) Annotated Footprint ........................................................ 34 Figure 29.1 64-pin QFN (9mm x 9mm) Scaled Footprint ............................................................. 35 Figure 29.2 64-pin QFN (9mm x 9mm) Annotated Footprint ........................................................ 35 Figure 29.3 64-pin QFN (9mm x 9mm) Bottom View ................................................................... 36 Figure 30.1 76-pin QFN Scaled Footprint..................................................................................... 37 Figure 30.2 76-pin QFN Annotated Footprint ............................................................................... 37 Figure 31.1 80-pin LQFP Scaled Footprint ................................................................................... 38 Figure 31.2 80-pin LQFP Annotated Footprint.............................................................................. 38 Figure 32.1 100-pin LQFP Scaled Footprint ................................................................................. 39 Figure 32.2 100-pin LQFP Annotated Footprint ............................................................................ 39 Figure 33.1 100-pin QFN Scaled Footprint................................................................................... 40 Figure 33.2 100-pin QFN Annotated Footprint ............................................................................. 40 44 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited Technical Note TN_166 FTDI Example IC PCB Footprints V ers ion 1 .0 D oc ument Reference N o.: FT _001321 C learance N o.: FT DI# 5 0 1 Appendix C – Revision History Document Title: TN_166 FTDI Example IC PCB Footprints Document Reference No.: FT_001321 Clearance No.: FTDI# 501 Product Page: http://www.ftdichip.com/FTProducts.htm Document Feedback: Send Feedback Revision Changes Date 1.0 Initial Release 2016-04-27 45 P roduc t Page D oc ument Feedback C opyright © Future T echnology D evices I nternational L imited