Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name FXLN8372QR1 QFN-COL 12 3*3*0.95 P.65 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-11-19 00DJK50008S310A1.4 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) Yes No No e4 7c-I MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles FXLN8372QR1 QFN-COL 12 3*3*0.95 P.65 ALL 0.023800 g EACH 1 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version Exemptions in this part List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Accepted Daniel Binyon 2012/51/EU 7c-I:Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight Bonding Wire 0.0001 Bonding Wire Silicon Semiconductor Die SubstanceClass Substance CAS Metals Gold, metal 7440-57-5 Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 1000000 100 4201 0.4201 g 0.0001 0.0003 g g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000006 g 20000 2 252 0.0252 Silicon Semiconductor Die Glass Silicon, doped - 0.000294 g 980000 98 12352 1.2352 Die Encapsulant 0.0133 g Die Encapsulant Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000008 g 6 0.0006 3 0.0003 Die Encapsulant Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00013353 g 10040 1.004 5610 0.561 Die Encapsulant Plastics/polymers Proprietary Material-Other Epoxy resins - 0.00100149 g 75300 7.53 42079 4.2079 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00004006 g 3012 0.3012 1683 0.1683 Die Encapsulant Lead/Lead Compounds Lead 7439-92-1 0.00000021 g 16 0.0016 8 0.0008 Die Encapsulant Solvents, additives, and other materials Other organic phosphorous compounds - 0.00004006 g 3012 0.3012 1683 0.1683 Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins - 0.00073441 g 55219 5.5219 30857 3.0857 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.01135016 g 853395 85.3395 476907 47.6907 Copper Lead Frame 0.0068 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.00634179 g 932615 93.2615 266461 26.6461 Copper Lead Frame Metals Gold, metal 7440-57-5 0 g 0 0 0 0 Copper Lead Frame Solvents, additives, and other materials Silicon 7440-21-3 0.00004283 g 6299 0.6299 1799 0.1799 Copper Lead Frame Metals Magnesium, metal 7439-95-4 0.00000996 g 1464 0.1464 418 0.0418 Copper Lead Frame Nickel (external applications only) Nickel 7440-02-0 0.00040144 g 59036 5.9036 16867 1.6867 Copper Lead Frame Metals Palladium, metal 7440-05-3 0.00000398 g 586 0.0586 167 0.0167 Copper Lead Frame Metals Silver, metal 7440-22-4 0 g 0 0 0 0 Non-conductive Epoxy 0.0007 g Non-conductive Epoxy Solvents, additives, and other materials Bisphenol A 80-05-7 0.00000042 g 600 0.06 17 0.0017 Non-conductive Epoxy Plastics/polymers 4,4'-Isopropylidenediphenol-1-chloro-2,3-epoxypropane concentrate 25068-38-6 0.00006958 g 99400 9.94 2923 0.2923 Non-conductive Epoxy Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00007 g 100000 10 2941 0.2941 Non-conductive Epoxy Glass Silicon dioxide 7631-86-9 0.00042 g 600000 60 17647 1.7647 Non-conductive Epoxy Plastics/polymers Proprietary Material-Other chlorinated epoxy resins - 0.00007 g 100000 10 2941 0.2941 Non-conductive Epoxy Plastics/polymers Cycloaliphatic Epoxy Resin 244772-00-7 0.00007 g 100000 10 2941 0.2941 Pb Glass Frit Semiconductor Di 0.0026 7c-I g Pb Glass Frit Semiconductor Di Lead/Lead Compounds Lead (II) titanate 12060-00-3 0.00002699 g 10381 1.0381 1134 0.1134 Pb Glass Frit Semiconductor Di Glass Fibrous-glass-wool 65997-17-3 0.00002585 g 9943 0.9943 1086 0.1086 Pb Glass Frit Semiconductor Di Solvents, additives, and other materials 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate 25265-77-4 0.00002585 g 9943 0.9943 1086 0.1086 Pb Glass Frit Semiconductor Di Glass Silicon, doped - 0.00252131 g 969733 96.9733 105937 10.5937 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/FXLN8372QR1_IPC1752_v11.xml http://www.freescale.com/mcds/FXLN8372QR1_IPC1752A.xml