AVX TAZG686004C

A KYOCERA GROUP COMPANY
AVX
Surface Mount
Tantalum Capacitors
Index
Introduction
2
TAJ – Standard Series
4
TAJ – Low Profile Series
8
TPS – High Performance, Low ESR
10
TACmicrochip
14
TAZ – Specialist Series
18
CWR09 MIL-C-55365/4
22
CWR11 MIL-C-55365/8
25
Technical Summary & Application Guidelines
28
Packaging
42
Questions & Answers
46
Technical Publications
48
Fax Back Form
49
1
Introduction
AVX Tantalum
AVX Paignton is the Divisional Headquarters for the Tantalum
division which has manufacturing locations in Paignton in the
UK, Biddeford in Maine, USA, Juarez in Mexico, Lanskroun
in the Czech Republic and El Salvador.
The Division takes its name from the raw material used to
make its main products, Tantalum Capacitors. Tantalum is
an element extracted from ores found alongside tin and
niobium deposits; the major sources of supply are Canada,
Brazil and Australasia.
So for high volume tantalum capacitors with leading edge
technology call us first - AVX your global partner.
TECHNOLOGY TRENDS
Tantalum Powder CV/gm
CV/g ('000s)
The amount of capacitance possible in a tantalum capacitor
is directly related to the type of tantalum powder used to
manufacture the anode.
The graph following shows how the CV/g has steadily
increased over time, thus allowing the production of larger
and larger capacitances with the same physical volume.
CV/g is the measure used to define the volumetric efficiency
of a powder, a high CV/g means a higher capacitance from
the same volume.
These improvements in the powder have been achieved
through close development with the material suppliers.
AVX Tantalum is committed to driving the available technology
forwards as is clearly identified by the new TACmicrochip
technology and the standard codes under development.
If you have any specific requirements, please contact your
local AVX sales office for details on how AVX Tantalum can
assist you in addressing your future requirements.
80
70
60
50
40
30
20
10
0
1975
1980
1985
1990
Year
1995
2000
WORKING WITH THE CUSTOMER
- ONE STOP SHOPPING
In line with our desire to become the number one supplier in
the world for passive and interconnection components, AVX
constantly feels the need to look forward and innovate.
It is not good enough to market the best products, the
customer must have access to a service system which suits
their needs and benefits their business.
The AVX ‘one stop shopping’ concept is already beneficial
in meeting the needs of major OEMs while worldwide
partnerships with only the premier division of distributors aids
the smaller user.
Helping to market the breadth and depth of our electronic
component line card and support our customers are a
dedicated team of commercial sales people, applications
engineers and product marketing managers. Their qualifica-
2
tions are hopefully always appropriate to your commercial
need, but as higher levels of technical expertise are required,
access directly to the appropriate department is seamless
and transparent.
Total quality starts and finishes with our customer service,
and where cost and quality are perceived as given quantities
the AVX service invariably has us selected as the preferred
supplier.
Facilities are equipped with instant worldwide computer and
telecommunication links connected to every sales and production site worldwide. That ensures that our customers
delivery requirements are consistently met wherever in the
world they may be.
Introduction
AVX Tantalum
APPLICATIONS
2-16 Volt
50 Volt @ 85°C
2-35 Volt
Low ESR
33 Volt @ 125°C
Low ESR
Low Profile Case
Automotive range due
second half 1998
Low Profile Case
0603 available
Low Failure Rate
High Volumetric Efficiency
Temperature Stability
High Reliability
Temperature Stability
QS9000 approved
Stable over Time
0603 available
Low Failure Rate
High Volumetric Efficiency
Temperature Stability
Stable over Time
QUALITY STATEMENTS
AVX’s focus is CUSTOMER satisfaction - customer satisfaction in the broadest sense: product quality, technical support,
product availability and all at a competitive price.
In pursuance of the ethos and established goals of our
corporate wide QV2000 program, it is the stated objective
of AVX Tantalum to supply our customers with a world class
service in the manufacturing and supplying of electronic
components which will result in an adequate return on
investment.
This world class service shall be defined as consistently
supplying product and services of the highest quality and
reliability.
This should encompass, but not be restricted to all aspects
of the customer supply chain.
In addition any new or changed products, processes or
services will be qualified to established standards of quality
and reliability.
The objectives and guidelines listed above shall be achieved
by the following codes of practice:
1. Continual objective evaluation of customer needs and
expectations for the future and the leverage of all AVX
resources to meet this challenge.
2. By continually fostering and promoting culture of continuous improvement through ongoing training and empowered
participation of employees at all levels of the company.
3. By Continuous Process Improvement using sound engineering principles to enhance existing equipment, material
and processes. This will involve the application of the
science of S.P.C. focused on improving the Process
Capability Index, Cpk.
All AVX Tantalum manufacturing locations are ISO9000
approved and Paignton is approved to QS9000 - Automotive
Quality System Requirements.
3
TAJ Series
The TAJ standard series encompasses
the five key sizes recognized by major
OEMs throughout the world. The V case
size has been added to the TAJ range
to allow high CVs to be offered. The
operational temperature is -55°C to
+85°C at rated voltage and up to +125°C
with voltage derating in applications
utilizing recommended series resistance.
TAJ is available in standard and extended
ranges.
CASE DIMENSIONS: millimeters (inches)
Code
EIA
Code
W+0.2 (0.008)
-0.1 (0.004)
L±0.2 (0.008)
H+0.2 (0.008)
-0.1 (0.004)
W1±0.2 (0.008)
A+0.3 (0.012)
-0.2 (0.008)
S Min.
1.1 (0.043)
A
3216
1.6 (0.063)
3.2 (0.126)
1.6 (0.063)
1.2 (0.047)
0.8 (0.031)
B
3528
2.8 (0.110)
3.5 (0.138)
1.9 (0.075)
2.2 (0.087)
0.8 (0.031)
1.4 (0.055)
C
6032
3.2 (0.126)
6.0 (0.236)
2.6 (0.102)
2.2 (0.087)
1.3 (0.051)
2.9 (0.114)
D
7343
4.3 (0.169)
7.3 (0.287)
2.9 (0.114)
2.4 (0.094)
1.3 (0.051)
4.4 (0.173)
E
7343H
4.3 (0.169)
7.3 (0.287)
4.1 (0.162)
2.4 (0.094)
1.3 (0.051)
4.4 (0.173)
7.3 (0.287)
3.45±0.3
(0.136±0.012)
3.1 (0.120)
1.4 (0.055)
3.4 (0.133)
V
6.1 (0.240)
W1 dimension applies to the termination width for A dimensional area only.
HOW TO ORDER
TAJ
C
106
M
025
R
**
Type
Case Code
See table above
Capacitance Code
pF code: 1st two
digits represent
significant figures
3rd digit represents
multiplier (number of
zeros to follow)
Tolerance
K=±10%
M=±20%
Rated DC Voltage
Packaging
Consult page 42
for details
Additional
characters may be
added for special
requirements
TECHNICAL SPECIFICATIONS
Technical Data:
Capacitance Range:
Capacitance Tolerance:
Rated Voltage (VR)
Category Voltage (VC)
Surge Voltage (VS)
Surge Voltage (VS)
Temperature Range:
Environmental Classification:
Reliability
Qualification
4
⬉
⬉
⬉
⬉
+85°C:
+125°C:
+85°C:
+125°C:
All technical data relate to an ambient temperature of +25°C
0.1µF to 470µF
±20%; ±10%
2
4
6.3
10
16
20
25
1.3
2.7
4
7
10
13
17
2.7
5.2
8
13
20
26
32
1.7
3.2
5
8
12
16
20
-55°C to +125°C
55/125/56 (IEC 68-2)
1% per 1000h at 85°C with a 0.1Ω/V series impedance, 60%
CECC 30801 - 005 issue 1
EIA 535BAAC
35
23
46
28
50
33
65
40
confidence level
TAJ Series
CAPACITANCE AND VOLTAGE RANGE
(LETTER DENOTES CASE CODE)
Capacitance
µF
Code
0.10
104
0.15
154
0.22
224
0.33
334
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
475
6.8
685
10
106
15
156
22
226
33
336
47
476
68
686
100
107
150
157
220
227
330
337
470
477
680
687
1000
108
1500
158
2V
A
B
C
D
E
4V
A
A
A
B A
A
A/B
B A
B/C
B/C
B
C/D
E
D
E
6.3V
A
A
A
A/B
A/B
B A
B/C A
C B A
C/D B
C/D B
D C B
C/D
C/D
E
E/ V D
E
Rated voltage (VR) at 85°C
10V
16V
20V
A
A
A
A/B
A/B
B/C A
B/C A
C B A
C/D B
D C B
D C
D C
E D
E D
D/E/ V
E
V
A
A
A/B
A/B
B A
B/C A
B/C A
C B
C/D B
D C B
D C
D C
E D
D/ V
V D/E
E
V
A
A
A
A/B
A/B
B/C A
B/C
C B
C/D B
D C B
D C
D C
E D
V D/E
E
25V
A
A
A
A/B
B A
B/C
C B
C B
C/D
D
D C
E D
D
E
35V
A
A
A
A
A/B
A/B
B A
B/C A
B/C
C B
C/D B
D C
D C
D C
E D
D
E
50V
A
A/B
A/B
B
C
C
C
D C
D
D
D
D
E
= Standard Range
= Extended Range
= Development Range
5
TAJ Series
RATINGS & PART NUMBER REFERENCE
AVX
Part No.
Case
Size
Capacitance
µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
AVX
Part No.
3.0
TAJA155*010
TAJA225*010
TAJA335*010
TAJA475*010
TAJB475*010
TAJA685*010
TAJB685*010
TAJA106*010
TAJB106*010
TAJC106*010
TAJA156*010
TAJB156*010
TAJC156*010
TAJB226*010
TAJC226*010
TAJB336*010
TAJC336*010
TAJD336*010
TAJC476*010
TAJD476*010
TAJC686*010
TAJD686*010
TAJC107*010
TAJD107*010
TAJD157*010
TAJE157*010
TAJD227*010
TAJE227*010
TAJD337*010
TAJE337*010
TAJV337*010
TAJE477*010
A
47
0.9
6
4 volt @ 85°C (2.5 volt @ 125°C)
TAJA475*004
TAJA685*004
TAJA106*004
TAJA156*004
TAJB156*004
TAJA226*004
TAJA336*004
TAJB336*004
TAJB476*004
TAJB686*004
TAJC686*004
TAJB107*004
TAJC107*004
TAJC227*004
TAJD227*004
TAJE337*004
A
A
A
A
B
A
A
B
B
B
C
B
C
C
D
E
4.7
6.8
10
15
15
22
33
33
47
68
68
100
100
220
220
330
0.5
0.5
0.5
0.6
0.6
0.9
1.3
1.4
1.9
2.7
2.7
4.0
4.0
8.8
8.8
13.2
6
6
6
6
6
6
6
6
6
6
6
8
6
8
8
8
7.5
6.5
6.0
4.0
3.0
3.5
3.0
2.8
2.4
1.8
1.6
1.6
1.3
1.2
0.9
0.9
6.3 volt @ 85°C (4 volt @ 125°C)
TAJA225*006
TAJA335*006
TAJA475*006
TAJA685*006
TAJB685*006
TAJA106*006
TAJB106*006
TAJA156*006
TAJB156*006
TAJA226*006
TAJB226*006
TAJC226*006
TAJB336*006
TAJC336*006
TAJB476*006
TAJC476*006
TAJD476*006
TAJB686*006
TAJC686*006
TAJD686*006
TAJC107*006
TAJD107*006
TAJC157*006
TAJD157*006
TAJC227*006
TAJD227*006
TAJE337*006
TAJE477*006
TAJV477*006
A
A
A
A
B
A
B
A
B
A
B
C
B
C
B
C
D
B
C
D
C
D
C
D
C
D
E
E
V
2.2
3.3
4.7
6.8
6.8
10
10
15
15
22
22
22
33
33
47
47
47
68
68
68
100
100
150
150
220
220
330
470
470
0.5
0.5
0.5
0.5
0.5
0.6
0.6
1.0
1.0
1.4
1.4
1.4
2.1
2.1
3.0
3.0
3.0
4.3
4.3
4.3
6.3
6.3
9.5
9.5
13.9
13.9
20.8
29.6
29.6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
8
6
6
6
6
6
6
10
8
8
10
8
Capacitance
µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
10 volt @ 85°C (6.3 volt @ 125°C)
2 volt @ 85°C (1.2 volt @ 125°C)
TAJA476*002
Case
Size
9.0
7.0
6.0
5.0
4.0
4.0
3.0
3.5
2.5
3.0
2.5
2.0
2.2
1.8
2.0
1.6
1.1
1.8
1.6
0.9
1.4
0.9
1.3
0.9
1.2
0.9
0.9
0.9
0.9
All technical data relates to an ambient temperature of +25°C measured at
120 Hz, 0.5V RMS unless otherwise stated.
*Insert K for ±10% and M for ±20%.
NOTE: We reserve the right to supply higher specification parts in the same
case size, to the same reliability standards.
A
A
A
A
B
A
B
A
B
C
A
B
C
B
C
B
C
D
C
D
C
D
C
D
D
E
D
E
D
E
V
E
1.5
2.2
3.3
4.7
4.7
6.8
6.8
10
10
10
15
15
15
22
22
33
33
33
47
47
68
68
100
100
150
150
220
220
330
330
330
470
0.5
0.5
0.5
0.5
0.5
0.7
0.7
1.0
1.0
1.0
1.5
1.5
1.5
2.2
2.2
3.3
3.3
3.3
4.7
4.7
6.8
6.8
10.0
10.0
15.0
15.0
22.0
22.0
33.0
33.0
33.0
47.0
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
8
8
8
8
8
8
8
10
10.0
7.0
5.5
5.0
4.0
4.0
3.0
3.0
2.5
2.5
3.2
2.8
2.0
2.4
1.8
2.0
1.6
1.1
1.2
0.9
1.3
0.9
1.2
0.9
0.9
0.9
0.9
0.9
0.9
0.9
0.9
0.9
16 volt @ 85°C (10 volt @ 125°C)
TAJA105*016
TAJA155*016
TAJA225*016
TAJB225*016
TAJA335*016
TAJB335*016
TAJA475*016
TAJB475*016
TAJA685*016
TAJB685*016
TAJC685*016
TAJB106*016
TAJC106*016
TAJB156*016
TAJC156*016
TAJB226*016
TAJC226*016
TAJD226*016
TAJC336*016
TAJD336*016
TAJC476*016
TAJD476*016
TAJD686*016
TAJD107*016
TAJE107*016
TAJD157*016
TAJV157*016
TAJV227*016
A
A
A
B
A
B
A
B
A
B
C
B
C
B
C
B
C
D
C
D
C
D
D
D
E
D
V
V
1.0
1.5
2.2
2.2
3.3
3.3
4.7
4.7
6.8
6.8
6.8
10
10
15
15
22
22
22
33
33
47
47
68
100
100
150
150
220
0.5
0.5
0.5
0.5
0.5
0.5
0.8
0.8
1.1
1.1
1.1
1.6
1.6
2.4
2.4
3.5
3.5
3.5
5.3
5.3
7.5
7.5
10.8
16.0
16.0
24.0
24.0
35.2
4
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
8
8
11.0
8.0
6.5
5.5
5.0
4.5
4.0
3.5
3.5
2.5
2.5
2.8
2.0
2.5
1.8
2.3
1.6
1.1
1.5
0.9
1.4
0.9
0.9
0.9
0.9
0.9
0.9
0.9
For parametric information on development codes, please contact your
local AVX sales office.
6
TAJ Series
RATINGS & PART NUMBER REFERENCE
AVX
Part No.
Case
Size
Capacitance
µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
A
A
A
A
B
A
B
A
B
C
B
C
B
C
B
C
D
C
D
C
D
D
D
E
V
0.68
1.0
1.5
2.2
2.2
3.3
3.3
4.7
4.7
4.7
6.8
6.8
10
10
15
15
15
22
22
33
33
47
68
68
100
0.5
0.5
0.5
0.5
0.5
0.7
0.7
1.0
1.0
1.0
1.4
1.4
2.0
2.0
3.0
3.0
3.0
4.4
4.4
6.6
6.6
9.4
13.6
13.6
20.0
4
4
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
8
12.0
9.0
6.5
5.3
3.5
4.5
3.0
4.0
3.0
2.8
2.5
2.0
2.1
1.9
2.0
2.0
1.1
1.6
0.9
1.5
0.9
0.9
0.9
0.9
0.9
25 volt @ 85°C (16 volt @ 125°C)
TAJA474*025
TAJA684*025
TAJA105*025
TAJA155*025
TAJB155*025
TAJA225*025
TAJB225*025
TAJB335*025
TAJC335*025
TAJB475*025
TAJC475*025
TAJB685*025
TAJC685*025
TAJC106*025
TAJD106*025
TAJD156*025
TAJC226*025
TAJD226*025
TAJD336*025
TAJE336*025
TAJD476*025
A
A
A
A
B
A
B
B
C
B
C
B
C
C
D
D
C
D
D
E
D
0.47
0.68
1.0
1.5
1.5
2.2
2.2
3.3
3.3
4.7
4.7
6.8
6.8
10
10
15
22
22
33
33
47
0.5
0.5
0.5
0.5
0.5
0.6
0.6
0.8
0.8
1.2
1.2
1.7
1.7
2.5
2.5
3.8
5.5
5.5
8.3
8.3
11.8
4
4
4
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Case
Size
Capacitance
µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
35 volt @ 85°C (23 volt @ 125°C)
20 volt @ 85°C (13 volt @ 125°C)
TAJA684*020
TAJA105*020
TAJA155*020
TAJA225*020
TAJB225*020
TAJA335*020
TAJB335*020
TAJA475*020
TAJB475*020
TAJC475*020
TAJB685*020
TAJC685*020
TAJB106*020
TAJC106*020
TAJB156*020
TAJC156*020
TAJD156*020
TAJC226*020
TAJD226*020
TAJC336*020
TAJD336*020
TAJD476*020
TAJD686*020
TAJE686*020
TAJV107*020
AVX
Part No.
14.0
10.0
8.0
7.5
5.0
7.0
4.5
3.5
2.8
2.8
2.4
2.8
2.0
1.8
1.2
1.0
1.4
0.9
0.9
0.9
0.9
All technical data relates to an ambient temperature of +25°C measured at
120 Hz, 0.5V RMS unless otherwise stated.
TAJA104*035
TAJA154*035
TAJA224*035
TAJA334*035
TAJA474*035
TAJB474*035
TAJA684*035
TAJB684*035
TAJA105*035
TAJB105*035
TAJA155*035
TAJB155*035
TAJC155*035
TAJB225*035
TAJC225*035
TAJB335*035
TAJC335*035
TAJB475*035
TAJC475*035
TAJD475*035
TAJC685*035
TAJD685*035
TAJC106*035
TAJD106*035
TAJC156*035
TAJD156*035
TAJD226*035
TAJE226*035
TAJD336*035
A
A
A
A
A
B
A
B
A
B
A
B
C
B
C
B
C
B
C
D
C
D
C
D
C
D
D
E
D
0.1
0.15
0.22
0.33
0.47
0.47
0.68
0.68
1.0
1.0
1.5
1.5
1.5
2.2
2.2
3.3
3.3
4.7
4.7
4.7
6.8
6.8
10.0
10.0
15.0
15.0
22.0
22.0
33.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.8
0.8
1.2
1.2
1.6
1.6
1.6
2.4
2.4
3.5
3.5
5.3
5.3
7.7
7.7
11.6
4
4
4
4
4
4
4
4
4
4
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
24.0
21.0
18.0
15.0
12.0
10.0
8.0
8.0
7.5
6.5
7.5
5.2
4.5
4.2
3.5
3.5
2.5
3.1
2.2
1.5
1.8
1.3
1.6
1.0
1.4
0.9
0.9
0.9
0.9
50 volt @ 85°C (33 volt @ 125°C)
TAJA104*050
TAJA154*050
TAJB154*050
TAJA224*050
TAJB224*050
TAJB334*050
TAJC474*050
TAJC684*050
TAJC105*050
TAJC155*050
TAJD155*050
TAJD225*050
TAJD335*050
TAJD475*050
TAJD685*050
TAJE106*050
A
A
B
A
B
B
C
C
C
C
D
D
D
D
D
E
0.1
0.15
0.15
0.22
0.22
0.33
0.47
0.68
1.0
1.5
1.5
2.2
3.3
4.7
6.8
10.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.8
0.8
1.1
1.7
2.4
3.4
5.0
4
4
4
4
4
4
4
4
4
6
6
6
6
6
6
8
22.0
15.0
17.0
18.0
14.0
12.0
8.0
7.0
5.5
4.5
4.0
2.5
2.0
1.4
1.0
0.9
For parametric information on development codes, please contact your
local AVX sales office.
*Insert K for ±10% and M for ±20%.
NOTE: We reserve the right to supply higher specification parts in the
same case size, to the same reliability standards.
7
TAJ Series
Low Profile
Three additional case sizes are available
in the TAJ range offering low profile solid
tantalum chip capacitors. Designed for
applications where maximum height of
components above or below board are of
prime consideration, this height of 1.2mm
equates to that of a standard integrated
circuit package after mounting. The S&T
footprints are identical to the A&B case
size parts.
CASE DIMENSIONS: millimeters (inches)
Code
EIA
Code
W+0.2 (0.008)
-0.1 (0.004)
L±0.2 (0.008)
H Max.
W1±0.1 (0.004)
A+0.3 (0.012)
-0.1 (0.004)
S Min.
R*
2012
1.3 (0.051)
2.05 (0.081)
1.2 (0.047)
S**
3216L
1.6 (0.063)
3.2 (0.126)
1.2 (0.047)
1.2 (0.047)
0.5 (0.020)
0.85 (0.033)
1.2 (0.047)
0.8 (0.031)
T**
3528L
2.8 (0.110)
3.5 (0.138)
1.2 (0.047)
1.1 (0.043)
2.2 (0.087)
0.8 (0.031)
W
—
3.2 (0.126)
6.0 (0.236)
1.4 (0.055)
1.5 (0.059)
2.2 (0.087)
1.3 (0.051)
Y
—
4.3 (0.169)
7.3 (0.287)
2.9 (0.114)
2.0 (0.079)
2.4 (0.094)
1.3 (0.051)
4.4 (0.173)
* 0805 Equivalent
** Low Profile Versions of A & B Case
W1 dimension applies to the termination width for A dimensional area only.
Pad Stand-off is 0.1±0.1.
CAPACITANCE AND VOLTAGE RANGE (LETTER DENOTES CASE CODE)
Capacitance
µF
Code
0.10
104
0.15
154
0.22
224
0.33
334
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
475
6.8
685
10
106
15
156
22
226
33
336
47
476
68
686
100
107
150
157
220
227
330
337
470
477
680
687
1000
108
2V
R
R
S
R/S
R/S
R/S
S/T
R/T
R/S
R/S
R/S
S/T
T R
T
T
R/S
R/S
R/S
S/T
T
R
T
R/S
R/S/T
S
T
T
20V
R/S
R/S
R/S
R/S
R/S
R/S/T
R/S/T
T
T
W
W
W
W
W
W
X
X/Y
Y
= Development Range
X = 1.5mm height in a D case footprint
X
Y
X
Y
W
Y W
Y
X
Y
25V
W
W
= Standard Range
8
4V
Rated voltage (VR ) at 85°C
6.3V
10V
16V
X
Y
X
Y
X
Y
TAJ Series
Low Profile
RATINGS & PART NUMBER REFERENCE
AVX
Part No.
Case
Size
Capacitance
µF
TAJR475*002
TAJR685*002
TAJS106*002
R
R
S
4.7
6.8
10.0
TAJR225*004
TAJS225*004
TAJR335*004
TAJS335*004
TAJR475*004
TAJS475*004
TAJS685*004
TAJT685*004
TAJR106*004
TAJT106*004
R
S
R
S
R
S
S
T
R
T
2.2
2.2
3.3
3.3
4.7
4.7
6.8
6.8
10.0
10.0
TAJR155*006
TAJS155*006
TAJR225*006
TAJS225*006
TAJR335*006
TAJS335*006
TAJS475*006
TAJT475*006
TAJT685*006
TAJT156*006
TAJW336*006
R
S
R
S
R
S
S
T
T
T
W
1.5
1.5
2.2
2.2
3.3
3.3
4.7
4.7
6.8
15.0
33.0
TAJR105*010
TAJS105*010
TAJR155*010
TAJS155*010
TAJR225*010
TAJS225*010
TAJS335*010
TAJT335*010
TAJT475*010
TAJT685*010
TAJT106*010
TAJY686*010
TAJY107*010
R
S
R
S
R
S
S
T
T
T
T
Y
Y
1.0
1.0
1.5
1.5
2.2
2.2
3.3
3.3
4.7
6.8
10.0
68
100
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
AVX
Part No.
Case
Size
Capacitance
µF
0.5
0.5
0.5
6
6
6
20.0
20.0
20.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
6
6
6
6
6
6
6
6
6
25.0
25.0
20.0
18.0
12.0
10.0
8.0
6.0
10.0
5.0
TAJR684*016
TAJS684*016
TAJR105*016
TAJS105*016
TAJT105*016
TAJS155*016
TAJT225*016
TAJT335*016
TAJW106*016
R
S
R
S
T
S
T
T
W
0.68
0.68
1.0
1.0
1.0
1.5
2.2
3.3
10.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1.0
2.1
6
6
6
6
6
6
6
6
6
6
6
25.0
25.0
20.0
18.0
12.0
9.0
7.5
6.0
5.0
4.5
2.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1.0
1.0
6.8
10
4
4
6
6
6
6
6
6
6
6
6
6
6
25.0
25.0
20.0
20.0
15.0
12.0
8.0
6.0
5.0
4.0
3.0
0.9
0.9
2 volt
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1.6
4
4
4
4
4
6
6
6
6
25.0
25.0
20.0
15.0
15.0
12.0
6.5
5.0
2.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
6
6
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
15.0
20.0
12.0
9.0
6.5
6.0
16 volt
4 volt
6.3 volt
10 volt
20 volt
TAJR104*020
TAJS104*020
TAJR154*020
TAJS154*020
TAJR224*020
TAJS224*020
TAJR334*020
TAJS334*020
TAJR474*020
TAJS474*020
TAJR684*020
TAJS684*020
TAJT684*020
TAJR105*020
TAJS105*020
TAJT105*020
TAJT155*020
TAJT225*020
R
S
R
S
R
S
R
S
R
S
R
S
T
R
S
T
T
T
0.1
0.1
0.15
0.15
0.22
0.22
0.33
0.33
0.47
0.47
0.68
0.68
0.68
1.0
1.0
1.0
1.5
2.2
For parametric information on development codes, please contact your
local AVX sales office.
All technical data relates to an ambient temperature of +25°C measured at
120 Hz, 0.5V RMS unless otherwise stated.
*Insert K for ±10% and M for ±20%.
NOTE: We reserve the right to supply higher specification parts in the
same case size, to the same reliability standards.
9
TPS Series
Low ESR
The TPS surface mount products
have inherently low ESR (equivalent series
resistance) and are capable of higher
ripple current handling, producing lower
ripple voltages, less power and heat
dissipation than standard product for the
most efficient use of circuit power. TPS
has been designed, manufactured, and
preconditioned for optimum performance
in typical power supply applications. By
combining the latest improvements in
tantalum powder technology, improved
manufacturing processes, and application specific preconditioning tests, AVX is
able to provide a technologically superior
alternative to the standard range.
CASE DIMENSIONS: millimeters (inches)
Code
EIA
Code
W+0.2 (0.008)
-0.1 (0.004)
L±0.2 (0.008)
H+0.2 (0.008)
-0.1 (0.004)
W1±0.2 (0.008)
A+0.3 (0.012)
-0.2 (0.008)
S Min.
1.1 (0.043)
A
3216
1.6 (0.063)
3.2 (0.126)
1.6 (0.063)
1.2 (0.047)
0.8 (0.031)
B
3528
2.8 (0.110)
3.5 (0.138)
1.9 (0.075)
2.2 (0.087)
0.8 (0.031)
1.4 (0.055)
C
6032
3.2 (0.126)
6.0 (0.236)
2.6 (0.102)
2.2 (0.087)
1.3 (0.051)
2.9 (0.114)
D
7343
4.3 (0.169)
7.3 (0.287)
2.9 (0.114)
2.4 (0.094)
1.3 (0.051)
4.4 (0.173)
E
7343H
4.3 (0.169)
7.3 (0.287)
4.1 (0.162)
2.4 (0.094)
1.3 (0.051)
4.4 (0.173)
7.3 (0.287)
3.45 ±0.3
(0.136±0.012)
3.1 (0.120)
1.4 (0.055)
3.4 (0.133)
V
6.1 (0.240)
W1 dimension applies to the termination width for A dimensional area only.
HOW TO ORDER
TPS
D
107
M
010
Type
Case Size
See table above
Capacitor Code
pF code: 1st two
digits represent
significant figures,
3rd digit represents
multiplier (number of
zeros to follow)
Tolerance
K=±10%
M=±20%
Rated
DC Voltage
R
Packaging
Consult page 42
for details
0100
Maximum ESR in
Milliohms
*See note below
NOTE: The EIA & CECC standards for low ESR Solid Tantalum Capacitors
allow an ESR movement to 1.25 times catalog limit post mounting
TECHNICAL SPECIFICATIONS
Technical Data:
Capacitance Range:
Capacitance Tolerance:
Rated Voltage (VR)
Category Voltage (VC)
Surge Voltage (VS)
Surge Voltage (VS)
Temperature Range:
Environmental Classification:
Reliability:
10
⬉ +85°C:
⬉ +125°C:
⬉ +85°C:
⬉ +125°C:
All technical data relate to an ambient temperature of +25°C
1.5µF to 470µF
±20%; ±10%
6.3
10
16
20
25
35
4
7
10
13
17
23
8
13
20
26
32
46
5
8
12
16
20
28
-55°C to +125°C
55/125/56 (IEC 68-2)
1% per 1000h at 85°C with 0.1Ω/V series impedance, 60% confidence level
TPS Series
Low ESR
CAPACITANCE AND VOLTAGE RANGE (LETTER DENOTES CASE CODE)
Capacitance
µF
Code
1.5
155
3.3
335
4.7
475
6.8
685
6.3V
10V
Rated voltage (VR) at 85°C
16V
20V
25V
35V
A(3000)
A(3500)
10
106
A(1800)
15
156
22
226
33
336
47
476
68
686
100
107
C(150)
150
157
D(125)
220
227
D(100)
330
337
E(100-150)
V(60-100)
470
477
E(50-200)
V(55-100)
A(1500)
B(600)
A(1000)
B(800)
B(700)
C(375)
C(375-500)
C(300)
C(350)
A(1800)
B(1500)
C(600)
B(1000)
C(500)
D(300)
E(200)
C(450)
D(300)
C(450)
D(200)
D(400)
E(200-300)
D(200)
E(175-300)
D(300)
C(350)
D(150-200)
E(150)
D(250)
D(150)
E(125-150)
V(95-300)
C(200)
D(65-140)
E(125)
D(125-150)
E(100-150)
V(85-200)
D(100)
D(150)
V(75)
D (150)
E(60-150)
V(60)
D(150)
E(60-100)
V(60-100)
V(75-150)
E(50-200)
ESR limits quoted in brackets are in milliohms
11
TPS Series
Low ESR
RATINGS & PART NUMBER REFERENCE
AVX
Part No.
TPSA156*006R1500
TPSB336*006R0600
TPSC107*006R0150
TPSD157*006R0125
TPSD227*006R0100
TPSE337*006R0100
TPSE337*006R0125
TPSE337*006R0150
TPSV337*006R0060
TPSV337*006R0100
TPSE477*006R0050
TPSE477*006R0100
TPSE477*006R0200
TPSV477*006R0055
TPSV477*006R0100
TPSA106*010R1800
TPSA156*010R1000
TPSB226*010R0700
TPSC336*010R0375
TPSC336*010R0500
TPSC476*010R0350
TPSC107*010R0200
TPSD107*010R0065
TPSD107*010R0080
TPSD107*010R0100
TPSD107*010R0125
TPSD107*010R0140
TPSD107*010R0150
TPSE107*010R0125
TPSD157*010R0100
TPSD227*010R0150
TPSE227*010R0060
TPSE227*010R0100
TPSE227*010R0125
TPSE227*010R0150
TPSV227*010R0060
TPSD337*010R0150
TPSE337*010R0060
TPSE337*010R0100
TPSV337*010R0060
TPSV337*010R0100
TPSE477*010R0050
TPSE477*010R0100
TPSE477*010R0200
12
Case
Size
Capacitance
µF
Rated
Voltage
A
B
C
D
D
E
E
E
V
V
E
E
E
V
V
A
A
B
C
C
C
C
D
D
D
D
D
D
E
D
D
E
E
E
E
V
D
E
E
V
V
E
E
E
15
33
100
150
220
330
330
330
330
330
470
470
470
470
470
10
15
22
33
33
47
100
100
100
100
100
100
100
100
150
220
220
220
220
220
220
330
330
330
330
330
470
470
470
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
6.3
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
DCL
(µA)
Max.
0.9
2.1
6.3
9.5
13.9
20.8
20.8
20.8
20.8
20.8
29.6
29.6
29.6
29.6
29.6
1.0
1.5
2.2
3.3
3.3
4.7
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
15.0
22.0
22.0
22.0
22.0
22.0
22.0
33.0
33.0
33.0
33.0
33.0
47.0
47.0
47.0
DF
%
Max.
6
6
6
6
6
8
8
8
8
8
10
10
10
10
10
6
6
6
6
6
6
8
6
6
6
6
6
6
6
6
8
8
8
8
8
8
8
8
8
8
10
10
10
10
ESR
Max. (mΩ)
@100kHz
1500
600
150
125
100
100
125
150
60
100
50
100
200
55
100
1800
1000
700
375
500
350
200
65
80
100
125
140
150
125
100
150
60
100
125
150
60
150
60
100
60
100
50
100
200
100kHz Ripple Current (mA) Ratings
25ºC
224
376
856
1095
1225
1285
1149
1049
2041
1581
1817
1285
908
2132
1581
204
274
348
542
469
561
742
1519
1369
1225
1095
1035
1000
1149
1225
1000
1658
1285
1149
1049
2041
1000
1658
1285
2041
1581
1817
1285
908
85ºC
200
337
766
980
1095
1149
1028
938
1826
1414
1625
1149
812
1907
1414
183
245
312
484
420
501
663
1359
1225
1095
980
926
894
1028
1095
894
1483
1149
1028
938
1826
894
1483
1149
1826
1414
1625
1149
812
125ºC
89
151
343
438
490
514
460
420
816
632
727
514
363
853
632
82
110
139
217
188
224
297
608
547
490
438
414
400
460
490
400
663
514
460
420
817
400
663
514
817
632
727
514
363
TPS Series
Low ESR
RATINGS & PART NUMBER REFERENCE
AVX
Part No.
TPSA335*016R3500
TPSB156*016R0800
TPSC226*016R0375
TPSC336*016R0300
TPSC476*016R0350
TPSD476*016R0150
TPSD476*016R0200
TPSD686*016R0150
TPSD107*016R0125
TPSD107*016R0150
TPSE107*016R0100
TPSE107*016R0125
TPSE107*016R0150
TPSD157*016R0150
TPSV157*016R0075
TPSE227*016R0100
TPSV227*016R0075
TPSV227*016R0150
TPSA475*020R1800
TPSB106*020R1000
TPSC156*020R0450
TPSD336*020R0200
TPSE476*020R0150
TPSE686*020R0125
TPSE686*020R0150
TPSV107*020R0085
TPSV107*020R0200
TPSA155*025R3000
TPSB475*025R1500
TPSC106*025R0500
TPSD226*025R0200
TPSE336*025R0175
TPSE336*025R0200
TPSE336*025R0300
TPSD476*025R0250
TPSV686*025R0095
TPSV686*025R0150
TPSV686*025R0300
TPSC475*035R0600
TPSD106*035R0300
TPSE106*035R0200
TPSC156*035R0450
TPSD156*035R0300
TPSD226*035R0400
TPSE226*035R0200
TPSE226*035R0300
TPSD336*035R0300
Case
Size
Capacitance
µF
A
B
C
C
C
D
D
D
D
D
E
E
E
D
V
E
V
V
A
B
C
D
E
E
E
V
V
A
B
C
D
E
E
E
D
V
V
V
C
D
E
C
D
D
E
E
D
3.3
15
22
33
47
47
47
68
100
100
100
100
100
150
150
220
220
220
4.7
10
15
33
47
68
68
100
100
1.5
4.7
10
22
33
33
33
47
68
68
68
4.7
10
10
15
15
22
22
22
33
Rated
Voltage
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
20
20
20
20
20
20
20
20
20
25
25
25
25
25
25
25
25
25
25
25
35
35
35
35
35
35
35
35
35
DCL
(µA)
Max.
0.5
2.4
3.5
5.3
7.5
7.5
7.5
10.9
16.0
16.0
16.0
16.0
16.0
24.0
24.0
35.2
35.2
35.2
0.9
2.0
3.0
6.6
9.4
13.6
13.6
20.0
20.0
0.5
1.2
2.5
5.5
8.3
8.3
8.3
11.8
17.0
17.0
17.0
1.6
3.5
3.5
5.3
5.3
7.7
7.7
7.7
11.6
DF
%
Max.
6
6
6
6
6
6
6
6
6
6
6
6
6
8
8
8
8
10
6
6
6
6
6
6
6
8
10
6
6
6
6
6
6
6
6
8
10
10
6
6
6
6
6
6
6
6
6
ESR
Max. (mΩ)
@100kHz
3500
800
375
300
350
150
200
150
125
150
100
125
150
150
75
100
75
150
1800
1000
450
200
150
125
150
85
200
3000
1500
500
200
175
200
300
250
95
150
300
600
300
200
450
300
400
200
300
300
100kHz Ripple Current (mA) Ratings
25ºC
146
326
542
606
561
1000
866
1000
1095
1000
1285
1149
1049
1000
1826
1285
1826
1291
204
292
494
866
1049
1149
1049
1715
1118
158
238
469
866
971
908
742
775
1622
1291
913
428
707
908
494
707
612
908
742
707
85ºC
131
292
484
542
501
894
775
894
980
894
1149
1028
938
894
1633
1149
1633
1155
183
261
442
775
938
1028
938
1534
1000
141
213
420
775
868
812
663
693
1451
1155
816
383
632
812
442
632
548
812
663
632
125ºC
59
130
217
242
224
400
346
400
438
400
514
460
420
400
730
514
730
516
82
117
198
346
420
160
420
686
447
63
95
188
346
388
363
297
310
649
516
365
171
283
363
198
283
245
363
297
283
13
TACmicrochip
The world’s smallest surface mount
Tantalum capacitor, small enough to
create space providing room for ideas
to grow.
TACmicrochip is a major breakthrough
in miniaturization without reduction in
performance.
L
It offers you the highest energy store
in an 0603 or 0805 case size; enhanced
high frequency operation through unique
ESR performance with temperature and
voltage stability.
CASE DIMENSIONS: millimeters (inches)
W
H
Code
EIA
Code
W +0.20 (0.008)
-0.10 (0.004)
L +0.25 (0.010)
-0.15 (0.006)
H +0.20 (0.008)
-0.10 (0.004)
L
0603
0.85 (0.033)
1.6 (0.063)
0.85 (0.033)
R
0805
1.35 (0.053)
2.0 (0.079)
1.35 (0.053)
STANDARD CAPACITANCE RANGE
(LETTER DENOTES CASE CODE)
µF
Capacitance
Code
0.47
0.68
1.0
474
684
105
1.5
2.2
3.3
155
225
335
4.7
6.8
10.0
475
685
106
15.0
22.0
33.0
47.0
156
226
336
476
= Standard Range
= Extended Range
= Development Range
14
2V
Rated voltage at 85°C
3V
4V
6.3V
L
L
L
L
L
L
L
L
L
L
R
R
R
R
R
R
R
L
L
L
L
L
L
L
L
L
R
L
R
R
R
10V
R
R
R
R
TACmicrochip
RATINGS AND PART NUMBER REFERENCE
AVX
Style
Case
Size
Capacitance
µ[email protected]
TAC
TAC
TAC
0805
0805
0805
22
33
47
TAC
TAC
TAC
0805
0805
0805
15
22
33
TAC
TAC
TAC
0805
0805
0805
10
15
22
TAC
TAC
TAC
0805
0805
0805
6.8
10
15
TAC
TAC
TAC
0805
0805
0805
4.7
6.8
10
Leakage
µA
(Max)
DF
%
Max
ESR
Max
@100kHz
AVX
Style
Case
Size
Capacitance
µ[email protected]
0.5
0.7
1.0
8
8
8
6
6
6
TAC
TAC
TAC
0603
0603
0603
3.3
4.7
6.8
0.5
0.7
1.0
8
8
8
6
6
6
TAC
TAC
TAC
0603
0603
0603
2.2
3.3
4.7
0.5
0.6
0.9
8
8
8
6
6
6
TAC
TAC
TAC
0603
0603
0603
1.5
2.2
3.3
0.5
0.6
0.9
8
8
8
6
6
6
TAC
TAC
TAC
0603
0603
0603
1.0
1.5
2.2
0.5
0.7
1.0
8
8
8
6
6
6
TAC
TAC
TAC
TAC
0603
0603
0603
0603
0.47
0.68
1.0
1.5
Leakage
µA
(Max)
DF
%
Max
ESR
Max
@100kHz
0.5
0.5
0.5
6
6
6
10
10
10
0.5
0.5
0.5
6
6
6
10
10
10
0.5
0.5
0.5
6
6
6
10
10
10
0.5
0.5
0.5
6
6
6
10
10
10
0.5
0.5
0.5
0.5
6
6
6
6
12
10
10
10
(2 volt)
(2 volt)
(3 volt)
(3 volt)
(4 volt)
(4 volt)
(6.3 volt)
(6.3 volt)
(10 volt)
(10 volt)
HOW TO ORDER
TAC
L
225
M
003
Type
TACmicrochip
Case Code
Capacitance Code
pF code: 1st two
digits represent
significant figures,
3rd digit represents
multiplier (number of
zeros to follow)
Tolerance
K=±10%
M=±20%
Rated DC Voltage
R
**
Packaging
Additional
X=8mm 4-1/4"
characters may be
Tape & Reel
add for special
requirements
R=7" Tape & Reel
Solder Plated
15
TACmicrochip
Average ESR (Ohms)
35
30
25
20
15
TACmicrochip Technology
Conventional Technology
Value
Added
10
5
0
D
A
B
Case Size
C
0805
0603
µF (mm3)
Figure 1.
9
8
TACmicrochip average
7
Molded average
6
Value
5
Added
4
3
2
1
0
87 88 89 90 91 92 93 94 95 96 97 98
Continued investment in R&D has resulted in AVX
introducing revolutionary technology to the tantalum
capacitor market.
The new TACmicrochip breaks new ground with the
unique structure allowing 10 times more capacitance to
be packaged in the 0603 case size than is possible with
traditional technology.
Conventional molded tantalum technology results in
an increase in ESR for each reduction in case size.
Figure 1 shows a reduction in ESR performance of the
TACmicrochip compared to the same case size if conventional technology were used.
Figure 2 shows a major leap forward in µF/mm3
performance. The CV values offered in the 0603 cannot
be achieved using conventional molded technology.
These features coupled with the temperature and
voltage stability of tantalum, enable system designers to
achieve equipment miniaturization without compromising performance, making TACmicrochip the optimum
choice for size critical applications.
Figure 2.
70
Enhancing Leakage Current & Battery
Efficiency.
TACL155M006 DCL vs Voltage
DCL (nA)
60
As portable electronic equipment becomes an integral
part of everyday life, a key design focus becomes
the ability to enhance and extend battery efficiency performance. Overall leakage current capability improvements are achieved using the unique TACmicrochip
construction technology.
50
40
30
20
10
0
0
ESR (Ohms)
10
1
2
3
4
Voltage (V)
5
6
TACL155M004
ESR with Frequency
1
Enhanced ESR & High Frequency Operation.
The radically new construction technique used to
manufacture the TACmicrochip eliminates a great many
of the parasitic inductance resistance paths inherent
in standard molded tantalum capacitors, giving the
TACmicrochip an equivalent high frequency performance of larger sized product.
Capacitance (µF)
0.1
1E+02 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08
Frequency (Hz)
16
1.58
TACL155M006
1.56
1.54 Cap. with Temperature
1.52
1.50
1.48
1.46
1.44
1.42
1.40
-60 -40 -20 0 20 40 60 80 100 120 140
Temperature (°C)
Volumetric Efficiency, Space & Weight Savings.
Achieving the industries highest available capacitance
in 0603 case size allows high bulk energy storage
with minimal use of valuable circuit board space. Add
stable temperature and voltage performance and
TACmicrochip becomes your preferred choice of miniature tantalum chip capacitor for size critical applications.
TACmicrochip
SURFACE MOUNTING
CHIP SOLDERING
WIRE BONDING WITHIN THE
SEMICONDUCTOR CHIP PACKAGE
QUADS
ARRAYS
OTHER POSSIBLE CONFIGURATIONS FOR THE WAFER CAPACITOR
The manufacturing techniques used to make the
TACmicrochip allow AVX to offer various custom options.
Some examples of which are shown above. Please contact
your local AVX sales office if you have a specific requirement.
17
TAZ Series
The TAZ molded surface mount series is
designed for use in applications utilizing
either solder, conductive adhesive or thermal compression bonding techniques.
Case sizes (A through H) are compatible
with CWR06 pad layouts and are qualified
as the CWR09 style.
The two styles are interchangeable per
MIL-C-55365/4. Each chip is marked
with polarity, capacitance code and rated
voltage. There are three termination
finishes available: fused solder plated
(standard) (“K” per MIL-C-55365), hot
solder dipped (“C”) and gold plated (“B”).
In addition, the molding compound has
been selected to meet the flammability
requirements of UL94V-O and outgassing
requirements of NASA SP-R-0022A.
CASE DIMENSIONS: millimeters (inches)
Case
Code
Width
Length
Height
W±0.38 (0.015) L±0.38 (0.015) H±0.38 (0.015)
Term. Width
W1
Term. Length
A+0.13 (0.005)
“S” Min
“Regular”
A
B
D
E
F
G
NOTE: For solder coated terminations add
0.38 (0.015) max. to length and
height dimensions.
H
1.27 (0.050)
2.54 (0.100)
1.27 (0.050)
1.27±0.13
(0.050±0.005)
0.76 (0.030)
0.38 (0.015)
1.27 (0.050)
3.81 (0.150)
1.27 (0.050)
1.27±0.13
(0.050±0.005)
0.76 (0.030)
1.65 (0.065)
2.54 (0.100)
3.81 (0.150)
1.27 (0.050)
2.41+0.13/-0.25
0.76 (0.030)
(0.095+0.005/-0.010)
1.65 (0.065)
2.54 (0.100)
5.08 (0.200)
1.27 (0.050)
2.41+0.13/-0.25
0.76 (0.030)
(0.095+0.005/-0.010)
2.92 (0.115)
3.43 (0.135)
5.59 (0.220)
1.78 (0.070)
3.30±0.13
(0.130±0.005)
0.76 (0.030)
3.43 (0.135)
2.79 (0.110)
6.73 (0.265)
2.79 (0.110)
2.67±0.13
(0.105±0.005)
1.27 (0.050)
3.56 (0.140)
3.81 (0.150)
7.24 (0.285)
2.79 (0.110)
3.68+0.13/-0.51
1.27 (0.050)
(0.145+0.005/-0.020)
4.06 (0.160)
Additional special case sizes are available. Contact your local sales office for details.
TECHNICAL SPECIFICATIONS
Technical Data
Capacitance Range
Capacitance Tolerance
Rated Voltage (VR)
Category Voltage (VC)
Surge Voltage (VS)
Surge Voltage (VS)
Operating Temperature Range
Reliability
Qualification
18
⬉
⬉
⬉
⬉
+85°C:
+125°C:
+85°C:
+125°C:
All technical data relate to an ambient temperature of +25°C
0.1µF to 220µF
±20%; ±10%
4
6.3
10
15
20
25
35
50
2.7
4
7
10
13
17
23
33
5.2
8
13
20
26
33
46
65
3.2
5
8
12
16
20
28
40
-55°C to +125°C
1% per 1000h at 85°C with a 0.1Ω/V series impedance, 60% confidence level
MIL-C-55365/4
TAZ Series
HOW TO ORDER
TAZ
(Professional Grade)
Type
D
335
M
015
C
R
SZ*
Case Code
See table on
page 18
Capacitance
Code
pF code:
1st two digits
represent
significant
figures, 3rd
digit represents
multiplier
(number of
zeros to follow)
Tolerance
J=±5%
K=±10%
M=±20%
Rated DC
Voltage
Lead
Configuration
C = Chip
X = Extended
Range
Packaging
Consult
page 44
for details
*Not applicable to European orders (other endings are
0000*
Manufacturing Termination
Routing and
Finish*
Failure Rate* 0000 = Fused
S = Standard
Solder
Z = Not
Plated
applicable 0800 = Hot
Solder
Dipped
0900 = Gold
Plated
assigned by the factory for special customer requirements)
MARKING
The positive end of body has videcon readable polarity bar
marking along with the capacitance code and rated work
voltage:
• Polarity Stripe (+)
• Capacitance Code
• Voltage Rating
The electrical and mechanical parameters shown on the
TAZ series are general.
For specific circuit applications, special screening
is available. Please contact AVX if you have special
electrical or mechanical requirements.
TYPICAL LEAD FRAME MATERIAL
THICKNESSES
Lead Frame: Alloy 194
Thickness: 0.005±0.0002"
0000 - Fused Solder Plate: (60/40)
60-135 microinches nickel
300±75 microinches fused solder
0800 - Hot Solder Dipped: (60/40)
50-100 microinches nickel
Min. 60 microinches solder
0900 - Gold Plated:
35-100 microinches nickel
50-75 microinches gold
CAPACITANCE AND VOLTAGE RANGE (LETTER DENOTES CASE CODE)
Capacitance
µF
Code
0.1
104
0.15
154
0.22
224
0.33
334
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
475
6.8
685
10
106
15
156
22
226
33
336
47
476
68
686
100
107
150
157
220
227
4V
6V
10V
Rated voltage (VR) at 85°C
15V
20V
25V
35V
A
A
A
A
A
B A
B A
B A
D B
E
D
F E
G
H F
G
A
A
B
D B
E
D
F E
G
H F
G
D B
E D
D
F E
E
G
H F
G
H
D B
E D
A
B A
B
D B
E D
E
F E
F E
G F
H
G F
H G
50V
A
A
B
B
B
B
B
D
E D
E
F
G F
G
H
H
D
E
F
G
H
H
D
E
F
F
G
H
H
H
H
NOTE: TAZ Standard Range ratings are also available as CWR09 Military parts, see page 22.
= Standard Range
= Extended Range
19
TAZ Series
Standard Range
RATINGS & PART NUMBER REFERENCE
AVX
Part No.
Case
Size
Capacitance
µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
4 volt @ 85°C (2.5 volt @ 125°C)
TAZA225(‡)004C*
TAZB475(‡)004C*
TAZD106(‡)004C*
TAZE156(‡)004C*
TAZF336(‡)004C*
TAZG686(‡)004C*
TAZH107(‡)004C*
A
B
D
E
R
F
H
2.2
4.7
10.0
15.0
33.0
68.0
100.0
1.0
1.0
1.0
1.0
2.0
3.0
4.0
6
6
6
8
8
10
10
A
B
D
E
F
G
H
1.5
3.3
6.8
10.0
22.0
47.0
68.0
1.0
1.0
1.0
1.0
2.0
3.0
4.0
6
6
6
6
8
10
10
20.0
10.0
10.0
5.0
4.0
2.0
1.0
12.0
12.0
12.0
6.0
4.0
2.0
2.0
10 volt @ 85°C (6.3 volt @ 125°C)
TAZA105(‡)010C*
TAZB225(‡)010C*
TAZD475(‡)010C*
TAZE685(‡)010C*
TAZF156(‡)010C*
TAZG336(‡)010C*
TAZH476(‡)010C*
A
B
D
E
F
G
H
1.0
2.2
4.7
6.8
15.0
33.0
47.0
1.0
1.0
1.0
1.0
2.0
3.0
5.0
6
6
6
6
6
10
10
18.0
12.0
10.0
4.0
3.0
3.0
2.0
15 volt @ 85°C (10 volt @ 125°C)
TAZA684(‡)015C*
TAZB155(‡)015C*
TAZD335(‡)015C*
TAZE475(‡)015C*
TAZF106(‡)015C*
TAZG226(‡)015C*
TAZH336(‡)015C*
A
B
D
E
F
G
H
0.68
1.5
3.3
4.7
10.0
22.0
33.0
1.0
1.0
1.0
1.0
2.0
4.0
5.0
6
6
6
6
6
8
8
AVX
Part No.
Case
Size
Capacitance
µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
25 volt @ 85°C (16 volt @ 125°C)
6.3 volt @ 85°C (4 volt @ 125°C)
TAZA155(‡)006C*
TAZB335(‡)006C*
TAZD685(‡)006C*
TAZE106(‡)006C*
TAZF226(‡)006C*
TAZG476(‡)006C*
TAZH686(‡)006C*
(Standard Range and Special Case Sizes Only)
22.0
15.0
10.0
6.0
5.0
3.0
2.0
TAZA334(‡)025C*
TAZB684(‡)025C*
TAZD155(‡)025C*
TAZE225(‡)025C*
TAZF475(‡)025C*
TAZG685(‡)025C*
TAZG106(‡)025C*
TAZH156(‡)025C*
A
B
D
E
F
G
G
H
0.33
0.68
1.5
2.2
4.7
6.8
10.0
15.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
4.0
6
6
6
6
6
6
6
6
25.0
15.0
10.0
8.0
6.0
4.0
3.0
2.0
35 volt @ 85°C (23 volt @ 125°C)
TAZA224(‡)035C*
TAZB474(‡)035C*
TAZD105(‡)035C*
TAZE155(‡)035C*
TAZF335(‡)035C*
TAZG475(‡)035C*
TAZH685(‡)035C*
A
B
D
E
F
G
H
0.22
0.47
1.0
1.5
3.3
4.7
6.8
1.0
1.0
1.0
1.0
1.0
2.0
3.0
6
6
6
6
6
6
6
25.0
20.0
12.0
6.0
6.0
3.0
3.0
50 volt @ 85°C (33 volt @ 125°C)
TAZA104(‡)050C*
TAZA154(‡)050C*
TAZB224(‡)050C*
TAZB334(‡)050C*
TAZD684(‡)050C*
TAZE105(‡)050C*
TAZF155(‡)050C*
TAZF225(‡)050C*
TAZG335(‡)050C*
TAZH475(‡)050C*
A
A
B
B
D
E
F
F
G
H
0.10
0.15
0.22
0.33
0.68
1.0
1.5
2.2
3.3
4.7
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
6
6
6
6
6
6
6
6
6
6
30.0
30.0
25.0
25.0
20.0
12.0
10.0
6.0
4.0
2.0
20 volt @ 85°C (13 volt @ 125°C)
TAZA474(‡)020C*
TAZB684(‡)020C*
TAZB105(‡)020C*
TAZD225(‡)020C*
TAZE335(‡)020C*
TAZF685(‡)020C*
TAZG156(‡)020C*
TAZH226(‡)020C*
A
B
B
D
E
F
G
H
0.47
0.68
1.0
2.2
3.3
6.8
15.0
22.0
1.0
1.0
1.0
1.0
1.0
2.0
3.0
4.0
6
6
6
6
6
6
6
6
20.0
15.0
15.0
10.0
8.0
5.0
3.0
2.0
All technical data relates to an ambient temperature of +25°C. Capacitance and
DF are measured at 120 Hz, 0.5V RMS with a maximum DC bias of 2.2 volts.
DCL is measured at rated voltage after 5 minutes.
‡ Insert J for ±5% tolerance, K for ±10%, M for ±20%
* Insert letter for packing option. See ordering information on page 19.
20
The electrical and mechanical parameters shown on the TAZ series are
general. For special circuit requirements, application specific testing is
available. Please contact your local AVX sales office if you have special
electrical or mechanical requirements.
DCL, DF and ESR limits are general information only. Contact AVX if your
application requires lower or tighter limits.
TAZ Series
Extended Range
RATINGS & PART NUMBER REFERENCE
AVX
Part No.
Case
Size
Capacitance
µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
AVX
Part No.
Case
Size
4 volt
TAZA475(‡)004X*
TAZB106(‡)004X*
TAZD226(‡)004X*
TAZE336(‡)004X*
TAZF107(‡)004X*
TAZG157(‡)004X*
A
B
D
E
F
G
4.7
10
22
33
100
150
TAZA335(‡)006X*
TAZB685(‡)006X*
TAZD156(‡)006X*
TAZE226(‡)006X*
TAZF686(‡)006X*
TAZG107(‡)006X*
TAZH227(‡)006X*
A
B
D
E
F
G
H
3.3
6.8
15
22
68
100
220
TAZA225(‡)010X*
TAZB475(‡)010X*
TAZD685(‡)010X*
TAZD106(‡)010X*
TAZE156(‡)010X*
TAZE226(‡)010X*
TAZF476(‡)010X*
TAZG686(‡)010X*
TAZH107(‡)010X*
A
B
D
D
E
E
F
G
H
2.2
4.7
6.8
10
15
22
47
68
100
Capacitance
µF
DCL
(µA)
Max.
DF
%
Max.
ESR
max. (Ω)
@ 100 kHz
15 volt
1
1
1
2
4
6
6
6
8
8
10
10
20
10
10
5
4
2
TAZA105(‡)015X*
TAZB335(‡)015X*
TAZD475(‡)015X*
TAZE106(‡)015X*
TAZF226(‡)015X*
TAZH686(‡)015X*
A
B
D
E
F
H
1
3.3
4.7
10
22
68
1
1
1
2
4
6
10
6
6
6
6
8
10
10
18
12
10
4
4
2
1
TAZA684(‡)020X*
TAZB225(‡)020X*
TAZD335(‡)020X*
TAZE475(‡)020X*
TAZE685(‡)020X*
TAZF156(‡)020X*
TAZG226(‡)020X*
TAZH476(‡)020X*
A
B
D
E
E
F
G
H
0.68
2.2
3.3
4.7
6.8
15
22
47
1
1
1
1
2
3
4
6
10
6
6
6
6
6
6
8
10
10
20
12
8
10
4
4
3
2
1
6 volt
1
1
1
2
3
10
6
6
6
6
6
8
22
12
10
6
5
2
1
1
1
1
2
3
4
10
6
6
6
6
6
6
8
8
22
12
10
8
8
4
3
2
1
1
1
2
6
6
6
6
6
8
12
10
8
6
2
4
8
2
20 volt
10 volt
‡ Insert J for ±5% tolerance, K for ±10%, M for ±20%
* Insert letter for packing option. See ordering information on page 19.
All technical data relates to an ambient temperature of +25°C. Capacitance and
DF are measured at 120 Hz, 0.5V RMS with a maximum DC bias of 2.2 volts.
DCL is measured at rated voltage after 5 minutes.
25 volt
TAZB105(‡)025X*
TAZD225(‡)025X*
TAZE335(‡)025X*
TAZF685(‡)025X*
TAZH226(‡)025X*
B
D
E
F
H
1
2.2
3.3
6.8
22
TAZH106(‡)035X*
H
10
35 volt
The electrical and mechanical parameters shown on the TAZ series are
general.
For special circuit requirements, application specific testing is available.
Please contact your local AVX sales office if you have special electrical or
mechanical requirements.
DCL, DF and ESR limits are general information only. Contact AVX if your
application requires lower or tighter limits.
NOTE: Voltage ratings are minimum values. We reserve the right to supply
higher voltage ratings in the same case size, to the same reliability
standards.
21
CWR09 Series
MIL-C-55365/4
MARKING
Polarity Stripe (+)
Capacitance Code
Rated Voltage
20V
HOW TO ORDER (MIL-C-55365/4)
CWR09
F
Type
Voltage
C=4
D=6
F=10
H=15
J=20
K=25
M=35
N=50
B
Termination
Finish
B=Gold Plated
C=Hot Solder
Dipped
K=Solder Fused
NOTES: CWR09 is fully interchangeable with CWR06.
Case Sizes correspond to TAZ A through H.
Packaging information can be found on page 44.
22
225
K
Capacitance
Code
Tolerance
J=±5%
K=±10%
M=±20%
M
A
\TR
Failure Rate
Optional Surge
Current
Exponential:
A=10 cycles at
M=1%/1000
25°C
hours
B=10 cycles at
P=0.1%/1000
-55°C and
hours
+85°C
R=0.01%/1000
hours
S=0.001%/1000
hours
Packaging
Bulk
(Standard if
nothing is
specified in
this position)
\TR=7"
Tape & Reel
Weibull:
B=0.1%/1000
hours
C=0.01%/1000
hours
\W=Waffle Pack
\TR13=13"
Tape & Reel
CWR09 Series
MIL-C-55365/4
ELECTRICAL RATINGS FOR CWR09 CAPACITORS
MIL-C-55365/4
Part
Number
(See Note)
Case
Size夹
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A
B
C
D
E
F
G
H
4
4
4
4
4
4
4
4
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A
B
C
D
E
F
G
H
A
B
C
D
E
F
G
H
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* = Termination Finish
B = Gold Plated
C = Hot Solder Dipped
K = Solder Fused
Rated
Voltage
(85°C)
(volts)
Capacitance
(nom.)
(µF)
DC Leakage (max.)
Dissipation Factor (max.)
-55°C
(%)
Max. ESR
100 kHz
+25°C
Style
CWR09
(Ohms)
8
8
8
8
10
10
12
12
8
8
8
10
12
12
12
12
8.0
8.0
5.5
4.0
3.5
2.2
1.1
0.9
6
6
6
6
8
8
10
10
6
6
6
6
6
8
10
10
8
8
8
8
10
10
12
12
8
8
8
8
8
8
12
12
8
8
8
8
12
12
12
12
8
8
8
8
8
10
12
12
8.0
8.0
5.5
4.5
3.5
2.2
1.1
0.9
10.0
8.0
5.5
4.5
3.5
2.5
1.1
0.9
12
12
12
12
12
24
48
60
6
6
6
6
6
6
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
10
10
12.0
8.0
5.5
5.0
4.0
2.5
1.1
0.9
12
12
12
12
12
12
24
36
48
6
6
6
6
6
6
6
6
6
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
14.0
10.0
12.0
6.0
5.0
4.0
2.4
1.1
0.9
+25°C
(µA)
+85°C
(µA)
+125°C
(µA)
2.2
4.7
6.8
10.0
15.0
33.0
68.0
100.0
1.0
1.0
1.0
1.0
1.0
2.0
3.0
4.0
10
10
10
10
10
20
30
40
12
12
12
12
12
24
36
48
6
6
6
8
8
8
10
10
6
6
6
6
6
6
6
6
10
10
10
10
10
10
10
10
1.5
3.3
4.7
6.8
10.0
22.0
47.0
68.0
1.0
2.2
3.3
4.7
6.8
15.0
33.0
47.0
1.0
1.0
1.0
1.0
1.0
2.0
3.0
4.0
1.0
1.0
1.0
1.0
1.0
2.0
3.0
5.0
10
10
10
10
10
20
30
40
10
10
10
10
10
20
30
50
12
12
12
12
12
24
36
48
12
12
12
12
12
24
36
60
A
B
C
D
E
F
G
H
15
15
15
15
15
15
15
15
0.68
1.5
2.2
3.3
4.7
10.0
22.0
33.0
1.0
1.0
1.0
1.0
1.0
2.0
4.0
5.0
10
10
10
10
10
20
40
50
A
B
B
C
D
E
F
G
H
20
20
20
20
20
20
20
20
20
0.47
0.68
1.0
1.5
2.2
3.3
6.8
15.0
22.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
3.0
4.0
10
10
10
10
10
10
20
30
40
† = Tolerance Code
J = ±5%
K = ±10%
M = ±20%
夹 The C case has limited availability. Where
possible D case should be substituted.
@ = Failure Rate Level
Exponential:
M = 1.0% per 1000 hours
P = 0.1% per 1000 hours
R = 0.01% per 1000 hours
S = 0.001% per 1000 hours
Weibull:
B = 0.1% per 1000 hours
C = 0.01% per 1000 hours
+25°C +85/125°C
(%)
(%)
䉭 = Optional Surge Current
A = 10 cycles at 25°C
B = 10 cycles at -55°C
and +85°C
䊐 = Packaging
Bulk Standard
\TR=7" Tape & Reel
\TR13=13" Tape & Reel
\W=Waffle Pack
23
CWR09 Series
MIL-C-55365/4
ELECTRICAL RATINGS FOR CWR09 CAPACITORS
MIL-C-55365/4
Part
Number
(See Note)
Case
Size夹
Rated Capacitance
Voltage
(nom.)
(85°C)
(µF)
(volts)
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A
B
C
D
E
F
G
G
H
25
25
25
25
25
25
25
25
25
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A
B
C
D
E
F
G
H
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[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
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A
A
B
B
C
D
E
F
F
G
H
-55°C
(%)
Max. ESR
100 kHz
+25°C
Style
CWR09
(Ohms)
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
15.0
7.5
6.5
6.5
3.5
2.5
1.2
1.4
1.0
6
6
6
6
6
6
6
6
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
18.0
10.0
8.0
6.5
4.5
2.5
1.5
1.3
6
6
6
6
6
6
6
6
6
6
6
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
22.0
17.0
14.0
12.0
8.0
7.0
6.0
4.0
2.5
2.0
1.5
+85°C
(µA)
+125°C
(µA)
0.33
0.68
1.0
1.5
2.2
4.7
6.8
10.0
15.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
4.0
10
10
10
10
10
20
20
30
40
12
12
12
12
12
24
24
36
48
6
6
6
6
6
6
6
6
6
35
35
35
35
35
35
35
35
0.22
0.47
0.68
1.0
1.5
3.3
4.7
6.8
1.0
1.0
1.0
1.0
1.0
1.0
2.0
3.0
10
10
10
10
10
10
20
30
12
12
12
12
12
12
24
36
50
50
50
50
50
50
50
50
50
50
50
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
10
10
10
10
10
10
10
10
20
20
30
12
12
12
12
12
12
12
12
24
24
36
† = Tolerance Code
J = ±5%
K = ±10%
M = ±20%
夹 The C case has limited availability. Where
possible D case should be substituted.
24
Dissipation Factor (max.)
+25°C
(µA)
NOTE: To complete the MIL-C-55365/4 Part Number, additional information
must be added:
* = Termination Finish
B = Gold Plated
C = Hot Solder Dipped
K = Solder Fused
DC Leakage (max.)
+25°C +85/125°C
(%)
(%)
Contact your local AVX sales office for latest qualification status.
@ = Failure Rate Level
Exponential:
M = 1.0% per 1000 hours
P = 0.1% per 1000 hours
R = 0.01% per 1000 hours
S = 0.001% per 1000 hours
Weibull:
B = 0.1% per 1000 hours
C = 0.01% per 1000 hours
䉭 = Optional Surge Current
A = 10 cycles at 25°C
B = 10 cycles at -55°C
and +85°C
䊐 = Packaging
Bulk Standard
\TR=7" Tape & Reel
\TR13=13" Tape & Reel
\W=Waffle Pack
CWR11 Style
MIL-C-55365/8
MARKING
Polarity Stripe
“J” for JAN Brand
Capacitance Code
Rated Voltage
(with manufacturer’s ID)
CASE DIMENSIONS: millimeters (inches)
Case
Code
W
L
H
W2
±0.1 (±0.004)
P
±0.3 (±0.012)
H2
(min)
A
1.6±0.2
(0.063±0.008)
3.2±0.2
(0.126±0.008)
1.6±0.2
(0.063±0.008)
1.2
(0.047)
0.8
(0.031)
0.7
(0.028)
B
2.8±0.2
(0.110±0.008)
3.5±0.2
(0.138±0.008)
1.9±0.2
(0.075±0.008)
2.2
(0.087)
0.8
(0.031)
0.7
(0.028)
C
3.2±0.3
(0.126±0.012)
6.0±0.3
(0.236±0.012)
2.5±0.3
(0.098±0.012)
2.2
(0.087)
1.3
(0.0.51)
1.0
(0.039)
D
4.3±0.3
(0.169±0.012)
7.3±0.3
(0.287±0.012)
2.8±0.3
(0.110±0.012)
2.4
(0.094)
1.3
(0.0.51)
1.0
(0.039)
HOW TO ORDER (MIL-C-55365/8)
CWR11
F
Type
Voltage
C=4
D=6
F=10
H=15
J=20
K=25
M=35
N=50
A
Termination
Finish
B=Gold Plated
C=Hot Solder
Dipped
K=Solder Fused
225
K
Capacitance
Code
Tolerance
J=±5%
K=±10%
M=±20%
M
A
\TR
Failure Rate
Optional Surge
Current
Exponential:
A=10 cycles at
M=1%/1000
25°C
hours
B=10 cycles at
P=0.1%/1000
-55°C and
hours
+85°C
R=0.01%/1000
hours
S=0.001%/1000
hours
Packaging
Bulk
(Standard if
nothing is
specified in
this position)
\TR=7"
Tape & Reel
Weibull:
B=0.1%/1000
hours
C=0.01%/1000
hours
D=0.001%/1000
hours
\W=Waffle Pack
\TR13=13"
Tape & Reel
25
CWR11 Style
MIL-C-55365/8
ELECTRICAL RATINGS FOR CWR11 CAPACITORS
MIL-C-55365/8
Part
Number
(See Note)
Case
Size
Rated
Voltage
(85°C)
(volts)
Capacitance
(nom.)
(µF)
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A
A
A
B
B
B
C
C
D
6
6
6
6
6
6
6
6
6
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
A
A
A
B
B
B
C
D
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
[email protected]
CWR11J*225†@䉭䊐
CWR11J*335†@䉭䊐
CWR11J*475†@䉭䊐
CWR11J*685†@䉭䊐
CWR11J*156†@䉭䊐
26
Dissipation Factor (max.)
-55°C
(%)
Max.
ESR
100 kHz
(Ω)
9
6
9
9
6
9
6
9
6
9
9
9
9
9
9
9
9
9
8.0
8.0
8.0
5.5
4.5
3.5
3.0
2.2
1.1
4
6
6
6
6
6
6
6
6
6
9
9
9
9
6
6
6
9
9
9
9
9
9
9
10.0
8.0
8.0
5.5
4.5
3.5
2.5
1.1
6.0
6.0
6.0
6.0
6.0
8.4
19.2
39.6
4
4
6
6
6
6
6
6
6
6
9
9
8
9
8
8
6
9
9
9
9
9
9
9
12.0
10.0
8.0
5.5
5.0
4.0
2.5
1.1
6.0
6.0
6.0
6.0
6.0
8.4
12.0
16.8
36.0
4
4
4
6
6
6
6
6
6
6
6
6
9
8
9
8
9
8
6
6
6
9
9
9
9
9
9
14.0
12.0
10.0
6.0
5.0
4.0
3.0
2.4
1.1
+25°C
(µA)
+85°C
(µA)
+125°C
(µA)
1.5
2.2
3.3
4.7
6.8
10.0
15.0
22.0
47.0
0.5
0.5
0.5
0.5
0.5
0.6
0.9
1.4
2.8
5.0
5.0
5.0
5.0
5.0
6.0
9.0
14.0
28.0
6.0
6.0
6.0
6.0
6.0
7.2
10.8
16.8
33.6
6
6
6
6
6
6
6
6
6
10
10
10
10
10
10
10
10
1.0
1.5
2.2
3.3
4.7
6.8
15.0
33.0
0.5
0.5
0.5
0.5
0.5
0.7
1.5
3.3
5.0
5.0
5.0
5.0
5.0
7.0
15.0
33.0
6.0
6.0
6.0
6.0
6.0
8.4
18.0
39.6
A
A
A
B
B
B
C
D
15
15
15
15
15
15
15
15
0.68
1.0
1.5
2.2
3.3
4.7
10.0
22.0
0.5
0.5
0.5
0.5
0.5
0.7
1.6
3.3
5.0
5.0
5.0
5.0
5.0
7.0
16.0
33.0
A
A
A
B
B
B
C
C
D
20
20
20
20
20
20
20
20
20
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
15.0
0.5
0.5
0.5
0.5
0.5
0.7
1.0
1.4
3.0
5.0
5.0
5.0
5.0
5.0
7.0
10.0
14.0
30.0
NOTE: To complete the MIL-C-55365/8 Part Number, additional information
must be added:
* = Termination Finish
B = Gold Plated
C = Hot Solder Dipped
K = Solder Fused
DC Leakage (max.)
† = Tolerance Code
J = ±5%
K = ±10%
M = ±20%
+25°C +85/125°C
(%)
(%)
Contact your local AVX sales office for latest qualification status.
@ = Failure Rate Level
Exponential:
M = 1.0% per 1000 hours
P = 0.1% per 1000 hours
R = 0.01% per 1000 hours
S = 0.001% per 1000 hours
Weibull:
B = 0.1% per 1000 hours
C = 0.01% per 1000 hours
D = 0.001% Per 1000 hours
䉭 = Optional Surge Current
A = 10 cycles at 25°C
B = 10 cycles at -55°C
and +85°C
䊐 = Packaging
Bulk Standard
\TR=7" Tape & Reel
\TR13=13" Tape & Reel
\W=Waffle Pack
CWR11 Style
MIL-C-55365/8
ELECTRICAL RATINGS FOR CWR11 CAPACITORS
MIL-C-55365/8
Part
Number
(See Note)
Case
Size
Rated
Voltage
(85°C)
(volts)
Capacitance
(nom.)
(µF)
CWR11K*334†@䉭䊐
CWR11K*474†@䉭䊐
CWR11K*684†@䉭䊐
CWR11K*105†@䉭䊐
CWR11K*155†@䉭䊐
CWR11K*225†@䉭䊐
CWR11K*335†@䉭䊐
CWR11K*475†@䉭䊐
CWR11K*685†@䉭䊐
CWR11K*106†@䉭䊐
A
A
B
B
B
C
C
C
D
D
25
25
25
25
25
25
25
25
25
25
CWR11M*104†@䉭䊐
CWR11M*154†@䉭䊐
CWR11M*224†@䉭䊐
CWR11M*334†@䉭䊐
CWR11M*474†@䉭䊐
CWR11M*684†@䉭䊐
CWR11M*105†@䉭䊐
CWR11M*155†@䉭䊐
CWR11M*225†@䉭䊐
CWR11M*335†@䉭䊐
CWR11M*475†@䉭䊐
A
A
A
A
B
B
B
C
C
C
D
CWR11N*104†@䉭䊐
CWR11N*154†@䉭䊐
CWR11N*224†@䉭䊐
CWR11N*334†@䉭䊐
CWR11N*474†@䉭䊐
CWR11N*684†@䉭䊐
CWR11N*105†@䉭䊐
CWR11N*155†@䉭䊐
CWR11N*225†@䉭䊐
A
B
B
B
C
C
C
D
D
Dissipation Factor (max.)
-55°C
(%)
Max.
ESR
100 kHz
(Ω)
6
6
6
6
8
9
8
9
9
8
6
6
6
6
9
9
9
9
9
9
15.0
14.0
7.5
6.5
6.5
3.5
3.5
2.5
1.4
1.2
4
4
4
4
4
4
4
6
6
6
6
6
6
6
6
6
6
6
8
8
8
8
6
6
6
6
6
6
6
9
9
9
9
24.0
21.0
18.0
15.0
10.0
8.0
6.5
4.5
3.5
2.5
1.5
4
4
4
4
4
6
6
6
6
6
6
6
6
6
6
6
8
8
6
6
6
6
6
6
6
9
9
22.0
17.0
14.0
12.0
8.0
7.0
6.0
4.0
2.5
+25°C
(µA)
+85°C
(µA)
+125°C
(µA)
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10.0
0.5
0.5
0.5
0.5
0.5
0.6
0.9
1.2
1.7
2.5
5.0
5.0
5.0
5.0
5.0
6.0
9.0
12.0
17.0
25.0
6.0
6.0
6.0
6.0
6.0
7.2
10.8
14.4
20.4
30.0
4
4
4
4
6
6
6
6
6
6
35
35
35
35
35
35
35
35
35
35
35
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.8
1.2
1.7
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
8.0
12.0
17.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
9.6
14.4
20.4
50
50
50
50
50
50
50
50
50
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.8
1.1
5.0
5.0
5.0
5.0
5.0
5.0
5.0
8.0
11.0
6.0
6.0
6.0
6.0
6.0
6.0
6.0
9.6
13.2
NOTE: To complete the MIL-C-55365/8 Part Number, additional information
must be added:
* = Termination Finish
Designator:
B = Gold Plated
C = Hot Solder Dipped
K = Solder Fused
DC Leakage (max.)
† = Tolerance Code
J = ±5%
K = ±10%
M = ±20%
+25°C +85/125°C
(%)
(%)
Contact your local AVX sales office for latest qualification status.
@ = Failure Rate Level
Exponential:
M = 1.0% per 1000 hours
P = 0.1% per 1000 hours
R = 0.01% per 1000 hours
S = 0.001% per 1000 hours
Weibull:
B = 0.1% per 1000 hours
C = 0.01% per 1000 hours
D = 0.001% per 1000 hours
䉭 = Optional Surge Current
A = 10 cycles at 25°C
B = 10 cycles at -55°C
and +85°C
䊐 = Packaging
Bulk Standard
\TR=7" Tape & Reel
\TR13=13" Tape & Reel
\W=Waffle Pack
27
Technical Summary and
Application Guidelines
INTRODUCTION
Tantalum capacitors are manufactured from a powder of
pure tantalum metal. The typical particle size is between 2
and 10 µm.
4000µFV
10000µFV
20000µFV
Figure 1.
The powder is compressed under high pressure around a
Tantalum wire to form a ‘pellet’ (known as the Riser Wire).
The riser wire is the anode connection to the capacitor.
This is subsequently vacuum sintered at high temperature
(typically 1500 - 2000°C). This helps to drive off any impurities within the powder by migration to the surface.
During sintering the powder becomes a sponge like
structure with all the particles interconnected in a huge
lattice.
This structure is of high mechanical strength and density, but
is also highly porous giving a large internal surface area
(see Figure 2).
The larger the surface area the larger the capacitance. Thus
high CV (capacitance/voltage product) powders, which have
a low average particle size, are used for low voltage, high
capacitance parts. The figure below shows typical powders.
Note the very great difference in particle size between the
powder CVs.
By choosing which powder is used to produce each capacitance/voltage rating the surface area can be controlled.
The following example uses a 22µF 25V capacitor to
illustrate the point.
␧␧ A
C= o r
d
where
␧o is the dielectric constant of free space
(8.855 x 10-12 Farads/m)
␧r is the relative dielectric constant for Tantalum
Pentoxide (27)
and
28
d is the dielectric thickness in meters
(for a typical 25V part)
C is the capacitance in Farads
A is the surface area in meters
Rearranging this equation gives:
A=
Cd
␧o␧r
thus for a 22µF/25V capacitor the surface area is 150 square
centimeters, or nearly half the size of this page.
The dielectric is then formed over all the tantalum surfaces
by the electrochemical process of anodization. To achieve
this, the ‘pellet’ is dipped into a very weak solution of phosphoric acid.
The dielectric thickness is controlled by the voltage applied
during the forming process. Initially the power supply is kept
in a constant current mode until the correct thickness of
dielectric has been reached (that is the voltage reaches the
‘forming voltage’), it then switches to constant voltage mode
and the current decays to close to zero.
Figure 2. Sintered Tantalum
The chemical equations describing the process are as
follows:
Anode:
Cathode:
2 Ta → 2 Ta5+ + 10 e
2 Ta5+ 10 OH-→ Ta2O5 + 5 H2O
10 H2O – 10 e → 5H2 ↑ + 10 OH-
The oxide forms on the surface of the Tantalum but it also
grows into the metal. For each unit of oxide two thirds grows
out and one third grows in. It is for this reason that there is a
limit on the maximum voltage rating of Tantalum capacitors
with present technology powders (see Figure 3).
The dielectric operates under high electrical stress. Consider
a 22µF 25V part:
Formation voltage = Formation Ratio x Working Voltage
= 4 x 25
= 100 Volts
Technical Summary and
Application Guidelines
The pentoxide (Ta2O5) dielectric grows at a rate of 1.7 x 10-9
m/V
Dielectric thickness (d)
= 100 x 1.7 x 10-9
= 0.17 µm
Electric Field strength
= Working Voltage / d
= 147 KV/mm
Tantalum
Dielectric
Oxide Film
Manganese
Dioxide
Tantalum
Figure 4. Manganese Dioxide Layer
Dielectric
Oxide Film
Figure 3. Dielectric Layer
The next stage is the production of the cathode plate. This is
achieved by pyrolysis of Manganese Nitrate into Manganese
Dioxide.
The ‘pellet’ is dipped into an aqueous solution of nitrate and
then baked in an oven at approximately 250°C to produce
the dioxide coat. The chemical equation is:
Mn (NO3)2 → Mn O2 + 2NO2↑
Anode
Manganese
Dioxide
Graphite
This process is repeated several times through varying
specific densities of nitrate to build up a thick coat over
all internal and external surfaces of the ‘pellet’, as shown in
Figure 4.
The ‘pellet’ is then dipped into graphite and silver to
provide a good connection to the Manganese Dioxide
cathode plate. Electrical contact is established by deposition
of carbon onto the surface of the cathode. The carbon
is then coated with a conductive material to facilitate
connection to the cathode termination. Packaging is carried
out to meet individual specifications and customer requirements. This manufacturing technique is adhered to for the
whole range of AVX tantalum capacitors, which can be subdivided into four basic groups: Chip / Resin dipped /
Rectangular boxed / Axial.
Further information on the production of Tantalum
Capacitors can be obtained from the technical paper "Basic
Tantalum Technology", by John Gill, available from your local
AVX representative.
Outer
Silver Layer
Silver
Epoxy
Cathode
Connection
29
Technical Summary and
Application Guidelines
SECTION 1
ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS
1.1 CAPACITANCE
1.2 VOLTAGE
1.1.1 Rated capacitance (CR).
1.2.1 Rated d.c. voltage (VR)
This is the nominal rated capacitance. For tantalum capacitors it is measured as the capacitance of the equivalent
series circuit at 20°C using a measuring bridge supplied by a
0.5Vpk-pk 120Hz sinusoidal signal, free of harmonics with a
maximum bias of 2.2Vd.c.
1.1.2 Capacitance tolerance.
This is the permissible variation of the actual value of the
capacitance from the rated value. For additional reading,
please consult the AVX technical publication "Capacitance
Tolerances for Solid Tantalum Capacitors".
This is the rated d.c. voltage for continuous operation at
85°C.
1.2.2 Category voltage (VC)
This is the maximum voltage that may be applied continuously to a capacitor. It is equal to the rated voltage up to
+85°C, beyond which it is subject to a linear derating, to 2/3
VR at 125°C.
1.1.3 Temperature dependence of capacitance.
The capacitance of a tantalum capacitor varies with temperature. This variation itself is dependent to a small extent on
the rated voltage and capacitor size.
1.2.3 Surge voltage (VS)
1.1.4 Frequency dependence of the capacitance.
The effective capacitance decreases as frequency increases.
Beyond 100KHz the capacitance continues to drop until resonance is reached (typically between 0.5 - 5MHz depending
on the rating). Beyond the resonant frequency the device
becomes inductive.
TAJE227K010
CAPACITANCE vs. FREQUENCY
250
Capacitance (µF)
200
150
50
1000
10000
Frequency (Hz)
30
85°C
125°C
Rated
Voltage
(Vdc.)
Surge
Voltage
(Vdc.)
Category
Voltage
(Vdc.)
Surge
Voltage
(Vdc.)
4
6.3
10
16
20
25
35
50
5.2
8
13
20
26
32
46
65
2.7
4
7.0
10
13
17
23
33
3.2
5
8
12
16
20
28
40
1.2.4 Effect of surges
100
0
100
This is the highest voltage that may be applied to a capacitor for short periods of time. The surge voltage may be
applied up to 10 times in an hour for periods of up to 30
seconds at a time. The surge voltage must not be used as a
parameter in the design of circuits in which, in the normal
course of operation, the capacitor is periodically charged
and discharged.
100000
1000000
The solid Tantalum capacitor has a limited ability to withstand
voltage and current surges. This is in common with all other
electrolytic capacitors and is due to the fact that they operate under very high electrical stress across the dielectric. For
example a 25 volt capacitor has an Electrical Field of 147
KV/mm when operated at rated voltage.
Technical Summary and
Application Guidelines
It is important to ensure that the voltage across the terminals
of the capacitor never exceeds the specified surge voltage
rating.
Solid tantalum capacitors have a self healing ability provided
by the Manganese Dioxide semiconducting layer used as the
negative plate. However, this is limited in low impedance
applications.
In the case of low impedance circuits, the capacitor is likely
to be stressed by current surges. Derating the capacitor by
50% or more increases the reliability of the component. (See
Figure 2 page 37). The “AVX Recommended Derating Table”
(page 38) summarizes voltage rating for use on common
voltage rails, in low impedance applications.
In circuits which undergo rapid charge or discharge a protective resistor of 1Ω/V is recommended. If this is impossible,
a derating factor of up to 70% should be used.
In such situations a higher voltage may be needed than is
available as a single capacitor. A series combination should
be used to increase the working voltage of the equivalent
capacitor: For example two 22µF 25V parts in series is equivalent to one 11µF 50V part. For further details refer to J.A.
Gill’s paper “Investigation into the effects of connecting
Tantalum capacitors in series”, available from AVX offices
worldwide.
NOTE:
While testing a circuit (e.g. at ICT or functional) it is likely that
the capacitors will be subjected to large voltage and current
transients, which will not be seen in normal use. These conditions should be borne in mind when considering the
capacitor’s rated voltage for use. These can be controlled by
ensuring a correct test resistance is used.
1.2.5 Reverse voltage and Non-Polar operation.
The values quoted are the maximum levels of reverse voltage
which should appear on the capacitors at any time. These
limits are based on the assumption that the capacitors are
polarized in the correct direction for the majority of their
working life. They are intended to cover short term reversals
of polarity such as those occurring during switching transients of during a minor portion of an impressed waveform.
Continuous application of reverse voltage without normal
polarization will result in a degradation of leakage current. In
conditions under which continuous application of a reverse
voltage could occur two similar capacitors should be used in
a back-to-back configuration with the negative terminations
connected together. Under most conditions this combination
will have a capacitance one half of the nominal capacitance
of either capacitor. Under conditions of isolated pulses or
during the first few cycles, the capacitance may approach
the full nominal value.
The reverse voltage ratings are designed to cover exceptional conditions of small level excursions into incorrect polarity.
The values quoted are not intended to cover continuous
reverse operation.
The peak reverse voltage applied to the capacitor must not
exceed:
10% of the rated d.c. working voltage to a maximum of
1.0v at 25°C
3% of the rated d.c. working voltage to a maximum of
0.5v at 85°C
1% of the category d.c. working voltage to a maximum of
0.1v at 125°C
1.2.6 Superimposed A.C. Voltage (Vr.m.s.) Ripple Voltage.
This is the maximum r.m.s. alternating voltage; superimposed on a d.c. voltage, that may be applied to a capacitor.
The sum of the d.c. voltage and peak value of the
super-imposed a.c. voltage must not exceed the category
voltage, Vc.
Full details are given in Section 2.
1.2.7 Forming voltage.
This is the voltage at which the anode oxide is formed. The
thickness of this oxide layer is proportional to the formation
voltage for a tantalum capacitor and is a factor in setting the
rated voltage.
1.3 DISSIPATION FACTOR AND
TANGENT OF LOSS ANGLE (TAN ␦)
1.3.1 Dissipation factor (D.F.).
Dissipation factor is the measurement of the tangent of the
loss angle (tan ␦) expressed as a percentage. The measurement of DF is carried out using a measuring bridge which
supplies a 0.5Vpk-pk 120Hz sinusoidal signal, free of harmonics with a maximum bias of 2.2Vdc. The value of DF is
temperature and frequency dependent.
Note: For surface mounted products the maximum allowed
DF values are indicated in the ratings table and it is important
to note that these are the limits met by the component
AFTER soldering onto the substrate.
1.3.2 Tangent of Loss Angle (tan ␦).
This is a measurement of the energy loss in the capacitor. It
is expressed as tan ␦ and is the power loss of the capacitor
divided by its reactive power at a sinusoidal voltage of specified frequency. Terms also used are power factor, loss factor
and dielectric loss. Cos (90 - ␦) is the true power factor. The
measurement of tan ␦ is carried out using a measuring
bridge which supplies a 0.5Vpk-pk 120Hz sinusoidal signal,
free of harmonics with a maximum bias of 2.2Vdc.
31
Technical Summary and
Application Guidelines
1.3.3 Frequency dependence of Dissipation Factor.
1.4.2 Equivalent Series Resistance, ESR.
Dissipation Factor increases with frequency as shown in the
typical curves:
Resistance losses occur in all practical forms of capacitors.
These are made up from several different mechanisms,
including resistance in components and contacts, viscous
forces within the dielectric and defects producing bypass
current paths. To express the effect of these losses they are
considered as the ESR of the capacitor. The ESR is frequency
dependent and can be found by using the relationship;
tan δ
ESR =
2πfC
Where f is the frequency in Hz, and C is the capacitance in
farads.
The ESR is measured at 20°C and 100kHz.
ESR is one of the contributing factors to impedance, and
at high frequencies (100kHz and above) it becomes the
dominant factor. Thus ESR and impedance become almost
identical, impedance being only marginally higher.
DF vs. FREQUENCY
(TPSE107M016R0100)
500
450
400
350
DF (%)
300
250
200
150
100
50
0
100
1000
Frequency (Hz)
10000
100000
1.3.4 Temperature dependence of Dissipation
Factor.
Dissipation factor varies with temperature as the typical
curves show. For maximum limits please refer to ratings
tables.
DF vs. TEMPERATURE
(TPSE107M016R0100)
1.4.3 Frequency dependence of Impedance and ESR.
ESR and Impedance both increase with decreasing frequency.
At lower frequencies the values diverge as the extra contributions to impedance (due to the reactance of the capacitor)
become more significant. Beyond 1MHz (and beyond the
resonant point of the capacitor) impedance again increases
due to the inductance of the capacitor.
ESR vs. FREQUENCY
(TPSE107M016R0100)
ESR (Ohms)
1
-40
-20
0
20
40
60
80
100
0.1
125
Temperature (°C)
0.01
100
1000
10000
100000
1000000
Frequency (Hz)
1.4 IMPEDANCE, (Z) AND EQUIVALENT
SERIES RESISTANCE (ESR)
IMPEDANCE vs. FREQUENCY
(TPSE107M016R0100)
10
This is the ratio of voltage to current at a specified frequency.
Three factors contribute to the impedance of a tantalum
capacitor; the resistance of the semiconductor layer; the
capacitance value and the inductance of the electrodes
and leads.
At high frequencies the inductance of the leads becomes
a limiting factor. The temperature and frequency behavior
of these three factors of impedance determine the behavior
of the impedance Z. The impedance is measured at 20°C
and 100kHz.
32
Impedance (Ohms)
1.4.1 Impedance, Z.
1
0.1
0.01
100
1000
10000
Frequency (Hz)
100000
1000000
Technical Summary and
Application Guidelines
1.4.4 Temperature dependence of the Impedance
and ESR.
At 100kHz, impedance and ESR behave identically and
decrease with increasing temperature as the typical curves
show.
ESR vs. TEMPERATURE
1
1.5.3 Voltage dependence of the leakage current.
The leakage current drops rapidly below the value corresponding to the rated voltage VR when reduced voltages are
applied. The effect of voltage derating on the leakage current
is shown in the graph. This will also give a significant increase
in the reliability for any application. See Section 3.1 for
details.
ESR (Ohms)
LEAKAGE CURRENT vs. RATED VOLTAGE
1
0.1
Leakage Current
ratio I/IVR
0.01
-55 -40 -20
0
20 40 60
Temperature (°C)
80
10
Typical
Range
0.1
125
1.5 D.C. LEAKAGE CURRENT
0.01
0
1.5.1 Leakage current.
The leakage current is dependent on the voltage applied,
the elapsed time since the voltage was applied and the
component temperature. It is measured at +20°C with the
rated voltage applied. A protective resistance of 1000Ω
is connected in series with the capacitor in the measuring
circuit. Three to five minutes after application of the rated
voltage the leakage current must not exceed the maximum
values indicated in the ratings table. These are based on the
formulae 0.01CV or 0.5µA (whichever is the greater).
Reforming of tantalum capacitors is unnecessary even after
prolonged storage periods without the application of voltage.
20
40
60
80
100
Rated Voltage (VR) %
For additional information on Leakage Current, please
consult the AVX technical publication "Analysis of Solid
Tantalum Capacitor Leakage Current" by R. W. Franklin.
1.5.4 Ripple current.
The maximum ripple current allowed can be calculated from
the power dissipation limits for a given temperature rise
above ambient temperature (please refer to Section 2).
LEAKAGE CURRENT vs. BIAS VOLTAGE
1.5.2 Temperature dependence of the leakage
current.
冇
冈
LEAKAGE CURRENT vs. TEMPERATURE
8
Leakage Current (µA)
The leakage current increases with higher temperatures,
typical values are shown in the graph. For operation between
85°C and 125°C, the maximum working voltage must be
derated and can be found from the following formula.
Vmax = 1- (T - 85) x VRvolts, where T is the required
125
operating temperature.
10
6
4
2
0
-2
-4
-6
-8
-10
-20
0
20
40
60
80
100
Applied Voltage (Volts)
10
TAJD336M006
TAJD476M010
TAJD336M016
TAJC685M020
Leakage current
1
ratio I/IR20
0.1
-55 -40 -20
0 20 40 60 80 100 +125
Temperature (°C)
33
Technical Summary and
Application Guidelines
SECTION 2
A.C. OPERATION, RIPPLE VOLTAGE AND RIPPLE CURRENT
2.1 RIPPLE RATINGS (A.C.)
In an a.c. application heat is generated within the capacitor
by both the a.c. component of the signal (which will depend
upon the signal form, amplitude and frequency), and by the
d.c. leakage. For practical purposes the second factor is
insignificant. The actual power dissipated in the capacitor is
calculated using the formula:
P=
I2 R
and
rearranged to I =
(P⁄R) .....(Eq. 1)
√
and substituting
where
I
R
E
P
Z
P= E R
Z2
= rms ripple current, amperes
= equivalent series resistance, ohms
= rms ripple voltage, volts
= power dissipated, watts
= impedance, ohms, at frequency under
consideration
Where P is the maximum permissible power dissipated as
listed for the product under consideration (see tables).
However care must be taken to ensure that:
1. The d.c. working voltage of the capacitor must not be
exceeded by the sum of the positive peak of the applied
a.c. voltage and the d.c. bias voltage.
2. The sum of the applied d.c. bias voltage and the negative
peak of the a.c. voltage must not allow a voltage reversal
in excess of the “Reverse Voltage”.
2
Maximum a.c. ripple voltage (Emax).
From the previous equation:
E
max
= Z
√
(P⁄R)
Historical ripple calculations.
Previous ripple current and voltage values were calculated
using an empirically derived power dissipation required to
give a 10°C rise of the capacitors body temperature from
room temperature, usually in free air. These values are shown
in Table I. Equation 1 then allows the maximum ripple current
to be established, and Equation 2, the maximum ripple
voltage. But as has been shown in the AVX article on thermal
management by I. Salisbury, the thermal conductivity of a
Tantalum chip capacitor varies considerably depending upon
how it is mounted.
.....(Eq. 2)
Table I: Power Dissipation Ratings (In Free Air)
TAJ/TPS/CWR11
Series Molded Chip
Case
size
A
B
C
D
E
M
N
R
S
T
V
34
Max. power
dissipation (W)
0.075
0.085
0.110
0.150
0.165
0.090
0.130
0.055
0.065
0.080
0.250
TAZ/CWR09
Series Molded Chip
Case
size
A
B
C
D
E
F
G
H
Max. power
dissipation (W)
0.050
0.070
0.075
0.080
0.090
0.100
0.125
0.150
TAJ/TPS/CWR11
TAZ/CWR09
Series Molded Chip
Temperature
derating factors
Temp. °C
Factor
+25
1.0
+55
0.90
+85
0.80
+125
0.16
Temperature correction factor
for ripple current
Temp. °C
Factor
+25
1.0
+55
0.95
+85
0.90
+125
0.40
Technical Summary and
Application Guidelines
A piece of equipment was designed which would pass sine
and square wave currents of varying amplitudes through a
biased capacitor. The temperature rise seen on the body for
the capacitor was then measured using an infra-red probe.
This ensured that there was no heat loss through any thermocouple attached to the capacitor’s surface.
Results for the C, D and E case sizes
70
Temperature rise (°C)
60
50
40
100KHz
1 MHz
30
20
0
0.00
C case
60
50
D case
40
30
20
10
0
0
0.20
0.40
0.60
0.80
RMS current (Amps)
1.00
1.20
If I 2R is then plotted it can be seen that the two lines are in
fact coincident, as shown in figure below.
E case
70.00
60.00
0.1
0.2
0.3
0.4
0.5
Power (Watts)
Several capacitors were tested and the combined results are
shown here. All these capacitors were measured on FR4
board, with no other heatsinking. The ripple was supplied at
various frequencies from 1KHz to 1MHz.
As can be seen in the figure above, the average Pmax value
for the C case capacitors was 0.11 Watts. This is the same
as that quoted in Table I.
The D case capacitors gave an average Pmax value 0.125
Watts. This is lower than the value quoted in the Table I by
0.025 Watts.
The E case capacitors gave an average Pmax of 0.200 Watts
which was much higher than the 0.165 Watts from Table I.
If a typical capacitor’s ESR with frequency is considered, e.g.
figure below, it can be seen that there is variation. Thus for a
set ripple current, the amount of power to be dissipated by
the capacitor will vary with frequency. This is clearly shown in
figure in top of next column, which shows that the surface
temperature of the unit rises less for a given value of ripple
current at 1MHz than at 100KHz.
The graph below shows a typical ESR variation with frequency. Typical ripple current versus temperature rise for
100KHz and 1MHz sine wave inputs.
ESR vs. FREQUENCY
Temperature Rise (°C)
Temperature rise ( o C)
10
100
90
80
70
50.00
40.00
100KHz
30.00
1 MHz
20.00
10.00
0.00
0.00
0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40
FR
0.45 0.50
Example
A Tantalum capacitor is being used in a filtering application,
where it will be required to handle a 2 Amp peak-to-peak,
200KHz square wave current.
A square wave is the sum of an infinite series of sine waves
at all the odd harmonics of the square waves fundamental
frequency. The equation which relates is:
ISquare = Ipksin (2πƒ) + Ipk sin (6πƒ) + Ipk sin (10πƒ) + Ipk sin (14πƒ) +...
Thus the special components are:
Frequency
200 KHz
600 KHz
1 MHz
1.4 MHz
Peak-to-peak current
(Amps)
2.000
0.667
0.400
0.286
RMS current
(Amps)
0.707
0.236
0.141
0.101
Let us assume the capacitor is a TAJD686M006
Typical ESR measurements would yield.
(TPSE107M016R0100)
ESR (Ohms)
1
Frequency
200 KHz
600 KHz
1 MHz
1.4 MHz
0.1
0.01
100
1000
10000
Frequency (Hz)
100000
1000000
Typical ESR
(Ohms)
0.120
0.115
0.090
0.100
Power (Watts)
Irms2 x ESR
0.060
0.006
0.002
0.001
Thus the total power dissipation would be 0.069 Watts.
From the D case results shown in figure top of previous
column, it can be seen that this power would cause the
capacitors surface temperature to rise by about 5°C.
For additional information, please refer to the AVX technical
publication “Ripple Rating of Tantalum Chip Capacitors” by
R.W. Franklin.
35
Technical Summary and
Application Guidelines
2.2 Thermal Management
The heat generated inside a tantalum capacitor in a.c.
operation comes from the power dissipation due to ripple
current. It is equal to I2R, where I is the rms value of the
current at a given frequency, and R is the ESR at the same
frequency with an additional contribution due to the leakage
current. The heat will be transferred from the outer surface by
conduction. How efficiently it is transferred from this point is
dependent on the thermal management of the board.
The power dissipation ratings given in Section 2.1 are based
on free-air calculations. These ratings can be approached if
efficient heat sinking and/or forced cooling is used.
In practice, in a high density assembly with no specific
thermal management, the power dissipation required to give
a 10°C rise above ambient may be up to a factor of 10
less. In these cases, the actual capacitor temperature should
be established (either by thermocouple probe or infra-red
scanner) and if it is seen to be above this limit it may
be necessary to specify a lower ESR part or a higher
voltage rating.
Please contact application engineering for details or contact
the AVX technical publication entitled “Thermal Management
of Surface Mounted Tantalum Capacitors” by Ian Salisbury.
Thermal Dissipation from the Mounted Chip
ENCAPSULANT
LEAD FRAME
TANTALUM
ANODE
COPPER
SOLDER
PRINTED CIRCUIT BOARD
Thermal Impedance Graph with Ripple Current
THERMAL IMPEDANCE GRAPH
C CASE SIZE CAPACITOR BODY
140
TEMPERATURE DEG C
121 C\WATT
120
100
236 C\WATT
80
60
40
20
0
0
73 C\WATT
X
X
X
X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY
0.1 0.2 0.3
0.4
0.5 0.6
0.7 0.8 0.9
1.0
1.1 1.2 1.3
1.4
POWER IN UNIT CASE, DC WATTS
= PCB MAX Cu THERMAL
36
= PCB MIN Cu AIR GAP
= CAP IN FREE AIR
Technical Summary and
Application Guidelines
SECTION 3
RELIABILITY AND CALCULATION OF FAILURE RATE
Figure 2. Correction factor to failure rate F for voltage
derating of a typical component (60% con. level).
3.1 STEADY-STATE
Infant
Mortalities
1.0000
Correction Factor
Tantalum Dielectric has essentially no wear out mechanism
and in certain circumstances is capable of limited self
healing. However, random failures can occur in operation.
The failure rate of Tantalum capacitors will decrease with time
and not increase as with other electrolytic capacitors and
other electronic components.
0.1000
0.0100
0.0010
0.0001
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Applied Voltage / Rated Voltage
Infinite Useful Life
Useful life reliability can be altered by voltage
derating, temperature or series resistance
Operating Temperature.
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be improved
as shown in Figure 3. This graph gives a correction factor FT
for any temperature of operation.
Figure 1. Tantalum Reliability Curve
where
FU is a correction factor due to operating
voltage/voltage derating
FT is a correction factor due to operating
temperature
FR is a correction factor due to circuit series
resistance
FB is the basic failure rate level. For standard
Tantalum product this is 1%/1000 hours
Base failure rate.
Standard tantalum product conforms to Level M reliability
(i.e., 1%/1000 hrs.) at rated voltage, rated temperature,
and 0.1Ω/volt circuit impedance. This is known as the
base failure rate, FB, which is used for calculating operating
reliability. The effect of varying the operating conditions on
failure rate is shown on this page.
Operating voltage/voltage derating.
If a capacitor with a higher voltage rating than the maximum
line voltage is used, then the operating reliability will be
improved. This is known as voltage derating.
The graph, Figure 2, shows the relationship between voltage
derating (the ratio between applied and rated voltage) and
the failure rate. The graph gives the correction factor FU for
any operating voltage.
Figure 3: Correction factor to failure rate F for ambient
temperature T for typical component
(60% con. level).
100.0
Correction Factor
The useful life reliability of the Tantalum capacitor is affected
by three factors. The equation from which the failure rate can
be calculated is:
F = FU x FT x FR x FB
10.0
1.0
0.10
0.01
20
30
40
50
60
70
80
90
100 110 120
Temperature
Circuit Impedance.
All solid tantalum capacitors require current limiting
resistance to protect the dielectric from surges. A series
resistor is recommended for this purpose. A lower circuit
impedance may cause an increase in failure rate, especially
at temperatures higher than 20°C. An inductive low impedance circuit may apply voltage surges to the capacitor and
similarly a non-inductive circuit may apply current surges to
the capacitor, causing localized over-heating and failure. The
recommended impedance is 1 Ω per volt. Where this is not
feasible, equivalent voltage derating should be used
(See MIL HANDBOOK 217E). The graph, Figure 4, shows
the correction factor, FR, for increasing series resistance.
37
Technical Summary and
Application Guidelines
Figure 4. Correction factor to failure rate F for series resistance
R on basic failure rate FB for a typical component
(60% con. level).
Circuit resistance
ohms/volt
3.0
2.0
1.0
0.8
0.6
0.4
0.2
0.1
FR
0.07
0.1
0.2
0.3
0.4
0.6
0.8
1.0
Leakage current vs number of surge failures
Example calculation
Consider a 12 volt power line. The designer needs about
10µF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier. Thus the circuit impedance will be
limited only by the output impedance of the board’s power
unit and the track resistance. Let us assume it to be about
2 Ohms minimum, i.e. 0.167 Ohms/Volt. The operating
temperature range is -25°C to +85°C. If a 10µF 16 Volt
capacitor was designed in the operating failure rate would
be as follows.
a) FT = 1.0 @ 85°C
b) FR = 0.85 @ 0.167 Ohms/Volt
c) FU = 0.08 @ applied voltage/rated
voltage = 75%
Thus
FB = 1.0 x 0.85 x 0.08 x 1 = 0.068%/1000 Hours
If the capacitor was changed for a 20 volt capacitor, the
operating failure rate will change as shown.
FU = 0.018 @ applied voltage/rated voltage = 60%
FB = 1.0 x 0.85 x 0.018 x 1 = 0.0153%/1000 Hours
3.2 Dynamic.
As stated in Section 1.2.4, the solid Tantalum capacitor has
a limited ability to withstand voltage and current surges.
Such current surges can cause a capacitor to fail. The
expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability. The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance.
The table below summarizes the results of trials carried out
at AVX with a piece of equipment which has very low series
resistance with no voltage derating applied. That is the
capacitor was tested at its rated voltage.
Results of production scale derating experiment
Capacitance
and Voltage
47µF 16V
100µF 10V
22µF 25V
38
Number of
units tested
1,547,587
632,876
2,256,258
As can clearly be seen from the results of this experiment,
the more derating applied by the user, the less likely the
probability of a surge failure occurring.
It must be remembered that these results were derived from
a highly accelerated surge test machine, and failure rates in
the low ppm are more likely with the end customer.
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen. This can be disproved
by the results of an experiment carried out at AVX on 47µF
10V surface mount capacitors with different leakage
currents. The results are summarized in the table below.
50% derating
applied
0.03%
0.01%
0.05%
No derating
applied
1.1%
0.5%
0.3%
Standard leakage range
0.1 µA to 1µA
Over Catalog limit
5µA to 50µA
Classified Short Circuit
50µA to 500µA
Number tested
10,000
Number failed surge
25
10,000
26
10,000
25
Again, it must be remembered that these results were
derived from a highly accelerated surge test machine,
and failure rates in the low ppm are more likely with the end
customer.
AVX recommended derating table
Voltage Rail
3.3
5
10
12
15
≥24
Working Cap Voltage
6.3
10
20
25
35
Series Combinations (11)
For further details on surge in Tantalum capacitors refer
to J.A. Gill’s paper “Surge in solid Tantalum capacitors”,
available from AVX offices worldwide.
An added bonus of increasing the derating applied in a
circuit, to improve the ability of the capacitor to withstand
surge conditions, is that the steady-state reliability is
improved by up to an order. Consider the example of a 6.3
volt capacitor being used on a 5 volt rail.
The steady-state reliability of a Tantalum capacitor is affected
by three parameters; temperature, series resistance and
voltage derating. Assume 40°C operation and 0.1
Ohms/Volt series resistance.
Technical Summary and
Application Guidelines
If a 10 volt capacitor was used instead, the new scaling factor
would be 0.006, thus the steady-state reliability would be:
Failure rate = FU x FT x FR x 1%/1000 hours
= 0.006 x 0.1 x 1 x 1%/1000 hours
= 6 x 10-4 %/1000 hours
The capacitors reliability will therefore be:
Failure rate = FU x FT x FR x 1%/1000 hours
= 0.15 x 0.1 x 1 x 1%/1000 hours
= 0.015%/1000 hours
SECTION 4
APPLICATION GUIDELINES FOR TANTALUM CAPACITORS
ture and is designed to ensure that the temperature of
the internal construction of the capacitor does not exceed
220°C. Preheat conditions vary according to the reflow
system used, maximum time and temperature would be 10
minutes at 150°C. Small parametric shifts may be noted
immediately after reflow, components should be allowed to
stabilize at room temperature prior to electrical testing.
Both TAJ and TAZ series are designed for reflow and wave
soldering operations. In addition TAZ is available with gold
terminations compatible with conductive epoxy or gold wire
bonding for hybrid assemblies.
So there is an order improvement in the capacitors steadystate reliability.
Soldering Conditions and Board Attachment.
The soldering temperature and time should be the minimum
for a good connection.
A suitable combination for wavesoldering is 230 - 250°C for
3 - 5 seconds.
For vapor phase or infra-red reflow soldering the profile
below shows allowable and dangerous time/temperature
combinations. The profile refers to the peak reflow tempera-
Allowable range of peak temp./time combination for wave soldering
270
260
Dangerous Range
250
Temperature 240
( o C)
230
Allowable Range
with Care
220
Allowable Range
with Preheat
210
200
0
2
4
6
8
Soldering Time (secs.)
10
Under the CECC 00 802
International Specification, AVX
Tantalum capacitors are a
Class A component.
The capacitors can therefore
be subjected to one IR reflow,
one wave solder and one
soldering iron cycle.
12
If more aggressive mounting
techniques are to be used
please consult AVX Tantalum
for guidance.
Allowable range of peak temp./time combination for IR reflow
260
Temperature ( oC)
DANGEROUS RANGE
250
ALLOWABLE
RANGE WITH CARE
240
230
RECOMMENDED RANGE
220
210
0
15
30
TIME IN SECONDS
45
60
39
Technical Summary and
Application Guidelines
SECTION 4
APPLICATION GUIDELINES FOR TANTALUM CAPACITORS
Recommended soldering profiles for surface mounting of tantalum capacitors is provided in figure below.
IR REFLOW
Recommended
Ramp Rate Less
than 2°C/sec.
WAVE SOLDERING
VAPOR PHASE
After soldering the assembly should preferably be allowed to cool naturally. In the event that assisted cooling is used, the rate
of change in temperature should not exceed that used in reflow.
40
Technical Summary and
Application Guidelines
SECTION 5
MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
D
5.1 Acceleration
C
z
98.1m/s (10g)
2
B
Y
x
5.2 Vibration Severity
10 to 2000Hz, 0.75mm of 98.1m/s (10g)
2
PW
A
5.3 Shock
Trapezoidal Pulse, 98.1m/s2 for 6ms.
PL
5.4 Adhesion to Substrate
IEC 384-3. minimum of 5N.
5.5 Resistance to Substrate Bending
The component has compliant leads which reduces
the risk of stress on the capacitor due to substrate
bending.
5.6 Soldering Conditions
Dip soldering is permissible provided the solder bath
temperature is ≤ 270°C, the solder time < 3 seconds
and the circuit board thickness ≥ 1.0mm.
5.7 Installation Instructions
The upper temperature limit (maximum capacitor surface
temperature) must not be exceeded even under the
most unfavorable conditions when the capacitor is
installed. This must be considered particularly when it
is positioned near components which radiate heat
strongly (e.g. valves and power transistors).
Furthermore, care must be taken, when bending
the wires, that the bending forces do not strain the
capacitor housing.
5.8 Installation Position
No restriction.
5.9 Soldering Instructions
Fluxes containing acids must not be used.
5.9.1 Guidelines for Surface Mount Footprints
Component footprint and reflow pad design for AVX
capacitors.
The component footprint is defined as the maximum board
area taken up by the terminators. The footprint dimensions
are given by A, B, C and D in the diagram, which corresponds to W, max., A max., S min. and L max. for the component. The footprint is symmetric about the center lines.
The dimensions x, y and z should be kept to a minimum
to reduce rotational tendencies while allowing for visual
inspection of the component and its solder fillet.
SECTION 6
EPOXY FLAMMABILITY
PS
PSL
Dimensions PS (Pad Separation) and PW (Pad Width) are
calculated using dimensions x and z. Dimension y may
vary, depending on whether reflow or wave soldering is to
be performed.
For reflow soldering, dimensions PL (Pad Length), PW (Pad
Width), and PSL (Pad Set Length) have been calculated. For
wave soldering the pad width (PWw) is reduced to less than
the termination width to minimize the amount of solder pick
up while ensuring that a good joint can be produced.
NOTE: These recommendations (also in compliance with EIA) are guidelines
only. With care and control, smaller footprints may be considered for
reflow soldering.
Nominal footprint and pad dimensions for each case size are
given in the following tables:
PAD DIMENSIONS: millimeters (inches)
CASE
TAJ
A
B
C
D
V
E
R
S
T
TAC L
R
TAZ A
B
D
E
F
G
H
PSL
4.0 (0.157)
4.0 (0.157)
6.5 (0.056)
8.0 (0.315)
8.3 (0.325)
8.0 (0.315)
2.7 (0.100)
4.0 (0.160)
4.0 (0.160)
2.4 (0.095)
3.0 (0.120)
3.3 (0.126)
4.5 (0.178)
4.5 (0.178)
5.8 (0.228)
6.3 (0.248)
7.4 (0.293)
8.0 (0.313)
PL
1.4 (0.054)
1.4 (0.054)
2.0 (0.079)
2.0 (0.079)
2.3 (0.090)
2.0 (0.079)
1.0 (0.040)
1.4 (0.050)
1.4 (0.050)
0.7 (0.027)
0.7 (0.027)
1.4 (0.054)
1.4 (0.054)
1.4 (0.054)
1.4 (0.054)
1.4 (0.054)
1.9 (0.074)
1.9 (0.074)
PS
1.2 (0.047)
1.2 (0.047)
2.5 (0.098)
4.0 (0.157)
3.7 (0.145)
4.0 (0.157)
1.0 (0.040)
1.0 (0.040)
1.0 (0.040)
0.9 (0.035)
1.6 (0.063)
0.5 (0.020)
1.8 (0.070)
1.8 (0.070)
3.0 (0.120)
3.6 (0.140)
3.7 (0.145)
4.2 (0.165)
PW
1.8 (0.071)
2.8 (0.110)
2.8 (0.110)
3.0 (0.119)
6.2 (0.245)
3.0 (0.119)
1.6 (0.060)
1.8 (0.070)
2.8 (0.110)
1.0 (0.039)
1.5 (0.059)
2.5 (0.098)
2.5 (0.098)
3.6 (0.143)
3.6 (0.143)
4.5 (0.178)
4.0 (0.157)
5.0 (0.197)
PWw
0.9 (0.035)
1.6 (0.063)
1.6 (0.063)
1.7 (0.068)
1.7 (0.068)
1.7 (0.068)
0.8 (0.030)
0.8 (0.030)
0.8 (0.030)
1.0 (0.039)
1.0 (0.039)
2.0 (0.079)
2.2 (0.085)
3.0 (0.119)
2.4 (0.095)
3.4 (0.135)
SECTION 7
QUALIFICATION APPROVAL STATUS
EPOXY
UL RATING
OXYGEN INDEX
DESCRIPTION
STYLE
TAJ
TPS
TAZ
UL94 V-0
UL94 V-0
UL94 V-0
35%
35%
35%
Surface mount
capacitors
TAJ
CECC 30801 - 005 Issue 2
CECC 30801 - 011 Issue 1
MIL-C-55365/8 (CWR11)
TAZ
MIL-C-55365/4 (CWR09)
SPECIFICATION
41
TAC, TAJ & TPS Series
Tape and Reel Packaging
Tape and reel packaging for automatic component placement.
Please enter required Suffix on order. Bulk product is not available.
TAC, TAJ AND TPS TAPING SUFFIX TABLE
Case Size Tape width
reference
mm
P
mm
103mm
(4") reel
180mm
(7") reel
Suffix
Qty.
Suffix
Qty.
330mm
Total Tape Thickness — K max
(13") reel
A
8
4
R
2000
S
8000
B
8
4
R
2000
S
8000
C
12
8
R
500
S
3000
D
12
8
R
500
S
2500
E
12
8
R
400
S
1500
V
12
8
R
400
S
1500
R
8
4
R
2500
S
10000
S
8
4
R
2500
S
10000
T
8
4
R
2500
S
10000
TACL
8
4
X
500
R
3500
TACR
8
4
X
500
R
2500
TAC/TAJ/TPS
Case size
reference
K
Ao
Bo
A
B
C
D
E
V
R
S
T
L
2.3 (0.090)
2.6 (0.102)
3.3 (0.130)
3.6 (0.142)
4.8 (0.189)
4.0 (0.156)
1.9 (0.075)
1.9 (0.075)
1.9 (0.075)
1.1 (0.043)
1.9
3.1
3.7
4.8
4.5
6.4
1.7
1.9
3.1
1.1
3.5
3.8
6.9
7.6
7.5
7.6
2.5
3.5
3.8
2.0
PLASTIC TAPE DIMENSIONS
Code
8mm Tape
(0.157±0.004)
12mm Tape
(0.157±0.004)
A: 9.5mm (8mm tape)
13.0mm (12mm tape)
(0.315±0.004)
Cover Tape Dimensions
P*
4±0.1
or
8±0.1
G
0.75 min
(0.03 min)
0.75 min
(0.03 min)
F
3.5±0.05 (0.138±0.002)
5.5±0.05
(0.22±0.002)
E
1.75±0.1 (0.069±0.004)
1.75±0.1
(0.069±0.004)
W
8±0.3
(0.315±0.012)
12±0.3
(0.472±0.012)
P2
2±0.05
(0.079±0.002)
2±0.05
(0.079±0.002)
P0
4±0.1
(0.157±0.004)
4±0.1
(0.157±0.004)
D
1.5±0.1
-0
(0.059±0.004)
(-0)
1.5±0.1
-0
(0.059±0.004)
(-0)
D1
1.0 min
(0.039 min)
1.5 min
(0.059 min)
(0.315±0.004)
4±0.1
or
8±0.1
Standard Dimensions mm
Thickness: 75±25µ
Width of tape:
5.5mm + 0.2mm (8mm tape)
9.5mm + 0.2mm (12mm tape)
*See taping suffix tables for actual P dimension (component pitch).
TAPE SPECIFICATION
P2
P
E
Tape dimensions comply to EIA RS 481 A
Dimensions A0 and B0 of the pocket and the tape thickness, K,
are dependent on the component size.
Tape materials do not affect component solderability during
storage. Carrier Tape Thickness <0.4mm
F
W
B0
G
D1
Positive Termination
42
D
P0
A0
K
TAJ & TPS Marking
MARKING: TAJ SERIES
For TAJ, the positive end of body has videcon readable
polarity bar marking, with the AVX logo “A” as shown in the
diagram. Bodies are marked by indelible laser marking on top
surface with capacitance value, voltage and date of
manufacture. Due to the small size of the A, B, S and T
cases, a voltage code is used as shown to the right. R case
is an exception in which only the voltage and capacitance
values are printed.
Voltage Code
A, B, S and T Cases
F
G
J
A
C
D
E
V
T
Rated Voltage
at 85°C
2
4
6.3
10
16
20
25
35
50
POLARITY BAR INDICATES ANODE (+) TERMINATION
R Case:
2µ2
6V
1. Voltage
2. Capacitance in µF
A, B, S and T Case:
A10µ
9814
1. Voltage Code
(see table)
2. Capacitance in µF
3. Date Code
A
68µ
6.3
C, D, E and V Case:
1. Capacitance in µF
2. Rated Voltage at 85°C
3. Date Code
9819
43
TAZ, CWR09, CWR11 Series
Tape and Reel Packaging
Solid Tantalum Chip TAZ Tape and reel packaging for automatic component placement.
Please enter required Suffix on order. Bulk packaging is standard.
TAZ TAPING SUFFIX TABLE
Case Size
reference
Tape width
mm
P
mm
Suffix
Qty.
Suffix
Qty.
A
8
4
R
2500
S
9000
7" (180mm) reel
B
12
4
R
2500
S
9000
D
12
4
R
2500
S
8000
E
12
4
R
2500
S
8000
F
12
8
R
1000
S
3000
G
12
8
R
500
S
2500
H
12
8
R
500
S
2500
4±0.1
or
8±0.1
(0.157±0.004)
Code
P*
Total Tape Thickness — K max
TAZ
Case size
Millimeters (Inches)
reference
DIM
13" reel (330mm) reel
8mm Tape
(0.315±0.004)
A
B
D
E
F
G
H
12mm Tape
4±0.1
or
8±0.1
(0.157±0.004)
(0.315±0.004)
G
0.75 min
(0.03 min)
0.75 min
(0.03 min)
F
3.5±0.05 (0.138±0.002)
5.5±0.05
(0.22±0.002)
E
1.75±0.1 (0.069±0.004)
1.75±0.1
(0.069±0.004)
W
8±0.3
(0.315±0.012)
12±0.3
(0.472±0.012)
P2
2±0.05
(0.079±0.002)
2±0.05
(0.079±0.002)
P0
4±0.1
(0.157±0.004)
4±0.1
(0.157±0.004)
D
1.5±0.1
-0
(0.059±0.004)
(-0)
1.5±0.1
-0
(0.059±0.004)
(-0)
D1
1.0 min
(0.039 min)
1.5 min
(0.059 min)
*See taping suffix tables for actual P dimension (component pitch).
TAPE SPECIFICATION
Tape dimensions comply to EIA RS 481 A
Dimensions A0 and B0 of the pocket and
the tape thickness, K, are dependent on
the component size.
Tape materials do not affect component
solderability during storage.
Carrier Tape Thickness <0.4mm
44
2.0 (0.079)
4.0 (0.157)
4.0 (0.157)
4.0 (0.157)
4.0 (0.157)
4.0 (0.157)
4.0 (0.157)
TAZ, CWR09, CWR11 Series
Tape and Reel Packaging
PLASTIC TAPE REEL DIMENSIONS
䉱
䉲
Standard Dimensions mm
䉱
A: 9.5mm (8mm tape)
13.0mm (12mm tape)
D max
13±0.5
50 min
21 ± 1.0
䉱
Cover Tape Dimensions
䉲
Thickness: 75±25µ
Width of tape:
5.5mm + 0.2mm (8mm tape)
9.5mm + 0.2mm (12mm tape)
䉲
䉲
䉲
䉲
䉲
2 ± 0.5
A ± 1.0
Waffle Packaging - 2" x 2" hard plastic waffle trays. To order Waffle
packaging use a “W” in part numbers packaging position.
TAZ A
Maximum
Quantity
Per Waffle
160
TAZ B
112
TAZ D
88
TAZ E
60
Case Size
TAZ F
48
TAZ G
50
TAZ H
28
CWR11 A
96
CWR11 B
72
CWR11 C
54
CWR11 D
28
NOTE: Orientation of parts in waffle packs
varies by case size.
45
Questions & Answers
Some commonly asked questions regarding Tantalum
Capacitors:
Question: If I use several tantalum capacitors in serial/parallel
combinations, how can I ensure equal current and voltage
sharing?
Answer: Connecting two or more capacitors in series
and parallel combinations allows almost any value
and rating to be constructed for use in an application. For
example, a capacitance of more than 60µF is required in a
circuit for stable operation. The working voltage rail is 24
volts dc with a superimposed ripple of 1.5 volts at 120 Hz.
The maximum voltage seen by the capacitor is Vdc +
Vac=25.5V
Applying the 50% derating rule tells us that a 50V
capacitor is required.
Connecting two 25V rated capacitors in series will
give the required capacitance voltage rating, but the
The two resistors are used to ensure that the leakage
currents of the capacitors does not affect the circuit
reliability, by ensuring that all the capacitors have half
the working voltage across them.
Question: What are the advantages of tantalum over other
capacitor technologies?
Answer:
1. Tantalum capacitors have high volumetric efficiency.
2. Electrical performance over temperature is very
stable.
3. They have a wide operating temperature range -55
degrees C to +125 degrees C.
4. They have better frequency characteristics than
aluminum electrolytics.
5. No wear out mechanism. Because of their construction,
solid tantalum capacitors do not degrade in performance or reliability over time.
Question: How does TPS differ from your standard
33µF
product?
16.5µF
25V
Answer: TPS has been designed from the initial anode
50V
production stages for power supply applications. Special
33µF
manufacturing processes provide the most robust capacitor
25V
dielectric by maximizing the volumetric efficiency of the
package. After manufacturing, parts are conditioned by
effective capacitance will be halved, so for greater than 60µF,
being subjected to elevated temperature overvoltage burn in
four such series combinations are required, as shown.
applied for a minimum of two hours. Parts are monitored on
a 100% basis for their direct current leakage performance at
elevated temperatures. Parts are then subjected to a low
impedance current surge. This current surge is performed on
a 100% basis with each capacitor individually monitored.
33µF
66µF At this stage, the capacitor undergoes 100% test for
25V
capacitance, Dissipation Factor, leakage current, and
50V
100 KHz ESR to TPS requirements.
Question: If the part is rated as a 25 volt part and you have
current surged it, why can’t I use it at 25 volts in a low
In order to ensure reliable operation, the capacitors should
impedance circuit?
be connected as shown below to allow current sharing of
Answer: The high volumetric efficiency obtained using
the ac noise and ripple signals. This prevents any one
tantalum technology is accomplished by using an extremely
capacitor heating more than its neighbors and thus being
thin film of tantalum pentoxide as the dielectric. Even
the weak link in the chain.
an application of the relatively low voltage of 25 volts will
+
produce a large field strength as seen by the dielectric. As a
•
•
result of this, derating has a significant impact on reliability as
100K
described under the reliability section. The following example
uses a 22 microfarad capacitor rated at 25 volts to illustrate
•
•
••
the point. The equation for determining the amount of
100K
surface area for a capacitor is as follows:
➡
➡
•
••
•
100K
46
Questions & Answers
C = ( (E) (E°) (A) ) / d
A = ( (C) (d) ) /( (E°)(E) )
A = ( (22 x 10-6) (170 x 10-9) ) / ( (8.85 x 10-12) (27) )
A = 0.015 square meters (150 square centimeters)
Where
C = Capacitance in farads
A = Dielectric (Electrode) Surface Area (m2)
d = Dielectric thickness (Space between dielectric) (m)
E = Dielectric constant (27 for tantalum)
E° = Dielectric Constant relative to a vacuum
(8.855 x 10-12 Farads x m-1)
To compute the field voltage potential felt by the dielectric we
use the following logic.
Dielectric formation potential = Formation Ratio x
Working Voltage
= 4 x 25
Formation Potential = 100 volts
Dielectric (Ta2O5) Thickness (d) is 1.7 x 10-9 Meters Per Volt
d = 0.17 µ meters
Electric Field Strength = Working Voltage / d
= (25 / 0.17 µ meters)
= 147 Kilovolts per
millimeter
= 147 Megavolts
per meter
No matter how pure the raw tantalum powder or the
precision of processing, there will always be impurity sites in
the dielectric. We attempt to stress these sites in the factory
with overvoltage surges, and elevated temperature burn in
so that components will fail in the factory and not in your
product. Unfortunately, within this large area of tantalum
pentoxide, impurity sites will exist in all capacitors.
To minimize the possibility of providing enough activation
energy for these impurity sites to turn from an amorphous
state to a crystalline state that will conduct energy, series
resistance and derating is recommended. By reducing the
electric field within the anode at these sites, the tantalum
capacitor has increased reliability. Tantalums differ from
other electrolytics in that charge transients are carried by
electronic conduction rather than absorption of ions.
Question: What negative transients can Solid Tantalum
Capacitors operate under?
Answer: The reverse voltage ratings are designed to cover
exceptional conditions of small level excursions into incorrect
polarity. The values quoted are not intended to cover continuous reverse operation. The peak reverse voltage applied to
the capacitor must not exceed:
10% of rated DC working voltage to a maximum
of 1 volt at 25°C.
3% of rated DC working voltage to a maximum of
0.5 volt at 85°C.
1% of category DC working voltage to a maximum
of 0.1 volt at 125°C.
Question: I have read that manufacturers recommend a
series resistance of 0.1 ohm per working volt. You suggest
we use 1 ohm per volt in a low impedance circuit. Why?
Answer: We are talking about two very different sets of
circuit conditions for those recommendations. The 0.1 ohm
per volt recommendation is for steady-state conditions. This
level of resistance is used as a basis for the series resistance
variable in a 1% / 1000 hours 60% confidence level
reference. This is what steady-state life tests are based on.
The 1 ohm per volt is recommended for dynamic conditions
which include current in-rush applications such as inputs to
power supply circuits. In many power supply topologies
where the di/dt through the capacitor(s) is limited, (such
as most implementations of buck (current mode), forward
converter, and flyback), the requirement for series resistance
is decreased.
Question: How long is the shelf life for a tantalum capacitor?
Answer: Solid tantalum capacitors have no limitation on
shelf life. The dielectric is stable and no reformation is
required. The only factors that affect future performance of
the capacitors would be high humidity conditions and
extreme storage temperatures. Solderability of solder coated
surfaces may be affected by storage in excess of one year
under temperatures greater than 40°C or humidities greater
than 80% relative humidity. Terminations should be checked
for solderability in the event an oxidation develops on the
solder plating.
Question: Do you recommend the use of tantalum capacitors
on the input side of DC-DC converters?
Answer: No. Typically the input side of a converter is fed
from the voltage sources which are not regulated and are of
nominally low impedance. Examples would be Nickel-MetalHydride batteries, Nickel-Cadmium batteries, etc., whose
internal resistance is typically in the low milliohm range.
47
Technical Publications
1. Steve Warden and John Gill, “Application Guidelines
on IR Reflow of Surface Mount Solid Tantalum
Capacitors.”
2. John Gill, “Glossary of Terms used in the Tantalum
Industry.”
3. R.W. Franklin, “Over-Heating in Failed Tantalum
Capacitors,” AVX Ltd.
4. R.W. Franklin, “Upgraded Surge Performance of
Tantalum Capacitors,” Electronic Engineering 1985
5. R.W. Franklin, “Screening beats surge threat,”
Electronics Manufacture & Test, June 1985
6. AVX Surface Mounting Guide
7. Ian Salisbury, “Thermal Management of Surface
Mounted Tantalum Capacitors,” AVX
8. John Gill, “Investigation into the Effects of Connecting
Tantalum Capacitors in Series,” AVX
9. Ian Salisbury, “Analysis of Fusing Technology for
Tantalum Capacitors,” AVX-Kyocera Group Company
10. R.W. Franklin, “Analysis of Solid Tantalum Capacitor
Leakage Current,” AVX Ltd.
11. R.W. Franklin, “An Exploration of Leakage Current,”
AVX, Ltd.
12. William A. Millman, “Application Specific SMD
Tantalum Capacitors,” Technical Operations, AVX Ltd.
13. R.W. Franklin, “Capacitance Tolerances for Solid
Tantalum Capacitors,” AVX Ltd.
14. Arch G. Martin, “Decoupling Basics,” AVX Corporation
15. R.W. Franklin, “Equivalent Series Resistance of
Tantalum Capacitors,” AVX Ltd.
16. John Stroud, “Molded Surface Mount Tantalum
Capacitors vs Conformally Coated Capacitors,”
AVX Corporation, Tantalum Division
17. Chris Reynolds, “Reliability Management of Tantalum
Capacitors,” AVX Tantalum Corporation
18. R.W. Franklin, “Ripple Rating of Tantalum Chip
Capacitors,” AVX Ltd.
19. Chris Reynolds, “Setting Standard Sizes for Tantalum
Chips,” AVX Corporation
20. John Gill, “Surge In Solid Tantalum Capacitors,”
AVX Ltd.
21. David Mattingly, “Increasing Reliability of SMD
Tantalum Capacitors in Low Impedance Applications,”
AVX Corporation
22. John Gill, “Basic Tantalum Technology,” AVX Ltd.
23. Ian Salisbury, “Solder Update Reflow Mounting
TACmicrochip Tantalum Capacitor,” AVX Ltd.
24. Ian Salisbury, “New Tantalum Capacitor Design for
0603 Size,” AVX Ltd.
25. John Gill, “Capacitor Technology Comparison,”
AVX Ltd.
26. Scott Chiang, “High Performance CPU Capacitor
Requirements, how AVX can help,” AVX Kyocera
Taiwan
27. John Gill and Ian Bishop, "Reverse Voltage Behavior
of Solid Tantalum Capacitors."
As the world’s broadest line molded tantalum chip supplier, it is our
mission to provide First In Class Technology, Quality and Service,
by establishing progressive design, manufacturing and continuous
improvement programs driving toward a single goal:
Total Customer Satisfaction.
Please contact AVX for application engineering assistance.
NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and
data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and
are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required.
Specifications are typical and may not apply to all applications.
48
Fax Back
For further information and sample availability.
AVX USA:
843-626-5186
AVX EUROPE: ++44-1252-770004
AVX ASIA:
++65-3504-880
Name:
Company:
Address:
Zip Code:
Tel. No:
Fax No:
Project launch date:
ⵧ
ⵧ
ⵧ
0-3mths
3-6mths
6-12mths
⬎12mths
Circuit Application:
ⵧ
ⵧ
ⵧ
ⵧ
ⵧ
ⵧ
Decoupling
Timing
Filtering
DC Blocking
Other
ⵧ
ⵧ
ⵧ
ⵧ
ⵧ
ⵧ
Telecoms
ⵧ
Cellular
Auto
ⵧ
Other
PC
Storage
Power Supply
Industrial
ⵧ
ⵧ
Leakage
Current
Height
Market Sector:
Please rank your critical design factors between 1-6 (1 most critical)
ⵧ
ⵧ
ⵧ
ⵧ
Size
Max
Impedance
Temperature
Capacitance
Stability
Please specify any CV ratings required outside of current matrix:
What other SMD products are used in this project:
ⵧ
ⵧ
ⵧ
ⵧ
ⵧ
ⵧ
Ceramic
Aluminum
Film
Chip Arrays
Conductive
Polymer
Os-con
Please specify any non standard special requirements:
ⵧ
ⵧ
ⵧ
ⵧ
ⵧ
Non Std Cap
Low ESR
Temp
Cap Tolerance
Interest in specials shown overleaf
of Short Form Catalog
Forecast usage of Tantalum:
Standard SMD Tantalum
TACmicrochip
1998
Favored Supplier, Please rank 1-5 (1 most favorable):
1999
2000
ⵧ
ⵧ
ⵧ
ⵧ
ⵧ
ⵧ
AVX
Hitachi
Kemet
NEC
Sprague
Other
Other engineers in your company who would like information:
Please specify sample requirements:
CAPACITANCE
VOLTAGE
49
USA
EUROPE
ASIA-PACIFIC
AVX Myrtle Beach, SC
Corporate Offices
AVX Limited, England
European Headquarters
AVX/Kyocera, Singapore
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Tel: 843-448-9411
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