SD05T1Series, SZSD05T1Series Transient Voltage Suppressor Diode SOD−323 Diodes for ESD Protection http://onsemi.com These TVS diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. These devices are ideal for situations where board space is at a premium. MARKING DIAGRAM Specification Features: • • • • • • • • • • • Steady State Power Routing of 300 mW Peak Power − 350 W (8 20 ms) Low Leakage Cathode Indicated by Polarity Band Package Weight: 4.507 mg/wmt Meets IEC61000−4−2 Level 4, 15 kV (Air), 8 kV (Contact) Meets IEC6100−4−4 Level 4, 40 A Meets IEC6100−4−5 (Lightning), 24 A Meets 16 kV Human Body Model ESD Requirements SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant xx MG G SOD−323 CASE 477 STYLE 1 xx = Specific Device Code ZA = SD05T1 ZC = SD12T1 M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device SD12T1G Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any Shipping† SOD−323 (Pb−Free) 3000/Tape & Reel SD05T1G SZSD05T1G Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Package SZSD12T1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. © Semiconductor Components Industries, LLC, 2014 September, 2014 − Rev. 4 1 Publication Order Number: SD05T1/D SD05T1 Series, SZSD05T1 Series MAXIMUM RATINGS Rating Symbol Value Unit Ppk 350 Watts ±15 ±8.0 kV 40 A Peak Power Dissipation @ 20 ms (Note 1) @ TL ≤ 25°C IEC 61000−4−2 (ESD) Air Contact IEC 61000−4−4 (EFT) ESD Voltage (Human Body Model (HBM) Waveform per IEC 61000−4−2) VPP 30 kV Total Power Dissipation on FR−4 Board (Note 2) @ TA = 25°C Derate above 25°C °PD° 300 2.4 °mW° mW/°C Thermal Resistance, Junction−to−Ambient RqJA 416 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C TL 260 °C Lead Solder Temperature − Maximum (10 Second Duration) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *Other voltages may be available upon request. 1. Nonrepetitive current pulse, per Figure 6. 2. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm2. ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) Symbol IF Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF VC VBR VRWM V IR VF IT IPP Uni−Directional TVS ELECTRICAL CHARACTERISTICS VBR, Breakdown Voltage (V) Max Capacitance (pF) Max IT mA VC @ IPP = 5 A (Note 3) (V) Max IPP (Note 3) (A) VC @ Max IPP (Note 3) (V) 6.2 7.3 1.0 9.8 24 14.5 350 13.3 15.75 1.0 19 15 25 150 Device VRWM (V) IR @ VRWM (mA) Min SD05T1G 5.0 10 SD12T1G 12 1.0 VR = 0 V f = 1.0 MHz Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. 8 × 20 ms pulse waveform. *Include SZ−prefix devices where applicable. http://onsemi.com 2 SD05T1 Series, SZSD05T1 Series TYPICAL CHARACTERISTICS 280 140 120 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 260 240 220 200 180 160 140 100 80 60 40 20 120 0 100 1 0.5 0 1.5 2 3 2.5 BIAS (V) 3.5 4 4.5 5 0 Figure 1. SD05 Typical Capacitance versus Bias Voltage 8 12 10 100 LEAKAGE CURRENT (nA) LEAKAGE CURRENT (nA) 6 BIAS (V) Figure 2. SD12 Typical Capacitance versus Bias Voltage 1000 100 10 −55 −35 −15 5 25 45 65 85 TEMPERATURE (°C) 10 1 0.1 −55 105 125 145 −30 Figure 3. SD05 Typical Leakage Current versus Temperature −5 20 45 70 TEMPERATURE (°C) 95 120 145 Figure 4. SD12 Typical Leakage Current versus Temperature 100 100 90 90 80 80 % OF PEAK PULSE CURRENT PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25°C 4 2 70 60 50 40 30 20 10 PEAK VALUE IRSM @ 8 ms tr PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 70 60 HALF VALUE IRSM/2 @ 20 ms 50 40 30 tP 20 10 0 0 25 50 75 100 125 150 175 TA, AMBIENT TEMPERATURE (°C) 200 0 0 20 40 t, TIME (ms) 60 Figure 6. 8 × 20 ms Pulse Waveform Figure 5. Pulse Derating Curve http://onsemi.com 3 80 SD05T1 Series, SZSD05T1 Series PACKAGE DIMENSIONS SOD−323 CASE 477−02 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. HE D b 1 2 E MILLIMETERS DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 L 0.08 HE 2.30 2.50 2.70 A3 A C NOTE 3 L A1 NOTE 5 INCHES NOM MAX 0.035 0.040 0.002 0.004 0.006 REF 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 MIN 0.031 0.000 STYLE 1: PIN 1. CATHODE 2. ANODE SOLDERING FOOTPRINT* 0.63 0.025 0.83 0.033 1.60 0.063 2.85 0.112 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative SD05T1/D