CSP6 1.77x3.54 / EFCP3517-6DGH-020

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
CSP6, 1.77x3.54 / EFCP3517−6DGH−020
CASE 568AL
ISSUE O
DATE 23 OCT 2013
SCALE 4:1
E
PIN A1
REFERENCE
2X
0.05 C
2X
ÈÈ
ÈÈ
A B
TOP VIEW
A
0.03 C
C
SIDE VIEW
e2
b
1
e2
2
MILLIMETERS
MIN
MAX
−−−
0.22
0.22
0.28
0.22
0.28
1.77 BSC
3.54 BSC
0.50 BSC
1.00 BSC
1.22
1.28
RECOMMENDED
SOLDERING FOOTPRINT*
0.03 C
SEATING
PLANE
2X
8X
R0.125
4X
1.25
0.25
PACKAGE
OUTLINE
0.50
PITCH
e/2
3
0.05 C A B
e
0.03 C
4X
DIM
A
b
b1
D
E
e
e2
L
D
0.05 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
1
2.00
PITCH
b1
6
5
4
L
BOTTOM VIEW
DOCUMENT NUMBER:
98AON79069F
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
CSP6, 1.77X3.54 / EFCP3517−6DGH−020
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON79069F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA.
DATE
23 OCT 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
October, 2013 − Rev. O
Case Outline Number:
568AL