DFN8 5x6, 1.27P (SO8FL)

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8 5x6, 1.27P
CASE 506BQ
ISSUE C
1
DATE 12 APR 2012
2X
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP.
4. PROFILE TOLERANCE APPLIES TO THE EXPOSED PAD AS WELL
AS THE TERMINAL.
5. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
6. SEATING PLANE IS DEFINED BY THE TERMINALS. A1 IS DEFINED
AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
7. A VISUAL INDICATOR FOR PIN 1 MUST BE LOCATED IN THIS AREA.
0.20 C
D
A
B
D1
8
6
7
2X
0.20 C
5
E1 E
PIN ONE
IDENTIFIER
NOTE 7
4X
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
h
K
L
M
N
h
1
2
3
c
4
A1
TOP VIEW
GENERIC
MARKING DIAGRAM*
0.10 C
A
DETAIL A
0.10 C
NOTE 4
C
SIDE VIEW
1
XXXXXX
AYWZZ
SEATING
PLANE
NOTE 6
DETAIL A
D2
1
8X
M
XXXXXX= Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
4
L
E2
N
K
8
G
MILLIMETERS
MIN
MAX
0.90
1.10
0.05
0.33
0.51
0.20
0.33
5.15 BSC
4.50
5.10
3.90
4.30
6.15 BSC
5.50
6.10
3.00
3.50
1.27 BSC
0.80
1.20
12 _
0.20
0.51
0.71
3.25
3.75
1.80
2.20
*This information is generic. Please refer
to device data sheet for actual part
marking.
5
e
8X
BOTTOM VIEW
SOLDERING FOOTPRINT*
b
0.10
C A B
8X
0.05
c
0.75
NOTE 3
4X
1.27
PITCH
0.92
4X
4.84
0.90
2.00
6.59
3.70
0.99
4X 1.00
4.56
5.55
DIMENSION: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON38888E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
DESCRIPTION:
October, 2002
Rev. 0
DFN8 5X6, 1.27P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON38888E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY J. CARTER.
27 FEB 2009
A
ADMIN CHANGE DUE TO WRONG FILE LOADED ON REV O. REQ. BY E. RIVAS.
02 MAR 2009
B
CORRECTED DIMENSION K LABEL ON BOTTOM VIEW. REQ. BY S. WINSTON.
27 MAR 2009
C
CORRECTED MARKING DIAGRAM TO ADD LOT TRACEABILITY. REQ. BY J.
CARTER.
12 APR 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
April, 2012 Rev. C
Case Outline Number:
506BQ
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