Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor The MLN SurgeArray™ Suppressor is designed to help protect components from transient voltages that exist at the circuit board level. This device provides four independent suppressors in a single “1206” leadless chip in order to reduce part count and placement time as well as save space on printed circuit boards. SurgeArray™ devices are intended to suppress ESD, EFT and other transients in order to protect integrated circuits or other sensitive components operating at any voltage up to 18VDC. SurgeArray devices are rated to the IEC 61000-4-2 human body model ESD to help products attain EMC compliance. The array offers excellent isolation and low crosstalk between sections. SURFACE MOUNT VARISTORS 3 The inherent capacitance of the SurgeArray Suppressor permits it to function as a filter/suppressor, thereby replacing separate zener/ capacitor combinations. The MLN array is manufactured using the Littelfuse Multilayer technology process and is similar to the Littelfuse ML and MLE Series of discrete leadless chips. The MLN can also be provided in a Dual version. Contact Littelfuse for information. Features • Four Individual Devices in One 1206 Chip • ESD Rated to IEC 61000-4-2 (Level 4) • AC Characterized for Impedance and Capacitance • Low Adjacent Channel Crosstalk, -55dB at 10MHz (Typ) • Low Leakage (6nA at 5.5V, 30nA at 15V) • Operating Voltage up to 18VM(DC) • -55oC to 125oC Operating Temperature Range • Low-Profile, PCMCIA Compatible Applications • Data, Diagnostic I/O Ports • Analog Signal/Sensor Lines • Portable/Hand-Held Products • Mobile Communications/Cellular Phones • Computer/DSP Products • Industrial Instruments Including Medical w w w. l i t t e l f u s e . c o m 151 Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table. MLN ARRAY Continuous: Steady State Applied Voltage: DC Voltage Range (VM(DC)). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 125 Storage Temperature Range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 150 Device Ratings and Specifications Any Single Section MAX RATINGS (125 oC) MAXIMUM NONMAXIMUM REPETITIVE CONTINUOUS SURGE WORKING CURRENT VOLTAGE (8/20µs) PART NUMBER PERFORMANCE SPECIFICATIONS (25 oC) MAXIMUM CLAMPING VOLTAGE (AT NOTED 8/20µs) CURRENT MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs) TYPICAL ESD SUPPRESSION VOLTAGE (NOTE 1) VC WTM (NOTE 2) (NOTE 3) 8kV CONTACT 15kV AIR ITM VM(DC) Peak Clamp (See Fig. 3) V5.5MLN41206 V9MLN41206 Peak CAPACITANCE AT 1MHz (1V p-p) NOMINAL VOLTAGE AT 1mA DC CURRENT VN(DC) MIN (NOTE 4) C VN(DC) MAX TYP MAX (V) (A) (V) (J) (V) (V) (V) (V) (V) (pF) (pF) 5.5 30 15.5 at 2A 0.1 60 35 45 7.1 9.3 430 520 9 30 23 at 2A 0.1 95 50 75 11.0 16.0 250 300 0.1 110 55 85 15.9 20.3 140 175 V14MLN41206 14 30 30 at 2A V18MLN41206 18 30 40 at 2A 0.1 165 60 100 22.0 28.0 100 125 V18MLN41206L 18 20 50 at 1A 0.05 200 95 130 25.0 35.0 45 75 100 110 120 NOTES: 1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit. See explanation of Terms on page 7. 2. Direct discharge to device terminals (IEC preffered test method). See figure 2. 3. Corona discharge through air (represents actual ESD event) 4. Capacitance may be customized, contact Sales. Temperature Derating 100 PERCENT OF RATED VALUE For applications exceeding 125oC ambient temperature, the peak surge current and energy ratings must be reduced as shown in Figure 1. 90 80 70 60 50 40 30 20 10 0 -55 50 60 70 80 90 130 140 150 AMBIENT TEMPERATURE ( oC) PERCENT OF PEAK VALUE FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE 100 90 O1 = VIRTUAL ORIGIN OF WAVE t = TIME FROM 10% TO 90% OF PEAK t1 = VIRTUAL FRONT TIME = 1.25 x t t2 = VIRTUAL TIME TO HALF VALUE (IMPULSE DURATION) 50 10 O1 t t1 EXAMPLE: FOR AN 8/20µs CURRENT WAVEFORM: 8µs = t1 = VIRTUAL FRONT TIME 20µs = t2 = VIRTUAL TIME TO HALF VALUE TIME t2 FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM FOR CLAMPING VOLTAGE 152 w w w. l i t t e l f u s e . c o m UNITS V C O C O Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Typical Performance Curves Any Single Section 70 40 60 30 20 10 40 30 3 20 10 0 1 10 100 10,000 1000 0 30 35 40 NUMBER OF DISCHARGES 45 50 55 60 65 70 CAPACITANCE (pF) FIGURE 4. PRODUCT DISTRIBUTION OF CAPACITANCE (1MHz) Typical Performance Curves Any Single Section 90 VARISTOR VOLTAGE (V) 80 MAXIMUM CLAMP VOLTAGE 70 MAXIMUM STANDBY CURRENT (LEAKAGE) 60 50 40 30 TYPICAL 20 10 0 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 CURRENT (A) FIGURE 5. V-I CHARACTERISTICS 100 NUMBER OF SURGES SURGE CURRENT (A) 1 2 10 100 103 104 105 106 10 1 ∞ 0.1 10 100 1000 10000 SQUARE WAVE PULSE DURATION ( µs) FIGURE 6. PULSE RATING FOR LONG DURATION SURGES (ANY SINGLE SECTION) w w w. l i t t e l f u s e . c o m 153 SURFACE MOUNT VARISTORS SAMPLES VNOM 50 Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Typical Performance Curves 100 Any Single Section (Continued) NORMALIZED VARISTOR VOLTAGE (%) -40oC 25oC 85oC 125oC 10 0.1µA 1 µA 1 0µA 100µA 1mA CURRENT (A) FIGURE 7. STANDBY CURRENT AT NORMALIZED VARISTOR VOLTAGE AND TEMPERATURE (ANY SINGLE SECTION) 70 CAPACITANCE (pF) 65 60 55 50 45 40 1MHz 10MHz 1GHz 100MHz FREQUENCY FIGURE 8. CAPACITANCE vs FREQUENCY 1000 OHMS 100 10 1 0.1 1MHz 10MHz 100MHz FREQUENCY FIGURE 9. EQUIVALENT SERIES RESISTANCE 154 w w w. l i t t e l f u s e . c o m 1GHz 10GHz Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Typical Performance Curves Any Single Section (Continued) 10000 100 3 10 SURFACE MOUNT VARISTORS IMPEDANCE (Z) 1000 1 0.1 1MHz 100MHz 10MHz 1GHz 10GHz FREQUENCY FIGURE 10. IMPEDANCE vs FREQUENCY 0 CROSSTALK (dB) -20 -40 -60 VIN = 1VRMS Z = 50Ω -80 -100 -120 1kHz 10kHz 100kHz 1MHz 10MHz 100MHz 1GHz FREQUENCY FIGURE 11. ADJACENT CHANNEL CROSSTALK Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are Infrared (IR) Reflow, Vapour Phase Reflow, and Wave Soldering. Typical profiles are shown in Figures 12, 13 and 14. When wave soldering, the MLN suppressor is attached to the circuit board by means of an adhesive. The assembly is then placed on a conveyor and run through the soldering process to contact the wave. With IR and Vapour Phase Reflow, the device is placed in a solder paste on the substrate. As the solder paste is heated, it reflows and solders the unit to the board. The recommended solder for the MLN suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. When using a reflow process, care should be taken to ensure that the MLN chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solders peak temperature is essential to minimize thermal shock. Examples of the soldering conditions for the MLN array of suppressors are given in the tables below. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to gradually cool to less than 50oC before cleaning. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. w w w. l i t t e l f u s e . c o m 155 Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor 250 250 MAXIMUM TEMPERATURE 222 oC MAXIMUM TEMPERATURE 222 oC 200 40-80 SECONDS ABOVE 183 oC 150 TEMPERATURE ( oC) TEMPERATURE ( oC) 200 RAMP RATE <2oC/s 100 PREHEAT DWELL 0 0 150 RAMP RATE >50oC/s 100 PREHEAT ZONE 50 PREHEAT ZONE 50 40-80 SECONDS ABOVE 183 oC 0 0.5 1.0 1.5 2.0 2.5 TIME (MINUTES) 3.0 3.5 0 4.0 0.5 1.0 FIGURE 12. IR REFLOW SOLDER PROFILE 2.0 2.5 3.0 3.5 FIGURE 14. VAPOR PHASE SOLDER PROFILE Recommended Pad Outline 300 MAXIMUM WAVE 260 oC E 250 TEMPERATURE ( oC) 1.5 TIME (MINUTES) D 200 A 150 B SECOND PREHEAT C 100 FIRST PREHEAT 50 0 0 0.5 1.0 1.5 2.0 2.5 3.0 TIME (MINUTES) 3.5 4.0 4.5 TABLE 1. PAD LAYOUT DIMENSIONS A B C D Millimeters DIMENSION 0.89 1.65 2.54 0.46 0.79 Inches 0.035 0.065 0.100 0.018 0.030 FIGURE 13. WAVE SOLDER PROFILE E Mechanical Dimensions W T X P L BW S BL Inch Millimeter 156 L W T 0.126 ±0.008 0.063 ±0.008 0.053 Max 3.2 ±0.2 1.6 ±0.2 1.35 Max BW BL 0.016 ±0.004 0.007 +0.01/- 0.002 0.41 ±0.1 0.18 +0.25/-0.05 w w w. l i t t e l f u s e . c o m P X 0.030 Ref 0.045 ±0.004 0.015 ±0.004 S 0.76 Ref 1.14 ±0.1 0.38 ±0.1 Next Previous Surface Mount Varistors Multiline Transient Voltage Surge Suppressor MLN SurgeArray™ Suppressor Ordering Information VXXMLN TYPES V 18 ML N 4 1206 W T DEVICE FAMILY TVSS Device PACKING OPTIONS A: 2500 Piece Bulk Pack H: 7in (178mm) Diameter Reel (Note) T: 13in (330mm) Diameter Reel (Note) MAXIMUM DC WORKING VOLTAGE NOTE: See Standard Shipping Quantities table. 3 SERIES DESIGNATOR N: Array SURFACE MOUNT VARISTORS MULTILAYER DESIGNATOR END TERMINATION OPTION W: Ag/Pd/Pt DEVICE SIZE: i.e., 120 mil x 60 mil NUMBER OF SECTIONS Tape and Reel Specifications • Conforms to EIA - 481, Revision A • Can be Supplied to IEC Publication 286 - 3 SYMBOL DESCRIPTION MILLIMETERS A0 Width of Cavity B0 Length of Cavity Dependent on Chip Size to Minimize Rotation. K0 Depth of Cavity Dependent on Chip Size to Minimize Rotation. W Width of Tape Dependent on Chip Size to Minimize Rotation. 8 ±0.2 F Distance Between Drive Hole Centers and Cavity Centers 3.5 ±0.5 E Distance Between Drive Hole Centers and Tape Edge 1.75 ±0.1 P1 Distance Between Cavity Center 4 ±0.1 P2 Axial Distance Between Drive Hole Centers and Cavity Centers 2 ±0.1 P0 Axial Distance Between Drive Hole Centers D0 Drive Hole Diameter 1.55 ±0.05 D1 Diameter of Cavity Piercing 1.05 ±0.05 t1 Embossed Tape Thickness 0.3 Max t2 Top Tape Thickness 0.1 Max 4 ±0.1 NOTE: Dimensions in millimeters. t1 D0 P0 PRODUCT IDENTIFYING LABEL P2 PLASTIC CARRIER TAPE E F K0 W B0 t2 D1 P1 A0 EMBOSSMENT TOP TAPE 8mm NOMINAL 178mm OR 330mm DIA. REEL Standard Shipping Quantities DEVICE SIZE “13” INCH REEL (“T” OPTION) “7” INCH REEL (“H”OPTION) BULK PACK (“A” OPTION) 1206 10,000 2,500 2,500 w w w. l i t t e l f u s e . c o m 157