SC4519H 600kHz, 3A Step-Down Switching Regulator POWER MANAGEMENT Description Features The SC4519H is a current mode switching regulator with an integrated switch, operating at 600kHz with separate sync and enable functions. The integrated switch allows for cost effective low power solutions (peak switch current 3 amps). The sync function allows customers to synchronize to a faster clock in order to avoid frequency beating in noise sensitive applications. High frequency of operation allows for very small passive components. Current mode operation allows for fast dynamic response and instantaneous duty cycle adjustment as the input varies (ideal for CPE applications where the input is a wall plug power). Integrated 3 Amp switch 600kHz frequency of operation Current mode controller Synchronizable to higher frequency up to 1.2MHz Precision enable threshold SO-8 EDP package. Lead free product, fully WEEE and RoHS compliant Applications The low shutdown current makes it ideal for portable applications where battery life is important. XDSL modems CPE equipment DC-DC point of load applications Portable equipment The SC4519H is a 600kHz switching regulator synchronizable to a faster frequency from 750kHz to 1.2MHz. Typical Application Circuit D1 C1 1 BST VIN 2 Enable 5 EN 8 SYNC C3 IN SW SC4519H FB COMP VOUT R1 6 7 GND 4 L1 3 C4 C2 D2 R2 R3 Revision: December 12, 2007 1 www.semtech.com SC4519H POWER MANAGEMENT Absolute Maximum Ratings Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Exposure to Absolute Maximum rated conditions for extended periods of time may affect device reliability. Parameter Symbol Limits Units Input Supply Voltage VIN -0.3 to +28 (1) V Boost Pin Above VSW (VBST - VSW) 16 V Boost Pin Voltage V BST -0.3 to +32 V EN Pin Voltage V EN -0.3 to +24 V FB Pin Voltage V FB -0.3 to +6 V FB Pin Current IFB 1 mA SYNC Pin Current ISYNC 1 mA Thermal Impedance Junction to Ambient θJ A 36.5(2) °C/W Operating Ambient Temperature Range TA -40 to +85 °C Maximum Junction Temperature TJ +150 °C Storage Temperature Range TSTG -65 to +150 °C Lead Temperature (Soldering) 10 sec TLEAD 300 °C ESD Rating (Human Body Model) ESD 2 kV Notes: (1) For proper operation of device, VIN should be within maximum Operating Input Voltage as defined in Electrical Characteristics. (2) ThetaJA is calculated from a package in still air, mounted to 3" x 4.5", 4 layer FR4 PCB with thermal vias under exposed pad per JESD51 standards. Electrical Characteristics Unless specified: VIN = 12V, VCOMP = 0.8V, VBST = VIN + 5V, EN = tied to VIN, SYNC = 0, SW = open. TA = TJ = -40°C to 125°C. Parameter Symbol Operating Input Voltage VIN Maximum Switch Current Limit ISW Oscillator Frequency fOSC Switch On Voltage Drop VD(SW) VIN Undervoltage Lockout VUVLO Conditions TA = 25°C, D = 50% ISW = 3A Standby Current 2007 Semtech Corp. Typ 3.5 500 600 Max Units 24(1) V 5.5 A 700 kHz 220 3.9 VIN UVLO Hysteresis VIN Supply Current Min mV 4.4 60 V mV IQ V FB = 1V 3 5 mA IQ(OFF) V E N = 0V 100 150 µA 2 www.semtech.com SC4519H POWER MANAGEMENT Electrical Characteristics (Cont.) Unless specified: VIN = 12V, VCOMP = 0.8V, VBST = VIN + 5V, EN = tied to VIN, SYNC = 0, SW = open. TA = TJ = -40°C to 125°C. PARAMETER FB Input Current SYMBOL CONDITIONS IFB Feedback Voltage Feedback Voltage Line Regulation FB to VCOMP Voltage Gain(3) FB to VCOMP Transconductance(3) MIN 0.784 4.4V < VIN < 24V(2) TYP MAX UNITS -0.25 -1 µA 0.8 0.816 V +3 mV/V V/V 0.9V ≤ VCOMP ≤ 2.0V 150 350 ∆ ICOMP = ± 10µA 500 850 1300 µMho VCOMP Pin Source Current VFB = 0.6V 70 110 µA VCOMP Pin Sink Current VFB = 1.0V -70 -110 µA VCOMP = 1.25V 5 A/V Duty cycle = 0% 0.6 V VCOMP OCP Threshold VCOMP rising 2 V VCOMP Hiccup Retry Threshold VCOMP falling 0.25 V Maximum Switch Duty Cycle VCOMP = 1.2V, ISW = 400mA VCOMP Pin to Switch Current Transconductance VCOMP Pin Maximum Switching Threshold Minimum Boost Voltage Above Switch(3) Boost Current 2007 Semtech Corp. 85 % 2.7 V ISW = 1A 10 15 ISW = 3A 30 45 3 mA www.semtech.com SC4519H POWER MANAGEMENT Electrical Characteristics (Cont.) Unless specified: VIN = 12V, VCOMP = 0.8V, VBST = VIN + 5V, EN = tied to VIN, SYNC = 0, SW = open. TA = TJ = -40°C to 125°C. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 1.1 1.27 1.5 V Enable Input Threshold Voltage VETH Enable Output Bias Current IEOL EN = 50mV below threshold 8 µA IEOH EN = 50mV above threshold 10 µA 1.5 V SYNC Threshold Voltage SYNC Input Frequency 800 (4) SYNC Pin Resistance VSYNC = 0.5V 1200 20 kHz kΩ Notes: (1) The device may not function properly outside its operating input voltage range. (2) The required minimum input voltage for a regulated output depends on the output voltage and load condition. (3) Guaranteed by design. (4) Please contact factory for SYNC applications. 2007 Semtech Corp. 4 www.semtech.com SC4519H POWER MANAGEMENT Pin Configurations Ordering Information TOP VIEW BST 1 8 SYNC IN 2 7 COMP SW 3 6 FB GND 4 5 EN Part Number (1)(2) P ackag e SC4519HSETRT SO-8 EDP SC4519HEVB(3) EVALUATION BOARD Notes: (1) Only available in tape and reel packaging. A reel contains 2500 devices. (2) Lead free product. This product is WEEE and RoHS compliant. (3) Consult factory for all other available options. (SO-8 EDP) Pin Descriptions Pin # Pin Name Pin Function 1 BST This pin provides power to the internal NPN switch. The minimum turn on voltage for this switch is 2.7V. 2 IN Pin IN delivers all power required by control and power circuitry. This pin sees high di/dt during switching. A decoupling capacitor should be attached to this pin as close as possible. 3 SW Pin SW is the emitter of the internal switch. The external freewheeling diode should be connected as close as possible to this pin. 4 GND All voltages are measured with respect to this pin. The decoupling capacitor and the freewheeling diode should be connected to GND as short as possible. 5 EN This is the chip enable input. The regulator is switched on if EN is high, and it is off if EN is low. The regulator is in standby mode when EN is low, and the input supply current is reduced to a few microamperes. 6 FB Feedback input for adjustable output controllers. 7 COMP Thi s i s the output of the i nternal error ampli fi er and i nput of the peak current comparator. A compensation network is connected to this pin to achieve the specified performance. 8 SYNC This is synchronous control pin used to synchronize the internal oscillator to an external pulse control signal. When not used, it should be connected to GND. - THERMAL P ad for heatsi nki ng purposes. C onnect to ground plane usi ng multi ple vi as. Not connected PAD internally. 2007 Semtech Corp. 5 www.semtech.com SC4519H POWER MANAGEMENT Block Diagram + + Is IN ISEN + 40m SLOPE COMP FB BST - + PWM S EA Q POWER TRANSISTOR R SW Is 1V REFERENCE EN UVLO SOFT START HICCUP GND OL 0.7V SLOPE FB SLOPE COMP SYNC OSCILLATOR FREQUENCY CLK Typical Characteristic - OCP Limit SC4519H OCP Limit vs Duty Cycle 7 6.5 6 Current Limit (A) 5.5 5 ILIM @-40C 4.5 ILIM @25C ILIM @125C 4 3.5 3 2.5 2 0 20 40 60 80 100 Duty Cycle (%) 2007 Semtech Corp. 6 www.semtech.com SC4519H POWER MANAGEMENT Application Information The SC4519H is a current mode buck converter regulator. SC4519H has an internal fixed-frequency clock. The SC4519H uses two feedback loops that control the duty cycle of the internal power switch. The error amplifier functions like that of the voltage mode converter. The output of the error amplifier works as a switch current reference. This technique effectively removes one of the double poles in the voltage mode system. With this, it is much simpler to compensate a current mode converter to have better performance. The current sense amplifier in the SC4519H monitors the switch current during each cycle. Overcurrent protection (OCP) is triggered when the current limit exceeds the upper limit of 3A, detected by a voltage on COMP greater than about 2V. When an OCP fault is detected, the switch is turned off and the external COMP capacitor is discharged at the rate of dv/dt = 3µA/ Ccomp. Once the COMP voltage has fallen below 250mV, the part enters a normal startup cycle. Ccomp is the total capacitance value attached to COMP. In the case of sustained overcurrent or dead-short, the part will continually cycle through the retry sequence as described above, at a rate dependent on the value of Ccomp. During start up, the voltage on COMP rises roughly at the rate of dv/dt = 120µA/Ccomp. Therefore, the retry time for a sustained overcurrent can be approximately calculated as: Tretry = Ccomp • Oscillator Its internal free running oscillator sets the PWM frequency at 600kHz for the SC4519H without any external components to program the frequency. An external clock with a duty cycle from 20% to 80% connected to the SYNC pin activates synchronous mode. The frequency of the external clock can be from 700kHz to 1.2MHz. UVLO When the EN pin is pulled and held above 1.8V, the voltage on Pin IN determines the operation of the SC4519H. As V increases during power up, the internal circuit senses IN V and keeps the power transistor off until V reaches IN IN 4.4V. Load Current The peak current IPEAK in the switch is internally limited. For a specific application, the allowed load current IOMAX will change if the input voltage drifts away from the original design as given for continuous current mode: IOMAX = 3 − VO ⋅ (1 − D) 2 ⋅ L ⋅ fs Where: fs = switching frequency, Vo = output voltage and D = duty ratio, VO/VI V = input voltage. 2V 2V + Ccomp • 120uA 3uA Figure 1 shows the voltage on COMP during a sustained overcurrent condition. I Figure 2 shows the theoretical maximum load current for the specific cases. In a real application, however, the allowed maximum load current also depends on the layout and the air cooling condition. Therefore, the maximum load current may need to be derated according to the thermal situation of the application. Figure 1. Voltage on COMP for Startup and OCP Enable Pulling and holding the EN pin below 0.4V activates the shut down mode of the SC4519H which reduces the input supply current to less than 150µA. During the shut down mode, the switch is turned off. The SC4519H is turned on if the EN pin is pulled high. 2007 Semtech Corp. 7 www.semtech.com SC4519H POWER MANAGEMENT Application Information (Cont.) The peak to peak inductor current is: I p − p = δ • I OMAX Iomax (A) Maximum Load Current vs Input Voltage L=10uH 2.900 2.880 2.860 2.840 2.820 2.800 2.780 2.760 2.740 2.720 2.700 After the required inductor value is selected, the proper selection of the core material is based on the peak inductor current and efficiency specifications. The core must be able to handle the peak inductor current IPEAK without saturation and produce low core loss during the high frequency operation. Vo=2.5V Vo=3.3V IPEAK = IOMAX + Vo=5V 4 6 8 10 12 14 16 2 The power loss for the inductor includes its core loss and copper loss. If possible, the winding resistance should be minimized to reduce inductor’s copper loss. The core must be able to handle the peak inductor current IPEAK without saturation and produce low core loss during the high frequency operation. The core loss can be found in the manufacturer’s datasheet. The inductor’s copper loss can be estimated as follows: 18 Vi (V) Figure 2. Theoretical maximum load current curves Inductor Selection PCOPPER = I 2LRMS ⋅ R WINDING Where: ILRMS is the RMS current in the inductor. This current can be calculated as follows: The factors for selecting the inductor include its cost, efficiency, size and EMI. For a typical SC4519H application, the inductor selection is mainly based on its value, saturation current and DC resistance. Increasing the inductor value will decrease the ripple level of the output voltage while the output transient response will be degraded. Low value inductors offer small size and fast transient responses while they allow large ripple currents, poor efficiencies and require more output capacitance for low output ripple. The inductor should be able to handle the peak current without saturating and its copper resistance in the winding should be as low as possible to minimize its resistive power loss. A good trade-off among its size, loss and cost is to set the inductor ripple current to be within 15% to 30% of the maximum output current. ILRMS = IOMAX ⋅ 1 + L= 1 2 ⋅δ 12 Output Capacitor Selection Basically there are two major factors to consider in selecting the type and quantity of the output capacitors. The first one is the required ESR (Equivalent Series Resistance) which should be low enough to reduce the output voltage deviation during load changes. The second one is the required capacitance, which should be high enough to hold up the output voltage. Before the SC4519H regulates the inductor current to a new value during a load transient, the output capacitor delivers all the additional current needed by the load. The ESR and ESL of the output capacitor, the loop parasitic inductance between the output capacitor and the load combined with inductor ripple current are all major contributors to the output voltage ripple. Surface mount ceramic capacitors are recommended. The inductor value can be determined according to its operating point under its continuous mode and the switching frequency as follows: VO ⋅ (VI − VO ) VI ⋅ f s ⋅ δ ⋅ IOMAX Where: fs = switching frequency, δ = ratio of the peak to peak inductor current to the output load current and VO = output voltage. 2007 Semtech Corp. Ip − p Input Capacitor Selection The input capacitor selection is based on its ripple current level, required capacitance and voltage rating. This 8 www.semtech.com SC4519H POWER MANAGEMENT Application Information (Cont.) capacitor must be able to provide the ripple current drawn by the converter. For the continuous conduction mode, the RMS value of the input capacitor current ICIN(RMS) can be calculated from: ICIN (RMS) = I OMAX ⋅ Where: IB = the boost current and VD= discharge ripple voltage. With fs = 600kHz, VD = 0.5V and IB =0.045A, the required minimum capacitance for the boost capacitor is: VO ⋅ (VI − VO ) V 2 I This current gives the capacitor’s power loss through its RCIN(ESR) as follows: Cboost = The internal driver of the switch requires a minimum 2.7V to fully turn on that switch to reduce its conduction loss. If the output voltage is less than 2.7V, the boost capacitor can be connected to either the input side or an independent supply with a decoupling capacitor. But the Pin BST should not see a voltage higher than its maximum rating. PCIN = I2CIN (RMS) • R CIN(ESR) The input ripple voltage mainly depends on the input capacitor’s ESR and its capacitance for a given load, input voltage and output voltage. Assuming that the input current of the converter is constant, the required input capacitance for a given voltage ripple can be calculated by: CIN = IOMAX ⋅ Freewheeling Diode Selection D ⋅ (1 − D) fs ⋅ ( ∆VI − IOMAX ⋅ RCIN(ESR) ) This diode conducts during the switch’s off-time. The diode should have enough current capability for full load and short circuit conditions without any thermal concerns. Its maximum repetitive reverse block voltage has to be higher than the input voltage of the SC4519H. A low forward conduction drop is also required to increase the overall efficiency. The freewheeling diode should be turned on and off fast with minimum reverse recovery because the SC4519H is designed for high frequency applications. SS23 Schottky rectifier is recommended for certain applications. The average current of the diode, ID_AVG can be calculated by: Where: ∆VI = the given input voltage ripple. Because the input capacitor is exposed to the large surge current, attention is needed for the input capacitor. If tantalum capacitors are used at the input side of the converter, one needs to ensure that the RMS and surge ratings are not exceeded. For generic tantalum capacitors, it is suggested to derate their voltage ratings at a ratio of about two to protect these input capacitors. Boost Capacitor and its Supply Source Selection ID- AVG = Iomax ⋅ (I − D) The boost capacitor selection is based on its discharge ripple voltage, worst case conduction time and boost current. The worst case conduction time Tw can be estimated as follows: TW = Thermal Considerations There are three major power dissipation sources for the SC4519H. The internal switch conduction loss, its switching loss due to the high frequency switching actions and the base drive boost circuit loss. These losses can be estimated as: 1 ⋅ D max fs Where: fs = the switching frequency and Dmax = maximum duty ratio, 0.85 for the SC4519H. 2 Ptotal = Io ⋅ R on ⋅ D + 10.8 ⋅ 10 −3 ⋅ Io ⋅ VI + 2007 Semtech Corp. 10 ⋅ Io ⋅ D ⋅ (Vboost ) 1000 Where: IO = load current; Ron = on-equivalent resistance of the switch; VBOOST = input voltage or output based on the boost circuit connection. The required minimum capacitance for the boost capacitor will be: C boost = 0.045 1 IB 1 ⋅ ⋅ Dmax = ⋅ ⋅ 0.85 = 128nF 0.5 600k VD fs IB ⋅ TW VD 9 www.semtech.com SC4519H POWER MANAGEMENT Application Information (Cont.) 5 θ JA is the thermal resistance from junction to ambient. Its value is a function of the IC package, the application layout and the air cooling system. COMP Vout 6 R1 C 7 R2 R3 D2 Figure 3. Compensation network provides 2 poles and 1 zero. The compensation network gives the following characteristics: Loop Compensation Design The SC4519H has an internal error amplifier and requires a compensation network to connect between the COMP pin and GND pin as shown in Figure 3. The compensation network includes C4, C5 and R3. R1 and R2 are used to program the output voltage according to: s R2 ωZ G COMP (s) = ω1 ⋅ ⋅ gm ⋅ s R1 + R 2 s ⋅ (1 + ) ωP2 1+ Where: R1 ) R2 Assuming the power stage ESR (equivalent series resistance) zero is an order of magnitude higher than the closed loop bandwidth, which is typically one tenth of the switching frequency, the power stage control to output transfer function with the current loop closed (Ridley model) for the SC4519H will be as follows: ω1 = 1 C 4 + C5 ωZ = 1 R 3 ⋅ C4 ω P2 = 5 ⋅ RL s 1+ 1 RL ⋅ C C 4 + C5 R 3 ⋅ C 4 ⋅ C5 The loop gain will be given by: s 1+ R R 1 ω 2 Z ⋅ T(s) = GCOMP (s) ⋅ G VD (s) = 4.25 ⋅ 10 −3 ⋅ L ⋅ C 4 R1 + R 2 s (1 + s ) ⋅ (1 + s ) ωP1 ωP2 Where: RL – Load and C – Output capacitor. Where: ωp1 = The goal of the compensation design is to shape the loop to have a high DC gain, high bandwidth, enough phase margin, and high attenuation for high frequency noises. Figure 3 gives a typical compensation network which offers 2 poles and 1 zero to the power stage: 2007 Semtech Corp. FB L1 3 C4 Pdiode = VF ⋅ Io ⋅ (1 − D) G VD (s) = SYNC SW C5 The freewheeling diode also contributes a significant portion of the total converter loss. This loss should be minimized to increase the converter efficiency by using Schottky diodes with low forward drop (VF). VO = 0.8 • (1 + EN SC4519H 4 8 IN GND TJ = TA + θ JA ⋅ Ptotal 2 BST 1 The junction temperature of the SC4519H can be further determined by: 1 RL ⋅ C One integrator is added at origin to increase the DC gain. ωZ is used to cancel the power stage pole ωP1 so that the loop gain has –20dB/dec rate when it reaches 0dB line. ωP2 is placed at half switching frequency to reject high frequency switching noises. Figure 4 gives the asymptotic diagrams of the power stage with current loop closed and its loop gain. 10 www.semtech.com SC4519H POWER MANAGEMENT Application Information (Cont.) Layout Guidelines: Mag In order to achieve optimal electrical and thermal performance for high frequency converters, special attention must be paid to the PCB layouts. The goal of layout optimization is to identify the high di/dt loops and minimize them. The following guidelines should be used to ensure proper operation of the converters. Loop gain T(s) ωp1 Power stage ωC ωP2 ω ωZ 1. A ground plane is suggested to minimize switching noises and trace losses and maximize heat transferring. 2. Start the PCB layout by placing the power components first. Arrange the power circuit to achieve a clean power flow route. Put all power connections on one side of the PCB with wide copper filled areas if possible. 3. The VIN bypass capacitor should be placed next to the VIN and GND pins. 4. The trace connecting the feedback resistors to the output should be short, direct and far away from any noise sources such as switching node and switching components. 5. Minimize the loop including input capacitor, the SC4519H and freewheeling diode D 2. This loop passes high di/dt current. Make sure the trace width is wide enough to reduce copper losses in this loop. 6. Maximize the trace width of the loop connecting the inductor, freewheeling diode D 2 and the output capacitor. 7. Connect the ground of the feedback divider and the compensation components directly to the GND pin of the SC4519H by using a separate ground trace. 8. Connect Pin 4 to a large copper area to remove the IC heat and increase the power capability of the SC4519H. A few feedthrough holes are required to connect this large copper area to a ground plane to further improve the thermal environment of the SC4519H. The traces attached to other pins should be as wide as possible for the same purpose. Figure 4. Asymptotic diagrams of power stage with current loop closed and its loop gain. The design guidelines for the SC4519H applications are as following: 1. Set the loop gain crossover corner frequency ωC for given switching corner frequency ωC = 2πfC 2. Place an integrator at the origin to increase DC and low frequency gains. 3. Select ωZ such that it is placed at ωP1 to obtain a -20dB/dec rate to go across the 0dB line. 4. Place a high frequency compensator pole ωP2 (ωP2 = πfs) to get the maximum attenuation of the switching ripple and high frequency noise with the adequate phase lag at ωC. 2007 Semtech Corp. 11 www.semtech.com SC4519H POWER MANAGEMENT Application Information (Cont.) Design Example: 16V to 5V at 2A D3 C1 0.22u 1 L1 C3 10u 4. 4.75k 5 R4 SW SC4519H FB IN EN SYNC Vo=5V 3 8.2uH 6 R1 C2 10u 52.3k 7 COMP 4 8 BST 2 GND V IN =16V C4 3.3n R2 10kk C5 180p R3 3.4k D2 Bill of Materials Item Qty Reference Value Part No./Manufacturer 1 1 C1 0.22uF, 25V, 0805, X7R Vishay 2 2 C 2, C 3 10u, 1210, X5R, 25V Panasonic 3 1 C4 3.3n, 0805, X7R, 25V Vishay 4 1 C5 180pF 5 1 D1 1N4148WS, SOD-323 6 1 D2 S S 33 Fairchild P/N: SS33 7 1 L1 8.2uH COOPER P/N:DR125-8R2 8 1 R1 52.3K 9 1 R2 10k 10 1 R3 3.4k 11 1 R4 4.75k 12 1 U1 S C 4519H Semtech Unless specified, all resistors have 1% precision with 0603 package. Resistors are +/-1% and all capacitors are +/-20% 2007 Semtech Corp. 12 www.semtech.com SC4519H POWER MANAGEMENT Application Information (Cont.) (COMPONENT - BOTTOM) (COMPONENT - TOP) SC4518 8 (PCB - TOP) 2007 Semtech Corp. (PCB - BOTTOM) 13 www.semtech.com SC4519H POWER MANAGEMENT Outline Drawing - SOIC-8L EDP A D e N DIM E1 E 1 2 e/2 B D aaa C A2 A SEATING PLANE C A1 bxN bbb .053 .069 .000 .005 .049 .065 .020 .012 .007 .010 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .116 .120 .130 .085 .095 .099 .010 .020 .016 .028 .041 (.041) 8 0° 8° .004 .010 .008 A A1 A2 b c D E1 E e F H h L L1 N 01 aaa bbb ccc 2X E/2 ccc C 2X N/2 TIPS DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX C A-B D 1.75 1.35 0.13 0.00 1.65 1.25 0.51 0.31 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 2.95 3.05 3.30 2.15 2.41 2.51 0.25 0.50 0.40 0.72 1.04 (1.05) 8 0° 8° 0.10 0.25 0.20 h F EXPOSED PAD h H H c GAGE PLANE 0.25 L (L1) SEE DETAIL A DETAIL 01 A SIDE VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION BA. Land Pattern - SOIC-8L EDP E SOLDER MASK D DIM (C) F G C D E F G P X Y Z Z Y THERMAL VIA Ø 0.36mm P X DIMENSIONS INCHES MILLIMETERS (.205) .134 .201 .101 .118 .050 .024 .087 .291 (5.20) 3.40 5.10 2.56 3.00 1.27 0.60 2.20 7.40 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. Contact Information Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2007 Semtech Corp. 14 www.semtech.com