View the Part Number Specific Data Sheet for full specifications

ECLIPTEK
PART NUMBER DATA SHEET
CORPORATION
EUFA18-12.000M
REGULATORY COMPLIANCE
R
(Data Sheet downloaded on Jun 28, 2016)
2011/65 +
2015/863
168 SVHC
ITEM DESCRIPTION
Quartz Crystal Resonator HC49/U Thru-Hole Metal Resistance Weld Seal 12.000MHz ±30ppm at 25°C, ±50ppm over -40°C to
+85°C 18pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
12.000MHz
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -40°C to +85°C
Aging at 25°C
±5ppm/year Maximum
Load Capacitance
18pF Parallel Resonant
Shunt Capacitance
7pF Maximum
Equivalent Series Resistance
30 Ohms Maximum
Mode of Operation
AT-Cut Fundamental
Drive Level
2mWatts Maximum
Storage Temperature Range
-40°C to +125°C
Insulation Resistance
500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Lead Integrity
MIL-STD-883, Method 2004
Mechanical Shock
MIL-STD-202, Method 213, Condition C
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 10/26/2012 | Page 1 of 4
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
EUFA18-12.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
12.70
MIN
DIA 0.457
±0.051(X2)
1
ECLIPTEK
2
E12.000M
E=Configuration Designator
3
XX
XX=Ecliptek Manufacturing
Identifier
11.18
MAX
4.88 ±0.20
13.58
MAX
4.70
MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 10/26/2012 | Page 2 of 4
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
EUFA18-12.000M
Recommended Solder Reflow Methods
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
Temperatures shown are applied to back of PCB board and device leads only.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 10/26/2012 | Page 3 of 4
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
EUFA18-12.000M
Recommended Solder Reflow Methods
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 Seconds Maximum 1 Time / 15 Seconds Maximum 2 Times
5°C/Second Maximum
N/A
Level 1
Temperatures shown are applied to back of PCB board and device leads only.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to back of PCB board and
device leads only.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to back of PCB board and device
leads only.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 10/26/2012 | Page 4 of 4
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200