Parallel EEPROM Die Products OVERVIEW Features High Performance CMOS Technology Low Power Dissipation – Active and Standby Hardware and Software Data Protection Features DATA Polling for End of Write Detection High Reliability ̶ ̶ ̶ Endurance:104 Cycles Extended Endurance: 105 Cycles (Option) Data Retention: 10 Years Single 5V ± 10% Supply Single 3V ± 10% Supply CMOS Compatible Inputs and Outputs -40°C to +85°C Operating Range Typical Die Thickness of 22mil Military Product Performance (-55°C to +125°C) Available Element Evaluation Program Available Description The Atmel® Parallel EEPROMs are available in die form. All die products are 100% electrically tested in wafer form and visually inspected after saw and clean. The Atmel EEPROM die products are processed with an advanced CMOS floating gate technology. As with all Atmel products, they are designed and tested to ensure high quality and manufacturability. The devices include such features as internal error correction for extended endurance and improved data retention characteristics. Atmel offers a full line of 5.5V die products (see Section 2., “Die Product Offering”). An optional Element Evaluation test flow, which entails sample packaging and electrical screening in accordance with MIL-STD 883 M5008, is available for military grade applications. Standard shipping methods for Atmel die products include protective waffle and wafer carriers. Optional packaging methods are available, including wafer ring mounting and wafer orientation to accommodate the customer’s manufacturing equipment. Atmel-0554G-PEEPROM-Die-Products-Overview_072014 1. Testing Reference Parallel EEPROM Die Product Test Flow. Die product Sort Test includes checks for DC parameters such as ICC and input leakage as well as for AC switching parameters. Data pattern testing, several oxide stress tests, and data retention high temperature bake tests are performed on a 100% basis to guard against pattern sensitivity, infant mortality, and ensure integrity of the core cell oxides. Contact Atmel sales for a detailed die product test flow diagram, including all test conditions. Atmel also supplies die product processed to the Element Evaluation Test Flow which includes wafer lot assembly and test in accordance with MIL-STD 883 M5004 (reference Atmel Military MIL-STD 883 Test Flow, Section 7). Figure 1-1. Standard Parallel EEPROM Die Product Test Flow FAB E-TEST (25˚C/100%) DIE SORT 1 (25˚C/100%) AC/DC Datasheet Parameters, ICC, Leakage Programming Characteristics (0,1,CKB,/CKB) Page Mode Characteristics Exit – Die Programmed RETENTION BAKE 250˚C/24 Hours DIE SORT 2 (25˚C/100%) Verify Pattern (CBK) AC/DC Datasheet Parameters, ICC, Leakage Byte Cycling (Diagonal) Exit – Blank SAW AND CLEAN OPTICAL INSP 100% MIL-STD883 M2010 ELEMENT EVALUATION (Optional Process Flow – Contact Factory to Specify) Lot Sample Assembled and Tested MIL-STD883 M5004/5005 PACKAGING WAFFLE PACK/WAFER CARRIER QA Visual/Documentation INVENTORY 2 Parallel EEPROM Die Products [OVERVIEW] Atmel-0554G-PEEPROM-Die-Products-Overview_072014 2. Die Product Offering Table 2-1. Die Product Offering — Battery Volt and 5V Atmel Ordering Code 3. Device TAA Operation Range AT28C64B-DWF 200ns Industrial Temperature (-40°C to +85°C) AT28C010-DWFM 150ns Military Temperature (-55C to 125C) AT28C256-DWF 120ns Industrial Temperature (-40°C to +85°C) AT28C256-DWFM 200ns Military Temperature (-55C to 125C) AT28HC64BF-DWF 120ns Industrial Temperature (-40°C to +85°C) AT28HC256-DWF 120ns Industrial Temperature (-40°C to +85°C) AT28HC256-DWFM 120ns Military Temperature (-55C to 125C) Package Voltage Die 4.5V to 5.5V Die Information Table 3-1. Die Information(1) Description Handling Instructions for Parallel EEPROM die products are available from Atmel. Backside Condition Silicon (Grind) Connection Connect substrate to ground. Note: 4. 1. Please contact Atmel sales for die maps and coordinates. Revision History Doc. Rev. Date 0554G 07/2014 0554F 10/2005 Comments Remove AT28BV64B and AT28C16 die codes which are no longer available. Update template, Atmel logos, disclaimer page, and implemented revision history. Parallel EEPROM Die Products [OVERVIEW] Atmel-0554G-PEEPROM-Die-Products-Overview_072014 3 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2014 Atmel Corporation. / Rev.: Atmel-0554G-PEEPROM-Die-Products-Overview_072014. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. 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