ADA4530-1R-EBZ User Guide UG-865 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Evaluation Board for the ADA4530-1 8-Lead SOIC Package FEATURES EVALUATION BOARD PHOTOGRAPHS Footprint for ADA4530-1 8-lead SOIC package Footprints for passive components Available in buffer or transimpedance configuration Easy modifications to other standard configurations Guard ring to minimize leakage current Assembled with metal shields Enables quick prototyping Easy connection to test equipment The ADA4530-1R-EBZ is an evaluation board for the ADA4530-1 offered in an 8-lead SOIC package. The ADA4530-1R-EBZ is a 4-layer printed circuit board (PCB) designed to minimize leakage currents with its guard ring features for femtoampere input bias current (IB) measurement. 13409-001 GENERAL DESCRIPTION Figure 1. ADA4530-1R-EBZ Top View The ADA4530-1R-EBZ is available in two default configurations: buffer (ADA4530-1R-EBZ-BUF) and transimpedance (ADA4530-1R-EBZ-TIA). Both boards are populated with the necessary passive components, banana jacks/terminal blocks for supply voltages, BNC/terminal blocks for the output voltage, multiple test pins, and metal shields. All components are placed on the primary side with the exception of the triaxial (triax)/ coaxial (coax) input connector (J1) and SHIELD3. Specifications for the ADA4530-1 are provided in the ADA4530-1 data sheet available from Analog Devices, Inc. The ADA4530-1 data sheet and the AN-1373 Application Note should be consulted in conjunction with this user guide when using the evaluation board. Figure 1 shows the top view of the evaluation board, and Figure 2 shows the bottom view. For more views of the evaluation board images, see the ADA4530-1R-EBZ Evaluation Board Photographs section. PLEASE SEE THE LAST PAGE FOR AN IMPORTANT WARNING AND LEGAL TERMS AND CONDITIONS. Rev. 0 | Page 1 of 14 13409-003 The ADA4530-1R-EBZ also has unpopulated resistor and capacitor pads that allows quick prototyping with different configurations, such as noninverting gain and inverting gain. Figure 2. ADA4530-1R-EBZ Bottom View UG-865 ADA4530-1R-EBZ User Guide TABLE OF CONTENTS Features .............................................................................................. 1 Buffer with Triax Guard Driven by Amp Guard .......................6 General Description ......................................................................... 1 Buffer with Resistor at IN+ to Ground.......................................7 Evaluation Board Photographs ....................................................... 1 Noninverting Gain ........................................................................7 Revision History ............................................................................... 2 Hardware Components .................................................................... 3 Transimpedance with 10 GΩ SMT Feedback Resistor and IN+ Connected to Ground (ADA4530-1R-EBZ-TIA) .............8 Board Assembly ............................................................................ 3 Transimpedance with Through Hole Feedback Resistor .........8 Input, Output, and Supplies ........................................................ 3 Transimpedance with Direct Sensor Connection .....................9 Guard and Shield .......................................................................... 3 Inverting Gain ................................................................................9 Board Layers Stackup ................................................................... 4 ADA4530-1R-EBZ Evaluation Board Photographs ................... 10 Cleaning and Handling .................................................................... 5 Evaluation Board Schematics........................................................ 11 Amplifier Configurations ................................................................ 6 Ordering Information .................................................................... 13 Buffer with Triax Guard Externally Driven (ADA4530-1R-EBZ-BUF) ........................................................... 6 Bill of Materials ........................................................................... 13 REVISION HISTORY 10/15—Revision 0: Initial Version Rev. 0 | Page 2 of 14 ADA4530-1R-EBZ User Guide UG-865 HARDWARE COMPONENTS BOARD ASSEMBLY Power supplies to the board can be applied in two different ways: The ADA4530-1R-EBZ evaluation board is available in two default configurations: 1. 2. V+_TP, GND_TP, and V−_TP test points are provided. ADA4530-1R-EBZ-BUF: amplifier is populated in buffer configuration ADA4530-1R-EBZ-TIA: amplifier is populated in transimpedance configuration Both evaluation boards are pre-assembled with necessary components, except for SHIELD2. SHIELD2 is included in the kit, but not installed. See the Amplifier Configurations section for all other possible configurations. INPUT, OUTPUT, AND SUPPLIES ADA4530-1R-EBZ-TIA is populated with an input BNC connector (J1) that connects to the amplifier inverting pin through JP2. ADA4530-1R-EBZ-BUF is populated with an input triax connector (J1). The inner conductor of J1 is the high impedance connection through JP1 to the noninverting pin of the ADA4530-1. The inner braided shield is a guard; the driving source is configured with JP3. The outer braided shield is the signal return; it is connected to GND. The evaluation board uses JP3 to select the driving source of the triax guard. Table 1 shows the three different configurations of JP3. Table 1. JP3 Configuration JP3 Unconnected Short TRIAX GUARD to AMP GUARD Short TRIAX GUARD to GND Description Triax guard is externally driven. This configuration is used when the guard is driven by an external test equipment, such as a picoammeter. This configuration is also by default on both the ADA4530-1R-EBZ-TIA and ADA4530-1R-EBZ-BUF boards. Triax guard is driven by the ADA4530-1 guard buffer. This configuration is useful if the ADA4530-1R-EBZ-BUF is connected to a passive sensor. Triax guard is connected to signal ground. This configuration is useful when the amplifier is in transimpedance configuration with the noninverting pin connected to signal ground. V+ (J3), GND (J4), and V− (J5) allow banana plugs to be used Terminal block (J6) allows wire-to-board connection GUARD AND SHIELD The ADA4530-1R-EBZ board uses guard rings, a guard plane, and a via fence to entirely guard the high impedance input traces against leakage current. On the top layer, the guard ring encircle the inverting and noninverting input components (see Figure 3). Guard via fences from the top layer to bottom layer are also used to encircle the high impedance inputs to prevent leakage currents from inner layers of the board. For more information on the physical implementation of guarding techniques, see the ADA4530-1 data sheet. The copper shield traces, SHIELD1, SHIELD2, and SHIELD3 allow soldered metal shields to enclose the high impedance inputs as a means to avoid electrostatic interference. The shield traces are electrically connected to the amplifier guard potential. SHIELD1 and SHIELD3 are 1 inch × 1.5 inch × 0.25 inch metal shields and are pre-assembled on board. There is a high impedance pin socket (P7) that goes through the bottom of the board, and hence SHIELD3 is populated at the bottom of the board. Other than providing electrostatic shielding, the shields also prevent contamination from fingerprints, dust, and other contaminants to the high impedance inputs. SHIELD2 is a 1.5 inch × 3 inch × 0.75 inch metal shield and is provided separately with the evaluation board. It is used when large through hole resistors are populated on board. RF clips are assembled to hold the shield in place. Note that it is sufficient to remove the SHIELD1 cover, without needing to desolder SHIELD1, to accommodate SHIELD2 when large through hole resistors are used. 1. 2. BNC connector (J2) allows BNC cabling Terminal block (J7) allows wire-to-board connection GUARD RING A VOUT_TP test point is also provided. GUARD VIA FENCE Figure 3. Guarding RO isolates the output load from the amplifier output to prevent any oscillation from excessive capacitive loading. A 499 Ω resistor is mounted on-board. Rev. 0 | Page 3 of 14 13409-004 The evaluation board output can be measured with two different options: UG-865 ADA4530-1R-EBZ User Guide 13409-005 BOARD LAYERS STACKUP The ADA4530-1R-EBZ is a 4-layer evaluation board that uses the Rogers 4350B, a high performance PCB laminate. A hybrid stackup is required for mechanical strength. The top and bottom layers are ceramic (Rogers 4350B) while the middle core layer is a conventional glass epoxy laminate (FR-4). The Rogers 4350B material provides superior insulation resistance in the presence of humidity compared to glass/epoxy materials. It minimizes current leakage and, therefore, increases signal integrity. Additionally, the dielectric relaxation times of Rogers 4350B are much shorter than glass/epoxy dielectrics. For more information on dielectric relaxation, see the ADA4530-1 data sheet. Figure 4. Board Layer Stackup Rev. 0 | Page 4 of 14 ADA4530-1R-EBZ User Guide UG-865 CLEANING AND HANDLING 3. It is important to always handle the board by the edges and never touch the area within SHIELD1. Before using the board, properly clean the evaluation board to remove any contaminants, such as solder flux, saline moisture, dirt, and dust, to maintain its low leakage performance. Any contaminants can severely degrade its femtoampere performance. The board must also be cleaned again after any rework to the components. An effective cleaning procedure consists of the following steps: 1. 2. Soak the board in an ultrasonic bath with cleanroom grade isopropyl alcohol for 15 minutes. Ultrasonic cleaning uses ultrasound at a high frequency, creating cavitation in the cleaning solution. This process helps to remove contaminants on the surface of the board and in areas under soldered components that are hard to reach. The next cleaning steps require using fresh isopropyl alcohol. Remove the board from the ultrasonic bath with a pair of forceps. Rinse and flush the board with isopropyl alcohol to remove any contaminant residue. 4. 5. 6. 7. 8. 9. Rev. 0 | Page 5 of 14 Flood the board with isopropyl alcohol and gently scrub it with an acid brush. Concentrate on areas between the U1 pins, the input traces to J1, the guard ring, and the area within SHIELD1. Rinse and flush the board with isopropyl alcohol. Repeat Step 3 and Step 4 for the bottom of the board. Give a final flush for the top and bottom of the board with isopropyl alcohol. Use compressed dry air to dry the board. Blow air around the U1 pins, the input traces to J1, and the guard ring area. Be sure to direct the compressed air under J1 and U1 as well. To make sure that the board is completely dry, bake the board in the oven at 125°C for 15 minutes. After cleaning, remember to place the cover of the metal shield on both sides of the board. The metal shields help prevent any contact to the guarded area. UG-865 ADA4530-1R-EBZ User Guide AMPLIFIER CONFIGURATIONS This section describes the different configurations possible with the evaluation board. For some configurations, remove stated preassembled components to allow assembly of new components of choice. After any rework, the evaluation board must be cleaned according to the Cleaning and Handling section. BUFFER WITH TRIAX GUARD EXTERNALLY DRIVEN (ADA4530-1R-EBZ-BUF) BUFFER WITH TRIAX GUARD DRIVEN BY AMP GUARD For a buffer configuration where the triax guard is not driven by any external test equipment, TRIAX GUARD must be shorted to AMP GUARD via JP3. This configuration is useful when the buffer is connected to a passive sensor (or an input signal). Table 3 shows the recommended component values. The amplifier on this evaluation board is defaulted to a buffer configuration. An input signal can be applied through the triax connector, J1. Note that JP3 is left unconnected by default so that the triax guard can to be driven by external test equipment. For direct input bias current (IB) measurement, connect an electrometer such as the Keithley 6430 to the board via J1. The Keithley 6430 internal guard buffer drives the triax guard (see Figure 5 and Figure 6 for the configuration). Details regarding IB measurement are described in the AN-1373 Application Note. Table 3. Buffer with Triax Guard Driven by Amp Guard Pad/Connector Configuration1 Pad/Connector JP1 JP3 RF1 1 Use the ADA4530-1R-EBZ-BUF board. SHORT TRIAX GUARD TO AMP GUARD Table 2. Buffer with Triax Guard Externally Driven Pad/Connector Configuration Pad/Connector JP1 JP3 RF1 Description 0Ω Short TRIAX GUARD to AMP GUARD 0Ω Description 0Ω Unconnected 0Ω RF1 0Ω JP1 0Ω 13409-014 RF1 0Ω JP1 0Ω Figure 7. Buffer with Triax Guard Driven by Amp Guard RF1 0Ω Figure 5. Buffer with Triax Guard Externally Driven RF1 0Ω V+ JP1 0Ω TRIAX GUARD IS EXTERNALLY DRIVEN U1 V– JP1 0Ω TRIAX GUARD IS CONNECTED TO AMP GUARD U1 V– RO 499Ω VOUT J2 (BNC) OUTPUT Figure 8. Buffer with Triax Guard Driven by Amp Guard Schematic RO 499Ω J2 (BNC) OUTPUT VOUT 13409-007 J1 (TRIAX) INPUT V+ 13409-015 13409-006 J1 (TRIAX) INPUT Figure 6. Buffer with Triax Guard Externally Driven Schematic Rev. 0 | Page 6 of 14 ADA4530-1R-EBZ User Guide UG-865 BUFFER WITH RESISTOR AT IN+ TO GROUND NONINVERTING GAIN To configure the DUT as a buffer with a large resistor at the noninverting pin to ground, use the ADA4530-1R-EBZ-BUF evaluation board and remove JP1. Large value, through hole resistors (RS2) can be placed between the noninverting pin and ground using the P7 and P4 pin sockets. Place one end of the leaded resistor at P7 and the other end at P4 (GND). If an SMT resistor is used, use the RS1 pad instead. The RS1 pad allows the assembly of a 1206 or 1210 package size resistor. This configuration allows the user to measure IB+, where VOUT = IB+ × RS1 or VOUT = IB+ × RS2. To configure the ADA4530-1 in a noninverting gain, use the components shown in Table 5. Choose appropriate RF1 and RS3 values for the desired gain. Note that the pre-assembled RF1 must be replaced with a resistor of choice. Table 4. Buffer with Resistor at IN+ to Ground Pad Configuration1 Pad/Connector JP1 JP3 RF1 RS3 1 Description 0Ω Short TRIAX GUARD to AMP GUARD Replace 0 Ω resistor with resistor of choice Populate with resistor of choice Use the ADA4530-1R-EBZ-BUF board. Description 0Ω Unconnected 0Ω Used for a SMT source resistor Used for a through hole source resistor SHORT TRIAX GUARD TO AMP GUARD RS3 RF1 1 Use the ADA4530-1R-EBZ-BUF board. 2 Assemble either RS1 or RS2.. JP1 0Ω RS2 (THROUGH HOLE) 13409-016 RF1 0Ω Figure 11. Noninverting Gain RS1 (SMT) RF1 J1 (TRIAX) INPUT RS3 V+ 13409-012 U1 Figure 9. Buffer with Resistor at IN+ to Ground RF1 0Ω TRIAX GUARD RS2 (THROUGH HOLE) J2 (BNC) RO OUTPUT 499Ω V+ JP1 0Ω U1 VOUT V– RS1 (SMT) 13409-013 J1 (TRIAX) INPUT Figure 10. Buffer with Resistor at IN+ to Ground Schematic Rev. 0 | Page 7 of 14 JP1 TRIAX GUARD IS 0Ω CONNECTED TO AMP GUARD RO 499Ω J2 (BNC) OUTPUT VOUT V– Figure 12. Noninverting Gain Schematic 13409-017 Pad JP1 JP3 RF1 RS12 RS22 Table 5. Noninverting Gain Pad/Connector Configuration1 UG-865 ADA4530-1R-EBZ User Guide TRANSIMPEDANCE WITH 10 GΩ SMT FEEDBACK RESISTOR AND IN+ CONNECTED TO GROUND (ADA4530-1R-EBZ-TIA) TRANSIMPEDANCE WITH THROUGH HOLE FEEDBACK RESISTOR On the ADA4530-1R-EBZ-TIA board, the amplifier is defaulted to a transimpedance configuration. The transimpedance configuration is a current-to-voltage (I to V) converter. A 10 GΩ SMT 1206 package size feedback resistor (RF1) is preassembled on board. If other resistor values or package sizes are needed, the 10 GΩ feedback resistor can be desoldered to allow the assembly for the SMT resistor of choice. The evaluation board provides a combination footprint that allows assembly of either an 0805, 1206, 1210, 2510, or 2512 package size for RF1. Larger value through hole feedback resistors, in the order of high gigaohms or teraohms, are also often used in a transimpedance application. This option is discussed in the Transimpedance with Through Hole Feedback Resistor section. Table 6. Transimpedance with 10 GΩ SMT Feedback Resistor and IN+ Connected to Ground Pad/Connector Configuration Pad/Connector JP2 JP3 RF1 RS1 In a transimpedance configuration, larger value through hole feedback resistors, in the order of high gigaohms or teraohms, are often used. These resistors are glass encapsulated and hermetically sealed, and come in large footprints. An example of this is the Ohmite RX-1M ultrahigh resistance, high stability, hermetically sealed resistor. To cater to its large footprint, pin sockets (P7 and VOUT) are provided for RF2. Place one end of the leaded resistor at P7 and the other end at VOUT. Note that when using the evaluation board for this configuration, use the ADA4530-1R-EBZ-TIA board and remove the pre-assembled 10 GΩ feedback resistor. When RF2 is used, remove the cover of SHIELD1 to allow placement of the large through hole resistor. Secure SHIELD3, which is provided with the kit, with the pre-assembled RF clips to provide electrostatic shielding. Table 7. Transimpedance with Through Hole Feedback Resistor Pad/Connector Configuration1 Description 0Ω Unconnected 10 GΩ 0Ω Pad/Connector JP2 JP3 RS1 RF1 RF2 1 Description 0Ω Unconnected 0Ω Remove from board Populate with resistor of choice Use the ADA4530-1R-EBZ-TIA board. JP2 0Ω RF1 10GΩ JP2 0Ω RS1 0Ω RF2 GΩ/TΩ 13409-008 RS1 0Ω RF1 10GΩ V+ U1 RS1 0Ω V– RO 499Ω Figure 15. Transimpedance with Through Hole Feedback Resistor J2 (BNC) OUTPUT J1 (BNC) INPUT VOUT RF2 THROUGH HOLE JP2 0Ω V+ U1 RS1 0Ω Figure 14. Transimpedance with 10 GΩ Feedback and IN+ Connected to Ground Schematic V– RO 499Ω J2 (BNC) OUTPUT VOUT 13409-011 JP2 0Ω 13409-009 J1 (BNC) INPUT 13409-010 Figure 13. Transimpedance with 10 GΩ Feedback and IN+ Connected to Ground Figure 16. Transimpedance with Through Hole Feedback Resistor Schematic Rev. 0 | Page 8 of 14 ADA4530-1R-EBZ User Guide UG-865 TRANSIMPEDANCE WITH DIRECT SENSOR CONNECTION INVERTING GAIN The ADA4530-1R-EBZ-TIA board can be reconfigured to allow direct sensor connection. The P6 and P1, P2, or P3 pins are provided to allow assembly of a photodiode. To reconfigure the board, remove the input BNC connector (J1). The user must then access Pin P6 (the inner conductor pin of the BNC connector). Assemble the photodiode of choice between P6 and P1, P2, or P3. P1, P2, and P3 are electrically connected to signal ground. These three pins are provided to allow different photodiode packages to be used, for example: TO-19, TO-5, or TO-8. To configure the ADA4530-1 in an inverting gain, use the components shown in Table 9. Choose appropriate RF1 and JP2 values for the desired gain. Table 9. Inverting Gain Pad Configuration1 Pad JP2 RS1 RF1 1 Description Populate with resistor of choice 0Ω Replace 10 GΩ with resistor of choice Use the ADA4530-1R-EBZ-TIA board. Table 8. Transimpedance with Direct Sensor Connection Pad/Connector Configuration1 RF23 Description Feedback capacitor2 Remove J1 0Ω Unconnected 0Ω Use pre-assembled 10 GΩ resistor or replace with SMT resistor of choice Used with through hole feedback resistor JP2 RF1 RS1 0Ω 13409-018 Pad/Connector CF1 J1 JP2 JP3 RS1 RF13 1 Use the ADA4530-1R-EBZ-TIA board. See the Photodiode Interface section in the ADA4530-1 data sheet on how to select CF1 3 Assemble either RF1 or RF2. 2 Figure 19. Inverting Gain RF1 JP2 V+ U1 JP2 RS1 0Ω CF1 PHOTODIODE RO 499Ω J2 (BNC) OUTPUT VOUT V– RF2 Figure 20. Inverting Gain Schematic 13409-124 RS1 0Ω Figure 17. Transimpedance with Direct Sensor Connection CF1 RF1 (SMT) RF2 (THROUGH HOLE) J2 (BNC) RO OUTPUT 499Ω V+ PHOTODIODE U1 RS1 0Ω V– VOUT 13409-125 JP2 0Ω Figure 18. Transimpedance with Direct Sensor Connection Schematic Rev. 0 | Page 9 of 14 13409-019 J1 (BNC) INPUT UG-865 ADA4530-1R-EBZ User Guide 13409-002 ADA4530-1R-EBZ EVALUATION BOARD PHOTOGRAPHS 13409-121 Figure 21. Evaluation Board Top View with SHIELD1 13409-122 Figure 22. Evaluation Board Bottom View with SHIELD3 Figure 23. Evaluation Board Top View with SHIELD2 Rev. 0 | Page 10 of 14 ADA4530-1R-EBZ User Guide UG-865 EVALUATION BOARD SCHEMATICS 1 RF2 DNI GND_P4_TP 1 2 3 AGND RS3 DNI CF1 DNI RF1 VOUT_TP 1 VOUT 10GΩ R0 VOUT_ISO 1 499Ω 5 4 3 2 GUARD JP2 1 J2 1-1337445-0 2 IN– VDD_DUT 0 R1206 1 2 U1 ADA4530-1 1 2 3 JP3 SAMTECTSW10608GS3PIN AGND 7 8 9 AGND DNI 1 JP1 VSS_DUT 2 AGND IN+ 0 R1206 C2 0.1µF C0805 AGND RS1 0Ω 13409-020 3 4 5 6 0.1µF C0805 1 8 +IN –IN 2 7 GRD GRD 6 3 DNC OUT 4 5 V– V+ J1 UCBBJR29 AGND C1 Figure 24. ADA4530-1R-EBZ-TIA Schematic Rev. 0 | Page 11 of 14 UG-865 ADA4530-1R-EBZ User Guide 1 RF2 DNI GND_P4_TP 1 2 3 AGND RS3 DNI CF1 DNI RF1 VOUT_TP 1 VOUT R0 VOUT_ISO 1 499Ω 0Ω 5 4 3 2 GUARD 1 JP2 J2 1-1337445-0 2 IN– VDD_DUT DNI 1 2 1 2 3 JP3 SAMTECTSW10608GS3PIN 7 8 9 AGND AGND 1 JP1 VSS_DUT 2 IN+ 0 R1206 C2 0.1µF C0805 AGND RS1 DNI 13409-021 3 4 5 6 U1 ADA4530-1 AGND 1 8 +IN –IN 2 7 GRD GRD 6 3 DNC OUT 4 5 V– V+ 0.1µF C0805 J1 CBBJR9A AGND C1 Figure 25. ADA4530-1R-EBZ-BUF Schematic Rev. 0 | Page 12 of 14 ADA4530-1R-EBZ User Guide UG-865 ORDERING INFORMATION BILL OF MATERIALS Table 10. Bill of Materials for ADA4530-1R-EBZ-TIA Qty 1 Reference Designator U1 2 2 1 2 1 Manufacturer Part Number Analog Devices, Inc., ADA4530-1 Distributor C1, C2 C3, C4 RO RS1, JP2 RF1 Description Femtoampere input bias current electrometer amplifier (device under test) 0.1 μF, 50 V, 5%, 0805 10 μF, 35 V, 10%, 7343 499 Ω, 0.125 W, 1%, 0805 0 Ω, 0.25 W, 0.05%, 1206 10G Ω, 0.25W, 10%, 1206 Kemet, C0805C104J5RACTU AVX, TPSD106K035R0125 Panasonic, ERJ-6ENF4990V Panasonic, ERJ-8GEY0R00V Ohmite, HVC1206Z1008KET 1 J1 BNC connector, right angle 1 1 3 J2 JP3 J3, J4, J5 BNC connector, through hole 3-pin header, 100 mil spacing Banana jack, panel mount 1 1 3 1 1 3 J6 J7 P4, P7, VOUT SHIELD1, SHEILD3 SHIELD2 N/A1 Terminal block, 2-position Terminal block, 3-position Pin receptacle, 22 mil to 32 mil pin diameter 1.0 x 1.5 x 0.25 RF shield 1.5 x 3.0 x 0.75 RF shield RF shield clip (to be used with SHIELD2) Trompeter/Cinch Connectivity, UCBBJR29 TE Connectivity, 1-1337445-0 Samtec, TSW-103-08-G-S Emerson Network Power Connectivity Johnson, 108-0740-001 Keystone, 8718 Keystone, 8719 Mill-Max, 0294-0-15-15-06-27-10-0 Fotofab, DMP-1.0 X 1.5 X 0.25 Fotofab, 1.5 X 3.0 X 0.75 Harwin, Inc., S1711-46R Digi-Key, 399-1171-6-ND Digi-Key, 478-3337-2-ND Digi-Key, P499CCT-ND Digi-Key, P0.0ECT-ND Digi-Key, HVC1206Z1008KETCT-ND Mouser, 530-UCBBJR29 1 Digi-Key, A101972-ND Digi-Key, SAM1038-03-ND Digi-Key, J147-ND Mouser, 534-8718 Mouser,534-8719 Digi-Key, ED90072-ND Digi-Key, 655-1015-ND Digi-Key, 952-1475-1-ND N/A means not applicable. Table 11. Bill of Materials for ADA4530-1R-EBZ-BUF Qty 1 Reference Designator U1 2 2 1 3 1 C1, C2 C3, C4 RO RF1, JP1 J1 Description Femtoampere Input bias current electrometer amplifier (device under test) 0.1 μF, 50 V, 5%, 0805 10 μF, 35 V, 10%, 7343 499 Ω, 0.125 W, 1%, 0805 0 Ω, 0.25 W, 0.05%, 1206 Triax connector, right angle, 3-lug 1 1 3 J2 JP3 J3, J4, J5 BNC connector, through hole 3-pin header, 100 mil spacing Banana jack, panel mount 1 1 3 1 1 3 J6 J7 P4, P7, VOUT SHIELD1, SHEILD3 SHIELD2 N/A1 Terminal block, 2-position Terminal block, 3-position Pin receptacle, 22 mil to 32 mil pin diameter 1.0 x 1.5 x 0.25 RF shield 1.5 x 3.0 x 0.75 RF Shield RF shield clip (to be used with SHIELD2) 1 Manufacturer Part Number Analog Devices, Inc., ADA4530-1 Distributor Kemet, C0805C104J5RACTU AVX, TPSD106K035R0125 Panasonic, ERJ-6ENF4990V Panasonic, ERJ-8GEY0R00V Emerson Network Power Connectivity Trompeter, CBBJR79/A TE Connectivity, 1-1337445-0 Samtec TSW-103-08-G-S Emerson Network Power Connectivity Johnson, 108-0740-001 Keystone, 8718 Keystone, 8719 Mill-Max, 0294-0-15-15-06-27-10-0 Fotofab, DMP-1.0 X 1.5 X 0.25 Fotofab, 1.5 X 3.0 X 0.75 Harwin, Inc., S1711-46R Digi-Key, 399-1171-6-ND Digi-Key, 478-3337-2-ND Digi-Key, P499CCT-ND Digi-Key, P0.0ECT-ND Digi-Key, 1097-1046-ND N/A means not applicable. Rev. 0 | Page 13 of 14 Digi-Key, A101972-ND Digi-Key, SAM1038-03-ND Digi-Key, J147-ND Mouser, 534-8718 Mouser, 534-8719 Digi-Key, ED90072-ND Digi-Key, 655-1015-ND Digi-Key, 952-1475-1-ND UG-865 ADA4530-1R-EBZ User Guide NOTES ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Legal Terms and Conditions By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the Analog Devices Standard Terms and Conditions of Sale shall govern. Do not use the Evaluation Board until you have read and agreed to the Agreement. Your use of the Evaluation Board shall signify your acceptance of the Agreement. This Agreement is made by and between you (“Customer”) and Analog Devices, Inc. (“ADI”), with its principal place of business at One Technology Way, Norwood, MA 02062, USA. Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal, temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Board FOR EVALUATION PURPOSES ONLY. Customer understands and agrees that the Evaluation Board is provided for the sole and exclusive purpose referenced above, and agrees not to use the Evaluation Board for any other purpose. Furthermore, the license granted is expressly made subject to the following additional limitations: Customer shall not (i) rent, lease, display, sell, transfer, assign, sublicense, or distribute the Evaluation Board; and (ii) permit any Third Party to access the Evaluation Board. As used herein, the term “Third Party” includes any entity other than ADI, Customer, their employees, affiliates and in-house consultants. The Evaluation Board is NOT sold to Customer; all rights not expressly granted herein, including ownership of the Evaluation Board, are reserved by ADI. CONFIDENTIALITY. This Agreement and the Evaluation Board shall all be considered the confidential and proprietary information of ADI. Customer may not disclose or transfer any portion of the Evaluation Board to any other party for any reason. Upon discontinuation of use of the Evaluation Board or termination of this Agreement, Customer agrees to promptly return the Evaluation Board to ADI. ADDITIONAL RESTRICTIONS. Customer may not disassemble, decompile or reverse engineer chips on the Evaluation Board. Customer shall inform ADI of any occurred damages or any modifications or alterations it makes to the Evaluation Board, including but not limited to soldering or any other activity that affects the material content of the Evaluation Board. Modifications to the Evaluation Board must comply with applicable law, including but not limited to the RoHS Directive. TERMINATION. ADI may terminate this Agreement at any time upon giving written notice to Customer. Customer agrees to return to ADI the Evaluation Board at that time. LIMITATION OF LIABILITY. THE EVALUATION BOARD PROVIDED HEREUNDER IS PROVIDED “AS IS” AND ADI MAKES NO WARRANTIES OR REPRESENTATIONS OF ANY KIND WITH RESPECT TO IT. ADI SPECIFICALLY DISCLAIMS ANY REPRESENTATIONS, ENDORSEMENTS, GUARANTEES, OR WARRANTIES, EXPRESS OR IMPLIED, RELATED TO THE EVALUATION BOARD INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, TITLE, FITNESS FOR A PARTICULAR PURPOSE OR NONINFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. IN NO EVENT WILL ADI AND ITS LICENSORS BE LIABLE FOR ANY INCIDENTAL, SPECIAL, INDIRECT, OR CONSEQUENTIAL DAMAGES RESULTING FROM CUSTOMER’S POSSESSION OR USE OF THE EVALUATION BOARD, INCLUDING BUT NOT LIMITED TO LOST PROFITS, DELAY COSTS, LABOR COSTS OR LOSS OF GOODWILL. ADI’S TOTAL LIABILITY FROM ANY AND ALL CAUSES SHALL BE LIMITED TO THE AMOUNT OF ONE HUNDRED US DOLLARS ($100.00). EXPORT. Customer agrees that it will not directly or indirectly export the Evaluation Board to another country, and that it will comply with all applicable United States federal laws and regulations relating to exports. GOVERNING LAW. This Agreement shall be governed by and construed in accordance with the substantive laws of the Commonwealth of Massachusetts (excluding conflict of law rules). Any legal action regarding this Agreement will be heard in the state or federal courts having jurisdiction in Suffolk County, Massachusetts, and Customer hereby submits to the personal jurisdiction and venue of such courts. The United Nations Convention on Contracts for the International Sale of Goods shall not apply to this Agreement and is expressly disclaimed. ©2015 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. UG13409-0-10/15(0) Rev. 0 | Page 14 of 14