Buck or Boost, PWM Controller for Battery Test Solutions ADP1972 Data Sheet FEATURES GENERAL DESCRIPTION Input voltage range: 6 V to 60 V On-board 5 V low dropout regulator Selective buck or boost mode Excellent PWM linearity with high amplitude PWM sawtooth 4.0 V p-p FAULT input compatible with AD8450 COMP input compatible with AD8450 Adjustable frequency from 50 kHz to 300 kHz Synchronization output or input with adjustable phase shift Programmable maximum duty cycle Maximum internal duty cycle: 98% Programmable soft start Peak hiccup current limit protection Input voltage UVLO protection TSD protection 16-lead TSSOP The ADP1972 is a constant frequency, voltage mode, pulse-width modulation (PWM) controller for buck or boost, dc-to-dc, asynchronous applications. The ADP1972 is designed for use in asynchronous battery testing applications with an external, high voltage field effect transistor (FET), half bridge driver, and an external control device, such as the AD8450. The asynchronous device operates as a buck converter in battery charge mode and operates as a boost converter in recycle mode to recycle energy to the input bus. The ADP1972 high voltage, VIN supply pin can withstand a maximum operating voltage of 60 V and reduces the need for additional system supply voltages. The ADP1972 has integrated features such as precision enable, pin selective buck or boost mode operation, internal and external synchronization control with programmable phase shift, programmable maximum duty cycle, and programmable peak hiccup current limit. Additional protection features include soft start to limit input inrush current during startup, input voltage undervoltage lockout (UVLO), and thermal shutdown (TSD). The ADP1972 also has a COMP pin to provide external control of the PWM operation and a FAULT pin that can be signaled to disable the DH and DL outputs if a fault condition occurs externally to the ADP1972. APPLICATIONS PWM battery test systems with recycle capability including hybrid vehicles, PCs, and camera batteries Compatible with AD8450 constant voltage (CV) and constant current (CC) monitors The ADP1972 is available in a 16-lead TSSOP package. TYPICAL APPLICATION CIRCUIT 24V FROM CENTRAL PC VIN SYNC VREG SCFG 24V RECYLCING DC BUS DH MODE HV MOSFET DRIVER EN FROM ANALOG IC BATTERY ADP1972 DL COMP FAULT CL FREQ GNDSENSE GND SS 11884-001 DMAX Figure 1. Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. 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Technical Support www.analog.com ADP1972 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 PWM Drive Signals.................................................................... 12 Applications ....................................................................................... 1 External COMP Control ........................................................... 12 General Description ......................................................................... 1 Current Limit .............................................................................. 12 Typical Application Circuit ............................................................. 1 PWM Frequency Control.......................................................... 12 Revision History ............................................................................... 2 Maximum Duty Cycle ............................................................... 13 Specifications..................................................................................... 3 External Fault Signaling ............................................................ 13 Absolute Maximum Ratings............................................................ 5 Thermal Shutdown (TSD) ........................................................ 13 Thermal Operating Ranges ......................................................... 5 Applications Information .............................................................. 14 ESD Caution .................................................................................. 5 Buck or Boost Selection............................................................. 14 Pin Configuration and Function Descriptions ............................. 6 Selecting RS to Set the Current Limit ....................................... 14 Typical Performance Characteristics ............................................. 7 Adjusting the Operating Frequency ........................................ 14 Theory of Operation ...................................................................... 10 Programming the Maximum Duty Cycle ............................... 15 Supply Pins .................................................................................. 10 Adjusting the Soft Start Period ................................................. 16 EN/Shutdown.............................................................................. 11 PCB Layout Guidelines .................................................................. 17 Undervoltage Lockout (UVLO) ............................................... 11 Outline Dimensions ....................................................................... 18 Soft Start ...................................................................................... 11 Ordering Guide .......................................................................... 18 Operating Modes ........................................................................ 11 REVISION HISTORY 11/14—Rev. A to Rev. B Changes to EN Threshold Falling Parameter, Unit Column, Table 1 ................................................................................ 4 Changes to the Programming Maximum Duty Cycle Section ...... 15 6/14—Rev. 0 to Rev. A Changes to Maximum Duty Cycle Range Parameter, Table 1 .... 3 Changes to Equation 7 and Equation 9 ....................................... 15 Changes to Ordering Guide .......................................................... 18 1/14—Revision 0: Initial Version Rev. B | Page 2 of 18 Data Sheet ADP1972 SPECIFICATIONS VIN = 24 V and the specifications are valid for TJ = −40°C to +125°C, unless otherwise specified. Typical values are at TA = 25°C. All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC). Table 1. Parameter INPUT VOLTAGE (VIN) Voltage Range VIN Supply Current VIN Shutdown Current UVLO Threshold Rising UVLO Threshold Falling SOFT START (SS) SS Pin Current SS Threshold Rising SS Threshold Falling PWM CONTROL FREQ Frequency Range Oscillator Frequency FREQ Pin Voltage SYNC Maximum SYNC Pin Voltage SYNC Pull-Down Resistor SYNC Output (Internal Frequency Control) Internal SYNC Range SYNC Output Clock Duty Cycle SYNC Sink Resistance SYNC Input (External Frequency Control) External SYNC Range SYNC Threshold Rising SYNC Threshold Falling RFREQ Slave to Master Ratio for Synchronization SCFG SCFG High Threshold Rising SCFG High Threshold Falling SCFG Low Threshold Rising SCFG Low Threshold Falling SCFG Current DMAX Maximum Internal Duty Cycle DMAX Setting Current DMAX and SCFG Current Matching1 COMP Maximum COMP Pin Voltage Internal Peak-to-Peak Ramp Voltage COMP Maximum Internal Ramp Voltage COMP Minimum Internal Ramp Voltage DH and DL Shutdown Range2 Maximum Duty Cycle Range2 Symbol VIN IVIN ISHDN ISS fSET fOSC VFREQ fSET RSYNC fSYNC Test Conditions/Comments Min Typ 6 RFREQ = 100 kΩ, VSS = 0 V, SYNC floating VEN = 0 V VIN rising VIN falling 5.1 VSS = 0 V 4 RFREQ = 100 kΩ RFREQ = 100 kΩ VSCFG ≥ 4.53 V or SCFG pin floating For SYNC output VSCFG = VVREG, RFREQ = 100 kΩ VSCFG = 5 V, ISYNC = 10 mA VSCFG < 4.25 V For SYNC input clock 1.5 15 5.71 5.34 Max Unit 60 2.5 70 6 V mA μA V V 6 0.65 μA V V 0.4 5 0.52 0.5 50 90 1.2 100 1.252 300 110 1.3 kHz kHz V 0.5 1 5.5 1.5 V MΩ 50 10 300 60 20 kHz % Ω 300 1.5 kHz V V 4.7 12.5 V V V V μA 12.5 10 % μA % 50 40 50 For example, RFREQ (SLAVE) = 1.11 × RFREQ (MASTER) 1.2 1.05 1.11 IISCFG RFREQ = 100 kΩ 0.4 9.5 4.53 4.51 0.52 0.5 11 IDMAX VCOMP, VDMAX, VSS, and VSCFG = 5 V VDMAX = 0 V, RFREQ = 100 kΩ 9.5 97.37 11 0.45 4 4.5 0.5 0.7 VSCFG 4.25 VCOMP V p-p VCOMP VCOMP 0.65 5 Internal oscillator is disabled COMP not regulated 4.4 Rev. B | Page 3 of 18 0.55 0.45 V V V V V V ADP1972 Parameter PRECISION ENABLE LOGIC (EN) Maximum EN Pin Voltage EN Threshold Rising EN Threshold Falling EN Pin Current MODE LOGIC Maximum MODE Pin Voltage MODE Threshold Rising MODE Threshold Falling CURRENT LIMIT (CL) Set Current Buck Internal Reference Boost Internal Reference Hiccup Detect Time Hiccup Off-Time VREG LDO Regulator Output Voltage Guaranteed Output Current Line Regulation Load Regulation FAULT Maximum FAULT Pin Voltage FAULT Threshold Rising FAULT Threshold Falling FAULT Pin Current PWM DRIVE LOGIC SIGNALS (DH/DL) DL Drive Voltage DH Drive Voltage DL and DH Sink Resistance DL and DH Source Resistance DL and DH Pull-Down Resistor THERMAL SHUTDOWN (TSD) TSD Threshold Rising TSD Threshold Falling 1 Data Sheet Symbol Test Conditions/Comments Typ 1.1 1.25 1.22 0.32 VEN = 5 V ICL VREF (BUCK) VREF (BOOST) VCL = 0 V RFREQ = 100 kΩ RFREQ = 100 kΩ VVREG IOUT (MAX) VIN = 6 V to 60 V VIN = 6 V VIN = 6 V to 60 V VIN = 6 V, IOUT = 0 mA to 5 mA Unit 60 1.4 V V V μA 2 5.5 1.5 V V V 0.7 18 250 450 4.4 4.4 20 300 500 5.2 5.2 21 350 550 6.1 6.1 μA mV mV ms ms 4.9 5 5.1 5 5.1 5.1 V mA V V 60 1.5 2 V V V μA 2.4 2.6 1.5 V V Ω Ω MΩ 5 5 0.7 VDL VDH Max 1.20 1.05 VFAULT = 5 V No load No load IDL = 10 mA IDL = 10 mA 0.5 1.2 1.05 0.49 VREG VREG 1.2 1.4 1 150 135 °C °C The DMAX and SCFG current matching specification is calculated by taking the absolute value of the difference between the measured ISCFG and IDMAX currents, dividing them by the 11 μA typical value, and multiplying this answer by 100. I I DMAX DMAX and SCFG Current Matching (%) SCFG 100 11 μA 2 Min See Figure 11 for a graph of the duty cycle vs. the applied COMP pin voltage. Rev. B | Page 4 of 18 Data Sheet ADP1972 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter VIN, EN, FAULT to GND SYNC, COMP, MODE to GND DH, DL, SS, DMAX, SCFG, CL to GND GNDSENSE to GND Operating Ambient Temperature Range Junction Temperature Storage Temperature Range Rating −0.3 V to +61 V −0.3 V to +5.5 V −0.3 V to VREG + 0.3 V −0.3 V to +0.3 V −40°C to +85°C 125°C −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Absolute maximum ratings apply individually only, not in combination. In applications with high power dissipation and poor printed circuit board (PCB) thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit when the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction to ambient thermal resistance of the package (θJA). Use the following equation to calculate the maximum junction temperature (TJ) from the ambient temperature (TA) and power dissipation (PD): TJ = TA + (PD × θJA) For additional information on thermal resistance, refer to Application Note AN-000, Thermal Characteristics of IC Assembly. ESD CAUTION THERMAL OPERATING RANGES The ADP1972 can be damaged when the junction temperature limits are exceeded. The maximum operating junction temperature (TJ MAX) takes precedence over the maximum operating ambient temperature (TA MAX). Monitoring ambient temperature does not guarantee that the junction temperature (TJ) is within the specified temperature limits. Rev. B | Page 5 of 18 (1) ADP1972 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS DL 1 16 CL DH 2 15 GNDSENSE VIN 4 ADP1972 13 SCFG EN 5 TOP VIEW (Not to Scale) 12 FREQ MODE 6 11 DMAX SYNC 7 10 SS FAULT 8 9 COMP 11884-002 14 GND VREG 3 Figure 2. Pin Configuration Table 3. Pin Function Descriptions Pin No. 1 2 3 Mnemonic DL DH VREG 4 5 6 VIN EN MODE 7 SYNC 8 FAULT 9 COMP 10 SS 11 DMAX 12 FREQ 13 SCFG 14 15 16 GND GNDSENSE CL Description Logic Drive Low Output for External Low-Side MOSFET Driver. Logic Drive High Output for External High-Side MOSFET Driver. Internal Low Dropout (LDO) Voltage Regulator Output and Internal Bias Supply. A bypass capacitance of 1 µF or greater from this pin to ground is required. High Input Voltage Supply Pin. Bypass this pin with a 4.7 µF capacitor to ground. Logic Enable Input. Drive EN logic low to shut down the device. Drive EN logic high to turn on the device. Mode Select. Drive MODE logic low to place the device in boost/recycle mode. Drive MODE logic high to place the device in buck/charge mode of operation. Synchronization Pin. This pin is used as an input and synchronized to an external clock or used as an output clock to synchronize with other channels. Fault Input Pin. Signaled by an overcurrent protection (OCP) or overvoltage protection (OVP) fault condition on the companion ASIC, AD8450. The ADP1972 is disabled until this pin is logic high. Output Error Amplifier Signal from the companion ASIC, AD8450. This pin is the error input to the ADP1972 and is compared internally to the linear ramp to produce the PWM signal. Do not leave this pin floating. Soft Start Control Pin. A capacitor connected from SS to ground brings the output up slowly during power-up and reduces the inrush current. Maximum Duty Cycle Input. Connect an external resistor to ground to set the maximum duty cycle. If the 98% internal maximum duty cycle is sufficient for the application, tie this pin to VREG. If DMAX is left floating, this pin is internally tied to VREG. Frequency Set Pin. Connect an external resistor between this pin and ground to set the frequency between 50 kHz and 300 kHz. Synchronization Configuration Input. Drive VSCFG ≥ 4.53 V to configure SYNC as an output clock signal. Drive VSCFG < 4.25 V to configure SYNC as an input. Connect a resistor to ground with 0.65 V < VSCFG < 4.25 V to introduce a phase shift to the synchronized clock. Drive VSCFG ≤ 0.5 V to configure SYNC as an input with no phase shift so that it synchronizes the device to an external clock source. If SCFG is left floating, the SYNC pin is internally tied to VREG, and SYNC is configured as an output. Power and Analog Ground Pin. Ground Sense for the Current-Limit Setting Resistor. Current-Limit Programming Pin. Connect a current-limit sense resistor in series with the FET source to set the peak current limit. Rev. B | Page 6 of 18 Data Sheet ADP1972 TYPICAL PERFORMANCE CHARACTERISTICS VVIN = VEN = VFAULT = 24 V, VMODE = VCL = VSS = VCOMP = 0 V, TA = 25°C, unless otherwise noted. 0.45 5.8 RISING 0.40 EN PIN CURRENT (µA) 5.5 5.4 FALLING –5 30 65 0.25 100 TEMPERATURE (°C) TA = +125°C TA = +25°C TA = –40°C 0.15 11884-003 5.2 –40 6 15 24 33 42 51 60 EN PIN VOLTAGE (V) Figure 3. Input Voltage UVLO Threshold vs. Temperature, VFAULT = 0 V Figure 6. EN Pin Current vs. EN Pin Voltage, VEN = 5 V and VFAULT = 0 V 30 1.25 TA = +125°C TA = +25°C TA = –40°C 25 RISING 1.24 EN PIN THRESHOLD (V) 20 15 10 1.23 1.22 FALLING 1.21 5 6 15 24 33 42 51 60 INPUT VOLTAGE (V) 1.20 –40 11884-004 0 –5 30 65 11884-008 SHUTDOWN CURRENT (µA) 0.30 0.20 5.3 100 TEMPERATURE (°C) Figure 4. Shutdown Current vs. Input Voltage, VEN = 0 V and VFAULT = 0 V Figure 7. EN Pin Threshold vs. Temperature, VFAULT = 0 V 5.00 1.9 TA = +125°C TA = +85°C TA = +25°C TA = –40°C 4.98 SS PIN CURRENT (µA) 1.8 1.7 1.6 1.5 1.4 VIN = 6V VIN = 24V VIN = 60V 4.96 4.94 4.92 4.90 1.3 6 15 24 33 42 INPUT VOLTAGE (V) 51 60 11884-005 NONSWITCHING QUIESCENT CURRENT (mA) 0.35 11884-007 5.6 Figure 5. Nonswitching Quiescent Current vs. Input Voltage (SYNC = Floating) Rev. B | Page 7 of 18 4.88 –40 0 40 80 TEMPERATURE (°C) Figure 8. SS Pin Current vs. Temperature 120 11884-009 VIN UVLO THRESHOLD (V) 5.7 ADP1972 Data Sheet 210 190 97.7 RFREQ (MASTER) (kΩ) 170 97.6 97.5 97.4 150 130 110 90 70 TA = +125°C TA = +25°C TA = –40°C 50 97.2 6 15 24 33 42 51 60 INPUT VOLTAGE (V) 30 50 250 200 150 300 fSET (kHz) Figure 9. Maximum Internal Duty Cycle vs. Input Voltage, RFREQ = 100 kΩ, VCOMP = 5 V, and No Load on DL, DH, or DMAX Figure 12. RFREQ (MASTER) vs. Switching Frequency (fSET) 450 5.020 TA = +125°C TA = +25°C TA = –40°C 400 TA = +125°C TA = +85°C TA = +25°C TA = –40°C 5.015 350 300 5.010 VREG (V) RDMAX (kΩ) 100 11884-015 97.3 11884-010 MAXIMUM INTERNAL DUTY CYCLE (%) 97.8 250 200 150 5.005 5.000 100 4.995 0 20 40 60 80 100 DUTY CYCLE (%) 4.990 11884-011 0 6 15 24 33 42 51 60 INPUT VOLTAGE (V) Figure 10. RDMAX vs. Duty Cycle, RFREQ = 100 kΩ, VCOMP = 5 V, and No Load on DL or DH 11884-016 50 Figure 13. VREG vs. Input Voltage, No Load 5.020 100 TA = +125°C TA = +25°C TA = –40°C 5.015 80 5.005 VREG (V) 60 40 5.000 4.995 4.990 4.985 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VCOMP (V) 5.0 Figure 11. Duty Cycle vs. VCOMP, RFREQ = 100 kΩ, and No Load on DL, DH, or DMAX 4.980 0 1 2 3 LOAD CURRENT (mA) Figure 14. VREG vs. Load Current Rev. B | Page 8 of 18 4 5 11884-017 TA = +125°C TA = +85°C TA = +25°C TA = –40°C 20 11884-018 DUTY CYCLE (%) 5.010 Data Sheet ADP1972 T EN 1 VREG VIN = 24V VCOMP = 2.5V NO CSS 2 SYNC 3 DL CH1 10.0V CH2 5.0V CH3 5.0V CH4 5.0V CH1 100µs 5.0GS/s T 14.42% 10M POINTS 7.00V 11884-014 4 Figure 15. Startup Rev. B | Page 9 of 18 ADP1972 Data Sheet THEORY OF OPERATION CVREG 1µF CIN 4.7µF VIN VREG MODE 24V MODE SELECT 15V 5V VREG EN M1 DH VREG = 5V 1MΩ UVLO TSD VOUT M2 BAND GAP COUT DL 1MΩ VBG = 1.252V FAULT MODE SELECT AD8450 8.5MΩ VREG ICL 20µA 500mV SYNC L EXTERNAL DRIVER DRIVE LOGIC SYNC DETECT CL 1MΩ RCL 20kΩ RS GNDSENSE FREQ IFREQ 300mV OSCILLATOR VREG RFREQ IFREQ SCFG CONFIG DETECT VREG IFREQ 4V DMAX CDMAX GND RDMAX AGND PGND COMP AD8450 ADP1972 VREG ISS 5µA 11884-020 SS CSS Figure 16. Block Diagram SUPPLY PINS The ADP1972 has two voltage supply pins, VIN and VREG. The VIN pin operates from an external supply that ranges from 6 V to 60 V and is the supply voltage for the internal LDO regulator of the ADP1972. Bypass the VIN pin to ground with a 4.7 µF or greater ceramic capacitor. The VREG pin is the output of the internal LDO regulator. The internal LDO regulator generates the 5 V (typical) rail that is used internally to bias the control circuitry and can be used externally as a pull-up voltage for the MODE, SYNC, DMAX, and FAULT pins. Bypass the VREG pin to ground with a 1 µF ceramic capacitor. When operating with an input voltage above 50 V, additional input filtering is necessary. Figure 17 shows the recommended filter configuration. ADP1972 R VIN SUPPLY > 50V 4.7µF C 11884-021 The ADP1972 is a constant frequency, voltage mode, PWM controller for buck or boost, dc-to-dc, asynchronous applications with an external, high voltage FET, half bridge driver, and an external error signal generating device, such as the AD8450. The ADP1972 has a high input voltage range, multiple externally programmed control pins, and integrated safety features. Figure 17. Recommended Filter Configuration for Input Voltages Greater than 50 V Rev. B | Page 10 of 18 Data Sheet ADP1972 EN/SHUTDOWN OPERATING MODES The EN input turns the ADP1972 on or off. The EN pin of the ADP1972 can operate from voltages up to 60 V and is designed with stable ±20% thresholds for precision enable control. When the EN voltage is less than 1.22 V (typical), the ADP1972 shuts down, driving both DL and DH low. When the ADP1972 is shut down, the VIN supply current is 15 μA (typical). When the EN voltage is greater than 1.25 V (typical), the ADP1972 is enabled. The ADP1972 can be programmed to operate as an asynchronous boost or as an asynchronous buck. If the MODE pin is driven low by less than 1.05 V (typical), then the ADP1972 operates in a boost configuration. A boost configuration is ideal for power recycling and discharging in battery charging applications. When the MODE pin is driven high by greater than 1.20 V (typical), the ADP1972 operates in a buck configuration for battery charging. See Figure 19 and Figure 20 for the ADP1972 behavior in each mode. When the ADP1972 is enabled, the internal LDO regulator connected to the VREG pin also powers up. On the rising edge of VREG, the state of the MODE pin is latched, preventing the mode of operation from being changed while the device is enabled. To change between boost and buck modes of operation, shutdown or disable the ADP1972, adjust the MODE pin to change the operating mode, and restart the system. UNDERVOLTAGE LOCKOUT (UVLO) There is internal UVLO for the VIN pin. When VIN rises, the UVLO does not allow the ADP1972 to turn on unless VIN is greater than 5.71 V (typical). When VIN falls, the UVLO disables the device when VIN drops below 5.34 V (typical). The UVLO prevents potentially erratic operation of the application at low input voltages that may damage the ADP1972 and the external circuitry. The UVLO levels have ~370 mV of hysteresis to ensure glitch free startup. SOFT START The ADP1972 is equipped with a programmable soft start that prevents output voltage overshoot during startup. When the ADP1972 is enabled with the EN pin, the VREG voltage begins rising to 5 V. When VREG reaches 90% of its 5 V (typical) value, the 5 μA (typical) internal soft start current (ISS) begins charging the soft start capacitor (CSS), causing the voltage on the SS pin (VSS) to rise. While VSS is less than 0.52 V (typical), the ADP1972 switching control remains disabled. The operating mode can be changed when the EN pin is driven low, the FAULT pin is driven low, or the ADP1972 is disabled via a TSD event or UVLO condition. On the rising edge of the FAULT control signal, the state of the MODE pin is latched, preventing the mode of operation from being changed while the device is enabled. BOOST MODE CONFIGURATION MODE ≤ 1.05V (TYPICAL) VSCFG ≥ 4.53V (TYPICAL) 0.5V 0V VREG (5V TYPICAL) DH 0V When VSS reaches 0.52 V (typical), switching is enabled, and regulation of the ADP1972 control loop begins. As CSS continues to charge and VSS rises, the PWM duty cycle gradually increases, allowing the output voltage to rise linearly with little to no overshoot during startup. CSS charges and VSS rises until VSS reaches the internal VREG voltage (5 V typical). When the internal system duty cycle is less than the soft start duty cycle, the internal control loop takes control of the ADP1972. See Figure 18 for a soft start diagram. There is an active, internal, pull-down resistor on the SS pin that discharges CSS when the device shuts down to prevent a fault from occurring. 4.5V COMP INTERNAL RAMP (4V p-p) VREG (5V TYPICAL) DL 0V 11884-023 The device can be disabled via the EN pin, a fault condition indicated by a TSD event, a UVLO condition, or an external fault condition signaled via the FAULT pin. Figure 19. Signal Diagram for Boost Configuration BUCK MODE CONFIGURATION MODE ≥ 1.2V (TYPICAL) VSCFG ≥ 4.53V (TYPICAL) COMP INTERNAL RAMP (4V p-p) 4.5V 0.5V 0V VREG (5V TYPICAL) tREG DH VOUT 0V VREG DL VSS 0V Figure 20. Signal Diagram for Buck Configuration ENABLE ADP1972 BEGIN REGULATION 11884-022 0.52V 0V Figure 18. Soft Start Diagram Rev. B | Page 11 of 18 11884-024 VREG (5V TYPICAL) ADP1972 Data Sheet The ADP1972 has two output drive signals, DH and DL, that are compatible with drivers similar to the IR2110S. The drive signal DL is active when the MODE pin is logic low and the ADP1972 is configured in the boost/recycle mode. The DL drive signal turns on and off the low-side switch driven from the external driver. While in the boost/recycle mode, the DH signal is driven low to prevent the high-side switch from turning on and only allows the body diode to conduct. The drive signal DH is active when the MODE pin is logic high and the ADP1972 is configured in the buck/charge mode. The DH drive signal turns on and off the high-side switch driven from the external driver. While in the buck/charge mode, the DL signal is driven low to prevent the low-side switch from turning on, and it only allows the body diode to conduct. When driving capacitive loads with the DH and DL pins, a 20 Ω resistor must be placed in series with the capacitive load to reduce ground noise and ensure signal integrity. EXTERNAL COMP CONTROL The ADP1972 COMP pin is the input to the error amplifier that controls the PWM output on the DH pin or DL pin. The ADP1972 uses voltage mode control that compares an error signal, applied to the COMP pin by an external device, such as the AD8450, to an internal 4 V p-p triangle waveform. As the load changes, the error signal increases or decreases. The internal PWM comparator determines the appropriate duty cycle drive signal by monitoring the error signal at the COMP pin and the internal 4 V p-p ramp signal. The internal PWM comparator subsequently drives the external gate driver at the determined duty cycle through the DH and DL drive control pins. The functional voltage range of the COMP pin is from 0 V to 5.0 V. If VCOMP is less than 0.5 V (typical), the DH and DL outputs are disabled. If VCOMP is between 0.5 V and 4.5 V, the ADP1972 regulates the DH and DL outputs accordingly. If VCOMP is greater than 4.5 V, the ADP1972 operates the DH and DL outputs at the maximum programmed duty cycle (98% default). The input to the COMP pin must never exceed the 5.5 V absolute maximum rating. When the SS pin exceeds 0.52 V (typical), the ADP1972 resumes PWM regulation. Figure 21 shows the current limit block diagram for peak current limit protection. MODE SELECT M2 VREG 500mV ICL 20µA RCL 20kΩ CL RS 300mV 11884-025 PWM DRIVE SIGNALS Figure 21. Current Limit Block Diagram PWM FREQUENCY CONTROL The FREQ, SYNC, and SCFG pins are all used to determine the source, frequency, and synchronization of the clock signal that operates the PWM control of the ADP1972. Internal Frequency Control The ADP1972 frequency can be programmed with an external resistor connected between FREQ and ground. The range of frequency can be set from a minimum of 50 kHz to a maximum of 300 kHz. If the SCFG pin is tied to VREG, forcing VSCFG ≥ 4.53 V, or if the SCFG pin is left floating, the SYNC pin is configured as an output, and the ADP1972 operates at the frequency set by RFREQ, which outputs from the SYNC pin through the open drain device. The output clock of the SYNC pin operates with a 50% (typical) duty cycle. In this configuration, the SYNC pin can be used to synchronize other switching regulators in the system to the ADP1972. When the SYNC pin is configured as an output, an external pull-up resistor is needed from the SYNC pin to an external supply. The VREG pin of the ADP1972 is used as the external supply rail for the pull-up resistor. External Frequency Control CURRENT LIMIT When VSCFG ≤ 0.5 V, the SYNC pin is configured as an input, and the ADP1972 synchronizes to the external clock applied to the SYNC pin and operates as a slave device. This synchronization allows the ADP1972 to operate at the same switching frequency with the same phase as other switching regulators or devices in the system. When operating the ADP1972 with an external clock, select RFREQ to provide a frequency that approximates but is not equal to the external clock frequency, which is further explained in the Applications Information section. The ADP1972 features a peak hiccup current limit implementation. When the peak inductor current exceeds the programmed current limit for more than 500 consecutive clock cycles, 5.2 ms (typical) for a 100 kHz programmed frequency, the peak hiccup current limit condition occurs. PWM regulation of the output voltage then disables for 500 clock cycles, which is enough time for the output to discharge, and the average power dissipation to reduce. When the 500 clock cycles have expired, the ADP1972 restarts. When the voltage applied to the SCFG pin is 0.65 V < VSCFG < 4.25 V, the SYNC pin is configured as an input, and the ADP1972 synchronizes to a phase shifted version of the external clock applied to the SYNC pin. To adjust the phase shift, place a resistor (RSCFG) from SCFG to ground. The phase shift reduces the input supply ripple for systems containing multiple switching power supplies. The DL and DH signals swing from VREG (5 V typical) to ground. The external FET driver used must have input control pins compatible with a 5 V logic signal. Operating Frequency Phase Shift Rev. B | Page 12 of 18 Data Sheet ADP1972 MAXIMUM DUTY CYCLE The maximum duty cycle of the ADP1972 can be externally programmed to any value between 0% and 98% via an external resistor on the DMAX pin connected from DMAX to ground. The maximum duty cycle defaults to 98% if DMAX is left floating, is tied to VREG, or is programmed to a value greater than 98%. EXTERNAL FAULT SIGNALING The ADP1972 is equipped with a FAULT pin that signals the ADP1972 when an external fault condition occurs. The external fault signal stops PWM operation of the system to avoid damage to the application and components. When a voltage less than 1.05 V (typical) is applied to the FAULT pin, the ADP1972 disables. In this state, the DL and DH PWM drive signals are both driven low to prevent switching of the system dc-to-dc converter, and the soft start is reset. When a voltage greater than 1.20 V (typical) is applied to the FAULT pin, the ADP1972 begins switching. A voltage ranging from 0 V to 60 V can be applied to the FAULT pin of the ADP1972. THERMAL SHUTDOWN (TSD) The ADP1972 has a TSD protection circuit. The thermal shutdown triggers and disables switching when the junction temperature of the ADP1972 reaches 150°C (typical). While in TSD, the DL and DH signals are driven low and the CSS capacitor discharges to ground. VREG remains high. When the junction temperature decreases to 135°C (typical), the ADP1972 restarts the application control loop. Rev. B | Page 13 of 18 ADP1972 Data Sheet APPLICATIONS INFORMATION The ADP1972 has many programmable features that are optimized and controlled for a given application. The ADP1972 provides pins for selecting the operating mode, controlling the current limit, selecting an internal or external clock, setting the operating frequency, phase shifting the operating frequency, programming the maximum duty cycle, and adjusting the soft start. ADJUSTING THE OPERATING FREQUENCY BUCK OR BOOST SELECTION If VSCFG is ≤ 0.5 V, the SYNC pin is configured as an input, and the ADP1972 operates as a slave device. As a slave device, the ADP1972 synchronizes to the external clock applied to the SYNC pin. If the voltage applied to the SCFG pin is 0.65 V < VSCFG < 4.25 V, and a resistor is connected between SCFG and ground, the SYNC pin is configured as an input, and the ADP1972 synchronizes to a phase shifted version of the external clock applied to the SYNC pin. To operate the ADP1972 in boost/recycle mode, apply a voltage less than 1.05 V (typical) to the MODE pin. To operate the ADP1972 in buck/discharge mode, drive the MODE pin high, greater than 1.2 V (typical). The state of the MODE pin can only be changed when the ADP1972 is shutdown via the EN pin, or disabled via an external fault condition signaled on the FAULT pin, a TSD event, or a UVLO condition. SELECTING RS TO SET THE CURRENT LIMIT Whether operating the ADP1972 as a master or as a slave device, RFREQ must be carefully selected using the equations in the following sections. See Figure 21 for the current-limit block diagram for peak current-limit control. Use using the following equation to set the current limit: 100 mV Selecting RFREQ for a Master Device (1) RS where: IPK is the desired peak current-limit in mA. RS is the sense resistor used to set the peak current limit in Ω. When the ADP1972 is configured to operate in buck/charge mode, the internal current-limit reference is set to 300 mV (typical). When the ADP1972 is configured to operate in boost/recycle mode, the internal current-limit reference is set to 500 mV (typical). The external resistor, RCL, is needed to offset the current properly to detect the peak in both buck and boost operation. Set the value of RCL to 20 kΩ. In operation, the equation for setting the peak current follows: For buck/charge mode, it is (2) Figure 22 shows the relationship between the programmed switching frequency (fSET) and the value of RFREQ. 210 190 170 130 110 90 70 For boost/recycle mode, it is VREF (BOOST) = (ICL) × (RCL) + (IPK) × (RS) 150 50 (3) 30 50 where: VREF (BUCK) = 300 mV, typical. VREF (BOOST) = 500 mV, typical. ICL = 20 µA, typical. RCL = 20 kΩ. 100 150 200 250 300 fSET (kHz) 11884-026 VREF (BUCK) = (ICL) × (RCL) − (IPK) × (RS) When VSCFG is ≥ 4.53 V, the ADP1972 operates as a master device. When functioning as a master device, the ADP1972 operates at the frequency set by the external RFREQ resistor connected between FREQ and ground, and the ADP1972 outputs a clock at the programmed frequency on the SYNC pin. RFREQ (MASTER) (kΩ) I PK (mA ) = If the SCFG pin is tied to VREG, forcing VSCFG ≥ 4.53 V, or if SCFG is left floating and internally tied to VREG, the ADP1972 operates at the frequency set by RFREQ, and the SYNC pin outputs a clock at the programmed frequency. When VSCFG ≥ 4.53 V, the output clock on the SYNC pin can be used as a master clock in applications that require synchronization. Figure 22. RFREQ vs. Switching Frequency (fSET) Use the following equation to calculate the RFREQ value for a desired master clock synchronization frequency: The ADP1972 is designed so that the peak current limit is the same in both the buck mode and boost mode of operation. A 1% or better tolerance for the RCL and RS resistors is recommended. RFREQ ( MASTER ) (kΩ ) = 10 4 f SET (kHz) (4) where: fSET is the switching frequency in kHz. RFREQ (MASTER) is the resistor in kΩ to set the frequency for master devices. Rev. B | Page 14 of 18 Data Sheet ADP1972 Selecting RFREQ for a Slave Device To configure the ADP1972 as a slave device, drive VSCFG < 4.53 V. When functioning as a slave device, the ADP1972 operates at the frequency of the external clock applied to the SYNC pin. To ensure proper synchronization, select RFREQ to set the frequency to a value slightly slower than that of the master clock by using the following equation: RFREQ (SLAVE) = 1.11 × RFREQ (MASTER) (5) where: RFREQ (MASTER) is the resistor value that corresponds to the frequency of the master clock applied to the SYNC pin. RFREQ (SLAVE) is the resistor value that appropriately scales the frequency for the slave device, and 1.11 is the RFREQ slave to master ratio for synchronization. Lastly, to calculate the phase delay (TDELAY), use the following equation: RSCFG (kΩ) = 0.45 × RFREQ (SLAVE) (kΩ) + 50 × TDELAY (μs) where: RSCFG is the corresponding resistor for the desired phase shift in kHz. When using the phase shift feature, connect a capacitor of 47 pF or greater in parallel with RSCFG. Alternatively, the SCFG pin can be controlled with a voltage source. When using an independent voltage source, ensure VSCFG ≤ VREG under all conditions. When the ADP1972 is disabled via the EN pin or UVLO, VREG = 0 V, and the voltage source must adjust accordingly to ensure VSCFG ≤ VREG. Figure 23 shows the internal voltage ramp of the ADP1972. The voltage ramp has a well controlled 4 V p-p. T 4.5V 0.5V 0.01T 0.99T Programming the External Clock Phase Shift Figure 23. Internal Voltage Ramp If a phase shift is not required for slave devices, connect SCFG of each slave device to ground. For devices that require a phase shifted version of the synchronization clock that is applied to the SYNC pin of the slave devices, connect a resistor (RSCFG) from SCFG to ground to program the desired phase shift. To determine the RSCFG for a desired phase shift (φSHIFT), start by calculating the frequency of the slave clock (fSLAVE). 10 4 PROGRAMMING THE MAXIMUM DUTY CYCLE The ADP1972 is designed with a 98% (typical) internal maximum duty cycle. By connecting a resistor from DMAX to ground, the maximum duty cycle can be programmed at any value from 0% to 98%, using the following equation: D MAX % 1 10 3 f SLAVE (kHz) (7) where: TSLAVE is the period of the master clock in μs. fSLAVE is the frequency of the master clock in kHz. φ SHIFT TSLAVE μs 360 where: TDELAY is the phase delay in μs. φSHIFT is the desired phase shift. RFREQ 10.5 (10) where: DMAX is the programmed maximum duty cycle. VFREQ is 1.252 V (typical). RDMAX is the value of the resistance used to program the maximum duty cycle. RFREQ is the frequency set resistor used in the application. The current source of DMAX is equivalent to the programmed current of the FREQ pin: Next, determine the phase time delay (TDELAY) for the desired phase shift (φSHIFT) using the following equation: TDELAY μs 21.5 VFREQ RDMAX (6) RFREQ(SLAVE) Next, calculate the period of the slave clock. TSLAVE μs 11884-027 The frequency of the slave device is set to a frequency slightly lower than that of the master device to allow the digital synchronization loop of the ADP1972 to synchronize to the master clock period. The slave device has approximately a 30% range capability to adjust to match the master clock value. Setting RFREQ (SLAVE) to 1.11× larger than RFREQ (MASTER) runs the synchronization loop in approximately the center of the adjustment range. f SLAVE (kHz) (9) I DMAX I FREQ (8) VFREQ RFREQ (11) where IDMAX = IFREQ = the current programmed on the FREQ pin. The maximum allowable duty cycle of the ADP1972 is 98% (typical). If the resistor on DMAX sets a maximum duty cycle larger than 98%, the ADP1972 defaults to its internal maximum. If the 98% internal maximum duty cycle is sufficient for the application, tie the DMAX pin to VREG or leave it floating. The CDMAX capacitor connected from the DMAX pin to GND must be 47 pF or greater. Rev. B | Page 15 of 18 ADP1972 Data Sheet ADJUSTING THE SOFT START PERIOD The ADP1972 has a programmable soft start feature that prevents output voltage overshoot during startup. Refer to Figure 18 for a soft start diagram. Use the following equation to calculate the delay time before switching is enabled (tREG): t REG = 0.52 × C SS I SS (12) A CSS capacitor is not required for the ADP1972. When the CSS capacitor is not used, the internal 5 µA (typical) current source immediately pulls the SS pin voltage to VREG. When a CSS capacitor is not used, there is no soft start control internal to the ADP1972, and the system could produce a large output overshoot and a large peak inductor spike during startup. When a CSS is not used, ensure that the output overshoot is not large enough to trip the hiccup current limit during startup. where ISS = 5 µA, typical. Rev. B | Page 16 of 18 Data Sheet ADP1972 PCB LAYOUT GUIDELINES • When building a system with a master and multiple slave devices, the capacitance of the trace attached to the SYNC pin must be minimized. o For small systems with only a few slave devices, a resistor connected in series between the master SYNC signal and the slave SYNC input pins limits the capacitance of the trace and reduces the fast ground currents that can inject noise into the master device. o For larger applications, the series resistance is not enough to isolate the master SYNC clock. In larger systems, use an external buffer to reduce the capacitance of the trace. The external buffer has the drive capability to support a large number of slave devices. Use the following guidelines when designing the PCB (see Figure 16 for the block diagram and Figure 2 for the pin configuration). • • • • • • • • • Keep the low effective series resistance (ESR) input supply capacitor for VIN (CIN) as close as possible to the VIN and GND pins to minimize noise being injected into the device from board parasitic inductance. Keep the low ESR input supply capacitor for VREG (CVREG) as close as possible to the VREG and GND pins to minimize noise being injected into the device from board parasitic inductance. Place the components for the SCFG, FREQ, DMAX, and SS pins close to the corresponding pins. Tie these components collectively to an AGND plane that makes a Kelvin connection to the GND pin. Keep the trace from the COMP pin to the accompanying device (for example, AD8450) as short as possible. Avoid routing this trace near switching signals and shield the trace if possible. Place any trace or components for the SYNC pin away from sensitive analog nodes. When using an external pull-up, it is best to use a local 0.1 µF bypass capacitor from the supply of the pull-up resistor to GND. Keep the traces from the DH and DL pins to the external components as short as possible to minimize parasitic inductance and capacitance, which affect the control signal. The DH and DL pins are switching nodes; do not route them near any sensitive analog circuitry. Keep high current traces as short and as wide as possible. Connect the ground connection of the ADP1972 directly to the ground connection of the current sense, RS, resistor. Connect CL through a 20 kΩ resistor directly to RS. Use a Kelvin connection shown in Figure 24 and Figure 25 from the following: o The GND pin to the ground point for RS o The GNDSENSE pin to the ground point for RS o The system power ground to the ground point of RS Extra resistance due to PCB routing introduces a voltage difference between the GND pin and the GNDSENSE pin. This voltage difference must not exceed ±0.3 V. CL RCL 20kΩ NMOS POWER FET SOURCE GNDSENSE RS GND GROUND BUS Figure 24. Recommended RS Kelvin Ground Connection CL GNDSENSE GND Figure 25. Recommended RS Kelvin Ground Connection on PCB Layout Rev. B | Page 17 of 18 11884-029 • 11884-028 For high efficiency, good regulation, and stability, a well designed PCB layout is required. ADP1972 Data Sheet OUTLINE DIMENSIONS 5.10 5.00 4.90 16 9 4.50 4.40 4.30 6.40 BSC 1 8 PIN 1 1.20 MAX 0.15 0.05 0.20 0.09 0.30 0.19 0.65 BSC COPLANARITY 0.10 SEATING PLANE 8° 0° 0.75 0.60 0.45 COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 26. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters ORDERING GUIDE Model1 ADP1972ARUZ-R7 ADP1972ARUZ-RL ADP1972-EVALZ 1 Temperature Range −40°C to +125°C −40°C to +125°C Package Description 16-Lead Thin Shrink Small Outline Package [TSSOP], 7” Tape and Reel 16-Lead Thin Shrink Small Outline Package [TSSOP], 13” Tape and Reel Evaluation Board Z = RoHS Compliant Part. ©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D11884-0-11/14(B) Rev. B | Page 18 of 18 Package Option RU-16 RU-16 Ordering Quantity 1,000 2,500