PDF Data Sheet Rev. E

FEATURES
FUNCTIONAL BLOCK DIAGRAM
Isolated RS-485/RS-422 transceiver, configurable as half or
full duplex
isoPower® integrated isolated dc-to-dc converter
±15 kV ESD protection on RS-485 input/output pins
Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E)
ADM2582E data rate: 16 Mbps
ADM2587E data rate: 500 kbps
5 V or 3.3 V operation
Connect up to 256 nodes on one bus
Open- and short-circuit, fail-safe receiver inputs
High common-mode transient immunity: >25 kV/μs
Thermal shutdown protection
Safety and regulatory approvals
UL recognition: 2500 V rms for 1 minute per UL 1577
VDE Certificates of Conformity
DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01
VIORM = 560 V peak
Operating temperature range: −40°C to +85°C
Highly integrated, 20-lead, wide-body SOIC package
VCC
VISOOUT
isoPower DC-TO-DC CONVERTER
OSCILLATOR
RECTIFIER
VISOIN
REGULATOR
DIGITAL ISOLATION iCoupler
TRANSCEIVER
Y
TxD
ENCODE
DECODE
D
Z
DE
ENCODE
DECODE
RxD
DECODE
ENCODE
A
R
B
ADM2582E/ADM2587E
RE
GND1
ISOLATION
BARRIER
GND2
08111-001
Data Sheet
Signal and Power Isolated RS-485
Transceiver with ±15 kV ESD Protection
ADM2582E/ADM2587E
Figure 1.
APPLICATIONS
Isolated RS-485/RS-422 interfaces
Industrial field networks
Multipoint data transmission systems
GENERAL DESCRIPTION
The ADM2582E/ADM2587E are fully integrated signal and
power isolated data transceivers with ±15 kV ESD protection
and are suitable for high speed communication on multipoint
transmission lines. The ADM2582E/ADM2587E include an
integrated isolated dc-to-dc power supply, which eliminates the
need for an external dc-to-dc isolation block.
They are designed for balanced transmission lines and comply
with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E).
The devices integrate Analog Devices, Inc., iCoupler® technology to
combine a 3-channel isolator, a three-state differential line driver, a
differential input receiver, and Analog Devices isoPower dc-to-dc
converter into a single package. The devices are powered by a
single 5 V or 3.3 V supply, realizing a fully integrated signal and
power isolated RS-485 solution.
Rev. E
The ADM2582E/ADM2587E driver has an active high enable.
An active low receiver enable is also provided, which causes the
receiver output to enter a high impedance state when disabled.
The devices have current limiting and thermal shutdown
features to protect against output short circuits and situations
where bus contention may cause excessive power dissipation.
The parts are fully specified over the industrial temperature
range and are available in a highly integrated, 20-lead, wide-body
SOIC package.
The ADM2582E/ADM2587E contain isoPower technology that
uses high frequency switching elements to transfer power through
the transformer. Special care must be taken during printed circuit
board (PCB) layout to meet emissions standards. Refer to the
AN-0971 Application Note, Control of Radiated Emissions with
isoPower Devices, for details on board layout considerations.
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ADM2582E/ADM2587E
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Test Circuits ..................................................................................... 12
Applications ....................................................................................... 1
Switching Characteristics .............................................................. 13
Functional Block Diagram .............................................................. 1
Circuit Description......................................................................... 14
General Description ......................................................................... 1
Signal Isolation ........................................................................... 14
Revision History ............................................................................... 2
Power Isolation ........................................................................... 14
Specifications..................................................................................... 3
Truth Tables................................................................................. 14
ADM2582E Timing Specifications ............................................ 4
Thermal Shutdown .................................................................... 14
ADM2587E Timing Specifications ............................................ 4
Open- and Short-Circuit, Fail-Safe Receiver Inputs.............. 14
ADM2582E/ADM2587E Package Characteristics ................... 4
DC Correctness and Magnetic Field Immunity........................... 14
ADM2582E/ADM2587E Regulatory Information .................. 5
Applications Information .............................................................. 16
ADM2582E/ADM2587E Insulation and Safety-Related
Specifications ................................................................................ 5
PCB Layout ................................................................................. 16
ADM2582E/ADM2587E VDE 0884 Insulation
Characteristics .............................................................................. 5
Insulation Lifetime ..................................................................... 16
Absolute Maximum Ratings............................................................ 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
EMI Considerations ................................................................... 16
Isolated Power Supply Considerations .................................... 17
Typical Applications ................................................................... 18
Outline Dimensions ....................................................................... 20
Ordering Guide .......................................................................... 20
REVISION HISTORY
10/14—Rev. D to Rev. E
Changes to Table 12 ........................................................................ 14
9/14—Rev. C to Rev. D
Changes to Figure 9 .......................................................................... 9
6/11—Rev. B to Rev. C
Changes to Features Section and Figure 1..................................... 1
Changes to Table 4 ............................................................................ 4
Changes to Table 5 ............................................................................ 5
Deleted Table 6; Renumbered Sequentially .................................. 5
Added Thermal Resistance θJA Parameter, Table 8....................... 6
Changes to Table 9 ............................................................................ 6
Changes to Table 10 .......................................................................... 7
Changes to Table 13 ........................................................................ 14
Moved DC Correctness and Magnetic Field Immunity
Section .............................................................................................. 14
Changes to PCB Layout Section and Figure 35 .......................... 16
Changes to Figure 39 ...................................................................... 17
Changes to Typical Applications Section and Figure 40 ........... 18
3/11—Rev. A to Rev. B
Removed Pending from Safety and Regulatory
Approvals ........................................................................ Throughout
Changed Minimum External Air Gap (Clearance) Value and
Minimum External Tracking (Creepage) Value ............................5
Added Text to the ADM2582E/ADM2587E VDE 0884
Insulation Characteristics Section ..................................................5
9/10—Rev. 0 to Rev. A
Changes to Features Section ............................................................1
Changes to Differential Output Voltage, Loaded Parameter,
Table 1 .................................................................................................3
Changes to Table 5.............................................................................5
Added Table 6; Renumbered Sequentially .....................................5
Change to Pin 8 Description, Table 11 ...........................................7
Changes to Figure 5 and Figure 6 ....................................................8
Changes to Table 13 and Table 14 ................................................ 14
9/09—Revision 0: Initial Version
Rev. E | Page 2 of 20
Data Sheet
ADM2582E/ADM2587E
SPECIFICATIONS
All voltages are relative to their respective ground; 3.0 ≤ VCC ≤ 5.5 V. All minimum/maximum specifications apply over the entire
recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 5 V unless otherwise noted.
Table 1.
Parameter
ADM2587E SUPPLY CURRENT
Data Rate ≤ 500 kbps
Symbol
ICC
ADM2582E SUPPLY CURRENT
Data Rate = 16 Mbps
ICC
ISOLATED SUPPLY VOLTAGE
DRIVER
Differential Outputs
Differential Output Voltage, Loaded
VISOUT
Δ|VOD| for Complementary Output States
Common-Mode Output Voltage
Δ|VOC| for Complementary Output States
Short-Circuit Output Current
Output Leakage Current (Y, Z)
Min
Typ
Max
Unit
Test Conditions
120
mA
mA
mA
mA
mA
VCC = 3.3 V, 100 Ω load between Y and Z
VCC = 5 V, 100 Ω load between Y and Z
VCC = 3.3 V, 54 Ω load between Y and Z
VCC = 5 V, 54 Ω load between Y and Z
120 Ω load between Y and Z
150
230
mA
mA
120 Ω load between Y and Z
54 Ω load between Y and Z
3.6
3.6
3.6
0.2
3.0
0.2
200
30
V
V
V
V
V
V
mA
µA
RL = 100 Ω (RS-422), see Figure 23
RL = 54 Ω (RS-485), see Figure 23
−7 V ≤ VTEST1 ≤ 12 V, see Figure 24
RL = 54 Ω or 100 Ω, see Figure 23
RL = 54 Ω or 100 Ω, see Figure 23
RL = 54 Ω or 100 Ω, see Figure 23
90
72
125
98
|VOD2|
|VOD3|
Δ|VOD|
VOC
Δ|VOC|
IOS
IO
3.3
2.0
1.5
1.5
−30
Logic Inputs DE, RE, TxD
Input Threshold Low
Input Threshold High
Input Current
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Input Voltage Hysteresis
Input Current (A, B)
Line Input Resistance
Logic Outputs
Output Voltage Low
Output Voltage High
Short-Circuit Current
COMMON-MODE TRANSIENT IMMUNITY1
1
µA
VIL
VIH
II
0.3 × VCC
−10
0.01
VTH
VHYS
II
−200
−125
15
0.7 × VCC
10
−30
125
RIN
−100
96
VOL
VOH
VCC − 0.3
0.2
VCC − 0.2
0.4
100
25
DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = 12 V
DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V,
VIN = −7 V
V
V
µA
DE, RE, TxD
DE, RE, TxD
DE, RE, TxD
mV
mV
µA
µA
kΩ
−7 V < VCM < +12 V
VOC = 0 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V
−7 V < VCM < +12 V
V
V
mA
kV/µs
IO = 1.5 mA, VA − VB = −0.2 V
IO = −1.5 mA, VA − VB = 0.2 V
VCM = 1 kV, transient magnitude = 800 V
CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential
difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates
apply to both rising and falling common-mode voltage edges.
Rev. E | Page 3 of 20
ADM2582E/ADM2587E
Data Sheet
ADM2582E TIMING SPECIFICATIONS
TA = −40°C to +85°C.
Table 2.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew
Rise Time/Fall Time
Enable Time
Disable Time
RECEIVER
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew1
Enable Time
Disable Time
1
Symbol
Min
Typ
Max
Unit
Test Conditions
tDPLH
tDPHL
tSKEW
tDR, tDF
tZL, tZH
tLZ, tHZ
63
64
1
100
100
8
15
120
150
Mbps
ns
ns
ns
ns
ns
ns
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
tRPLH
tRPHL
tSKEW
tZL, tZH
tLZ, tHZ
94
95
1
110
110
12
15
15
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
Typ
Max
Unit
Test Conditions
503
510
7
700
700
100
1100
2.5
200
kbps
ns
ns
ns
ns
µs
ns
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
91
95
4
200
200
30
15
15
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
CL = 15 pF, see Figure 27 and Figure 30
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
16
Guaranteed by design.
ADM2587E TIMING SPECIFICATIONS
TA = −40°C to +85°C.
Table 3.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew
Rise Time/Fall Time
Enable Time
Disable Time
RECEIVER
Propagation Delay, Low to High
Propagation Delay, High to Low
Output Skew
Enable Time
Disable Time
Symbol
tDPLH
tDPHL
tSKEW
tDR, tDF
tZL, tZH
tLZ, tHZ
tRPLH
tRPHL
tSKEW
tZL, tZH
tLZ, tHZ
Min
500
250
250
200
ADM2582E/ADM2587E PACKAGE CHARACTERISTICS
Table 4.
Parameter
Resistance (Input-to-Output)1
Capacitance (Input-to-Output)1
Input Capacitance2
1
2
Symbol
RI-O
CI-O
CI
Min
Typ
1012
3
4
Max
Device considered a 2-terminal device: short together Pin 1 to Pin 10 and short together Pin 11 to Pin 20.
Input capacitance is from any input data pin to ground.
Rev. E | Page 4 of 20
Unit
Ω
pF
pF
Test Conditions
f = 1 MHz
Data Sheet
ADM2582E/ADM2587E
ADM2582E/ADM2587E REGULATORY INFORMATION
Table 5. ADM2582E/ADM2587E Approvals
Organization
UL
VDE
Approval Type
Recognized under the Component
Recognition Program of Underwriters
Laboratories, Inc.
Certified according to DIN EN 60747-5-2
(VDE 0884 Part 2): 2003-01
Notes
In accordance with UL 1577, each ADM2582E/ADM2587E is proof tested
by applying an insulation test voltage ≥ 3000 V rms for 1 second.
In accordance with DIN EN 60747-5-2, each ADM2582E/ADM2587E is
proof tested by applying an insulation test voltage ≥ 1050 VPEAK for
1 second.
ADM2582E/ADM2587E INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 6.
Parameter
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
Symbol
L(I01)
Value
2500
7.7
Unit
V rms
mm
Minimum External Tracking (Creepage)
L(I02)
7.6
mm
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Isolation Group
CTI
0.017 min
>175
IIIa
mm
V
Conditions
1-minute duration
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance along body
Insulation distance through insulation
DIN IEC 112/VDE 0303-1
Material Group (DIN VDE 0110: 1989-01, Table 1)
ADM2582E/ADM2587E VDE 0884 INSULATION CHARACTERISTICS
This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by
means of protective circuits.
An asterisk (*) on packages denotes VDE 0884 Part 2 approval.
Table 7.
Description
CLASSIFICATIONS
Installation Classification per DIN VDE 0110 for
Rated Mains Voltage
≤150 V rms
≤300 V rms
≤400 V rms
Climatic Classification
Pollution Degree
VOLTAGE
Maximum Working Insulation Voltage
Input-to-Output Test Voltage
Method b1
Method a
After Environmental Tests, Subgroup 1
After Input and/or Safety Test,
Subgroup 2/Subgroup 3
Highest Allowable Overvoltage
SAFETY-LIMITING VALUES
Case Temperature
Input Current
Output Current
Insulation Resistance at TS
Conditions
Symbol
Characteristic
Unit
I to IV
I to III
I to II
40/85/21
2
DIN VDE 0110, see Table 1
VIORM
VPR
560
V peak
VIORM × 1.875 = VPR, 100% production tested,
tm = 1 sec, partial discharge < 5 pC
1050
V peak
VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC
896
672
V peak
V peak
VTR
4000
V peak
TS
IS, INPUT
IS, OUTPUT
RS
150
265
335
>109
°C
mA
mA
Ω
Transient overvoltage, tTR = 10 sec
Maximum value allowed in the event of a failure
VIO = 500 V
Rev. E | Page 5 of 20
ADM2582E/ADM2587E
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. All voltages are relative to
their respective ground.
Table 8.
Parameter
VCC
Digital Input Voltage (DE, RE, TxD)
Digital Output Voltage (RxD)
Driver Output/Receiver Input Voltage
Operating Temperature Range
Storage Temperature Range
ESD (Human Body Model) on
A, B, Y, and Z pins
ESD (Human Body Model) on Other Pins
Thermal Resistance θJA
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
−0.5 V to +7 V
−0.5 V to VDD + 0.5 V
−0.5 V to VDD + 0.5 V
−9 V to +14 V
−40°C to +85°C
−55°C to +150°C
±15 kV
±2 kV
50°C/W
Table 9. Maximum Continuous Working Voltage1
Parameter
AC Voltage
Bipolar Waveform
Max
Unit
Reference Standard
424
V peak
50-year minimum
lifetime
Unipolar Waveform
Basic Insulation
560
V peak
Maximum approved
working voltage per
VDE 0884 Part 2
DC Voltage
Basic Insulation
560
V peak
Maximum approved
working voltage per
VDE 0884 Part 2
1
260°C
215°C
220°C
Refers to continuous voltage magnitude imposed across the isolation
barrier. See the Insulation Lifetime section for more details.
ESD CAUTION
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. E | Page 6 of 20
Data Sheet
ADM2582E/ADM2587E
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
20 GND2
GND1 1
19 VISOIN
VCC 2
RxD 4
RE 5
DE 6
TxD 7
VCC 8
18 A
ADM2582E
ADM2587E
17 B
16 GND2
TOP VIEW
(Not to Scale) 15 Z
14 GND2
13 Y
GND1 9
12 VISOOUT
GND1 10
11 GND2
NOTES
1. PIN 12 AND PIN 19 MUST BE
CONNECTED EXTERNALLY.
08111-002
GND1 3
Figure 2. Pin Configuration
Table 10. Pin Function Description
Pin No.
1
2
Mnemonic
GND1
VCC
3
4
GND1
RxD
5
RE
6
7
8
DE
TxD
VCC
9
10
11
12
GND1
GND1
GND2
VISOOUT
13
14
15
16
17
18
19
Y
GND2
Z
GND2
B
A
VISOIN
20
GND2
Description
Ground, Logic Side.
Logic Side Power Supply. It is recommended that a 0.1 µF and a 0.01 µF decoupling capacitor be fitted between
Pin 2 and Pin 1.
Ground, Logic Side.
Receiver Output Data. This output is high when (A − B) ≥ −30 mV and low when (A − B) ≤ –200 mV.
The output is tristated when the receiver is disabled, that is, when RE is driven high.
Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver; driving it
high disables the receiver.
Driver Enable Input. Driving this input high enables the driver; driving it low disables the driver.
Driver Input. Data to be transmitted by the driver is applied to this input.
Logic Side Power Supply. It is recommended that a 0.1 µF and a 10 µF decoupling capacitor be fitted between
Pin 8 and Pin 9.
Ground, Logic Side.
Ground, Logic Side.
Ground, Bus Side.
Isolated Power Supply Output. This pin must be connected externally to VISOIN. It is recommended that a reservoir
capacitor of 10 µF and a decoupling capacitor of 0.1 µF be fitted between Pin 12 and Pin 11.
Driver Noninverting Output
Ground, Bus Side.
Driver Inverting Output
Ground, Bus Side.
Receiver Inverting Input.
Receiver Noninverting Input.
Isolated Power Supply Input. This pin must be connected externally to VISOOUT. It is recommended that a
0.1 µF and a 0.01 µF decoupling capacitor be fitted between Pin 19 and Pin 20.
Ground, Bus Side.
Rev. E | Page 7 of 20
ADM2582E/ADM2587E
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
180
140
120
RL = 54Ω
140
SUPPLY CURRENT, ICC (mA)
120
RL = 120Ω
100
80
NO LOAD
60
40
100
80
60
40
NO LOAD
10
35
TEMPERATURE (°C)
60
85
08111-103
–15
0
–40
Figure 3. ADM2582E Supply Current (ICC) vs. Temperature
(Data Rate = 16 Mbps, DE = 3.3 V, VCC = 3.3 V)
–15
10
35
TEMPERATURE (°C)
60
85
Figure 6. ADM2587E Supply Current (ICC) vs. Temperature
(Data Rate = 500 kbps, DE = 3.3 V, VCC = 3.3 V)
140
72
70
DRIVER PROPAGATION DELAY (ns)
RL = 54Ω
120
SUPPLY CURRENT, ICC (mA)
RL = 120Ω
20
20
0
–40
RL = 54Ω
08111-105
SUPPLY CURRENT, ICC (mA)
160
100
RL = 120Ω
80
60
NO LOAD
40
20
68
66
64
tDPHL
62
tDPLH
60
58
56
54
–15
10
35
TEMPERATURE (°C)
60
85
50
–40
08111-104
0
–40
Figure 4. ADM2582E Supply Current (ICC) vs. Temperature
(Data Rate = 16 Mbps, DE = 5 V, VCC = 5 V)
–15
10
35
TEMPERATURE (°C)
60
85
08111-107
52
Figure 7. ADM2582E Differential Driver Propagation Delay vs. Temperature
120
600
580
DRIVER PROPAGATION DELAY (ns)
RL = 54Ω
80
RL = 120Ω
60
40
NO LOAD
20
560
540
tDPLH
520
tDPHL
500
480
460
440
0
–40
–15
10
35
TEMPERATURE (°C)
60
Figure 5. ADM2587E Supply Current (ICC) vs. Temperature
(Data Rate = 500 kbps, DE = 5 V, VCC = 5 V)
85
400
–40
–15
10
35
TEMPERATURE (°C)
60
85
08111-108
420
08111-106
SUPPLY CURRENT, ICC (mA)
100
Figure 8. ADM2587E Differential Driver Propagation Delay vs. Temperature
Rev. E | Page 8 of 20
Data Sheet
ADM2582E/ADM2587E
60
TxD
OUTPUT CURRENT (mA)
50
1
Y
40
30
20
Z
10
CH2 2.0V
M10.00ns
A CH1
1.28V
0
08111-109
CH1 2.0V
CH3 2.0V
0
Figure 9. ADM2582E Driver Propagation Delay
1
2
3
OUTPUT VOLTAGE (V)
4
5
08111-112
3
Figure 12. Receiver Output Current vs. Receiver Output Low Voltage
4.75
4.74
OUTPUT VOLTAGE(V)
4.73
TxD
1
Z
Y
4.72
4.71
4.70
4.69
4.68
4.67
3
CH2 2.0V
M200ns
A CH1
2.56V
4.65
–40
08111-110
CH1 2.0V
CH3 2.0V
Figure 10. ADM2587E Driver Propagation Delay
10
35
TEMPERATURE (°C)
60
85
Figure 13. Receiver Output High Voltage vs. Temperature
0
0.32
–10
0.30
–20
OUTPUT VOLTAGE (V)
–30
–40
–50
0.28
0.26
0.24
0.22
–60
0
1
2
3
OUTPUT VOLTAGE (V)
4
5
0.20
–40
08111-111
–70
Figure 11. Receiver Output Current vs. Receiver Output High Voltage
–15
10
35
TEMPERATURE (°C)
60
Figure 14. Receiver Output Low Voltage vs. Temperature
Rev. E | Page 9 of 20
85
08111-114
OUTPUT CURRENT (mA)
–15
08111-113
4.66
ADM2582E/ADM2587E
Data Sheet
B
A
1
RxD
3
CH2 2.0V
M10.00ns
A CH1
2.56V
98
97
96
Figure 15. ADM2582E Receiver Propagation Delay
tRPHL
95
94
93
92
tRPLH
91
90
–40
08111-115
CH1 2.0V
CH3 2.0V
99
–15
10
35
TEMPERATURE (°C)
60
85
08111-118
RECEIVER PROPAGATION DELAY (ns)
100
Figure 18. ADM2587E Receiver Propagation Delay vs. Temperature
3.33
ISOLATED SUPPLY VOLTAGE (V)
A
B
1
RxD
A CH1
2.56V
3.29
NO LOAD
RL = 120Ω
RL = 54Ω
3.28
3.26
–40
–15
10
35
TEMPERATURE (°C)
60
85
Figure 19. ADM2582E Isolated Supply Voltage vs. Temperature
(VCC = 3.3 V, Data Rate = 16 Mbps)
Figure 16. ADM2587E Receiver Propagation Delay
98
3.36
3.35
96
tRPHL
95
tRPLH
94
93
3.34
3.33
3.32
3.31
3.30
3.29
NO LOAD
RL = 120Ω
RL = 54Ω
3.28
3.27
92
–40
–15
10
35
TEMPERATURE (°C)
60
85
3.26
–40
–15
10
35
TEMPERATURE (°C)
60
85
Figure 20. ADM2582E Isolated Supply Voltage vs. Temperature
(VCC = 5 V, Data Rate = 16 Mbps)
Figure 17. ADM2582E Receiver Propagation Delay vs. Temperature
Rev. E | Page 10 of 20
08111-120
ISOLATED SUPPLY VOLTAGE (V)
97
08111-117
RECEIVER PROPAGATION DELAY (ns)
3.30
08111-119
M10.00ns
08111-116
CH2 2.0V
3.31
3.27
3
CH1 2.0V
CH3 2.0V
3.32
Data Sheet
ADM2582E/ADM2587E
40
RL = 54Ω
40
ISOLATED SUPPLY CURRENT (mA)
50
RL = 120Ω
30
NO LOAD
20
10
30
RL = 120Ω
25
20
15
10
NO LOAD
5
–15
10
35
TEMPERATURE (°C)
60
85
Figure 21. ADM2582E Isolated Supply Current vs. Temperature
(VCC = 3.3 V, Data Rate = 16 Mbps)
0
–40
–15
10
35
TEMPERATURE (°C)
60
85
Figure 22. ADM2587E Isolated Supply Current vs. Temperature
(VCC = 3.3 V, Data Rate = 500 kbps)
Rev. E | Page 11 of 20
08111-122
0
–40
RL = 54Ω
35
08111-121
ISOLATED SUPPLY CURRENT (mA)
60
ADM2582E/ADM2587E
Data Sheet
TEST CIRCUITS
RL
2
Y
VOD2
VOUT
VOC
TxD
08111-003
Z
Y
S1
Figure 26. Driver Enable/Disable
Figure 23. Driver Voltage Measurement
Y
375Ω
A
60Ω
375Ω
VTEST
B
08111-004
Z
VOUT
RE
CL
Figure 27. Receiver Propagation Delay
Figure 24. Driver Voltage Measurement
VCC
+1.5V
Y
TxD
CL
S1
RL
RE
08111-005
Z
RL
–1.5V
CL
S2
CL
VOUT
RE IN
Figure 28. Receiver Enable/Disable
Figure 25. Driver Propagation Delay
Rev. E | Page 12 of 20
08111-008
VOD3
TxD
S2
CL
50pF
Z
DE
VCC
RL
110Ω
08111-006
RL
2
08111-007
TxD
Data Sheet
ADM2582E/ADM2587E
SWITCHING CHARACTERISTICS
VCC
VCC/2
VCC/2
0V
tDPLH
tDPHL
VCC
Z
1/2VO
DE
0.5VCC
0.5VCC
VO
0V
tZL
Y
Y, Z
90% POINT
VDIFF
VOL
tZH
10% POINT
10% POINT
tDF
tDR
tHZ
2.3V
VOH
VOH – 0.5V
Y, Z
08111-011
–VO
VOL + 0.5V
90% POINT
VDIFF = V(Y) – V(Z)
08111-009
+VO
tLZ
2.3V
tSKEW = │tDPHL – tDPLH │
Figure 31. Driver Enable/Disable Timing
Figure 29. Driver Propagation Delay, Rise/Fall Timing
0.7VCC
RE
0.5VCC
0.5VCC
0.3VCC
0V
0V
tRPLH
tRPHL
tLZ
tZL
1.5V
RO
VOH
VOL + 0.5V
OUTPUT LOW
tZH
VOL
tHZ
OUTPUT HIGH
1.5V
tSKEW = |tRPLH – tRPHL |
1.5V
RO
VOL
08111-010
RxD
1.5V
VOH – 0.5V
0V
Figure 32. Receiver Enable/Disable Timing
Figure 30. Receiver Propagation Delay
Rev. E | Page 13 of 20
VOH
08111-012
A–B
ADM2582E/ADM2587E
Data Sheet
CIRCUIT DESCRIPTION
SIGNAL ISOLATION
Table 13. Receiving (see Table 11 for Abbreviations)
The ADM2582E/ADM2587E signal isolation is implemented on
the logic side of the interface. The part achieves signal isolation
by having a digital isolation section and a transceiver section
(see Figure 1). Data applied to the TxD and DE pins and referenced
to logic ground (GND1) are coupled across an isolation barrier
to appear at the transceiver section referenced to isolated ground
(GND2). Similarly, the single-ended receiver output signal,
referenced to isolated ground in the transceiver section, is
coupled across the isolation barrier to appear at the RXD pin
referenced to logic ground.
POWER ISOLATION
The ADM2582E/ADM2587E power isolation is implemented
using an isoPower integrated isolated dc-to-dc converter. The
dc-to-dc converter section of the ADM2582E/ADM2587E works
on principles that are common to most modern power supplies. It
is a secondary side controller architecture with isolated pulse-width
modulation (PWM) feedback. VCC power is supplied to an
oscillating circuit that switches current into a chip-scale air core
transformer. Power transferred to the secondary side is rectified
and regulated to 3.3 V. The secondary (VISO) side controller
regulates the output by creating a PWM control signal that is
sent to the primary (VCC) side by a dedicated iCoupler data
channel. The PWM modulates the oscillator circuit to control
the power being sent to the secondary side. Feedback allows for
significantly higher power and efficiency.
TRUTH TABLES
The truth tables in this section use the abbreviations found in
Table 11.
Table 11. Truth Table Abbreviations
Letter
H
L
X
Z
NC
Description
High level
Low level
Don’t care
High impedance (off )
Disconnected
Inputs
TxD
H
L
X
Y
H
L
Z
Inputs
RE
Output
RxD
≥ −0.03 V
≤ −0.2 V
−0.2 V < A − B < −0.03 V
Inputs open
X
L or NC
L or NC
L or NC
L or NC
H
H
L
X
H
Z
THERMAL SHUTDOWN
The ADM2582E/ADM2587E contain thermal shutdown circuitry
that protects the parts from excessive power dissipation during
fault conditions. Shorting the driver outputs to a low impedance
source can result in high driver currents. The thermal sensing
circuitry detects the increase in die temperature under this
condition and disables the driver outputs. This circuitry is
designed to disable the driver outputs when a die temperature
of 150°C is reached. As the device cools, the drivers are reenabled
at a temperature of 140°C.
OPEN- AND SHORT-CIRCUIT, FAIL-SAFE RECEIVER
INPUTS
The receiver inputs have open- and short-circuit, fail-safe
features that ensure that the receiver output is high when the
inputs are open or shorted. During line-idle conditions, when no
driver on the bus is enabled, the voltage across a terminating
resistance at the receiver input decays to 0 V. With traditional
transceivers, receiver input thresholds specified between −200 mV
and +200 mV mean that external bias resistors are required on the
A and B pins to ensure that the receiver outputs are in a known
state. The short-circuit, fail-safe receiver input feature eliminates
the need for bias resistors by specifying the receiver input threshold
between −30 mV and −200 mV. The guaranteed negative threshold
means that when the voltage between A and B decays to 0 V, the
receiver output is guaranteed to be high.
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
Table 12. Transmitting (see Table 11 for Abbreviations)
DE
H
H
L
A−B
Outputs
Z
L
H
Z
The digital signals transmit across the isolation barrier using
iCoupler technology. This technique uses chip-scale transformer
windings to couple the digital signals magnetically from one
side of the barrier to the other. Digital inputs are encoded into
waveforms that are capable of exciting the primary transformer
winding. At the secondary winding, the induced waveforms are
decoded into the binary value that was originally transmitted.
Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by the
pulses, indicating input logic transitions. In the absence of logic
transitions at the input for more than 1 µs, periodic sets of refresh
pulses indicative of the correct input state are sent to ensure dc
correctness at the output. If the decoder receives no internal pulses
of more than approximately 5 µs, the input side is assumed to be
Rev. E | Page 14 of 20
Data Sheet
ADM2582E/ADM2587E
unpowered or nonfunctional, in which case, the isolator output
is forced to a default state by the watchdog timer circuit.
This situation should occur in the ADM2582E/ADM2587E
devices only during power-up and power-down operations. The
limitation on the ADM2582E/ADM2587E magnetic field
immunity is set by the condition in which induced voltage in
the transformer receiving coil is sufficiently large to either
falsely set or reset the decoder. The following analysis defines
the conditions under which this can occur.
The 3.3 V operating condition of the ADM2582E/ADM2587E
is examined because it represents the most susceptible mode of
operation. The pulses at the transformer output have an amplitude
of >1.0 V. The decoder has a sensing threshold of about 0.5 V,
thus establishing a 0.5 V margin in which induced voltages can
be tolerated. The voltage induced across the receiving coil is
given by
V = (−dβ/dt)Σπrn2; n = 1, 2, … , N
where:
β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).
The preceding magnetic flux density values correspond to
specific current magnitudes at given distances from the
ADM2582E/ADM2587E transformers. Figure 34 expresses
these allowable current magnitudes as a function of frequency
for selected distances. As shown in Figure 34, the ADM2582E/
ADM2587E are extremely immune and can be affected only by
extremely large currents operated at high frequency very close
to the component. For the 1 MHz example, a 0.5 kA current must
be placed 5 mm away from the ADM2582E/ADM2587E to affect
component operation.
100
MAXIMUM ALLOWABLE CURRENT (kA)
1k
Given the geometry of the receiving coil in the ADM2582E/
ADM2587E and an imposed requirement that the induced
voltage be, at most, 50% of the 0.5 V margin at the decoder, a
maximum allowable magnetic field is calculated as shown in
Figure 33.
10
DISTANCE = 1m
100
10
DISTANCE = 100mm
1
DISTANCE = 5mm
0.1
0.01
1k
10k
100k
1M
10M
MAGNETIC FIELD FREQUENCY (Hz)
Figure 34. Maximum Allowable Current for Various
Current-to-ADM2582E/ADM2587E Spacings
1
Note that in combinations of strong magnetic field and high
frequency, any loops formed by printed circuit board (PCB)
traces can induce error voltages sufficiently large to trigger the
thresholds of succeeding circuitry. Take care in the layout of
such traces to avoid this possibility.
0.1
10k
100k
1M
10M
MAGNETIC FIELD FREQUENCY (Hz)
100M
08111-019
0.01
0.001
1k
100M
08111-020
MAXIMUM ALLOWABLE MAGNETIC FLUX
DENSITY (kGauss)
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurs during a transmitted pulse
(and is of the worst-case polarity), it reduces the received pulse
from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing
threshold of the decoder.
Figure 33. Maximum Allowable External Magnetic Flux Density
Rev. E | Page 15 of 20
ADM2582E/ADM2587E
Data Sheet
APPLICATIONS INFORMATION
PCB LAYOUT
The ADM2582E/ADM2587E isolated RS-422/RS-485 transceiver
contains an isoPower integrated dc-to-dc converter, requiring
no external interface circuitry for the logic interfaces. Power
supply bypassing is required at the input and output supply pins
(see Figure 35). The power supply section of the ADM2582E/
ADM2587E uses a 180 MHz oscillator frequency to pass power
efficiently through its chip-scale transformers. In addition, the
normal operation of the data section of the iCoupler introduces
switching transients on the power supply pins.
Bypass capacitors are required for several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor, whereas ripple suppression and proper regulation
require a large value capacitor. These capacitors are connected
between Pin 1 (GND1) and Pin 2 (VCC) and Pin 8 (VCC) and
Pin 9 (GND1) for VCC. The VISOIN and VISOOUT capacitors are
connected between Pin 11 (GND2) and Pin 12 (VISOOUT) and
Pin 19 (VISOIN) and Pin 20 (GND2). To suppress noise and reduce
ripple, a parallel combination of at least two capacitors is required
with the smaller of the two capacitors located closest to the device.
The recommended capacitor values are 0.1 µF and 10 µF for
VISOOUT at Pin 11 and Pin 12 and VCC at Pin 8 and Pin 9. Capacitor
values of 0.01 µF and 0.1 µF are recommended for VISOIN at
Pin 19 and Pin 20 and VCC at Pin 1 and Pin 2. The recommended
best practice is to use a very low inductance ceramic capacitor,
or its equivalent, for the smaller value. The total lead length
between both ends of the capacitor and the input power supply
pin should not exceed 10 mm.
10nF
100nF
10nF
100nF
GND2
GND1
1
20
VCC
2
19
GND1
3
18
A
RxD
4
17
B
GND2
VISOIN
RE
5
16
DE
6
15
Z
TxD
7
14
GND2
VCC
8
13
Y
GND1
9
12
10
11
10µF
100nF
VISOOUT
GND2
10µF
100nF
08111-125
GND1
Figure 35. Recommended PCB Layout
In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component
side. Failure to ensure this can cause voltage differentials between
pins exceeding the absolute maximum ratings for the device,
thereby leading to latch-up and/or permanent damage.
The ADM2582E/ADM2587E dissipate approximately 650 mW
of power when fully loaded. Because it is not possible to apply a
heat sink to an isolation device, the devices primarily depend
on heat dissipation into the PCB through the GND pins. If the
devices are used at high ambient temperatures, provide a thermal
path from the GND pins to the PCB ground plane. The board
layout in Figure 35 shows enlarged pads for Pin 1, Pin 3, Pin 9,
Pin 10, Pin 11, Pin 14, Pin 16, and Pin 20. Implement multiple
vias from the pad to the ground plane to reduce the temperature
inside the chip significantly. The dimensions of the expanded
pads are at the discretion of the designer and dependent on the
available board space.
EMI CONSIDERATIONS
The dc-to-dc converter section of the ADM2582E/ADM2587E
components must, of necessity, operate at very high frequency
to allow efficient power transfer through the small transformers.
This creates high frequency currents that can propagate in circuit
board ground and power planes, causing edge and dipole radiation.
Grounded enclosures are recommended for applications that use
these devices. If grounded enclosures are not possible, good RF
design practices should be followed in the layout of the PCB.
See the AN-0971 Application Note, Control of Radiated
Emissions with isoPower Devices, for more information.
INSULATION LIFETIME
All insulation structures eventually break down when subjected to
voltage stress over a sufficiently long period. The rate of insulation
degradation is dependent on the characteristics of the voltage
waveform applied across the insulation. Analog Devices conducts
an extensive set of evaluations to determine the lifetime of the
insulation structure within the ADM2582E/ADM2587E.
Accelerated life testing is performed using voltage levels higher
than the rated continuous working voltage. Acceleration factors for
several operating conditions are determined, allowing calculation
of the time to failure at the working voltage of interest. The values
shown in Table 9 summarize the peak voltages for 50 years of
service life in several operating conditions. In many cases, the
working voltage approved by agency testing is higher than the
50-year service life voltage. Operation at working voltages higher
than the service life voltage listed leads to premature insulation
failure.
The insulation lifetime of the ADM2582E/ADM2587E depends
on the voltage waveform type imposed across the isolation barrier.
The iCoupler insulation structure degrades at different rates,
depending on whether the waveform is bipolar ac, unipolar ac,
or dc. Figure 36, Figure 37, and Figure 38 illustrate these different
isolation voltage waveforms.
Bipolar ac voltage is the most stringent environment. A 50-year
operating lifetime under the bipolar ac condition determines
the Analog Devices recommended maximum working voltage.
Rev. E | Page 16 of 20
Data Sheet
ADM2582E/ADM2587E
In the case of unipolar ac or dc voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50-year service life. The working
voltages listed in Table 9 can be applied while maintaining the
50-year minimum lifetime, provided the voltage conforms to either
the unipolar ac or dc voltage cases. Any crossinsulation voltage
waveform that does not conform to Figure 37 or Figure 38 should
be treated as a bipolar ac waveform, and its peak voltage should
be limited to the 50-year lifetime voltage value listed in Table 9.
ISOLATED POWER SUPPLY CONSIDERATIONS
The typical output voltage of the integrated isoPower dc-to-dc
isolated supply is 3.3 V. The isolated supply in the ADM2587E is
capable of supplying a current of 55 mA when the junction
temperature of the device is kept below 120°C. It is important to
note that the current available on the VISOOUT pin is the total current
available and includes the current required to supply the
internal RS-485 circuitry.
The ADM2587E can typically supply 15 mA externally on
VISOOUT when the driver is switching at 500 kbps loaded with 54 Ω,
while the junction temperature of the part is less than 120°C.
08111-021
RATED PEAK VOLTAGE
0V
Table 14. Typical Maximum External Current Available
on VISOOUT
Figure 36. Bipolar AC Waveform
08111-023
RATED PEAK VOLTAGE
0V
Figure 37. DC Waveform
RATED PEAK VOLTAGE
RT
54 Ω
29
46
120 Ω
Unloaded
System Configuration
Double terminated
bus with RT = 110 Ω
Single terminated bus
Unterminated bus
The ADM2582E typically has no current available externally
on VISOOUT.
When external current is drawn from the VISOOUT pin, there is
an increased risk of generating radiated emissions due to the
high frequency switching elements used in the isoPower dc to-dc
converter. Special care must be taken during PCB layout to
meet emissions standards. See Application Note AN-0971,
Control of Radiated Emissions with isoPower Devices, for details
on board layout considerations.
08111-022
0V
NOTES
1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION
PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE
WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE.
THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE
VOLTAGE CANNOT CROSS 0V.
External Load Current (mA)
15
Figure 38. Unipolar AC Waveform
VCC
EXTERNAL
LOAD
VISOOUT
VCC
isoPower DC-TO-DC CONVERTER
GND1
OSCILLATOR
GND
RECTIFIER
GND2
VISOIN
REGULATOR
TRANSCEIVER
DIGITAL ISOLATION iCoupler
Y
TxD
500kbps
ENCODE
DECODE
ENCODE
DECODE
D
Z
VCC
DE
RT
A
DECODE
ENCODE
R
B
ADM2582E/ADM2587E
RE
GND1
ISOLATION
BARRIER
GND2
Figure 39. ADM2587E Typical Maximum External Current Measurements
Rev. E | Page 17 of 20
08111-038
RxD
ADM2582E/ADM2587E
Data Sheet
TYPICAL APPLICATIONS
An example application of the ADM2582E/ADM2587E for a fullduplex RS-485 node is shown in the circuit diagram of Figure 40.
Refer to the PCB Layout section for the recommended placement
of the capacitors shown in this circuit diagram. Placement of the RT
termination resistors depends on the location of the node and the
network configuration. Refer to the AN-960 Application Note,
RS-485/ RS-422 Circuit Implementation Guide, for guidance on
termination.
Figure 41 and Figure 42 show typical applications of the
ADM2582E/ADM2587E in half duplex and full duplex RS-485
network configurations. Up to 256 transceivers can be connected to
the RS-485 bus. To minimize reflections, terminate the line at the
receiving end in its characteristic impedance and keep stub lengths
off the main line as short as possible. For half-duplex operation, this
means that both ends of the line must be terminated because either
end can be the receiving end.
3.3V/5V POWER
SUPPLY
100nF
10µF
100nF
10nF
VCC
VISOOUT
VCC
100nF
10µF
isoPower DC-TO-DC CONVERTER
OSCILLATOR
RECTIFIER
VISOIN
100nF
REGULATOR
DIGITAL ISOLATION iCoupler
TxD
MICROCONTROLLER
AND UART
DE
TRANSCEIVER
ENCODE
DECODE
ENCODE
DECODE
D
10nF
Y
Z
A
RxD
DECODE
RE
R
ENCODE
B
RT
ADM2582E/ADM2587E
ISOLATION
BARRIER
GND2
GND1
Figure 40. Example Circuit Diagram Using the ADM2582E/ADM2587E
Rev. E | Page 18 of 20
08111-124
GND1
Data Sheet
ADM2582E/ADM2587E
MAXIMUM NUMBER OF TRANSCEIVERS ON BUS = 256
ADM2582E/
ADM2587E
RxD
R
A
A
B
B
RE
D
RxD
R
RE
RT
RT
DE
TxD
ADM2582E/
ADM2587E
Z
Z
Y
Y
A
B
Z
Y
A
B
R
Z
DE
D
TxD
Y
R
D
ADM2582E/
ADM2587E
RxD RE
D
ADM2582E/
ADM2587E
DE TxD
RxD RE
DE TxD
08111-027
NOTES
1. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
2. ISOLATION NOT SHOWN.
Figure 41. ADM2582E/ADM2587E Typical Half-Duplex RS-485 Network
MAXIMUM NUMBER OF NODES = 256
MASTER
SLAVE
A
R
RxD
B
Y
D
RT
RE
DE
Z
D
B
RT
Y
A
ADM2582E/
ADM2587E
RE
R
RxD
ADM2582E/
ADM2587E
A
B
Z
Y
A
B
Z
Y
SLAVE
SLAVE
R
R
D
D
ADM2582E/
ADM2587E
ADM2582E/
ADM2587E
RxD RE
RxD RE
DE TxD
DE TxD
NOTES
1. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
2. ISOLATION NOT SHOWN.
Figure 42. ADM2582E/ADM2587E Typical Full Duplex RS-485 Network
Rev. E | Page 19 of 20
08111-028
DE
TxD
TxD
Z
ADM2582E/ADM2587E
Data Sheet
OUTLINE DIMENSIONS
13.00 (0.5118)
12.60 (0.4961)
11
20
7.60 (0.2992)
7.40 (0.2913)
10
2.65 (0.1043)
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
10.65 (0.4193)
10.00 (0.3937)
1.27
(0.0500)
BSC
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
0.75 (0.0295)
45°
0.25 (0.0098)
8°
0°
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
1.27 (0.0500)
0.40 (0.0157)
06-07-2006-A
1
Figure 43. 20-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-20)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model1
ADM2582EBRWZ
ADM2582EBRWZ-REEL7
ADM2587EBRWZ
ADM2587EBRWZ-REEL7
EVAL-ADM2582EEBZ
EVAL-ADM2587EEBZ
1
Data Rate (Mbps)
16
16
0.5
0.5
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Z = RoHS Compliant Part.
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D08111-0-10/14(E)
Rev. E | Page 20 of 20
Package Description
20-Lead SOIC_W
20-Lead SOIC_W
20-Lead SOIC_W
20-Lead SOIC_W
ADM2582E Evaluation Board
ADM2587E Evaluation Board
Package Option
RW-20
RW-20
RW-20
RW-20