View the Part Number Specific Data Sheet for full specifications

PART NUMBER DATA SHEET
E5WSDC12-32.768K
REGULATORY COMPLIANCE
2011/65
ECLIPTEK
R
CORPORATION
(Data Sheet downloaded on Jun 28, 2016)
155 SVHC
ITEM DESCRIPTION
Watch Crystal Resonator 1.5mm x 7.0mm x 1.4mm 4 Pad Plastic Surface Mount (SMD) 32.768KHz ±20ppm at 25°C -40°C to
+85°C 12.5pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
32.768KHz
Frequency Tolerance
±20ppm at 25°C
Frequency Stability Temperature
Coefficient
-0.035ppm/(Change in °C)² Maximum
Turn over Temperature
25°C ±5°C
Aging at 25°C
±3ppm/year Maximum
Operating Temperature Range
-40°C to +85°C
Load Capacitance
12.5pF Parallel Resonant
Shunt Capacitance
0.85pF Typical, 2pF Maximum
Motional Capacitance
1.9fF Typical
Equivalent Series Resistance
65,000 Ohms Maximum
Mode of Operation
Fundamental
Drive Level
1µWatt Maximum
Crystal Cut
Tuning Fork
Storage Temperature Range
-55°C to +125°C
Insulation Resistance
500 Megaohms Minimum (Measured at 100Vdc)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 11/05/2012 | Page 1 of 3
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
E5WSDC12-32.768K
MECHANICAL DIMENSIONS (all dimensions in millimeters)
1.40
MAX
0.55 ±0.10
0.30 ±0.10 (x4)
0.15
±0.05
(x4)
Pad Connections
2
3
3
2
MARKING
ORIENTATION
7.00 6.7
MAX ±0.2
0.10
±0.05
(x4)
PIN
CONNECTION
1
Crystal
2
Connected to Pin 3
3
Connected to Pin 2
4
Crystal
LINE MARKING
1
4
1
1.50
MAX
CYXXXXX
C=Frequency Code
Y=Load Capacitance
XXXXX=Ecliptek
Manufacturing Identifier
1
4
0.20 ±0.10 (x4)
Suggested Solder Pad Layout
All Dimensions in Millimeters
0.6 (X4)
1.2 (X4)
Solder Land
(X4)
5.1
0.3
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 11/05/2012 | Page 2 of 3
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
E5WSDC12-32.768K
Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
5°C/Second Maximum
N/A
Level 1
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to device leads only.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to device leads only.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 11/05/2012 | Page 3 of 3
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200