CM6305 D

CM6305
EMI Filter with ESD
Protection for SIM Card
Applications
Product Description
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The CM6305 is a 3 x 3, 8−bump EMI filter with ESD protection
device for SIM card applications in a 0.4 mm pitch CSP form factor. It
is fully compliant with IEC 61000−4−2. The CM6305 is also RoHS II
compliant.
ELECTRICAL SCHEMATIC
WLCSP8
CASE 567CE
R1
R2
R3
O1 (A3)
O2 (B3)
O3 (C3)
I1 (A2)
I2 (B1)
I3 (C1)
MARKING DIAGRAM
External
Internal
V (C2) {External}
65
YWW
65
YWW
GND (B2)
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
Orientation
Marking
ORDERING INFORMATION
Bottom View
(Bumps Up View)
Device
CM6305
1
A
B
2
3
+
65
C
= CM6305
= Date Code
1
3
2
A
A3
A2
B
B3
B2
B1
C
C3
C2
C1
Package
Shipping†
WLCSP−8
(Pb−Free)
5000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
A1
A1 Corner
Indicator
Table 1. PIN DESCRIPTIONS
Pin
Description
Pin
Description
A2
Channel 1 External
A3
Channel 1 Internal
B1
Channel 2 External
B3
Channel 2 Internal
C1
Channel 3 External
C3
Channel 3 Internal
B2
GND
C2
V External
© Semiconductor Components Industries, LLC, 2011
August, 2011 − Rev. 2
1
Publication Order Number:
CM6305/D
CM6305
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Units
Storage Temperature Range
–55 to +150
°C
Operating Temperature Range
–40 to +85
°C
60
mW
Power Dissipation at 70°C per Channel
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
R1
Resistance
80
100
120
W
R2
Resistance
37.6
47
56.4
W
R3
Resistance
80
100
120
W
10
100
nA
ILEAK
C
VB
VESD
Leakage Current per Channel
VIN = 3.0 V
Capacitance on Filter Channels 1, 2 and 3
At 1 MHz, VIN = 0 V
8
10
12
pF
Capacitance on Clamp Channel (pin C2)
At 1 MHz, VIN = 0 V
8
10
12
pF
Breakdown Voltage (Positive)
IR = 1 mA
6
7
9
V
ESD Protection Peak Discharge Voltage at A2, B1 and C1 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
(Note 2)
ESD Protection Peak Discharge Voltage at C2 pin
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
(Note 2)
ESD Protection Peak Discharge Voltage at A3, B3 and C3 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
(Note 2)
kV
±8
±15
kV
±15
±15
kV
±2
±2
1. All parameters specified at TA = 25°C unless otherwise noted.
2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W.
Table 4. CSP TAPE AND REEL SPECIFICATIONS †
Part Number
Chip Size (mm)
Pocket Size (mm)
B0 X A0 X K0
Tape Width
W
Reel Dia.
Qty Per Reel
P0
P1
CM6305
1.16 X 1.16 X 0.60
1.27 X 1.27 X 0.69
8 mm
178 mm (7″)
5000
4 mm
4 mm
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
http://onsemi.com
2
CM6305
RF CHARACTERISTICS
Figure 1. Insertion Loss, Filter 1 (pins A2, A3) and Filter 3 (pins C1, C3) (Bias = 0 V, TA = 255C)
Figure 2. Insertion Loss, Filter 2 (pins B1, B3) (Bias = 0 V, TA = 255C)
http://onsemi.com
3
CM6305
PACKAGE DIMENSIONS
WLCSP8, 1.16x1.16
CASE 567CE
ISSUE O
PIN A1
REFERENCE
2X
0.05 C
2X
0.05 C
È
È
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
A B
E
DIM
A
A1
A2
b
D
E
e
TOP VIEW
A2
0.05 C
RECOMMENDED
SOLDERING FOOTPRINT*
A
0.05 C
NOTE 3
8X
A1
0.05 C A B
0.03 C
C
SIDE VIEW
A1
SEATING
PLANE
PACKAGE
OUTLINE
8X
e
b
MILLIMETERS
MIN
MAX
0.57
0.63
0.17
0.24
0.41 REF
0.24
0.29
1.16 BSC
1.16 BSC
0.40 BSC
e
0.40
PITCH
C
B
A
0.25
0.40
PITCH
DIMENSIONS: MILLIMETERS
1
2
3
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM6305/D
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