Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TEA1507
GreenChipII SMPS control IC
Preliminary specification
File under Integrated Circuits, IC11
2000 Dec 05
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
FEATURES
Distinctive features
• Universal mains supply operation (70 to 276 V AC)
• High level of integration, giving a very low external
component count.
handbook, halfpage
Green features
• Valley/zero voltage switching for minimum switching
losses
• Efficient quasi-resonant operation at high power levels
• Frequency reduction at low power standby for improved
system efficiency (<3 W)
1
8
2
7
TEA1507
• Burst mode operation for very low standby levels (<1 W)
• On-chip start-up current source.
3
6
4
5
Protection features
• Safe restart mode for system fault conditions
• Continuous mode protection by means of
demagnetization detection (zero switch-on current)
• Accurate and adjustable overvoltage protection
• Short winding protection
• Undervoltage protection (foldback during overload)
• Overtemperature protection
• Low and adjustable overcurrent protection trip level
• Soft (re)start
MGU229
• Mains voltage-dependent operation-enabling level.
APPLICATIONS
Besides typical application areas, i.e. TV and Monitor
supplies, the device can be used in all applications that
demand an efficient and cost-effective solution up to
250 W.
2000 Dec 05
Fig.1 Typical application.
2
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
GENERAL DESCRIPTION
If burst mode operation is applied, the standby power level
can even be reduced to below 1 W.
The GreenChipII is the second generation of green
Switched Mode Power Supply (SMPS) controller ICs
operating directly from the rectified universal mains. A high
level of integration leads to a cost effective power supply
with a very low number of external components.
The proprietary high voltage BCD800 process makes
direct start-up possible from the rectified mains voltage in
an effective and green way. A second low voltage
BICMOS IC is used for accurate, high speed protection
functions and control.
The special built-in green functions allow the efficiency to
be optimum at all power levels. This holds for
quasi-resonant operation at high power levels, as well as
fixed frequency operation with valley switching at medium
power levels. At low power (standby) levels, the system
operates at reduced frequency and with valley detection.
Highly efficient, reliable supplies can easily be designed
using the GreenChipII controller.
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
TEA1507P
DIP8
2000 Dec 05
DESCRIPTION
plastic dual in-line package; 8 leads (300 mil)
3
VERSION
SOT97-1
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8
START-UP
CURRENT SOURCE
clamp
internal UVLO start
supply
GND
2
S1
7
VALLEY
DRAIN
HVS
n.c.
M-level
4
VOLTAGE
CONTROLLED
OSCILLATOR
LOGIC
DEM
100 mV
OVERVOLTAGE
PROTECTION
FREQUENCY
CONTROL
4
OVERTEMPERATURE
PROTECTION
CTRL
LOGIC
6
DRIVER
Philips Semiconductors
SUPPLY
MANAGEMENT
GreenChipII SMPS control IC
1
BLOCK DIAGRAM
andbook, full pagewidth
2000 Dec 05
VCC
DRIVER
Iss
3
−1
LEB
POWER-ON
RESET
S
Q
R
Q
soft
start
S2
blank
UVLO
2.5 V
0.5 V
5
OCP
burst
detect
short
winding
0.75 V
OVERPOWER
PROTECTION
Fig.2 Block diagram.
TEA1507
MGU230
Preliminary specification
TEA1507
MAXIMUM
ON-TIME
PROTECTION
Isense
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
PINNING
SYMBOL PIN
DESCRIPTION
VCC
1
supply voltage
GND
2
ground
CTRL
3
control input
DEM
4
input from auxiliary winding for
demagnetization timing, OVP and OPP
Isense
5
programmable current sense input
DRIVER
6
gate driver output
HVS
7
high voltage safety spacer, not
connected
DRAIN
8
drain of external MOS switch, input for
start-up current and valley sensing
handbook, halfpage
VCC 1
8 DRAIN
GND 2
7 HVS
TEA1507
CTRL 3
6 DRIVER
DEM 4
5 Isense
MGU231
Fig.3 Pin configuration.
continue charging capacitor CVCC (switch S1 will be
opened), see Fig.2. The IC will activate the power
converter as soon as the voltage on pin VCC passes the
VCC(start) level. The IC supply is taken over by the auxiliary
winding as soon as the output voltage reaches its intended
level and the IC supply from the mains voltage is
subsequently stopped for high efficiency operation (green
function).
FUNCTIONAL DESCRIPTION
The TEA1507 is the controller of a compact flyback
converter, with the IC situated at the primary side. An
auxiliary winding of the transformer provides
demagnetization detection and powers the IC after
start-up.
The TEA1507 operates in multi modes.
The next converter stroke is started only after
demagnetization of the transformer current (zero current
switching), while the drain voltage has reached the lowest
voltage to prevent switching losses (green function). The
primary resonant circuit of primary inductance and drain
capacitor ensures this quasi-resonant operation. The
design can be optimized in such a way that zero voltage
switching can be reached over almost the universal mains
range.
The moment the voltage on pin VCC drops below the
VUVLO (undervoltage lock out) level, the IC stops switching
and enters a safe restart from the rectified mains voltage.
Inhibiting the auxiliary supply by external means causes
the converter to operate in a stable, well-defined burst
mode.
Supply management
All (internal) reference voltages are derived from a
temperature compensated, on-chip band gap circuit.
To prevent very high frequency operation at lower loads,
the quasi-resonant operation changes smoothly in fixed
frequency PWM control.
At very low power (standby) levels, the frequency is
controlled down, via the VCO, to a minimum frequency of
about 6 kHz. Typically, 3 Watts can be achieved for a
75 W converter with an output power of 100 mW.
f
MGU232
handbook, halfpage
VCO
fixed
quasi resonant
175 kHz
Start-up, mains enabling operation level and
undervoltage lock out (see Figs. 10 and 11)
Initially, the IC is self supplying from the rectified mains
voltage via pin DRAIN. Supply capacitor CVCC is charged
by the internal start-up current source to a level of about
4 V or higher, depending on the drain voltage. Once the
drain voltage exceeds the M-level (mains-dependent
operation-enabling level), the start-up current source will
2000 Dec 05
6 kHz
power
Fig.4 Multi mode operation.
5
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for the
lowest drain voltage before starting a new primary stroke.
This method is called valley detection. Figure 7 shows the
drain voltage together with the valley signal, the signal
indicating the secondary stroke and the oscillator signal.
Current mode control
Current mode control is used for its good line regulation
behaviour.
The ‘on-time’ is controlled by the internally inverted control
pin voltage, which is compared with the primary current
information. The primary current is sensed across an
external resistor. The driver output is latched in the logic,
preventing multiple switch-on.
In an optimum design, the reflected secondary voltage on
the primary side will force the drain voltage to zero. Thus,
zero voltage switching is very possible, preventing large
The internal control voltage is inversely proportional to the
external control pin voltage, with an offset of 1.5 V. This
means that a voltage range from 1 to 1.5 V on pin CTRL
will result in an internal control voltage range from
0.5 to 0 V (the maximum external control voltage results in
a minimum duty cycle).
1
2
capacitive switching losses  P = --- × C × V × f , and


2
Oscillator
The system will be in discontinuous conduction mode all
the time. The oscillator will not start a new primary stroke
until the secondary stroke has ended.
allowing high frequency operation, which results in small
and cost effective inductors.
Demagnetization
The maximum fixed frequency of the oscillator is set by an
internal current source and capacitor. The maximum
frequency is reduced once the control voltage enters the
VCO control window. Then, the maximum frequency
changes linearly with the control voltage until the minimum
frequency is reached (see Figs 5 and 6).
Demagnetization features a cycle-by-cycle output
short-circuit protection by immediately lowering the
frequency (longer off-time), thereby reducing the power
level.
Demagnetization recognition is suppressed during the first
tsuppr time. This suppression may be necessary in
applications where the transformer has a large leakage
inductance and at low output voltages/start-up.
Valley switching (see Fig.7)
A new cycle starts when the power switch is switched on.
After the ‘on-time’ (which is determined by the ‘sense’
voltage and the internal control voltage), the switch is
opened and the secondary stroke starts. After the
secondary stroke, the drain voltage shows an oscillation
1
with a frequency of approximately ---------------------------------------------------( 2 × π × ( Lp × Cd ) )
Minimum and maximum ‘on-time’
The minimum ‘on-time’ of the SMPS is determined by the
Leading Edge Blanking (LEB) time. The IC limits the
‘on-time’ to 50 µs. When the system desires an ‘on-time’
longer than 50 µs, a fault condition is assumed (e.g.
removed Ci), the IC will stop switching and enter the safe
restart mode.
where Lp is the primary self inductance of the transformer
and Cd is the capacitance on the drain node.
MGU233
V
MGU234
sense(max)
handbook, halfpage
handbook, halfpage f
175 kHz
0.5 V
6 kHz
1V
(typ)
1.5 V
(typ)
50 mV
(typ)
VCTRL
Vsense(max)
Fig.6 The VCO frequency as function of Vsense(max)
Fig.5 The Vsense(max) voltage as function of VCTRL.
2000 Dec 05
75 mV
(typ)
6
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
primary
stroke
handbook, full pagewidth
TEA1507
secondary
ringing
secondary
stroke
drain
valley
secondary
stroke
B
A
oscillator
MGU235
A: Start of new cycle at lowest drain voltage.
B: Start of new cycle in a classical PWM system at high drain voltage.
Fig.7 Signals for valley switching.
2000 Dec 05
7
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
OverVoltage Protection (OVP)
An OVP mode is implemented in the GreenChip series.
For the TEA1507, this works by sensing the auxiliary
voltage via the current flowing into pin DEM during the
secondary stroke. The auxiliary winding voltage is a
well-defined replica of the output voltage. Any voltage
spikes are averaged by an internal filter.
MGU236
handbook, halfpage
0.50 V
(typ)
0.3 V
(typ)
If the output voltage exceeds the OVP trip level, the OVP
circuit switches the power MOSFET off. Next, the
controller waits until the UVLO level is reached on pin VCC.
This is followed by a safe restart cycle, after which
switching starts again. This process is repeated as long as
the OVP condition exists.
−100 µA
(typ)
The output voltage at which the OVP function trips, Vo(OVP)
can be set by the demagnetization resistor, RDEM:
IDEM
−24 µA
(typ)
Fig.8 OPP correction curve.
Ns
V o ( OVP ) = ----------- × ( I (OVP)(DEM) × R DEM + V clamp ( DEM ) ( pos ) )
N aux
Short winding protection
After the leading edge blanking time, the short winding
protection circuit is also activated. If the ‘sense’ voltage
exceeds the short winding protection voltage Vswp, the
converter will stop switching. Once VCC drops below the
UVLO level, capacitor CVCC will be recharged and the
supply will restart again. This cycle will be repeated until
the short circuit is removed (safe restart mode).
Where Ns is the number of secondary turns and Naux is the
number of auxiliary turns of the transformer.
Current Iref is internally trimmed.
The value of the demagnetization resistor (RDEM) can be
adjusted to the turns ratio of the transformer, thus making
an accurate OVP possible.
The short winding protection will also protect in case of a
secondary diode short circuit.
OverCurrent Protection (OCP)
The cycle-by-cycle peak drain current limit circuit uses the
external source resistor to measure the current accurately.
This allows optimum size determination of the transformer
core (cost issue). The circuit is activated after the leading
edge blanking time, tleb. The OCP protection circuit limits
the ‘sense’ voltage to an internal level.
Overtemperature protection
An accurate temperature protection is provided in the
circuit. When the junction temperature exceeds the
thermal shutdown temperature, the IC will stop switching.
When VCC drops to UVLO, capacitor CVCC will be
recharged to the Vstart level. If the temperature is still too
high, VCC will drop again to the UVLO level, etc. (safe
restart mode).
OverPower Protection (OPP)
During the primary stroke, the rectified mains input voltage
is measured by sensing the current drawn from pin DEM.
This current is dependent on the mains voltage, according
V aux N × V mains
to the following formula: I ( DEM ) ≈ --------------- ≈ -------------------------R DEM
R DEM
Operation recommences when the junction temperature
drops 8 degrees typically.
N aux
Where: N = ----------Np
The current information is used to adjust the peak drain
current, which is measured via pin Isense. The internal
compensation is such that an almost mains independent
maximum output power can be realized.
The OPP curve is given in Fig.8.
2000 Dec 05
Vsense(max)
8
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
V ocp – ( I ss × R ss )
I primary(max) = ------------------------------------------R sense
Burst mode standby
Pin CTRL (pin 3) is also used to implement the burst mode
standby. In burst mode standby, the power supply enters
a special low dissipation state, where it typically consumes
less than 1 W of input power (Po < 100 mW), but is still
able to supply a microprocessor, for example. Figure 12
shows a flyback converter using the burst mode standby
function. The system enters burst mode standby when the
microprocessor closes switches S2 and S3 on the
secondary side. Switch S2 connects the high voltage
output secondary winding to the low voltage
microprocessor capacitor (CµC), bypassing Co.
τ = R ss × C ss
The charging current Iss will flow as long as the voltage on
pin Isense is below approximately 0.5 V. If the voltage on
pin Isense exceeds the 0.5 V, the soft start current source
will start limiting the current Iss. At the VCC(start) level, the Iss
current source is completely switched off (see Fig.9).
Since the soft start current Iss is subtracted from pin VCC
charging current, the Rss value will affect the VCC charging
current level by a maximum of 60 µA (typical value).
When the voltage on CµC exceeds the Zener voltage, the
opto-coupler is activated, sending a large current signal to
CTRL. In response to this signal, the IC stops switching
and enters a ‘hiccup’ mode. This burst activation signal
should be present for longer than the ‘burst blank’ period
(typically 30 µs): the blanking time prevents false burst
triggering due to spikes. Figure 11 shows the burst-mode
standby signals. The hiccup mode during burst mode
standby operation does not differ from the hiccup mode in
safe-restart mode during a system fault condition (e.g.
OVP or output short circuit). The power is reduced
during soft-restart mode.
handbook, halfpage
ISS
0.5 V
pin 5
RSS
Isense
Vocp
Burst mode standby operation continues until the
microcontroller opens switches S2 and S3. The system
then enters the start-up sequence and begins normal
switching behaviour.
CSS
Rsense
MGU237
Fig.9 Soft start-up.
V th
I burstmode = ----------------+I
R CTRL th ( on )
Driver
(For burst mode specification, see Figs 11 and 12.)
The driver circuit to the gate of the power MOSFET has a
current sourcing capability of typically 125 mA and a
current sink capability of typical 540 mA. This permits fast
turn-on and turn-off of the power MOSFET for efficient
operation.
Soft start-up (pin Isense)
To prevent transformer rattle during hiccup, the
transformer peak current is slowly increased by the soft
start function. This can be achieved by inserting a resistor
and a capacitor between pin Isense (pin 5) and the sense
resistor. An internal current source charges the capacitor
to V = Iss × Rss, with a maximum of about 0.5 V.
A low driver source current has been chosen to limit the
∆V/∆t at switch-on. This reduces Electro Magnetic
Interference (EMI) and also limits the current spikes
across Rsense.
The start level and the time constant of the increasing
primary current level can be adjusted externally by
changing the values of Rss and Css.
2000 Dec 05
start-up
9
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to
ground (pin 2); positive currents flow into the chip; pin 1 may not be current driven. The voltage ratings are valid
provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Voltages
V1
pin 1 (VCC)
V3
pin 3 (CTRL)
V4
pin 4 (DEM)
V5
pin 5 (Isense)
V8
pin 8 (DRAIN)
−0.4
+20
V
−0.4
+5
V
current limited
−0.4
−
V
current limited
−0.4
−
V
−0.4
+650
V
continuous
Currents
I3
pin 3 (CTRL)
−
+50
mA
I4
pin 4 (DEM)
−250
+250
µA
I5
pin 5 (Isense)
−1
+10
mA
I6
pin 6 (DRIVER)
I8
pin 8 (DRAIN)
d < 10%
d < 10%
−0.8
+2
A
−
+5
mA
General
Ptot
total power dissipation
−
1.0
W
Tstg
storage temperature
Tamb < 55 °C
−55
+150
°C
Tvj
virtual junction temperature
−20
+145
°C
−
1750
V
pin 8 (DRAIN); note 1 −
1000
V
200
V
ESD
VESD
electrostatic discharge voltage
human body model
machine model
class 1
pins 1 to 6; note 1
−
note 2
Notes
1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
2. Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
in free air; note 1
Note
1. With pin GND connected to sufficient copper area on the printed-circuit board.
QUALITY SPECIFICATION
In accordance with ‘SNW-FQ-611-E’.
2000 Dec 05
10
VALUE
UNIT
100
K/W
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
CHARACTERISTICS
Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing
into the IC; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VCC = 0 V; VDRAIN > 100 V
1.0
1.2
1.4
mA
with auxiliary supply;
VDRAIN > 100 V
−
100
300
µA
Start-up current source (pin 8)
Ii(DRAIN)
supply current drawn from drain pin
BVDSS
breakdown voltage
650
−
−
V
M-level
mains-dependent operation-enabling level
60
−
100
V
VCC management (pin 1)
VCC(start)
start-up voltage on VCC
10.3
11
11.7
V
VCC(UVLO)
under voltage lock-out on VCC
8.1
8.7
9.3
V
VCC(hys)
hysteresis voltage on VCC
VCC(start) − VCC(UVLO)
2.0
2.3
2.6
V
Ii(VCC)H
pin VCC charging current
VDRAIN > 100 V; VCC < 3V
−1.2
−1
−0.8
mA
Ii(VCC)L
pin VCC charging current
VDRAIN > 100 V;
3 V < VCC < VCC(UVLO)
−1.2
−0.75 −0.45 mA
IVCC(restart)
pin VCC restart current
VDRAIN > 100 V;
−650
VCC(UVLO) < VCC < VCC(start)
−550
−450
µA
ICC(operate)
supply current under normal operation
no load on pin DRIVER
1.1
1.3
1.5
mA
50
100
150
mV
0
nA
Demagnetization management (pin 4)
VDEM
demagnetization comparator threshold
voltage on pin DEM
IDEM
pin DEM current
VDEM = 50 mV
−50(1) −
Vclamp(DEM)(neg) negative clamp voltage on pin DEM
at IDEM = −150 µA
−0.5
Vclamp(DEM)(pos) positive clamp voltage on pin DEM
at IDEM = 250 µA
tsuppr
suppression of transformer ringing at start
of secondary stroke
−0.25 −0.05 V
0.5
0.7
0.9
V
1.1
1.5
1.9
µs
−
tleb
−
ns
Pulse width modulator
ton(min)
minimum on-time
ton(max)
maximum on-time
latched
40
50
60
µs
foscL
oscillator low frequency (fixed frequency)
VCTRL > 1.5 V
5
6.5
8
kHz
foscH
oscillator high frequency (fixed frequency) VCTRL < 1 V
145
175
205
kHz
Vvco(start)
peak voltage at pin Isense, where
frequency reduction starts
−
75
−
mV
Vvco(max)
peak voltage at pin Isense, where the
frequency is equal to foscL
−
50
−
mV
Oscillator
see Fig.6
Duty cycle control (pin 3)
VCTRL(min)
min. voltage on CTRL (max. duty cycle)
−
1.0
−
V
VCTRL(max)
max. voltage on CTRL (min. duty cycle)
−
1.5
−
V
2000 Dec 05
11
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
SYMBOL
TEA1507
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
3.3
3.8
4.3
V
Burst mode standby (pin 3)
Vth(burst)(on)
burst mode standby active threshold
voltage
at Iburst = 6 mA
Ith(burst)(on)
burst mode standby active current
16
−
−
mA
Ith(burst)(off)
burst mode standby inactive current
−
−
6
mA
t(burst-blank)
burst mode standby blanking time
25
30
35
µs
+85
Valley switch (pin 8)
∆V/∆tvalley
∆V/∆t for valley recognition
−85
−
tvalley-swon
delay from valley recognition to switch-on
−
150(1) −
ns
V/µs
Current and short winding protection (pin 5)
Vsense(max)
maximum source voltage OCP
∆V/∆t = 0.1 V/µs
0.48
0.52
0.56
V
tpropagation
delay from detecting Vsense(max) to
switch-off
∆V/∆t = 0.5 V/µs
−
140
185
ns
Vswp
short winding protection voltage
0.83
0.88
0.96
V
tleb
blanking time for current and short
winding protection
300
370
440
ns
Iss
soft start current
45
60
75
µA
54
60
66
µA
Vsense < 0.5 V
Overvoltage protection (pin 4)
I(OVP)(DEM)
OVP protection level at pin 4, set by the
demagnetization resistor RDEM; see
Section “OverVoltage Protection (OVP)”
Overpower protection (pin 4)
I(OPP)(DEM)
OPP current at pin 4, start of OPP
correction. Set by the demagnetization
resistor RDEM; see Section “OverPower
Protection (OPP)”
−
−24
−
µA
I(OPP50%)(DEM)
OPP current at pin 4 where maximum
source voltage is limited to 0.3 V
−
−100
−
µA
−170
−88
mA
Driver (pin 6)
Isource
source current capability of driver
VCC = 9.5 V; VDRIVER = 2 V −
Isink
sink current capability of driver
VCC= 9.5 V; VDRIVER = 2 V
−
300
−
mA
VCC = 9.5 V;
VDRIVER = 9.5 V
400
700
−
mA
VCC > 12 V
−
11.5
12
V
maximum temperature threshold
130
140
150
°C
hysteresis temperature
−
8(1)
−
°C
Vo(driver)(max)
maximum output voltage of the driver
Temperature protection
Tprot(max)
Tprot(hyst)
Note
1. Guaranteed by design.
2000 Dec 05
12
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
APPLICATION INFORMATION
during start-up and via the auxiliary winding during
operation.
A converter with the TEA1507 consists of an input filter, a
transformer with a third winding (auxiliary), and an output
stage with a feedback circuit.
A sense resistor converts the primary current into a
voltage at pin Isense (pin 5). The value of this sense resistor
defines the maximum primary peak current.
Capacitor CVCC (at pin 1) buffers the supply voltage of the
IC, which is powered via the high voltage rectified mains
handbook, full pagewidth
An application note is available: AN00047.
Vmains
Vo
Ci
Np
VCC
CVCC
CCTRL
RCTRL
GND
CTRL
DEM
1
8 DRAIN
2
7
TEA1507
3
6
4
5
HVS
Ns
Co
n.c.
DRIVER
power
MOSFET
Isense
Rsense
RDEM
Naux
MGU238
Fig.10 Flyback configuration with secondary sensing.
2000 Dec 05
13
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
handbook, full pagewidth
Vi
VD
(power
MOSFET)
Vi
Vo
VCC
Vgate
M-level
burst mode
VµC
start-up
sequence
normal
operation
overvoltage
protection
output short
circuit
burst mode standby
normal
operation
MGU239
Fig.11 Typical waveforms.
2000 Dec 05
14
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
Vmains
handbook, full pagewidth
Vo
Ci
S2
VCC
CVCC
CCTRL
RCTRL
GND
CTRL
DEM
2
7
Co
1
8 DRAIN
TEA1507
3
6
4
5
RDEM
HVS
n.c.
power
MOSFET
DRIVER
Isense RSS
microcontroller
supply
Rsense
CSS
CµC
S3
burst mode
standby on/off
from microcontroller
MGU240
Fig.12 Flyback configuration with secondary sensing using the burst mode standby.
2000 Dec 05
15
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
PACKAGE OUTLINE
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.020
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
EIAJ
SOT97-1
050G01
MO-001
SC-504-8
2000 Dec 05
16
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
99-12-27
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
The total contact time of successive solder waves must not
exceed 5 seconds.
SOLDERING
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
DBS, DIP, HDIP, SDIP, SIL
WAVE
suitable(1)
suitable
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2000 Dec 05
17
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Dec 05
18
Philips Semiconductors
Preliminary specification
GreenChipII SMPS control IC
TEA1507
NOTES
2000 Dec 05
19
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Internet: http://www.semiconductors.philips.com
SCA 70
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Printed in The Netherlands
613502/01/pp20
Date of release: 2000
Dec 05
Document order number:
9397 750 07298
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