Materials Declaration Package Body Size Ball Count Option Ball Size Item Epoxy resin SiO2 Filler Sb2O3 Carbon Black Item BT Epoxy Resin Copper (Cu) Main agent Hardener Copper (Cu) Nickel (Ni) Gold (Au) PBGA 27 X 27 400 SnPbAg 0.76 mm Molding Compound % of Compound 13.7 85 1 0.3 Laminate % of Laminate 46 33.406 7.11 3.049 0.672 7.445 1.742 Solder Ball % of Solder Ball Weight (g) 1.50 E-01 9.28 E-01 1.09 E-02 3.28 E-03 PPM 48319 299787 3527 1058 Weight (g) 5.03 E-01 3.68 E-01 7.84 E-02 3.36 E-02 7.41 E-03 8.21 E-02 1.92 E-02 PPM 162372 119006 25329 10862 2394 26522 6206 Sn Pb Ag 62 36 2 Weight (g) 4.86 E-01 2.82 E-01 1.57 E-02 PPM 157032 91180 5066 Au Bond Wires % of Wire 99.99 Weight (g) 1.70 E-02 PPM 5491 100 Weight (g) 1.01 E-01 PPM 32621 80 20 Weight (g) 8.00 E-03 2.00 E-03 PPM 2584 646 Chip % of Chip Si Item Ag Filler Resin Die Attach % of Die Attach Item Pb Cd Hg Cr+6 PPM <10 <5 <10 <10 Molding Compound Method ICP-AES ICP-AES ICP-AES ICP-AES Package Totals PPM Weight (g) 1000000 3.10 E+00 AST-B-E Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/9/04