a 105-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-105-1) Dimensions shown in millimeters A1 BALL CORNER 8.10 8.00 SQ 7.90 11 10 9 8 7 6 5 4 3 2 1 A BALL A1 PAD CORNER B C D E F G 6.50 BSC SQ H J K L 0.65 BSC BOTTOM VIEW TOP VIEW DETAIL A DETAIL A 0.91 MIN 0.25 MIN 0.45 0.40 0.35 BALL DIAMETER *COMPLIANT TO JEDEC STANDARDS MO-225 WITH THE EXCEPTION TO PACKAGE HEIGHT. SEATING PLANE COPLANARITY 0.10 080807-A *1.40 1.31 1.16