Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish Ball Size (mm) RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant CSP BGA 6X6 112 SnAgCu 0.30 Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Component Level Weight (g) CAS# 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 2.85 E-02 1.98 E-03 1.98 E-03 4.95 E-04 9.90 E-05 3.30 E-02 Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 34.90 2.43 2.43 0.61 0.12 40.49 PPM 349002 24292 24292 6073 1215 404875 Laminate Homogeneous Material Level Substance Description Copper & its alloys Composite Thermoset Thermoset Thermoset Other inorganic materials Other inorganic materials Other organic materials Other organic materials Thermoset Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Other inorganic materials Other organic materials Other organic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal Copper Foil Glass Cloth Epoxy resin Bismaleimide Triazine Inorganic filler CAS# 3.86 E-03 3.88 E-03 7.71 E-04 7.71 E-04 7.71 E-04 1.55 E-03 1.16 E-02 3.62 E-04 3.06 E-04 1.98 E-04 1.86 E-04 1.31 E-04 8.04 E-05 5.28 E-05 3.52 E-05 2.76 E-05 2.51 E-05 1.26 E-05 5.02 E-06 1.06 E-03 1.17 E-02 6.03 E-05 3.22 E-04 2.51 E-02 7440-50-8 65997-17-3 7238-97-4 13676-54-5 25722-66-1 Proprietary Laminate Core Subtotal Barium Sulfate Modified resin Aromatic hydrocarbon Epoxy resin Diethylene Glycol Monomethyl Ether Acetate Aromatic Carbonyl Compound Acrylic ester monomer Dipropylene gylcol monomethyl ether Amine Compound Levelling Agents & Others Organic Filler Phthalocyanine Green Soldermask Subtotal Copper Nickel Gold Component Level Weight (g) 7727-43-7 Proprietary Proprietary 85954-11-6 112-15-2 Proprietary Proprietary 34590-94-8 Proprietary Proprietary Proprietary Proprietary 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 15.37 15.45 3.07 3.07 3.07 6.18 46.21 1.44 1.22 0.79 0.74 0.52 0.32 0.21 0.14 0.11 0.10 0.05 0.02 5.66 46.61 0.24 1.28 100.00 153700 154500 30700 30700 30700 61800 462100 14400 12200 7900 7400 5200 3200 2100 1400 1100 1000 500 200 56600 466100 2400 12800 1000000 4.74 4.76 0.95 0.95 0.95 1.90 14.24 0.44 0.38 0.24 0.23 0.16 0.10 0.06 0.04 0.03 0.03 0.02 0.01 1.74 14.36 0.07 0.39 30.81 PPM 47360 47606 9460 9460 9460 19043 142388 4437 3759 2434 2280 1602 986 647 431 339 308 154 62 17440 143620 740 3944 308132 Solder Ball Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Tin Silver Copper Weight (g) CAS# 7440-31-5 7440-22-4 7440-50-8 1.13 E-02 3.52 E-04 5.86 E-05 1.17 E-02 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 13.87 0.43 0.07 14.37 PPM 138693 4312 719 143724 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 1.16 E-03 1.17 E-05 1.17 E-03 Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 1.42 0.014 1.44 PPM 14207 144 14351 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon Component Level Weight (g) CAS# 7440-21-3 9.42 E-03 Percentage (%) PPM Percentage (%) 100 1000000 11.55 PPM 115502 Die Attach Component Level Homogeneous Material Level Description Other organic materials Other organic materials Other organic materials Other inorganic materials Subtotal Substance Acrylic copolymer Epoxy Resin Phenol Resin Silicon Dioxide CAS# Weight (g) Proprietary Proprietary Proprietary Proprietary 7.26 E-04 1.56 E-04 1.56 E-04 5.70 E-05 1.09 E-03 Weight (g) 8.15 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 66.35 14.22 14.22 5.21 100.00 663500 142200 142200 52100 1000000 0.89 0.19 0.19 0.07 1.34 Percentage (%) 100.00 PPM 8902 1908 1908 699 13417 PPM 1000000