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a
124-Lead Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-124-1)
Dimensions shown in millimeters
A1 CORNER
INDEX AREA
9.10
9.00 SQ
8.90
12 11 10 9 8 7 6 5 4 3 2 1
BALL A1
PAD CORNER
TOP VIEW
A
B
C
D
E
F
G
H
J
K
L
M
7.15
BSC SQ
0.65 BSC
DETAIL A
*1.40 MAX
DETAIL A
0.65 MIN
0.15 MIN
0.45
0.40
0.35
BALL DIAMETER
*COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION OF PACKAGE HEIGHT.
.............................
SEATING
PLANE
COPLANARITY
0.10