Materials Declaration Package Body Size Ball Count Option Item Molding Compound % of Compound 88 12 Molding Compound Weight (g) 8.94 E-02 1.22 E-02 PPM 464810 63431 Weight (g) 1.67 E-02 9.40 E-03 6.00 E-04 3.60 E-03 8.10 E-03 1.10 E-03 PPM 86827 48873 3120 18717 42114 5719 Solder Ball % of Balls 96.5 3 0.5 Weight (g) 3.15 E-02 1.00 E-03 2.00 E-04 PPM 163775 5199 1040 Item Bond Wires % of Wire 99.99 Weight (g) 2.09 E-03 PPM 10844 Item Chip 1- Bottom % of Chip 100 Weight (g) 8.06 E-03 PPM 41898 Silica Epoxy Resin Item BT-Epoxy Copper Gold Nickel Solder Mask Brominated Compound Item Sn Ag Cu Au Si Item Si Item Ag Filler Resin Item Si Filler Epoxy/Acrylic Item Epoxy Rubber Silica CSP-BGA - Stacked Die 9X9 124 Pb-Free Laminate % of Laminate 42.3 23.8 1.5 9.1 20.5 2.89 Chip 2 - Top % of Chip 100 Weight (g) 6.17 E-03 PPM 32092 Die Attach 1 - Bottom Die % of Die Attach Weight (g) 1.00 E-03 78 3.00 E-04 22 PPM 5199 1560 Die Attach 2 - Top Die % of Die Attach Weight (g) 2.00 E-05 6 3.00 E-04 94 Film Spacer % of Spacer 60 30 10 Item Method PPM Pb Cd Hg Cr+6 PBB PBDE Laminate Item Method PPM Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste 1 Item Pb Cd Hg Cr+6 PBB PBDE PPM Item PPM Method Die Attach Paste 2 Method Pb Cd Hg Cr+6 PBB PBDE PPM 104 1560 Weight (g) 3.00 E-04 2.00 E-04 1.00 E-04 PPM 1560 1040 520 Package Totals Weight (g) 1.92 E-01 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 1/2/2006