Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Biphenyl resin Sb2O3 Br Item Laminate Copper Solder Mask Nickel Brominated Compound Gold CSP_BGA 15 X 15 124 Sn/Ag/Cu 0.45mm Molding Compound % of Compound 87.0 12.2 0.5 0.3 Laminate % of Laminate 43.2 24.2 21.0 7.4 3.0 1.3 Weight (g) 2.37 E-01 3.32 E-02 1.40 E-03 8.00E-04 PPM 486689 68235 2877 1644 Weight (g) 4.63E-02 2.60E-02 2.25E-02 7.90E-03 3.20E-03 1.40E-03 1.07 E-01 PPM 95159 53437 46244 16237 6577 2877 Sn Ag Cu Solder Ball % of Solder Ball 96.5 3.0 0.5 Weight (g) 4.79 E-02 1.50 E-03 2.00 E-04 PPM 98448 3083 411 Au Bond Wires % of Wire 99.99 Weight (g) 1.89 E-03 PPM 3887 Si Chip % of Chip 100.0 Weight (g) 5.30 E-02 PPM 108851 % of Die Attach 54.0 48.0 Weight (g) 1.40E-03 1.20E-03 PPM 2877 2466 Die Attach Item Epoxy/Acrylic SiO2 Filler Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM EPA3052. ICP-AES None Detected EPA3052. ICP-AES None Detected EPA3052. ICP-AES None Detected None Detected USEPA 3060A. UV-VIS. Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method US EPA Method 3050B. ICP-AES US EPA Method 3050B. ICP-AES US EPA Method 3052. ICP-AES US EPA Method 3060A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Package Totals PPM Weight (g) 1000000 4.87 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 10/11/06 Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Biphenyl resin Sb2O3 Br Item Laminate Copper Solder Mask Nickel Brominated Compound Gold Sn Pb CSP_BGA 15 X 15 124 Sn/Pb 0.45mm Molding Compound % of Compound 87.0 12.2 0.5 0.3 Laminate % of Laminate 43.2 24.2 21.0 7.4 3.0 1.3 Solder Ball % of Solder Ball 63.0 37.0 Weight (g) 2.37 E-01 3.32 E-02 1.40 E-03 8.00E-04 PPM 477464 66942 2823 1613 Weight (g) 4.63E-02 2.60E-02 2.25E-02 7.90E-03 3.20E-03 1.40E-03 1.07 E-01 PPM 93356 52424 45367 15929 6452 2823 Weight (g) 3.72 E-02 2.18 E-02 PPM 75007 43956 Bond Wires % of Wire 99.99 Weight (g) 1.89 E-03 PPM Au Si Chip % of Chip 100.0 Weight (g) 5.30 E-02 PPM 106788 Die Attach % of Die Attach 54.0 48.0 Weight (g) 1.40E-03 1.20E-03 PPM Item Epoxy/Acrylic SiO2 Filler Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM EPA3052. ICP-AES None Detected EPA3052. ICP-AES None Detected EPA3052. ICP-AES None Detected None Detected USEPA 3060A. UV-VIS. Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS None Detected Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM US EPA Method 3050B. ICP-AES None Detected None Detected US EPA Method 3050B. ICP-AES None Detected US EPA Method 3052. ICP-AES None Detected US EPA Method 3060A. UV-VIS None Detected Analysis was performed by GC/MS Analysis was performed by GC/MS None Detected 3814 2823 2420 Package Totals Weight (g) PPM 1000000 4.96 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 10/11/06