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a
148-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-148)
Dimensions shown in millimeters
A1 CORNER
INDEX AREA
9.10
9.00 SQ
8.90
BALL A1
PAD CORNER
TOP VIEW
16
14 12 10
15 13 11 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
7.50
BSC SQ
0.50 BSC
DETAIL A
*1.11 MAX
0.15 MIN
0.35
0.30
0.25
BALL DIAMETER
SEATING
PLANE
*COMPLIANT TO JEDEC STANDARDS MO-195 WITH EXCEPTION
TO DIMENSIONS PACKAGE HEIGHT AND THICKNESS.
COPLANARITY
0.08
012006-0
*1.40 MAX
DETAIL A