Materials Declaration Package Body Size LeadCount Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Item BT - epoxy Glass Fiber Cu Ni Solder mask Au CSP_BGA 17 x 17 mm 208 SnPbAg 0.45 mm Molding Compound % of Compound Weight (g) 86.2 3.55 E-01 6.0 2.47 E-02 6.0 2.47 E-02 1.5 6.18 E-03 0.3 1.24 E-03 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 PPM 414592 28858 28858 7214 1443 Weight (g) 7.52 E-02 6.97 E-02 5.01 E-02 3.06 E-02 3.06 E-02 2.23 E-02 PPM 87816 81311 58543 35777 35777 26020 Sn Pb Ag Solder Ball % of Plating 62.0 36.0 2.00 Weight (g) 5.17 E-02 3.00 E-02 1.67 E-03 PPM 60362 35049 1947 Au Bond Wires % of Wire 99.00 Weight (g) 3.87 E-03 PPM 4515 Si Chip % of Chip 100.0 Weight (g) 1.62 E-02 PPM 18955 Die Attach % of Die Attach 75.0 12.0 5.0 5.0 3.0 Weight (g) 4.69 E-02 7.50 E-03 3.13 E-03 3.13 E-03 1.88 E-03 PPM 54721 8755 3648 3648 2189 Weight (g) 8.57 E-01 PPM 1000000 Item Ag Filler Diester Functionalized ester Epoxy resin Functionalized urethane Item Pb Cd Hg Cr+6 PBB PBDE Mold Compound Method PPM None Detected USEPA3050B. ICP-AES None Detected EN 1122 Method B:2001. ICP-AES None Detected USEPA 3052. ICP-AES None Detected USEPA 3060A & USEPA 7196A None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 10/19/2006 Materials Declaration Package Body Size LeadCount Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black CSP_BGA 17 x 17 mm 208 SnAgCu 0.45 mm Molding Compound % of Compound Weight (g) 86.2 3.55 E-01 6.0 2.47 E-02 6.0 2.47 E-02 1.5 6.18 E-03 0.3 1.24 E-03 PPM 419454 29196 29196 7299 1460 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Weight (g) 7.52 E-02 6.97 E-02 5.01 E-02 3.06 E-02 3.06 E-02 2.23 E-02 PPM 88846 82265 59230 36197 36197 26325 Sn Ag Cu Solder Ball % of Plating 96.5 3.00 0.50 Weight (g) 7.09 E-02 2.20 E-03 3.67 E-04 PPM 83736 2603 433 Bond Wires % of Wire 99.00 Weight (g) 3.87 E-03 PPM Au Si Chip % of Chip 100.0 Weight (g) 1.62 E-02 PPM 19177 Die Attach % of Die Attach Weight (g) 75.0 4.69 E-02 12.0 7.50 E-03 5.0 3.13 E-03 5.0 3.13 E-03 3.0 1.88 E-03 PPM 55363 8858 3691 3691 2215 Weight (g) 8.47 E-01 PPM 1000000 Item BT - epoxy Glass Fiber Cu Ni Solder mask Au Item Ag Filler Diester Functionalized ester Epoxy resin Functionalized urethane 4568 Item Pb Cd Hg Cr+6 PBB PBDE Mold Compound Method PPM None Detected USEPA3050B. ICP-AES None Detected EN 1122 Method B:2001. ICP-AES None Detected USEPA 3052. ICP-AES None Detected USEPA 3060A & USEPA 7196A None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 10/19/2006