Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
Product specification
2003 Sep 09
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
FEATURES
APPLICATIONS
Distinctive features
Besides typical application areas, i.e. TV and monitor
supplies, the device can be used in adapters and chargers
and all applications that demand an efficient and
cost-effective solution up to 150 W. Unlike the other
GreenChipII control ICs, the TEA1506 has no internal
high voltage start-up source and needs to be started by
means of an external bleeder resistor.
• Universal mains supply operation (70 to 276 V AC)
• High level of integration; giving a low external
component count.
Green features
• Valley or zero voltage switching for minimum switching
losses
• Efficient quasi-resonant operation at high power levels
• Frequency reduction at low power standby for improved
system efficiency (≤3 W)
• Cycle skipping mode at very low loads.
Protection features
• Safe restart mode for system fault conditions
1
8
• Continuous mode protection by means of
demagnetization detection (zero switch-on current)
2
7
3
6
4
5
TEA1506P
TEA1506AP
• Accurate and adjustable overvoltage protection (latched
in TEA1506; safe restart in TEA1506A)
• Short winding protection
• Undervoltage protection (foldback during overload)
• Overtemperature protection
• Low and adjustable overcurrent protection trip level
• Soft (re)start.
MDB504
Fig.1 Basic application diagram.
2003 Sep 09
2
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
The special built-in green functions allow the efficiency to
be optimum at all power levels. This holds for
quasi-resonant operation at high power levels, as well as
fixed frequency operation with valley switching at medium
power levels. At low power (standby) levels, the system
operates at a reduced frequency and with valley detection.
GENERAL DESCRIPTION
GreenChip(1)II
is the second generation of green
The
Switched Mode Power Supply (SMPS) control ICs. A high
level of integration leads to a cost effective power supply
with a low number of external components.
Highly efficient and reliable supplies can easily be
designed using the GreenChipII control IC.
(1) GreenChip is a trademark of Koninklijke Philips
Electronics N.V.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TEA1506P
DESCRIPTION
VERSION
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
TEA1506AP
TEA1506T
TEA1506AT
2003 Sep 09
3
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DRAIN
Iprot(DEM)
internal
supply
GND
VALLEY
UVLO start
clamp
2
(3)
4
VOLTAGE
CONTROLLED
OSCILLATOR
LOGIC
(7)
DEM
100
mV
UP/DOWN
COUNTER
FREQUENCY
CONTROL
LOGIC
Iprot(CTRL)
4
CTRL
3
OVERVOLTAGE
PROTECTION
6
DRIVER
Philips Semiconductors
(2)
8
(14)
GreenChipII SMPS control IC
SUPPLY
MANAGEMENT
BLOCK DIAGRAM
1
k, full pagewidth
2003 Sep 09
VCC
DRIVER
(11)
−1
(6)
Iss
POWER-ON
RESET
LEB
S
Q
R
Q
3.8 V
soft
start
S2
blank
UVLO
0.5 V
5
OCP
TEA1506P;
TEA1506AP
(TEA1506T;
TEA1506 AT)
VCC < 4.5 V
or UVLO
(TEA1506AT)
Q
R
Q
short
winding
MAXIMUM
ON-TIME
PROTECTION
0.88 V
MDB505
Pin numbers in parenthesis represent the SO version.
Fig.2 Block diagram.
Product specification
OVERPOWER
PROTECTION
Isense
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
OVERTEMPERATURE
PROTECTION
S
(9)
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
PINNING
PIN
SYMBOL
DESCRIPTION
DIP8
SO14
VCC
1
2
supply voltage
GND
2
3
ground
CTRL
3
6
control input
DEM
4
7
input from auxiliary winding for demagnetization timing; overvoltage and
overpower protection
Isense
5
9
programmable current sense input
DRIVER
6
11
gate driver output
HVS
7
12, 13
DRAIN
8
14
n.c.
−
1, 4, 5, 8,
10
high voltage safety spacer; not connected
drain of external MOS switch; input for valley sensing and initial internal
supply
not connected
handbook, halfpage
n.c. 1
handbook, halfpage
VCC 1
8 DRAIN
GND 2
7 HVS
TEA1506P
VCC 2
13 HVS
GND 3
12 HVS
n.c. 4
CTRL 3 TEA1506AP 6 DRIVER
n.c. 5
DEM 4
5 Isense
14 DRAIN
TEA1506T 11 DRIVER
TEA1506AT
10 n.c.
CTRL 6
9
Isense
DEM 7
8
n.c.
MDB506
MDB507
Fig.3 Pin configuration DIP8.
2003 Sep 09
Fig.4 Pin configuration SO14.
5
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
FUNCTIONAL DESCRIPTION
The TEA1506 is the controller of a compact flyback
converter, and is situated at the primary side. An auxiliary
winding of the transformer provides demagnetization
detection and powers the IC after start-up.
0.52 V
The TEA1506 can operate in multi modes (see Fig.5).
f
MGU233
V
sense(max)
handbook, halfpage
MGU508
handbook, halfpage
(kHz)
VCO
fixed
1V
(typ)
quasi resonant
175
1.5 V
(typ)
VCTRL
Fig.6 Vsense(max) voltage as function of VCTRL.
25
The moment the voltage on pin VCC drops below the
undervoltage lock-out level, the IC stops switching and
re-enters the safe restart mode.
P (W)
Fig.5 Multi modes operation.
Supply management
All (internal) reference voltages are derived from a
temperature compensated, on-chip band gap circuit.
The next converter stroke is started only after
demagnetization of the transformer current (zero current
switching), while the drain voltage has reached the lowest
voltage to prevent switching losses (green function). The
primary resonant circuit of the primary inductance and
drain capacitor ensures this quasi-resonant operation. The
design can be optimized in such a way that zero voltage
switching can be reached over almost the universal mains
range.
Current mode control
Current mode control is used for its good line regulation
behaviour.
The ‘on-time’ is controlled by the internally inverted control
voltage, which is compared with the primary current
information. The primary current is sensed across an
external resistor. The driver output is latched in the logic,
preventing multiple switch-on.
To prevent very high frequency operation at lower loads,
the quasi-resonant operation changes smoothly in fixed
frequency PWM control.
The internal control voltage is inversely proportional to the
external control pin voltage, with an offset of 1.5 V. This
means that a voltage range from 1 to 1.5 V on pin CTRL
will result in an internal control voltage range from
0.5 to 0 V (a high external control voltage results in a low
duty cycle).
At very low power (standby) levels, the frequency is
controlled down, via the VCO, to a minimum frequency of
approximately 25 kHz.
Start-up and undervoltage lock-out
Initially the IC is in the save restart mode. As long as VCC
is below the VCC(start) level, the supply current is nearly
zero.
Oscillator
The maximum fixed frequency of the oscillator is set by an
internal current source and capacitor. The maximum
frequency is reduced once the control voltage enters the
VCO control window. Then, the maximum frequency
changes linearly with the control voltage until the minimum
frequency is reached (see Figs 6 and 7).
The IC will activate the converter as soon as the voltage on
pin VCC passes the VCC(start) level.
The IC supply is taken over by the auxiliary winding as
soon as the output voltage reaches its intended level.
2003 Sep 09
6
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
Cycle skipping
At very low power levels, a cycle skipping mode will be
activated. A high control voltage will reduce the switching
frequency to a minimum of 25 kHz. If the voltage on the
control pin is raised even more, switch-on of the external
power MOSFET will be inhibited until the voltage on the
control pin has dropped to a lower value again (see Fig.8).
MGU509
f
(kHz)
handbook, halfpage
175 kHz
175
25
VCO2
level
VCO1
level
For system accuracy, it is not the absolute voltage on the
control pin that will trigger the cycle skipping mode, but a
signal derived from the internal VCO will be used.
Vsense(max) (V)
Remark: If the no-load requirement of the system is such
that the output voltage can be regulated to its intended
level at a switching frequency of 25 kHz or above, the
cycle skipping mode will not be activated.
Fig.7 VCO frequency as function of Vsense(max).
fosc
handbook, full pagewidth
1.5 V − VCTRL
current
comparator
CTRL
fmax
DRIVER
DRIVER
fmin
Isense
X2
dV2
Vx
cycle
skipping
V
I
dV1
150
Vx (mV)
OSCILLATOR
150 mV
1
0
Vx (mV)
MGU510
The voltage levels dV1 and dV2 are fixed in the IC to 50 mV (typical) and 18 mV (typical) respectively.
Fig.8 The cycle skipping circuitry.
2003 Sep 09
7
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
Regarding the TEA1506, the IC will not start switching
again. Subsequently, VCC will drop again to the UVLO
level, etc.
Operation only recommences when the VCC voltage drops
below a level of about 4.5 V.
Demagnetization
The system will be in discontinuous conduction mode all
the time. The oscillator will not start a new primary stroke
until the secondary stroke has ended.
Demagnetization features a cycle-by-cycle output
short-circuit protection by immediately lowering the
frequency (longer off-time), thereby reducing the power
level.
Regarding the TEA1506A, when the Vstart level is reached,
switching starts again (safe restart mode) when the Vstart
level is reached. This process is repeated as long as the
OVP condition exists.
Demagnetization recognition is suppressed during the first
tsuppr time. This suppression may be necessary in
applications where the transformer has a large leakage
inductance, at low output voltages and at start-up.
The output voltage Vo(OVP) at which the OVP function trips,
can be set by the demagnetization resistor, RDEM:
V o ( OVP ) =
If pin DEM is open-circuit or not connected, a fault
condition is assumed and the converter will stop operating
immediately. Operation will recommence as soon as the
fault condition is removed.
Ns
----------- { I (OVP)(DEM) × R DEM + V clamp(DEM)(pos) }
N aux
where Ns is the number of secondary turns and Naux is the
number of auxiliary turns of the transformer.
Minimum and maximum ‘on-time’
Current I(OVP)(DEM) is internally trimmed.
The minimum ‘on-time’ of the SMPS is determined by the
Leading Edge Blanking (LEB) time. The IC limits the
‘on-time’ to 50 µs. When the system desires an ‘on-time’
longer than 50 µs, a fault condition is assumed (e.g.
removed Ci in Fig.12), the IC will stop switching and enter
the safe restart mode.
The value of RDEM can be adjusted to the turns ratio of the
transformer, thus making an accurate OVP possible.
OverVoltage Protection (OVP)
An OVP mode is implemented in the GreenChip series.
This works for the TEA1506 by sensing the auxiliary
voltage via the current flowing into pin DEM during the
secondary stroke. The auxiliary winding voltage is a
well-defined replica of the output voltage. Any voltage
spikes are averaged by an internal filter.
If the output voltage exceeds the OVP trip level, an internal
counter starts counting subsequent OVP events. The
counter has been added to prevent incorrect OVP
detections which might occur during ESD or lightning
events. If the output voltage exceeds the OVP trip level a
few times and not again in a subsequent cycle, the internal
counter will count down with twice the speed compared
with counting-up. However, when typical 10 cycles of
subsequent OVP events are detected, the IC assumes a
true OVP and the OVP circuit switches the power
MOSFET off. Next, the controller waits until the UVLO
level is reached on pin VCC. When VCC drops to UVLO,
capacitor CVCC will be recharged to the Vstart level.
2003 Sep 09
8
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
Valley switching
lowest drain voltage before starting a new primary stroke.
This method is called valley detection.
Figure 9 shows the drain voltage together with the valley
signal, the signal indicating the secondary stroke and the
oscillator signal.
A new cycle starts when the power MOSFET is switched
on (see Fig.9). After the ‘on-time’ (which is determined by
the ‘sense’ voltage and the internal control voltage), the
switch is opened and the secondary stroke starts. After the
secondary stroke, the drain voltage shows an oscillation
1
with a frequency of approximately ----------------------------------------------2 × π × ( Lp × Cd )
In an optimum design, the reflected secondary voltage on
the primary side will force the drain voltage to zero. Thus,
zero voltage switching is very possible, preventing large
1
2
capacitive switching losses  P = --- × C × V × f
2
where Lp is the primary self inductance of the transformer
and Cd is the capacitance on the drain node.
and allowing high frequency operation, which results in
small and cost effective inductors.
As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for the
primary
stroke
handbook, full pagewidth
secondary
ringing
secondary
stroke
drain
valley
secondary
stroke
B
A
oscillator
MGU235
A: Start of new cycle at lowest drain voltage.
B: Start of new cycle in a classical PWM system at high drain voltage.
Fig.9 Signals for valley switching.
2003 Sep 09
9
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
Short winding protection
After the leading edge blanking time, the short winding
protection circuit is activated. If the ‘sense’ voltage
exceeds the short winding protection voltage Vswp, the
converter will stop switching. Once VCC drops below the
UVLO level, capacitor CVCC will be recharged and the
supply will restart again. This cycle will be repeated until
the short-circuit is removed (safe restart mode).
MGU236
handbook, halfpage
Vsense(max)
0.52 V
(typ)
0.3 V
(typ)
The short winding protection will also protect in case of a
secondary diode short-circuit.
−100 µA
(typ)
IDEM
−24 µA
(typ)
OverTemperature Protection (OTP)
An accurate temperature protection is provided in the
circuit. When the junction temperature exceeds the
thermal shutdown temperature, the IC will enter the safe
restart mode.
Fig.10 OPP correction curve.
OverCurrent Protection (OCP)
When the Vstart level is reached, switching starts again.
This process is repeated as long as the OTP condition
exists.
The cycle-by-cycle peak drain current limit circuit uses the
external source resistor to measure the current accurately.
This allows optimum size determination of the transformer
core (cost issue). The circuit is activated after the leading
edge blanking time, tleb. The OCP circuit limits the ‘sense’
voltage to an internal level.
OverPower Protection (OPP)
During the primary stroke, the rectified mains input voltage
is measured by sensing the current drawn from pin DEM.
This current is dependent on the mains voltage, according
V aux N × V mains
to the following formula: I DEM ≈ --------------- ≈ -------------------------R DEM
R DEM
N aux
where: N = ----------Np
The current information is used to adjust the peak drain
current, which is measured via pin Isense. The internal
compensation is such that an almost mains independent
maximum output power can be realized.
The OPP curve is given in Fig.10.
2003 Sep 09
10
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
Control pin protection
If pin CTRL is open-circuit or not connected, a fault
condition is assumed and the converter will stop switching.
Operation will recommence as soon as the fault condition
is removed.
handbook, halfpage
ISS
Soft start-up
0.5 V
To prevent transformer rattle during hiccup, the
transformer peak current is slowly increased by the soft
start function. This can be achieved by inserting a resistor
and a capacitor between pin Isense and the sense resistor
(see Fig.11). An internal current source charges the
capacitor to V = ISS × RSS, with a maximum of
approximately 0.5 V.
start-up
RSS
5 Isense
Vocp
CSS
Rsense
MGU237
The start level and the time constant of the increasing
primary current level can be adjusted externally by
changing the values of RSS and CSS.
Fig.11 Soft start.
V ocp – ( I SS × R SS )
I primary(max) = ---------------------------------------------R sense
Driver
τ = R SS × C SS
The driver circuit to the gate of the power MOSFET has a
current sourcing capability of 135 mA typical and a current
sink capability of 560 mA typical. This permits fast turn-on
and turn-off of the power MOSFET for efficient operation.
The charging current ISS will flow as long as the voltage on
pin Isense is below approximately 0.5 V. If the voltage on
pin Isense exceeds 0.5 V, the soft start current source will
start limiting the current ISS. At the VCC(start) level, the ISS
current source is completely switched off.
A low driver source current has been chosen to limit the
∆V/∆t at switch-on. This reduces Electro Magnetic
Interference (EMI) and also limits the current spikes
across Rsense.
Since the soft start current ISS is supplied from pin DRAIN,
the RSS value will not affect the VCC current during start-up.
2003 Sep 09
11
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Voltages
continuous
−0.4
VCC
supply voltage
+20
V
VCTRL
voltage on pin CTRL
−0.4
+5
V
VDEM
voltage on pin DEM
current limited
−0.4
−
V
Vsense
voltage on pin Isense
current limited
−0.4
−
V
VDRAIN
voltage on pin DRAIN
−0.4
+650
V
ICTRL
current on pin CTRL
−
5
mA
IDEM
current on pin DEM
−250
+250
µA
Isense
current on pin Isense
−1
+10
mA
IDRIVER
current on pin DRIVER
−0.8
+2
A
IDRAIN
current on pin DRAIN
−
5
mA
Currents
d < 10 %
General
Ptot
total power dissipation
−
0.75
W
Tstg
storage temperature
Tamb < 70 °C
−55
+150
°C
Tj
operating junction temperature
−20
+145
°C
Vesd
electrostatic discharge voltage
all pins except pins DRAIN and VCC
HBM class 1; note 2
−
2000
V
pins DRAIN and VCC
HBM class 1; note 2
−
1500
V
any pin
MM; note 3
−
400
V
Notes
1. All voltages are measured with respect to ground; positive currents flow into the IC; pin VCC may not be current
driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the
maximum power rating is not violated.
2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
thermal resistance from junction to
ambient
QUALITY SPECIFICATION
In accordance with ‘SNW-FQ-611-D’.
2003 Sep 09
12
CONDITIONS
VALUE
UNIT
in free air
100
K/W
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
CHARACTERISTICS
Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into
the IC; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Start-up current source (pin DRAIN)
IDRAIN
supply current drawn from
pin DRAIN
BVDSS
breakdown voltage
VCC < Vstart
VCC > Vstart
−
500
−
µA
−
50
−
µA
650
−
−
V
10.3
11
11.7
V
8.1
Supply voltage management (pin VCC)
VCC(start)
start-up voltage on VCC
VCC(UVLO)
undervoltage lock-out on VCC
8.7
9.3
V
VCC(hys)
hysteresis voltage on VCC
VCC(start) − VCC(UVLO)
2.0
2.3
2.6
V
ICC(oper)
supply current under normal
operation
no load on pin DRIVER 1.1
1.3
1.5
mA
ICC(start)
supply current in start-up and safe
restart mode
VCC < Vstart
0(1)
−
70
µA
ICC(protection)
supply current while not switching
VCC > VUVLO
−
0.85
−
mA
50
100
150
mV
−50(2)
−
−10
nA
−0.5
−0.25
−0.05
V
0.5
0.7
0.9
V
1.1
1.5
1.9
µs
−
tleb
−
ns
Demagnetization management (pin DEM)
Vth(DEM)
demagnetization comparator
threshold voltage on pin DEM
Iprot(DEM)
protection current on pin DEM
VDEM = 50 mV
Vclamp(DEM)(neg) negative clamp voltage on pin DEM IDEM = −150 µA
Vclamp(DEM)(pos) positive clamp voltage on pin DEM
tsuppr
IDEM = 250 µA
suppression of transformer ringing
at start of secondary stroke
Pulse width modulator
ton(min)
minimum on-time
ton(max)
maximum on-time
latched
40
50
60
µs
fosc(l)
oscillator low fixed frequency
VCTRL > 1.5 V
20
25
30
kHz
fosc(h)
oscillator high fixed frequency
VCTRL < 1 V
145
175
205
kHz
Vvco(start)
peak voltage on pin Isense; where
frequency reduction starts
see Figs 7 and 8
−
VCO1
−
mV
Vvco(nom)
peak voltage on pin Isense; where
the frequency is equal to fosc(l)
−
VCO1 − 50
−
mV
Oscillator
Duty cycle control (pin CTRL)
VCTRL(min)
minimum voltage on pin CTRL for
maximum duty cycle
−
1.0
−
V
VCTRL(max)
maximum voltage on pin CTRL for
minimum duty cycle
−
1.5
−
V
Iprot(CTRL)
protection current on pin CTRL
−1(2)
−0.8
−0.5
µA
2003 Sep 09
VCTRL = 1.5 V
13
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Valley switch (pin DRAIN)
∆V/∆tvalley
valley recognition voltage change
−85
−
+85
V/µs
tvalley-swon
delay from valley recognition to
switch-on
−
150(2)
−
ns
Overcurrent and short winding protection (pin Isense)
Vsense(max)
maximum source voltage OCP
∆V/∆t = 0.1 V/µs
0.48
0.52
0.56
V
tPD
propagating delay from detecting
Vsense(max) to switch-off
∆V/∆t = 0.5 V/µs
−
140
185
ns
Vswp
short winding protection voltage
0.83
0.88
0.96
V
tleb
blanking time for current and short
winding protection
300
370
440
ns
ISS
soft start current
Vsense < 0.5 V
45
60
75
µA
set by resistor RDEM;
see Section
“OverVoltage
Protection (OVP)”
54
60
66
µA
set by resistor RDEM;
see Section
“OverPower
Protection (OPP)”
−
−24
−
µA
−
−100
−
µA
Overvoltage protection (pin DEM)
IOVP(DEM)
OVP level on pin DEM
Overpower protection (pin DEM)
IOPP(DEM)
OPP current on pin DEM to start
OPP correction
IOPP50%(DEM)
OPP current on pin DEM; where
maximum source voltage is limited
to 0.3 V
Driver (pin DRIVER)
Isource
source current capability of driver
VCC = 9.5 V;
VDRIVER = 2 V
−
−135
−
mA
Isink
sink current capability of driver
VCC= 9.5 V;
VDRIVER = 2 V
−
240
−
mA
VCC = 9.5 V;
VDRIVER = 9.5 V
−
560
−
mA
VCC > 12 V
−
11.5
12
V
Vo(max)
maximum output voltage of the
driver
Overtemperature protection
Tprot(max)
maximum temperature protection
level
130
140
150
°C
Tprot(hys)
hysteresis for the temperature
protection level
−
8(2)
−
°C
Notes
1. For VCC ≥ 2 V.
2. Guaranteed by design.
2003 Sep 09
14
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
APPLICATION INFORMATION
A converter with the TEA1506 consists of an input filter, a transformer with a third winding (auxiliary), and an output stage
with a feedback circuit.
Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the resistor RS during start-up and
via the auxiliary winding during operation.
A sense resistor converts the primary current into a voltage at pin Isense. The value of this sense resistor defines the
maximum primary peak current.
handbook, full pagewidth
Vmains
Do
Vi
Vo
Ci
RS
Np
VCC
CVCC
CCTRL
RCTRL
GND
CTRL
DEM
3
Co
8 DRAIN
1
2
Ns
TEA1506P
TEA1506AP
7
6
5
4
HVS
n.c.
power
MOSFET
DRIVER
Isense
RSS
CSS
Rsense
Dmicro
VµC
RDEM
Naux
Cmicro
MICROCONTROLLER
Rreg1
Rreg2
MDB508
Fig.12 Flyback configuration with secondary sensing.
2003 Sep 09
15
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
handbook, full pagewidth
Vi
VD
(power
MOSFET)
Vi
Vo
VCC
Vgate
VµC
start-up
sequence
normal
operation
overvoltage
protection
(TEA1506AP/TEA1506AT)
Fig.13 Typical waveforms.
2003 Sep 09
16
output
short-circuit
normal
operation
MDB509
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.02
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT97-1
050G01
MO-001
SC-504-8
2003 Sep 09
17
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.010 0.057
0.004 0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.05
0.028
0.024
0.01
0.01
0.004
0.028
0.012
inches 0.069
0.244
0.039
0.041
0.228
0.016
θ
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
2003 Sep 09
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
18
o
8
0o
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
SOLDERING
cooling) vary between 100 and 200 seconds depending
on heating method.
Introduction
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
– for all the BGA and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
The total contact time of successive solder waves must not
exceed 5 seconds.
To overcome these problems the double-wave soldering
method was specifically developed.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
MANUAL SOLDERING
• For packages with leads on two sides and a pitch (e):
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Surface mount packages
The footprint must incorporate solder thieves at the
downstream end.
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
2003 Sep 09
19
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
dispensing. The package can be soldered after the
adhesive is cured.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
PACKAGE(1)
MOUNTING
WAVE
REFLOW(2) DIPPING
suitable(3)
−
suitable
Through-holesurface mount
PMFP(9)
not suitable
not suitable
−
Surface mount
BGA, LBGA, LFBGA, SQFP, SSOP-T(4),
TFBGA, VFBGA
not suitable
suitable
−
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
not suitable(5)
suitable
−
PLCC(6), SO, SOJ
suitable
suitable
−
suitable
−
suitable
−
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
recommended(6)(7)
LQFP, QFP, TQFP
not
SSOP, TSSOP, VSO, VSSOP
not recommended(8)
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
5. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
6. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
7. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
8. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2003 Sep 09
20
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Sep 09
21
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA75
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/01/pp22
Date of release: 2003
Sep 09
Document order number:
9397 750 11434
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