Materials Declaration Package Body Size Lead Count Option Item Kovar Nickel Gold Subtotal Item Gold Sn Subtotal Item Al2O3 Iron Nickel Chromium SiO2 Co,Ag,Cu,MgO,CaO Tungsten Gold Subtotal Item Aluminum Item Si Item Tin Lead Subtotal Item Silver Filler Cyanate ester resin Subtotal Sidebraze 300 mils 14 SnPb Combolid % of Combolid 92 4 4 Weight (g) 1.63E-01 7.08E-03 7.08E-03 1.77E-01 PPM 125791 5469 5469 136730 Weight (g) 1.19 E-02 3.06 E-03 1.50 E-02 PPM 9221 2366 11587 0.015 Weight (g) 8.19 E-01 6.71 E-02 5.17 E-02 3.52 E-02 3.21 E-02 3.06 E-02 2.66 E-02 1.70 E-03 1.06 E+00 PPM 632880 51863 39945 27206 24822 23671 20548 1315 822251 1.064 Bond Wires % of Wire 100 Weight (g) 1.20 E-03 PPM Chip 1 % of Chip 100 Weight (g) 6.70 E-03 PPM 5176 0.0067 Weight (g) 1.83 E-02 1.07 E-02 2.90 E-02 PPM 14113 8289 22402 0.029 Weight (g) 9.60 E-04 2.40 E-04 1.20 E-03 PPM Lid Frame % of Lid Frame 79.58 20.42 Ceramic Package % of Ceramic 77.0 6.3 4.9 3.3 3.0 2.9 2.5 0.2 Solder % of Solder 63 37 Die Attach Paste % of Die Attach Paste 80 20 0.177 0.0012 927 0.0012 742 185 927 Package Totals Weight (g) 1.29E+00 PPM 1000000 1.2941 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size Lead Count Option Item Kovar Nickel Gold Subtotal Item Gold Sn Subtotal Item Sidebraze 300 mils 14 Pb-free Combolid % of Combolid 92 4 4 Lid Frame % of Lid Frame 79.58 20.42 Ceramic Package % of Ceramic Weight (g) 1.63E-01 7.08E-03 7.08E-03 1.77E-01 PPM 117396 5104 5104 127604 Weight (g) 1.19 E-02 3.06 E-03 1.50 E-02 PPM 8606 2208 10814 Weight (g) PPM Ceramic Al2O3 Cr2O3 SiO2 TiO2 Cao MgO Subtotal 90.5 3.9 3.5 1.0 0.6 0.5 7.57 E-01 3.26 E-02 2.93 E-02 8.36 E-03 5.02 E-03 4.18 E-03 8.36 E-01 545440 23505 21094 6027 3616 3013 602696 Metallization Tungsten Molybdenum Subtotal 96.61 3.39 4.83 E-02 1.70 E-03 5.00 E-02 34824 1222 36046 Lead Iron Nickel Manganese Cobalt Subtotal 58 40.7 0.8 0.5 1.51 E-01 1.06 E-01 2.08 E-03 1.30 E-03 2.60 E-01 108716 76289 1500 937 187441 85 15 8.50 E-03 1.50 E-03 1.00 E-02 6128 1081 7209 93.89 5.36 0.7 0.05 9.39 E-03 5.36 E-04 7.00 E-05 5.00 E-06 1.00 E-02 6769 386 50 4 7209 92 8 9.20 E-03 8.00 E-04 1.00 E-02 6633 577 7209 Weight (g) 1.00 E-02 PPM 7209 Ag-Au ( base metal) Silver Copper Subtotal Nickel Plating ( 1st coating) Nickel Palladium Boron Lead Subtotal Nickel Plating ( 2nd layer) Nickel Cobalt Subtotal Item Gold External Leadframe Plating % of External Plating 100 Item Bond Wires % of Wire 100 Weight (g) 1.20 E-03 PPM 865 Item Chip 1 % of Chip 100 Weight (g) 6.70 E-03 PPM 4830 Weight (g) 9.60 E-04 2.40 E-04 1.20 E-03 PPM 692 173 865 Aluminum Si Item Silver Filler Cyanate ester resin Die Attach Paste % of Die Attach Paste 80 20 Package Totals Weight (g) 1.39E+00 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary