v00.0609 C-14 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-14 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR TM 2. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN. 3. SPACER MATERIAL: NICKEL PLATED ALUMINUM 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. TOLERANCES ±0.010 [0.25] UNLESS OTHERWISE SPECIFIED 6. FIELD REPLACEABLE SMA CONNECTORS. TENSOLITE 5602-5CCSF OR EQUIVALENT. B - 18 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com