TEA1731TS GreenChip SMPS control IC Rev. 2.1 — 16 August 2012 Product data sheet 1. General description The TEA1731TS is a low cost Switched Mode Power Supply (SMPS) controller IC intended for flyback topologies. The TEA1731TS operates in peak current and frequency control mode. Frequency jitter has been implemented to reduce ElectroMagnetic Interference (EMI). Slope compensation is integrated for Continuous Conduction Mode (CCM) operation. The TEA1731TS IC features OverPower Protection (OPP). The controller accepts an overpower situation for a limited amount of time. One pin is reserved for protection purposes. OverTemperature Protection (OTP) can be implemented with a minimal number of external components. At low-power levels, the primary peak current is set to 25 % of the maximum peak current. The switching frequency is reduced to limit the switching losses. The combination of fixed frequency operation at high output power and frequency reduction at low output power provides high efficiency over the total load range. The TEA1731TS makes the design of low cost, highly efficient and reliable supplies for power requirements up to 75 W easier by requiring a minimum number of external components. 2. Features and benefits SMPS controller IC enabling low-cost applications Large input voltage range (12 V to 30 V) Integrated OverVoltage Protection (OVP) on VCC Very low supply current during start-up and restart (10 A typical) Low supply current during normal operation (0.58 mA typical without load) Internal overpower time-out Overpower or high/low line compensation (NXP patent: 81421271EP01) Fixed switching frequency with frequency jitter to reduce EMI Frequency reduction at medium power operation to maintain high efficiency Frequency reduction with fixed minimum peak current to maintain high efficiency at low output power levels Frequency increase at peak power operation Slope compensation for CCM operation Adjustable soft start Low and adjustable OverCurrent Protection (OCP) trip level TEA1731TS NXP Semiconductors GreenChip SMPS control IC Protection input (for external OTP and external OVP) IC overtemperature protection 3. Applications All applications that require an efficient and cost-effective power supply solution up to 75 W. 4. Ordering information Table 1. Ordering information Type number Package TEA1731TS Name Description Version TSOP6 plastic surface-mounted package; 6 leads SOT457 5. Block diagram UHVWDUW 9&&VWDUW 6 9 9&& P$ 9 ODWFKUHVHW ODWFK 5 VHW 26&,//$725 įPD[ &2817 293 72 IUHTXHQF\UHGXFWLRQ 9 GULYHU 9FWUO,SHDN 9FWUO,SHDN P9 PVHF GHOD\ RYHUORDG įPD[SURW '5,9(5 '59 4 GULYHU $ ,6(16( SRZHUGRZQ 7(03(5$785( 3527(&7,21 273 9 9FFVLQN *1' 9 9FFVLQN 5(67$57 &21752/ 4 9&&VWRS VHW VWRS įPD[ 6 5 UHVWDUW 4 %/$1. /(% VRIWVWDUW 2&3 29(532:(5 &203(16$7,21 9FWUO,SHDN VWRS ODWFK N SRZHUGRZQ SURWORZ &75/ SURWKLJK 9 SURWORZ 9 $ $ 3527(&7 273 SURWKLJK SURWORZ ODWFK 6 4 5 6/23( &203(16$7,21 9&&VWDUW 5 9 įPD[ įPD[SURW RYHUORDG 6 UHVWDUW VRIWVWDUW &2817 72 $1$/2* &21752/ 02'8/$7,21 ODWFKUHVHW 293 ',*,7$/&21752/ DDD Fig 1. TEA1731TS block diagram TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 2 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 6. Pinning information 6.1 Pinning 9&& '5,9(5 ,& *1' 3527(&7 ,6(16( &75/ DDD Fig 2. TEA1731TS pin configuration 6.2 Pin description Table 2. TEA1731TS Product data sheet Pin description Symbol Pin Description VCC 1 supply voltage GND 2 ground PROTECT 3 general-purpose protection input CTRL 4 control input ISENSE 5 current sense input DRIVER 6 gate driver output All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 3 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 7. Functional description 7.1 General control The TEA1731TS contains a controller for a flyback circuit. A typical configuration is shown in Figure 3. ' & ' 6 5 9&& *1' 5 3527(&7 ,& '5,9(5 ,6(16( & 7 5 5 = & &75/ 2 2 & & 5 ' 5 5 DDD Fig 3. TEA1731TS typical configuration 7.2 Start-up and UnderVoltage LockOut (UVLO) Initially, the capacitor on the VCC pin, C3, is charged from the high-voltage mains via resistor R1. As long as VCC is below Vstartup, the IC current consumption is low (10 A typical). When VCC reaches Vstartup, the IC first waits for the PROTECT pin to reach the Vdet(PROTECT)(L) voltage. When Vdet(PROTECT)(L) is reached, the IC charges the ISENSE pin to the Vstart(soft) level and then starts switching. In a typical application, the auxiliary winding of the transformer takes over the supply voltage. If a protection is triggered, the controller stops switching. Depending on the protection triggered, it either causes a restart or latches the converter to an off-state. A restart protection disables the switching of the IC. The supply voltage of the IC drops to the UVLO level. When the UVLO level is reached, the IC switches to Power-down mode, where it consumes a low supply current (10 A typical). The VCC capacitor is recharged via R1 until the VCC start-up level is reached. A delayed restart is performed to lower the input power during a fault condition. Depending on the cause of the restart protection, the restart sequence that discharges and recharges the VCC capacitor is performed once or repeated three times, before switching recommences (See Figure 4). When a latched protection is triggered, the TEA1731TS immediately enters Power-down mode. The VCC pin is clamped to a voltage just above the latch protection reset voltage (Vrst(latch) + 0.9 V). TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 4 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 9VWDUWXS 9WK89/2 9&& VRIWVWDUW VRIWVWDUW ,6(16( 9GHW+3527(&7 9GHW/3527(&7 3527(&7 PD[LPXPORDG RXWSXWORDG RXWSXWYROWDJH FKDUJLQJ9&& FDSDFLWRU Fig 4. VWDUWLQJ FRQYHUWHU QRUPDO UHVWDUW RSHUDWLRQ GHOD\ RYHUSRZHU WLPHRXW UHVWDUW DDD Start-up sequence, normal operation and restart sequence When the voltage on pin VCC drops below the Vth(UVLO) level during normal operation, the controller stops switching. The TEA1731TS waits for the rectified mains to charge the VCC pin using resistor R1. 7.3 Supply management All internal reference voltages are derived from a temperature compensated on-chip band gap circuit. Internal reference currents are derived from a trimmed and temperature compensated current reference circuit. 7.4 Overvoltage protection (pin VCC) An OverVoltage Protection (OVP) circuit is connected to the VCC pin. When the VCC exceeds Vth(OVP) (30 V typical) for four consecutive switching cycles, the IC triggers the latched protection. When VCC drops below Vth(OVP) before count = 4 is reached, the counter is reset to zero. If a lower over voltage protection level is needed, a Zener diode can be connected between pins VCC and PROTECT. 7.5 Protection input (pin PROTECT) Pin PROTECT is a general-purpose input pin, which can be used to switch off the converter (latched protection). The converter is stopped when the voltage on this pin is pulled above Vdet(H)(PROTECT) (0.8 V typical) or below Vdet(L)(PROTECT) (0.5 V typical) for four consecutive converter strokes. A current of 32 A (typical) flows out of the chip when the pin voltage is Vdet(L)(PROTECT). A current of 107 A (typical.) flows into the chip when the pin voltage is Vdet(H)(PROTECT). The PROTECT input can be used for creating an (additional) overvoltage detection and an external OverTemperature Protection (OTP) function. TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 5 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC A small capacitor can be connected to the pin if the protections on this pin are not used. An internal clamp of 4.1 V (typical) protects this pin from excessive voltages. 7.6 Duty cycle control (pin CTRL) Pin CTRL regulates the output power of the converter. This pin is connected to an internal voltage source of 5.4 V via an internal resistor (typical resistance: 7 k). The CTRL pin voltage sets the peak current which is measured using the ISENSE pin (see Section 7.9). At low and medium output power the switching frequency is reduced (see Section 7.11). The maximum duty cycle is limited to 80 % (typical). After eight consecutive converter strokes at maximum duty cycle the restart protection is activated. In a restart, the VCC capacitor is quickly discharged to the Vth(UVLO) level and recharged to the start-up level from the high-voltage mains, before switching recommences. This occurs when the mains input voltage is removed. 7.7 Slope compensation (pin CTRL) A slope compensation circuit is integrated for CCM. The slope compensation guarantees stable operation for duty cycles exceeding 50 %. 7.8 Overpower timer A temporary overload situation is allowed. If Vctrl(Ipeak) (see Figure 1) set by pin CTRL exceeds 400 mV, an internal timer is started. If the overload situation continues to exist for more than 60 ms (typical), an OverPower Protection (OPP) is triggered (see Figure 5). 2XWSXWORDG 2XWSXWYROWDJH P9 9,6(16( 7LPHRXWOHYHO ,QWHUQDOWLPHU KLJKORDG QRUPDO ORDG KLJKORDG SURWHFWLRQ DDD Fig 5. Overpower delay The TEA1731TS enters the overpower restart mode when the overload time-out is reached. In overpower restart mode, the VCC capacitor is discharged to UVLO level and then charged to the start-up level three times before the converter switches again. TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 6 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 7.9 Current mode control (pin ISENSE) Current mode control is used because it ensures a good line regulation. Pin ISENSE senses the primary current across external resistor R6 and compares it with an internal control voltage. The internal control voltage is proportional to the CTRL pin voltage (see Figure 6). DDD IUHTXHQF\ LQFUHDVH 9FWUO,SHDN 9 IUHTXHQF\ UHGXFWLRQ IUHTXHQF\ UHGXFWLRQ Fig 6. 9&75/9 Peak current control Leading edge blanking prevents false triggering due to capacitive discharge when switching on the external power switch (see Figure 7). tleb Vsense(max) VISENSE t 014aaa932 Fig 7. Leading edge blanking 7.10 Soft start-up (pin ISENSE) A soft start is made to prevent audible noise during start-up or restart. Before the converter starts, soft start capacitor C4 on the ISENSE pin is charged. When the converter starts switching, the primary peak current slowly increases when the soft start capacitor discharges through the soft start resistor (R5, see Figure 3). The soft start capacitor (C4) and resistor (R5) values chosen set the soft start time constant. TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 7 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 7.11 Peak power, high-power, medium power and low-power operation During high-power operation, with the converter running at a 65 kHz (typical) fixed frequency, the power is controlled by varying the peak current. A peak power mode is implemented to supply a short overload situation. In peak power mode, both frequency and peak current are increased. At reduced power levels, the converter enters the medium power mode where the peak current is reduced. The switching losses are reduced by lowering the switching frequency to 27.5 kHz (typical). When the power is further reduced to low power, a second frequency reduction is made. In low-power operation, the switching frequency of the converter is reduced while the peak current is set to 25 % of the maximum peak current (see Figure 6 and Figure 8). IRVF SHDNSRZHU N+] KLJK SRZHU N+] PHGLXP SRZHU ORZSRZHU N+] Fig 8. 9&75/9 DDD Frequency control 7.12 Overpower or high/low line compensation Overpower compensation is built in to compensate for high/low line. The maximum continuous output power and the maximum peak power are about constant over the full mains input voltage range (see Figure 9). The rectified mains input voltage is measured by sensing the slope of the primary current from pin ISENSE. The slope information is then used to adjust the primary current by subtracting an offset V(sense)offset from the internal control voltage Vctrl(Ipeak) cycle-by-cycle (NXP patent: 81421271EP01). TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 8 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC DDD Fig 9. Overpower compensation 7.13 Driver (pin DRIVER) The driver circuit to the gate of the power MOSFET has a current sourcing capability of typically 300 mA and a current sink capability of typically 750 mA. This enables a fast turn-on and turn-off of the power MOSFET for efficient operation. 7.14 OverTemperature Protection (OTP) Integrated overtemperature protection ensures that the IC stops switching if the junction temperature exceeds the thermal shutdown limit. OTP is a latched protection. It can be reset by removing the voltage on pin VCC. TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 9 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit supply voltage continuous 0.4 +30 V t < 100 ms - 35 V current limited 0.4 +5 V 0.4 +5.5 V Voltages VCC VPROTECT voltage on pin PROTECT VCTRL voltage on pin CTRL VISENSE voltage on pin ISENSE current limited 0.4 +5 V current on pin VCC < 10 % - 0.4 A II(PROTECT) input current on pin PROTECT 1 +1 mA ICTRL current on pin CTRL 3 0 mA IISENSE current on pin ISENSE 10 +1 mA IDRIVER current on pin DRIVER < 10 % 0.4 +1 A Ptot total power dissipation Tamb < 75 C - 0.29 W Tstg storage temperature 55 +150 C Tj junction temperature 40 +150 C - 4000 V - 750 V Currents IVCC General ESD VESD electrostatic discharge voltage class 1 human body model changed device model [1] [1] Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. 9. Thermal characteristics Table 4. TEA1731TS Product data sheet Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; single layer JEDEC test board 259 K/W Rth(j-c) thermal resistance from junction to case in free air; JEDEC test board 152 K/W All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 10 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 10. Characteristics Table 5. Characteristics Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply voltage management (pin VCC) Vstartup start-up voltage 19.3 21.5 23.8 V Vth(UVLO) undervoltage lockout threshold voltage 11.2 12.5 13.8 V Vth(ovp) overvoltage protection threshold voltage 29 30 31 V Ncy(ovp) number of overvoltage protection cycles - 4 - Vclamp(VCC) clamp voltage on pin VCC activated during latched protection; ICC = 100 A - Vrst(latch) + 0.9 - V activated during latched protection, ICC = 1 mA - - Vrst(latch) + 3.5 V 1 2.5 - mA ICC(restart) restart supply current Vhys hysteresis voltage Vstartup - Vth(UVLO) 6.6 9.1 11.6 V ICC(startup) start-up supply current VCC < Vstartup 5 10 15 A ICC(oper) operating supply current no-load on pin DRIVER; = 2 %; excluding optocurrent - 0.58 - mA no-load on pin DRIVER; = 25 %, excluding optocurrent - 0.62 - mA 3.5 4.5 5.5 V Vdet(L)(PROTECT) LOW-level detection voltage on pin PROTECT 0.47 0.50 0.53 V Vdet(H)(PROTECT) HIGH-level detection voltage on pin PROTECT 0.75 0.8 0.85 V Vrst(latch) latched reset voltage Protection input (pin PROTECT) IO(PROTECT) output current on pin PROTECT Vclamp(PROTECT) clamp voltage on pin PROTECT VPROTECT = Vlow(PROTECT) 34 32 30 A VPROTECT = Vhigh(PROTECT) 87 107 127 A 3.5 4.1 4.7 V 1 1.3 1.6 V 5 7 9 k 0.7 0.5 0.3 mA II(PROTECT) = 200 A [1] Peak current control (pin CTRL) VCTRL voltage on pin CTRL Rint(CTRL) internal resistance on pin CTRL IO(CTRL) output current on pin CTRL TEA1731TS Product data sheet for minimum flyback peak current VCTRL = 1.4 V All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 11 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC Table 5. Characteristics …continued Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Pulse width modulator fosc oscillator frequency peak power 75 82 89 kHz high power 60.5 65 69.5 kHz medium power 24 27.5 31 kHz fmod modulation frequency 210 280 350 Hz fmod modulation frequency high power variation 3 4 5 kHz max maximum duty cycle - 80 - % Ncy(dmax) number of switching cycles with maximum duty cycle - 8 - Vstart(red)f frequency reduction start voltage pin CTRL dropping to low power 1.1 1.4 1.7 V V(zero) zero duty cycle voltage pin CTRL 0.9 1.2 1.5 V - 60 - ms 0.47 0.50 0.53 V Overpower protection tto(opp) overpower protection time-out time Current sense and overpower compensation (pin ISENSE) V/t = 0 V/s Vsense(max) maximum sense voltage tPD(sense) sense propagation delay - 146 - ns Vth(sense)opp overpower protection sense threshold voltage 370 400 430 mV Voffset(opc) overpower compensation offset voltage Vsense = 400 mV; V/t = 115 mV/s 38 62 86 mV Vsense = 500 mV; V/t = 115 mV/s 60 95 130 mV VISENSE/t slope compensation voltage on pin ISENSE high-power mode - 20 - mV/s tleb leading edge blanking time 275 325 375 ns 63 55 47 A - Vsense(max) - V 12 - - k Soft start (pin ISENSE) Istart(soft) soft start current Vstart(soft) soft start voltage Rstart(soft) soft start resistance TEA1731TS Product data sheet VCTRL = 4 V; enable voltage All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 12 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC Table 5. Characteristics …continued Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver (pin DRIVER) Isource(DRIVER) source current on pin VDRIVER = 2 V DRIVER - 0.3 0.25 A Isink(DRIVER) sink current on pin DRIVER VDRIVER = 2 V 0.25 0.3 - A VDRIVER = 10 V 0.6 0.75 - A 9 10.5 12 V 130 140 150 C VO(DRIVER)max maximum output voltage on pin DRIVER Temperature protection Tpl(IC) [1] IC protection level temperature The clamp voltage on the PROTECT pin is lowered when the IC is in Power-down mode. (latched or restart protection) TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 13 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 11. Application information A power supply with the TEA1731TS is a flyback converter operating in continuous conduction mode. See Figure 10. Capacitor C3 buffers the IC supply voltage, which is powered via resistor R1 for start-up and via the auxiliary winding during normal operation. Sense resistor R6 converts the current through MOSFET S1 into a voltage on pin ISENSE. The value of resistor R6 defines the maximum primary peak current through MOSFET S1. Resistor R7 reduces the peak current to capacitor C3. Resistor R5 and capacitor C4 define the soft start time. Resistor R3 is added to prevent that soft start capacitor C4 is charged during normal operation due to negative voltage spikes across current sense resistor R6. Capacitor C2 is added to reduce noise on the CTRL pin. Resistor R4 is required to limit the current spikes to pin DRIVER because of parasitic inductance of current sense resistor R6. Resistor R4 also dampens possible oscillations of MOSFET S1. Adding a bead on the gate pin of MOSFET S1 can be required to prevent local oscillations of the MOSFET. D1 C1 68 μF D3 S1 R4 VCC GND R1 1 MΩ PROTECT 1 6 2 IC 3 5 4 DRIVER ISENSE CTRL 10 Ω R3 1 kΩ O1 C3 4.7 μF C2 1 nF R2 200 kΩ D2 C5 R5 22 kΩ C4 220 nF T1 Z1 O1 R6 0.25 Ω R7 10 Ω aaa-002335 Fig 10. TEA1731TS application diagram TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 14 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 12. Package outline Plastic surface-mounted package (TSOP6); 6 leads D SOT457 E B y A HE 6 5 X v M A 4 Q pin 1 index A A1 c 1 2 3 Lp bp e w M B detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.1 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION SOT457 REFERENCES IEC JEDEC JEITA SC-74 EUROPEAN PROJECTION ISSUE DATE 05-11-07 06-03-16 Fig 11. SOT457 (TSOP6) TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 15 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 13. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes TEA1731TS v.2.1 20120816 Product data sheet - TEA1731TS v.2 Modifications: • R4 value changed in Figure 10 “TEA1731TS application diagram” has been updated. TEA1731TS v.2 20120731 Product data sheet - TEA1731TS v.1 TEA1731TS v.1 20120215 Objective data sheet - - TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 16 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 14.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TEA1731TS Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 17 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP B.V. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TEA1731TS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2.1 — 16 August 2012 © NXP B.V. 2012. All rights reserved. 18 of 19 TEA1731TS NXP Semiconductors GreenChip SMPS control IC 16. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 General control . . . . . . . . . . . . . . . . . . . . . . . . . 4 Start-up and UnderVoltage LockOut (UVLO) . . 4 Supply management. . . . . . . . . . . . . . . . . . . . . 5 Overvoltage protection (pin VCC). . . . . . . . . . . 5 Protection input (pin PROTECT) . . . . . . . . . . . 5 Duty cycle control (pin CTRL). . . . . . . . . . . . . . 6 Slope compensation (pin CTRL). . . . . . . . . . . . 6 Overpower timer . . . . . . . . . . . . . . . . . . . . . . . . 6 Current mode control (pin ISENSE) . . . . . . . . . 7 Soft start-up (pin ISENSE) . . . . . . . . . . . . . . . . 7 Peak power, high-power, medium power and low-power operation . . . . . . . . . . . . . . . . . . . . . 8 Overpower or high/low line compensation . . . . 8 Driver (pin DRIVER) . . . . . . . . . . . . . . . . . . . . . 9 OverTemperature Protection (OTP) . . . . . . . . . 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal characteristics . . . . . . . . . . . . . . . . . 10 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application information. . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 16 August 2012 Document identifier: TEA1731TS