Product / Package Information Environmental Compliance Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOIC_N_EP (2.41 EP) 150 mil 8 100 Sn Yes Yes No Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black CAS# Weight (g) 60676-86-0 Proprietary 9003-35-4 1309-64-4 40039-93-8 1333-86-4 3.96 E-02 3.44 E-03 1.84 E-03 6.88 E-04 2.29 E-04 1.38 E-04 4.59 E-02 CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 2.88 E-02 6.73 E-04 3.73 E-05 7.16 E-06 2.95 E-02 Homogeneous Material Level Percentage (%) PPM 86.2 862000 7.5 75000 4 40000 1.5 15000 0.5 5000 0.3 3000 100 1000000 Percentage (%) 50.03 4.35 2.32 0.87 0.29 0.17 58.04 Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 100.00 1000000 Percentage (%) 36.46 0.85 0.05 0.01 37.36 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Percentage (%) 0.54 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Percentage (%) 2.27 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Percentage (%) 0.29 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Percentage (%) 0.82 Homogeneous Material Level Percentage (%) PPM 77.71 777100 3.11 31100 3.11 31100 3.11 31100 3 11 3.11 31100 3.11 31100 3.11 31100 3.11 31100 0.52 5200 100.00 1000000 Percentage (%) 0.52 0.02 0.02 0.02 0 02 0.02 0.02 0.02 0.02 0.004 0.68 PPM Percentage (%) 100.00 PPM Component Level PPM 500269 43527 23214 8705 2902 1741 580359 Leadframe Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus Component Level PPM 364560 8515 472 91 373637 Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 4.29 E-04 Component Level PPM 5426 External Leadframe Plating Substance Description Tin & its alloys Tin CAS# Weight (g) 7440-31-5 1.80 E-03 Component Level PPM 22717 Bond Wires Description Precious metals Substance Gold CAS# Weight (g) 7440-57-5 2.30 E-04 Component Level PPM 2909 Chip Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 6.48 E-04 Component Level PPM 8197 Die Attach Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# Weight (g) 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046 10 0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 4.15 E-04 1.66 E-05 1.66 E-05 1.66 E-05 1 66 E 1.66 E-05 05 1.66 E-05 1.66 E-05 1.66 E-05 2.78 E-06 5.34 E-04 Weight (g) 7.91 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level 5249 210 210 210 210 210 210 210 35 6755 1000000