MIC384 Micrel MIC384 Three-Zone Thermal Supervisor General Description Features The MIC384 is a versatile digital thermal supervisor capable of measuring temperature using its own internal sensor and two inexpensive external sensors or embedded silicon diodes such as those found in the Intel Pentium III* CPU. A 2-wire serial interface is provided to allow communication with either I2C** or SMBus* masters. The open-drain interrupt output pin can be used as either an over-temperature alarm or a thermostatic control signal. Interrupt mask and status bits are provided for reduced software overhead. Fault queues prevent nuisance tripping due to thermal or electrical noise. A programmable address pin permits two devices to share the bus. (Alternate base addresses available – contact Micrel.) Superior performance, low power and small size makes the MIC384 an excellent choice for multiple zone thermal management applications. • • • • • • • • • • Measures Local and Two Remote Temperatures 2-Wire SMBus-compatible Interface Programmable Thermostat Settings for All Three Zones Open-Drain Interrupt Output Pin Interrupt Mask and Status Bits Fault Queues to Prevent Nuisance Tripping Low Power Shutdown Mode Failsafe response to diode faults 2.7V to 5.5V Power Supply Range 8-Lead SOIC and MSOP Packages Applications • • • • • *SMBus and Pentium III are trademarks of Intel Corporation. **I2C is a trademark of Philips Electronics, N.V. Desktop, Server and Notebook Computers Power Supplies Test and Measurement Equipment Wireless Systems Networking/Datacom Hardware Ordering Information Part Number Base Address (*) Junction Temp. Range Package Availability Standard Pb-Free MIC384-0BM MIC384-0YM 100 100x -55°C to +125°C 8-Lead SOIC MIC384-1BM MIC384-1YM 100 101x -55°C to +125°C 8-Lead SOIC Contact Factory MIC384-2BM MIC384-2YM 100 110x -55°C to +125°C 8-Lead SOIC Contact Factory MIC384-3BM MIC384-3YM 100 111x -55°C to +125°C 8-Lead SOIC Contact Factory MIC384-0BMM MIC384-0YMM 100 100x -55°C to +125°C 8-Lead MSOP MIC384-1BMM MIC384-1YMM 100 101x -55°C to +125°C 8-Lead MSOP Contact Factory MIC384-2BMM MIC384-2YMM 100 110x -55°C to +125°C 8-Lead MSOP Contact Factory MIC384-3BMM MIC384-3YMM 100 111x -55°C to +125°C 8-Lead MSOP Contact Factory * The least-significant bit of the slave address is determined by the state of the A0 pin. Typical Application 3.3V 3 × 10k pull-ups FROM SERIAL BUS HOST 0.1µF MIC384 DATA VDD CLK T1 /INT GND T2 A0 2200pF 2200pF REMOTE DIODE REMOTE DIODE 3-Channel SMBus Temperature Measurement System Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com September 2005 1 MIC384 MIC384 Micrel Pin Configuration DATA 1 8 VDD CLK 2 7 A0 /INT 3 6 T1 GND 4 5 T2 Pin Description Pin Number Pin Name 1 DATA Digital I/O: Open-drain. Serial data input/output. 2 CLK Digital Input: The host provides the serial bit clock on this input. 3 /INT Digital Output: Open-drain. Interrupt or thermostat output. 4 GND Ground: Power and signal return for all IC functions. 5 T2 Analog Input: Connection to remote temperature sensor (diode junction) 6 T1 Analog Input: Connection to remote temperature sensor (diode junction) 7 A0 Digital Input: Slave address selection input. See Table 1. MIC384 Slave Address Settings. 8 VDD MIC384 Pin Function Analog Input: Power supply input to the IC. 2 September 2005 MIC384 Micrel Absolute Maximum Ratings (Note 1) Operating Ratings (Note 2) Power Supply Voltage, VDD .......................................... 6.0V Voltage on Any Pin ................................ –0.3V to VDD+0.3V Current Into Any Pin ................................................. ±10mA Power Dissipation, TA = +125°C ................................ 30mW Junction Temperature .............................................. +150°C Storage Temperature ................................ –65°C to +150°C ESD Ratings (Note 3) Human Body Model ...................................................TBD V Machine Model ..........................................................TBD V Soldering Vapor Phase (60 sec.) .............................. +220°C +5⁄–0°C Infrared (15 sec.) ...................................... +235°C +5⁄–0°C Power Supply Voltage, VDD ......................... +2.7V to +5.5V Ambient Temperature Range (TA) ............. -55°C to +125°C Package Thermal Resistance (θJA) SOP ................................................................. +152°C/W MSOP .............................................................. +206°C/W Electrical Characteristics 2.7V ≤ VDD ≤ 5.5; TA = +25°C, bold values indicate –55°C ≤ TA ≤ +125°C, Note 4; unless noted. Symbol Parameter Condition Supply Current /INT, open, A0 = VDD or GND, CLK = DATA = high, normal mode Min Typ Max Units 350 750 µA Power Supply IDD tPOR Power-On Reset Time; Note 7 VPOR Power-On Reset Voltage VHYST Power-On Reset Hysteresis Voltage /INT, open, A0 = VDD or GND, shutdown mode, CLK = 100kHz 3 /INT, open, A0 = VDD or GND, shutdown mode, CLK = DATA = high 1 VDD > VPOR all registers reset to default values, A/D conversions initiated 2.0 µA 10 µA 200 µs 2.7 V 250 mV Temperature-to-Digital Converter Characteristics Accuracy—Local Temperature Note 4, 9 3V ≤ VDD ≤ 3.6V Accuracy—Remote Temperature Note 5, 4, 9 tCONV0 tCONV1 3V ≤ VDD ≤ 3.6V, 0°C ≤ TA ≤ +85°C 0°C ≤ TA ≤ +100°C, /INT open, 3V ≤ VDD ≤ 3.6V ±1 ±2 °C –55°C ≤ TA ≤ +125°C, /INT open, ±2 ±3 °C 0°C ≤ TD ≤ +100°C, /INT open, 3V ≤ VDD ≤ 3.6V, 0°C ≤ TA ≤ +85°C ±1 ±3 °C ±2 ±5 °C 50 80 ms 100 160 ms 224 400 µA –55°C ≤ TD ≤ +125°C, /INT open, Conversion Time, local zone Note 7, 8 Conversion Time, remote zone Note 7, 8 Remote Temperature Inputs (T1, T2) IF Current to External Diode Note 7 high level, T1 or T2 forced to 1.5V 7.5 low level 14 µA Address Input (A0) VIL Low Input Voltage CIN Input Capacitance VIH High Input Voltage ILEAK Input Current September 2005 2.7V ≤ VDD ≤ 5.5V 2.7V ≤ VDD ≤ 5.5V 0.6 2.0 V 10 ±0.01 3 V pF ±1 µA MIC384 MIC384 Micrel Symbol Parameter Condition Min Typ Max Units 0.4 V 0.8 V 0.3VDD V Serial Data I/O Pin (DATA) VOL Low Output Voltage VIL Low Input Voltage CIN Input Capacitance Note 6 VIH High Input Voltage ILEAK Input current VIL Low Input Voltage IOL = 3mA IOL = 6mA 2.7V ≤ VDD ≤ 5.5V 2.7V ≤ VDD ≤ 5.5V 0.7VDD 10 ±0.01 V pF ±1 µA Serial Clock Input (CLK) VIH High Input Voltage ILEAK Input current VOL Low Output Voltage, Note 6 tINT Interrupt Propagation Delay, Note 7, 8 tnINT Interrupt Reset Propagation Delay, Note 7 CIN Input Capacitance 2.7V ≤ VDD ≤ 5.5V 2.7V ≤ VDD ≤ 5.5V 0.7VDD 0.3VDD 10 ±0.01 V V pF ±1 µA 0.4 V Status Output (/INT) T_SET0 Default T_SET0 Value T_HYST0 Default T_HYST0 Value T_SET1 Default T_SET1 Value T_HYST1 Default T_HYST1 Value T_SET2 Default T_SET2 Value T_HYST2 Default T_HYST2 Value Serial Interface Timing (Note 7) IOL = 3mA IOL = 6mA from TEMPx > T_SETx or TEMPx < T_HYSTx to /INT < VOL, FQ = 00, RPULLUP = 10kΩ from any register read to /INT > VOH, RPULLUP = 10kΩ tPOR after VDD > VPOR 0.8 V tCONV+1 µs 1 µs 81 81 81 °C tPOR after VDD > VPOR 76 76 76 °C tPOR after VDD > VPOR 97 97 97 °C tPOR after VDD > VPOR 92 92 92 °C tPOR after VDD > VPOR 97 97 97 °C tPOR after VDD > VPOR 92 92 92 °C t1 CLK (Clock) Period 2.5 t2 Data In Setup Time to CLK High 100 ns t3 Data Out Stable After CLK Low 0 ns t4 DATA Low Setup Time to CLK Low start condition 100 ns t5 DATA High Hold Time After CLK High stop condition 100 ns Note 1. Exceeding the absolute maximum rating may damage the device. Note 2. The device is not guaranteed to function outside its operating rating. Note 3. Devices are ESD sensitive. Handling precautions recommended. Human body model: 1.5k in series with 100pF. Machine model: 200pF, no series resistance. Note 4. Final test on outgoing product is performed at TA = TBD°C. Note 5. Note 6. Note 7. Note 8. Note 9. MIC384 µs TD is the temperature of the remote diode junction. Testing is performed using a single unit of one of the transistors listed in Table 6. Current into this pin will result in self-heating of the MIC384. Sink current should be minimized for best accuracy. Guaranteed by design over the operating temperature range. Not 100% production tested. tCONV = tCONV0 +(2 X tCONV1). tCONV0 is the conversion time for the local zone; tCONV1 is the conversion time for the remote zones.` Accuracy specification does not include quantization noise, which may be as great as ±1⁄ 2LSB (±0.5°C). 4 September 2005 MIC384 Micrel Timing Diagram t1 SCL t4 t5 t2 SDA Data In t3 SDA Data Out Serial Interface Timing September 2005 5 MIC384 MIC384 Micrel Functional Diagram VDD 8-Bit Sigma-Delta ADC T1 3:1 MUX T2 Bandgap Sensor and Reference Digital Filter and Control Logic 1-Bit DAC Result Registers A0 2-Wire Serial Bus Interface DATA Pointer Register CLK Temperature Setpoint Registers State Machine and Digital Comparator Temperature Hysteresis Registers Configuration Register Open-Drain Output /INT MIC384 GND Functional Description Power On" for more information. A0 determines the slave address as shown in Table 1: Pin Descriptions VDD: Power supply input. See electrical specifications. GND: Ground return for all MIC384 functions. P a r t N u m be r MI C 3 8 4 -0 CLK: Clock input to the MIC384 from the two-wire serial bus. The clock signal is provided by the host, and is shared by all devices on the bus. DATA: Serial data I/O pin that connects to the two-wire serial bus. DATA is bi-directional and has an open-drain output driver. An external pull-up resistor or current source somewhere in the system is necessary on this line. This line is shared by all devices on the bus. A0: This inputs sets the least significant bit of the MIC384’s 7-bit slave address. The six most-significant bits are fixed and are determined by the part number ordered. (See ordering information table above.) Each MIC384 will only respond to its own unique slave address, allowing up to eight MIC384’s to share a single bus. A match between the MIC384’s address and the address specified in the serial bit stream must be made to initiate communication. A0 should be tied directly to VDD or ground. See "Temperature Measurement and MIC384 MI C 3 8 4 -1 MI C 3 8 4 -2 MI C 3 8 4 -3 I n p u ts MI C 3 8 4 S l a v e A d d r e s s A0 B ina r y Hex 0 100 1000b 48h 1 1 0 0 1 0 01 b 49h 0 100 1010b 4Ah 1 1 0 0 1 0 11 b 4B h 0 100 1100b 4C h 1 1 0 0 1 1 01 b 4D h 0 100 1110b 4E h 1 1 0 0 1 1 11 b 4F h Table 1. MIC384 Slave Address Settings /INT: Temperature events are indicated to external circuitry via this output. Operation of the /INT output is controlled by the MODE and IM bits in the MIC384’s configuration register. See "Comparator and Interrupt Modes" below. This output is open-drain and may be wire-OR’ed with other open-drain signals. Most systems will require a pull-up resistor or current source on this pin. If the IM bit in the configuration register 6 September 2005 MIC384 Micrel is set, it prevents the /INT output from sinking current. In I2C and SMBus systems, the IM bit is therefore an interrupt mask bit. T1 and T2: The T1 and T2 pins connect to off-chip PN diode junctions, for monitoring the temperature at remote locations. The remote diodes may be embedded thermal sensing junctions in integrated circuits so equipped (such as Intel's Pentium III), or discrete 2N3906-type bipolar transistors with base and collector tied together. Temperature Measurement The temperature-to-digital converter is built around a switched current source and an eight-bit analog-to-digital converter. The temperature is calculated by measuring the forward voltage of a diode junction at two different bias current levels. An internal multiplexer directs the current source’s output to either the internal or one of the external diode junctions. The MIC384 uses two’s-complement data to represent temperatures. If the MSB of a temperature value is zero, the temperature is zero or positive. If the MSB is one, the temperature is negative. More detail on this is given in the "Temperature Data Format" section below. A “temperature event” results if the value in any of the temperature result registers (TEMPx) becomes greater than the value in the corresponding temperature setpoint register (T_SETx). Another temperature event occurs if and when the measured temperature subsequently falls below the temperature hysteresis setting in T_HYSTx. During normal operation the MIC384 continuously performs temperature-to-digital conversions, compares the results against the setpoint and hysteresis registers, and updates the state of /INT and the status bits accordingly. The remote zones are converted first, followed by the local zone (T1⇒ T2⇒LOCAL). The states of /INT and the status bits are updated after each measurement is taken. Diode Faults The MIC384 is designed to respond in a failsafe manner to hardware faults in the external sensing circuitry. If the connection to an external diode is lost or the sense line (T1 or T2) is shorted to VDD or ground, the temperature data reported by the A/D converter will be forced to its full-scale value (+127°C). This will cause a temperature event to occur if the setpoint register for the corresponding zone is set to any value less than 127°C (7Fh = 0111 1111b). An interrupt will be generated on /INT if so enabled. The temperature reported for the external zone will remain +127°C until the fault condition is cleared. This fault detection mechanism requires that the MIC384 complete the number of conversion cycles specified by Fault_Queue (see below). The part will therefore require one or more conversion cycles following power-on or a transition from shutdown to normal operation before reporting an external diode fault. Serial Port Operation The MIC384 uses standard SMBus Write_Byte and Read_Byte operations for communication with its host. The SMBus Write_Byte operation involves sending the device’s slave address (with the R/W bit low to signal a write operation), followed by a command byte and a data byte. The SMBus Read_Byte operation is similar, but is a composite write and read operation: the host first sends the device’s slave address followed by the command byte, as in a write operation. A new start bit must then be sent to the MIC384, followed by a repeat of the slave address with the R/W bit (LSB) set to the high (read) state. The data to be read from the part may then be clocked out. The command byte is eight bits wide. This byte carries the address of the MIC384 register to be operated upon, and is stored in the part’s pointer register. The pointer register is an internal write-only register. The command byte (pointer register) values corresponding to the various MIC384 registers are shown in Table 2. Command byte values other than those explicitly shown are reserved, and should not be used. Any command byte sent to the MIC384 will persist in the pointer register indefinitely until it is overwritten by another command byte. If the location latched in the pointer register from the last operation is known to be correct (i.e., points to the desired register), then the Receive_Byte procedure may be used. To perform a Receive_Byte, the host sends an address byte to select the MIC384, and then retrieves the data byte. Figures 1 through 3 show the formats for these procedures. C o m m a n d _ B y te T a r g e t R e g i s te r B ina r y Hex L a be l D e s c r i p ti o n 0000 0000b 00h T E MP 0 loc a l te mpe ra ture 0000 0001b 01h C O N F IG c onfigura tion re gis te r 0000 0010b 02h T _HY S T 0 loc a l te mpe ra ture hys te re s is 0000 0011b 03h T _S E T 0 loc a l te mpe ra ture s e tpoint 0001 0000b 10h T E MP 1 re mote z one 1 te mpe ra ture 0001 0010b 12h T _ H Y S T 1 re mote z one 1 te mpe ra ture hys te re s is 0001 0011b 13h T _S E T 1 0010 0000b 20h T E MP 2 re mote z one 1 te mpe ra ture s e tpoint re mote z one 2 te mpe ra ture 0010 0010b 22h T _HY S T 2 re mote z one 2 te mpe ra ture hys te re s is 0010 0011b 23h T _S E T 2 re mote z one 2 te mpe ra ture s e tpoint Table 2. MIC384 Register Addresses September 2005 7 MIC384 MIC384 CLK DATA Command Byte Data Byte to MIC384 START ACKNOWLEDGE NOT ACKNOWLEDGE STOP START 8 CLK DATA R/W = WRITE R/W = READ Master-to-slave transmission START R/W = READ NOT ACKNOWLEDGE Slave-to-master response ACKNOWLEDGE Figure 3. RECEIVE_BYTE Master-to-slave transmission START STOP NOT ACKNOWLEDGE Slave-to-master response ACKNOWLEDGE S 1 0 0 1 X X A0 1 A X X X X X X X X /A P Data Byte from MIC384 Figure 2. READ_BYTE Protocol ACKNOWLEDGE MIC384 Slave Address ACKNOWLEDGE S 1 0 0 1 X X A0 0 A 0 0 X X X X X X A S 1 0 0 1 X X A0 1 A X X X X X X X X /A P Data Read From MIC384 Slave-to-master response MIC384 Slave Address Figure 1. WRITE_BYTE Protocol Master-to-slave transmission ACKNOWLEDGE Command Byte R/W = WRITE S 1 0 0 1 X X A0 0 A 0 0 X X X X X X A X X X X X X X X /A P MIC384 Slave Address CLK DATA MIC384 Slave Address STOP MIC384 Micrel September 2005 September 2005 9 START R/W = DONT CARE Slave-to-master response MIC384 Slave Address Figure 4. A/D Converter Timing Command Byte = 01h = CONFIG STOP CONFIG Value* New Conversion� in Progress tCONV1 New Conversion First Begins Result� Ready NOT ACKNOWLEDGE START ACKNOWLEDGE ACKNOWLEDGE tn/INT R/W = READ ACKNOWLEDGE Master-to-slave transmission START Figure 5. Responding to Interrupts * Status bits in CONFIG are cleared to zero following this operation R/W = WRITE Slave-to-master response NOT ACKNOWLEDGE S 1 0 0 0 X X A0 0 A 0 0 0 0 0 0 0 1 A S 1 0 0 0 X X A0 1 A X X X X X X X X /A P MIC384 Slave Address Last Byte of Transaction X X X X X X X X /A P A/D Converter� in Standby ACKNOWLEDGE … Master-to-slave transmission ACKNOWLEDGE Conversion Interrupted By MIC384 Acknowledge Conversion� in Progress Temperature event occurs INT t/INT First Byte of Transaction S 1 0 0 1 X X X X A X X X X X X X X A MIC384 Slave Address STOP MIC384 Micrel MIC384 MIC384 Micrel Temperature Data Format The LSB of each register represents one degree Centigrade. The values are in a two’s complement format, wherein the most significant bit (D7) represents the sign: zero for positive temperatures and one for negative temperatures. Table 3 shows examples of the data format used by the MIC384 for temperatures. A/D Converter Timing Whenever the MIC384 is not in its low power shutdown mode, the internal A/D converter (ADC) attempts to make continuous conversions unless interrupted by a bus transaction accessing the MIC384. Upon powering up or coming out of shutdown mode, the ADC will begin acquiring temperature data starting with the first external zone, zone 1, then the second external zone, zone 2, and finally the internal zone, zone 0. Results for zone 1 will be valid after tCONV1, results for zone two will be ready after another tCONV1, and for the local zone tCONV0 later. Figure 4 shows this behavior. The conversion time is twice as long for external conversions as it is for internal conversions. This allws the use of a filter capacitor on T1 and/or T2 without a loss of accuracy due to the resulting longer settling times. Upon powering up, coming out of shutdown mode, or resuming operation following a serial bus transaction, the ADC will begin aquiring temperature data with the first external zone (zone 1), followed by the second external zone (zone 2), and then the internal zone (zone 0). If the ADC in interrupted by a serial bus transaction, it will restart the conversion that was interrupted and then continue in the normal sequence. This sequence will repeat indefinitely until the MIC384 is shut down, powered off, or is interrupted by a serial bus transaction as described above. Power On When power is initially applied, the MIC384’s internal registers are set to their default states. Also at this time, the level on the address input, A0, is read to establish the device’s slave address. The MIC384’s power-up default state can be summarized as follows: • Normal mode operation (i.e., part is not in shutdown) • /INT function is set to comparator mode • Fault queue depth = 1 (FQ=00) • Interrupts are enabled (IM = 0) • T_SET0 = 81°C; T_HYST0 = 76°C • T_SET1 = 97°C; T_HYST1 = 92°C • T_SET2 = 97°C; T_HYST2 = 92°C • Initialized to recognize overtemperature faults MIC384 Comparator and Interrupt Modes Depending on the setting of the MODE bit in the configuration register, the /INT output will behave either as an interrupt request signal or a thermostatic control signal. Thermostatic operation is known as comparator mode. The /INT output is asserted when the measured temperature, as reported in any of the TEMPx registers, exceeds the threshold programmed into the corresponding T_SETx register for the number of conversions specified by Fault_Queue (described below). In comparator mode, /INT will remain asserted and the status bit(s) will remain high unless and until the measured temperature falls below the value in the T_HYSTx register for Fault_Queue conversions. No action on the part of the host is required for operation in comparator mode. Note that entering shutdown mode will not affect the state of /INT when the device is in comparator mode. In interrupt mode, once a temperature event has caused a status bit to be set and the /INT output to be asserted, they will not be automatically de-asserted when the measured temperature falls below T_HYSTx. They can only be de-asserted by reading any of the MIC384’s internal registers or by putting the device into shutdown mode. If the most recent temperature event was an overtemperature condition, Sx will not be set again, and /INT cannot be reasserted, until the device has detected that TEMPx < T_HYSTx. Similarly, if the most recent temperature event was an undertemperature condition, Sx will not be set again, and /INT cannot be reasserted, until the device has detected that TEMPx > T_SETx. This keeps the internal logic of the MIC384 backward compatible with that of the LM75 and similar devices. In both modes, the MIC384 will be responsive to over-temperature events at power-up. See "Interrupt Generation", below. Shutdown Mode Setting the SHDN bit in the configuration register halts the otherwise continuous conversions by the A/D converter. The MIC384’s power consumption drops to 1µA typical in shutdown mode. All registers may be read from or written to while in shutdown mode. Serial bus activity will slightly increase the part’s power consumption. Entering shutdown mode will not affect the state of /INT when the device is in comparator mode (MODE = 0). It will retain its state until after the device exits shutdown mode and resumes A/D conversions. However, if the device is shut down while in interrupt mode, the /INT pin will be unconditionally de-asserted and the internal latches holding the interrupt status will be cleared. Therefore, no interrupts will be generated while the MIC384 is in 10 September 2005 MIC384 Micrel T e m p e r a tu r e B ina ry Hex +1 2 5 ° C 0 1 1 1 1 1 01 b 7Dh +1 0 0 ° C 0110 0100 b 64h +2 5 ° C 0001 1001b 19h +1 . 0 ° C 0000 000 1b 01h 0° C 0000 0000 b 00h – 1. 0° C 1111 1111b FFh – 25° C 1 1 1 0 0 1 11 b E 7h – 40° C 1 1 0 1 1 0 00 b D 8h – 55° C 1 1 0 0 1 0 01 b C 9h Table 3. Digital Temperature Format September 2005 11 MIC384 MIC384 Micrel shutdown mode, and the interrupt status will not be retained. Since entering shutdown mode stops A/D conversions, the MIC384 is incapable of detecting or reporting temperature events of any kind while in shutdown. Diode faults require one or more A/D conversion cycles to be recognized, and therefore will not be reported either while the device is in shutdown (see "Diode Faults" above). S2, in CONFIG and assert its /INT output. These conditions are listed in Table 5. When a temperature event occurs, the corresponding status bit will be set in CONFIG. This action cannot be masked. However, a temperature event will only generate an interrupt signal on /INT if it is specifically enabled by the interrupt mask bit (IM =0 in CONFIG). Following an interrupt, the host should read the contents of the configuration register to confirm that the MIC384 was the source of the interrupt. A read operation on any register will cause /INT to be de-asserted. This is shown in Figure 5. The status bits will only be cleared once CONFIG has been read. Since temperature-to-digital conversions continue while /INT is asserted, the measured temperature could change between the MIC384’s assertion of /INT and the host’s response. It is good practice for the interrupt service routine to read the value in TEMPx, to verify that the over-temperature or undertemperature condition still exists. In addition, more than one temperature event may have occurred simultaneously or in rapid succession between the assertion of /INT and servicing of the MIC384 by the host. The interrupt service routine should allow for this eventuality. Keep in mind that clearing the status bits and deasserting /INT is not sufficient to allow further interrupts to occur. TEMPx must become less than T_HYSTx if the last event was an over-temperature condition, or greater than T_SETx if the last event was an under-temperature condition, before /INT can be asserted again. Putting the device into shutdown mode will de-assert /INT and clear the status bits (S0, S1, and S2). This should not be done before completing the appropriate interrupt service routine(s). Polling The MIC384 may either be polled by the host, or request the host’s attention via the /INT pin. In the case of polled operation, the host periodically reads the contents of CONFIG to check the state of the status bits. The act of reading CONFIG clears the status bits. If more than one event that sets a given status bit occurs before the host polls the MIC384, only the fact that at least one such event has occurred will be apparent to the host. For polled systems, the interrupt mask bit should be set (IM = 1). This will disable interrupts from the MIC384 and prevent the /INT pin from sinking current. Fault_Queue Fault queues (programmable digital filters) are provided in the MIC384 to prevent false tripping due to thermal or electrical noise. The two bits in CONFIG[4:3] set the depth of Fault_Queue. Fault_Queue then determines the number of consecutive temperature events (TEMPx > T_SETx, or TEMPx < T_HYSTx) which must occur in order for the condition to be considered valid. There are separate fault queues for each zone. As an example, assume the part is in comparator mode, and CONFIG[4:3] is programmed with 10b. The measured temperature in zone one would have to exceed T_SET1 for four consecutive A/D conversions before /INT would be asserted or the S1 status bit set. Similarly, TEMP1 would then have to be less than T_HYST1 for four consecutive conversions before /INT would be reset. Like any filter, the fault queue function also has the effect of delaying the detection of temperature events. In this example, it would take 4 x tCONV to detect a temperature event. The depth of Fault_Queue vs. D[4:3] of the configuration register is shown in Table 4. C O N F IG [4: 3] F a u l t_ Q u e u e D e p th 00 1 c onve rs ion* 01 2 c onve rs ions 10 4 c onve rs ions 11 6 c onve rs ions * D e fa ult s e tting Table 4. Fault_Queue Depth Settings Interrupt Generation Assuming the MIC384 is in interrupt mode and interrupts are enabled, there are seven different conditions that will cause the MIC384 to set one of the status bits, S0, S1, or MIC384 12 September 2005 MIC384 Micrel E v ent C o n d i ti o n * MI C 3 8 4 r e s p o n s e ** high te mpe ra ture , loc a l T E MP 0 > T _ S E T 0 s e t S 0 in C O N F I G , a s s e rt /I N T high te mpe ra ture , re mote z one 1 T E MP 1 > T _ S E T 1 s e t S 1 in C O N F I G , a s s e rt /I N T high te mpe ra ture , re mote z one 2 T E MP 2 > T _ S E T 2 s e t S 2 in C O N F I G , a s s e rt /I N T low te mpe ra ture , loc a l T E MP 0 < T _ H Y S T 0 s e t S 0 in C O N F I G , a s s e rt /I N T low te mpe ra ture , re mote z one 1 T E MP 1 < T _ H Y S T 1 s e t S 1 in C O N F I G , a s s e rt /I N T low te mpe ra ture , re mote z one 2 T E MP 2 < T _ H Y S T 2 s e t S 2 in C O N F I G , a s s e rt /I N T diode fa ult T 1 or T 2 ope n or s horte d to V D D or G ND s e t S 1 a nd/or S 2 in C O N F I G , a s s e rt /I N T a nd /C R I T *** * C ondition mus t be true for F A U L T _ Q U E U E c onve rs ion to be re c ogniz e d ** A s s ume s inte rrupts e na ble d *** A s s ume s the T _ S E T 1 a nd/or C R I T 1 a re s e t to a ny va lue le s s the n +1 2 7 ° C = 7 fh = 0 1 1 1 1 1 1 1 b Table 5. MIC384 Temperature Events September 2005 13 MIC384 MIC384 Micrel Register Set and Programmer’s Model Internal Register Set Na me D e s c r i p ti o n C o m m a n d B y te O p e r a ti o n P o w e r -U p D e f a u l t T E MP 0 me a s ure d te mpe ra ture , loc a l z one 00h 8 -bit re a d only 0 0h ( 0° C ) (1) C O N F IG c onfigura tion re gis te r 01h 8 -bit re a d/write 0 0 h( 2 ) T _HY S T 0 hys te re s is s e tting, loc a l z o ne 02h 8 -bit re a d/write 4 C h ( +7 6 ° C ) T _S E T 0 te mpe ra ture s e tpoint, loc a l z o ne 03h 8 -bit re a d/write 5 1 h ( +8 1 ° C ) T E MP 1 me a s ure d te mpe ra ture , z o ne 1 10h 8 -bit re a d only 0 0h ( 0° C ) (1) T _HY S T 1 hys te re s is s e tting, z one 1 1 2h 8 -bit re a d/write 5 C h ( +9 2 ° C ) T _S E T 1 te mpe ra ture s e tpoint, z o ne 1 13h 8 -bit re a d/write 6 1 h ( +9 7 ° C ) T E MP 2 me a s ure d te mpe ra ture , z o ne 2 20h 8 -bit re a d only 0 0h ( 0° C ) (1) T _HY S T 2 hys te re s is s e tting, z one 2 22h 8 -bit re a d/write 5 C h ( +9 2 ° C ) T _S E T 2 te mpe ra ture s e tpoint, z o ne 2 23h 8 -bit re a d/write 6 1 h ( +9 7 ° C ) (1) TEMPx will contain measured temperature data after the completion of one conversion cycle. (2) After the first Fault_Queue conversions are complete, status bits will be set if TEMPx > T_SETx. Detailed Register Descriptions Configuration Register C O N F IG U R A T IO N R E G IS T E R (C O N F IG ) 8 -B i t R e a d /W r i te D [7] D [ 6] D [ 5] re a d only re a d only re a d only loc a l s ta tus (S 0) re mote s ta tus (S 1) /C R I T s ta tus (C R IT 1) B i ts D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] re a d/write re a d/write re a d/write re a d/write fa ult que ue de pth ( F Q [1 : 0 ]) inte rrupt ma s k ( I M) C MP /I N T mode ( MO D E ) S hutdown (S H DN ) F u n c ti o n O p e r a ti o n S0 loc a l inte rrupt s ta tus ( re a d only) 1 = e ve nt oc c ure d, 0 = no e ve nt S1 re mote inte rrupt s ta tus ( re a d only) 1 = e ve nt oc c ure d, 0 = no e ve nt re mote ove r-te mpe ra ture s ta tus ( re a d only) 1 = ove r-te mpe ra ture , 0 = no e ve nt C R IT 1 0 0 = 1 c onve rs ion, 0 1 = 2 c onve rs ions , 1 0 = 4 c onve rs ions , 1 1 = 6 c onve rs ions F Q [1 : 0 ] F a ult_ Q ue ue de pth IM inte rrupt ma s k 1 = dis a ble d, 0 = inte rrupts e na ble d MO D E c ompa ra tor/inte rrupt mode s e le c tion for /I N T pin 1 = inte rrupt mode , 0 = c ompa ra tor mode S HDN norma l/s hutdown ope ra ting mode s e le c tion 1 = s hutdown, 0 = norma l CONFIG Power-Up Value: 0000 0000b = 00h(*) • not in shutdown mode • comparator mode • Fault_Queue depth = 1 • interrupts enabled. • no temperature events pending CONFIG Command Byte Value: 0000 0001b = 01h * Following the first Fault_Queue conversions, one or more of the status bits may be set. MIC384 14 September 2005 MIC384 Micrel Local Temperature Result Register L O C A L T E MP E R A T U R E R E S U L T R E G I S T E R ( T E MP 0 ) 8 -B i t R e a d /W r i te D [7] D [ 6] D [ 5] MS B bit 6 bit 5 D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] bit 4 bit 3 bit 2 bit 1 LS B te mpe ra ture da ta from A D C * B i ts D [7 : 0 ] F u n c ti o n O p e r a ti o n me a s ure d te mpe ra ture da ta for the loc a l z o ne * TEMP0 Power-Up Value: 0000 0000b = 00h (0°C)† TEMP0 Command Byte Value: 0000 0000b = 00h re a d only * Each LSB represents one degree Centigrade. The values are in a two's complement format such that 0°C is reported as 0000 0000b. See "Temperature Data Format" for more details. † TEMP0 will contain measured temperature data after the completion of one conversion. Local Hysteresis Register L O C A L T E MP E R A T U R E H Y S T E R E S I S ( T _ H Y S T 0 ) 8 -B i t R e a d /W r i te D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] MS B bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 LS B loc a l te mpe ra ture hys te re s is s e tting B i ts D [7 : 0 ] F u n c ti o n O p e r a ti o n loc a l te mpe ra ture hys te re s is s e tting* T_HYST0 Power-Up Value: 0100 1100b = 4Ch (+76°C) T_HYST0 Command Byte Value: 0000 0010b = 02h re a d/write * Each LSB represents one degree Centigrade. The values are in a two's complement format such that 0°C is reported as 0000 0000b. See "Temperature Data Format" for more details. Local Temperature Setpoint Register L O C A L T E MP E R A T U R E S E T P O I N T ( T _ S E T 0 ) 8 -B i t R e a d /W r i te D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] MS B bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 LS B loc a l te mpe ra ture s e tpoint B i ts D [7 : 0 ] F u n c ti o n O p e r a ti o n loc a l te mpe ra ture s e tpoint* re a d/write T_SET0 Power-Up Value: 0101 0001b = 51h (+81°C) T_SET0 Command Byte Value: 0000 0011b = 03h September 2005 * Each LSB represents one degree Centigrade. The values are in a two's complement format such that 0°C is reported as 0000 0000b. See "Temperature Data Format" for more details. 15 MIC384 MIC384 Micrel Remote Zone 1 Temperature Result Register R E MO T E Z O N E 1 T E MP E R A T U R E R E S U L T ( T E MP 1 ) 8 -B i t R e a d O n l y D [7] D [ 6] MS B bit 6 D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] bit 5 bit 4 bit 3 bit 2 bit 1 LS B re mote z one 1 te mpe ra ture da ta from A D C * B i ts D [7 : 0 ] F u n c ti o n O p e r a ti o n me a s ure d te mpe ra ture da ta for re mote z o ne o ne * TEMP1 Power-Up Value: 0000 0000b = 00h (0°C)† TEMP1 Command Byte Value: 0001 0000b = 10h re a d only * Each LSB represents one degree Centigrade. The values are in a two's complement format such that 0°C is reported as 0000 0000b. See "Temperature Data Format" for more details. † TEMP1 will contain measured temperature data for the selected zone after the completion of one conversion. Remote Zone 1 Hysteresis Register R E MO T E Z O N E 1 T E MP E R A T U R E H Y S T E R E S I S R E G I S T E R ( T _ H Y S T 1 ) 8 -B i t R e a d /W r i te D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] MS B bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 LS B re mote z one 1 te mpe ra ture hys te re s is * B i ts D [7 : 0 ] F u n c ti o n O p e r a ti o n re mote z one one te mpe ra ture hys te re s is * T_HYST1 Power-Up Value: 0101 1100b = 5Ch (+92°C) T_HYST1 Command Byte Value: 0001 0010b = 12h re a d/write * Each LSB represents one degree Centigrade. The values are in a two's complement format such that 0°C is reported as 0000 0000b. See "Temperature Data Format" for more details. Remote Zone 1 Temperature Setpoint Register R E MO T E Z O N E 1 T E MP E R A T U R E S E T P O I N T ( T _ S E T 1 ) 8 -B i t R e a d /W r i te D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] MS B bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 LS B re mote z one 1 te mpe ra ture s e tpoint B i ts D [7 : 0 ] F u n c ti o n O p e r a ti o n re mote z one one te mpe ra ture s e tpoint* T_SET1 Power-Up Value: 0110 0001b = 61h (+97°C) T_SET1 Command Byte Value: 0001 0011b = 13h MIC384 re a d/write * Each LSB represents one degree Centigrade. The values are in a two's complement format such that 0°C is reported as 0000 0000b. See "Temperature Data Format" for more details. 16 September 2005 MIC384 Micrel Remote Zone 2 Temperature Result Register R E MO T E Z O N E 2 T E MP E R A T U R E R E S U L T S R E G I S T E R ( T E MP 2 ) 8 -B i t R e a d O n l y D [7] D [ 6] MS B bit 6 D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] bit 5 bit 4 bit 3 bit 2 bit 1 LS B re mote z one 2 te mpe ra ture da ta from A D C * B i ts F u n c ti o n D [7 : 0 ] me a s ure d te mpe ra ture da ta for re mote z o ne 2 * O p e r a ti o n TEMP2 Power-Up Value: 0000 0000b = 00h (0°C)† TEMP2 Command Byte Value: 0010 0000b = 20h re a d only * Each LSB represents one degree Centigrade. The values are in a two's complement format such that 0°C is reported as 0000 0000b. See "Temperature Data Format" for more details. † TEMP2 will contain measured temperature data for the selected zone after the completion of one conversion. Remote Zone 2 Hysteresis Register R E MO T E Z O N E 2 H Y S T E R E S I S R E G I S T E R ( T _ H Y S T 2 ) 8 -B i t R e a d /W r i te D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] MS B bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 LS B re mote z one 2 te mpe ra ture hys te re s is s e tting B i ts F u n c ti o n D [7 : 0 ] re mote z one 2 te mpe ra ture hys te re s is s e tting* O p e r a ti o n T_HYST2 Power-Up Value: 0101 1100b = 5Ch (+92°C) T_HYST2 Command Byte Value: 0010 0010b = 22h re a d/write * Each LSB represents one degree Centigrade. The values are in a two's complement format such that 0°C is reported as 0000 0000b. See "Temperature Data Format" for more details. Remote Zone 2 Setpoint Register R E MO T E Z O N E 2 T E MP E R A T U R E S E T P O I N T ( T _ S E T 2 ) 8 -B i t R e a d /W r i te D [7] D [ 6] D [ 5] D [ 4] D [ 3] D [ 2] D [ 1] D [ 0] MS B bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 LS B re mote z one 2 te mpe ra ture s e tpoint B i ts F u n c ti o n O p e r a ti o n D [7 : 0 ] re mote z one 2 te mpe ra ture s e tpoint* T_SET2 Power-Up Value: 0110 0001b = 61h (+97°C) T_SET2 Command Byte Value: 0010 0011b = 23h September 2005 re a d/write * Each LSB represents one degree Centigrade. The values are in a two's complement format such that 0°C is reported as 0000 0000b. See "Temperature Data Format" for more details. 17 MIC384 MIC384 Micrel Applications against calculation in the final application environment. This is especially true when dealing with systems for which some of the thermal data (e.g., PC board thermal conductivity and ambient temperature) may be poorly defined or unobtainable except by empirical means. Series resistance The operation of the MIC384 depends upon sensing the ΔVCB-E of a diode-connected PNP transistor (“diode”) at two different current levels. For remote temperature measurements, this is done using external diodes connected between T1, T2 and ground. Since this technique relies upon measuring the relatively small voltage difference resulting from two levels of current through the external diodes, any resistance in series with those diodes will cause an error in the temperature reading from the MIC384. A good rule of thumb is this: for each ohm in series with a zone's external transistor, there will be a 0.9°C error in the MIC384’s temperature measurement. It isn’t difficult to keep the series resistance well below an ohm (typically < 0.1Ω), so this will rarely be an issue. Filter capacitor selection It is sometimes desirable to use a filter capacitor between the T1 and/or T2 pins and the GND pin of the MIC384. The use of these capacitors is recommended in environments with a lot of high frequency noise (such as digital switching noise), or if long wires are used to attach to the remote diodes. The maximum recommended total capacitance from the T1 or T2 pin to GND is 2700pF. This typically suggests the use of 2200pF NP0 or C0G ceramic capacitors with a 10% tolerance. If a remote diode is to be at a distance of more than ≈ 6"—12" from the MIC384, using twisted pair wiring or shielded microphone cable for the connections to the diode can significantly help reduce noise pickup. If using a long run of shielded cable, remember to subtract the cable’s conductor-to-shield capacitance from the 2700pF maximum total capacitance. Remote Diode Selection Most small-signal PNP transistors with characteristics similar to the JEDEC 2N3906 will perform well as remote temperature sensors. Table 6 lists several examples of such parts that Micrel has tested for use with the MIC384. Other transistors equivalent to these should also work well. Minimizing Errors Self-Heating One concern when using a part with the temperature accuracy and resolution of the MIC384 is to avoid errors in measuring the local temperature induced by self-heating. Self-heating is caused by the power naturally dissipated inside the device due to operating supply current and I/O sink currents (VDD × IDD ) + (VOL × IOL). In order to understand what level of error this represents, and how to reduce that error, the dissipation in the MIC384 must be calculated and its effects reduced to a temperature offset. The worst-case operating condition for the MIC384 is when VDD = 5.5V, MSOP-08 package. The maximum power dissipated in the part is given in Equation 1 below. In most applications, the /INT output will be low for at most a few milliseconds before the host resets it back to the high state, making its duty cycle low enough that its contribution to self-heating of the MIC384 is negligible. Similarly, the DATA pin will in all likelihood have a duty cycle of substantially less than 25% in the low state. These considerations, combined with more typical device and application parameters, give a better system-level view of device self-heating in interruptmode. This is illustrated in Equation 2. If the part is to be used in comparator mode, calculations similar to those shown above (accounting for the expected value and duty cycle of IOL(INT)) will give a good estimate of the temperature error due to self-heating. In any application, the best test is to verify performance PD = [(IDD x VDD) + (IOL(DATA)) x VOL(DATA) + (IOL(/INT) x VOL(/INT))] PD = [(0.75mA x 5.5V) + (6mA x 0.8V) + (6mA x 0.8V)] PD = 13.73mW Rq(j-a) of MSOP - 08 package is 206°C/W Maximum ∆TJ relative to TA due to self heating is 13.73mW x 206°C/W = 2.83°C Equation 1. Worst-Case Self-Heating [(0.35mA IDD(typ) x 3.3V) + (25% x 1.5mA IOL(DATA)) x 0.3V) + (1% x 1.5mA IOL(/INT) x 0.3V)] = 1.27mW ∆TJ = (1.27mW x 206°C/W) ∆TJ = 0.262°C Equation 2. Real-World Self-heating Example Vendor Part Number Package Fairchild MMBT3906 SOT-23 On Semiconductor MMBT3906L SOT-23 Phillips Semiconductor PMBT3906 SOT-23 Samsung KST3906-TF SOT-23 Table 6. Transistors Suitable for Remote Temperature Sensing Use MIC384 18 September 2005 MIC384 Micrel Layout Considerations The following guidelines should be kept in mind when designing and laying out circuits using the MIC384: 1. Place the MIC384 as close to the remote diodes as possible, while taking care to avoid severe noise sources such as high frequency power transformers, CRTs, memory and data busses, and the like. 2. Since any conductance from the various voltages on the PC Board to the T1 or T2 line can induce serious errors, it is good practice to guard the remote diodes’ emitter traces with pairs of ground traces. These ground traces should be returned to the MIC384’s own ground pin. They should not be grounded at any other part of their run. However, it is highly desirable to use these guard traces to carry the diodes’ own ground return back to the ground pin of the MIC384, thereby providing a Kelvin connection for the base of the diodes. See Figure 6. 3. When using the MIC384 to sense the temperature of a processor or other device which has an integral thermal diode, e.g., Intel’s Pentium III, connect the emitter and base of the remote sensor to the MIC384 using the guard traces and Kelvin return shown in Figure 6. The collector of the remote diode is typically inaccessible to the user on these devices. To allow for this, the MIC384 has superb rejection of noise appearing from collector to GND, as long as the base to ground connection is relatively quiet. 4. Due to the small currents involved in the measurement of the remote diode’s ΔVBE, it is important to adequately clean the PC board after soldering to prevent current leakage. This is most likely to show up as an issue in situations where water-soluble soldering fluxes are used. 5. In general, wider traces for the ground and T1/T2 lines will help reduce susceptibility to radiated noise (wider traces are less inductive). Use trace widths and spacing of 10 mils wherever possible and provide a ground plane under the MIC384 and under the connections from the MIC384 to the remote diodes. This will help guard against stray noise pickup. 6. Always place a good quality 0.1µF power supply bypass capacitor directly adjacent to, or underneath, the MIC384. Surface-mount capacitors are preferable because of their low inductance. 7. When the MIC384 is being powered from particularly noisy power supplies, or from supplies which may have sudden high-amplitude spikes appearing on them, it can be helpful to add additional power supply filtering. This should be implemented as a 100Ω resistor in series with the part’s VDD pin, and an additional 4.7µF, 6.3V electrolytic capacitor from VDD to GND. See Figure 7. MIC384 1 DATA VDD 8 2 CLK A0 7 3 /INT T1 6 4 GND T2 5 GUARD/RETURN REMOTE DIODE (T1) GUARD/RETURN GUARD/RETURN REMOTE DIODE (T2) GUARD/RETURN Figure 6. Guard Traces/Kelvin Ground Returns September 2005 19 MIC384 MIC384 Micrel 100 3.3V 10k pull-ups FROM SERIAL BUS HOST 0.1µF 4.7µF MIC384 DATA VDD CLK / INT GND T1 T2 A0 2200pF 2200pF Remote Diode Remote Diode Figure 7. VDD Decoupling for Very Noisy Supplies MIC384 20 September 2005 MIC384 Micrel Package Information 8-Lead SOIC (M) 8-Lead MSOP (MM) September 2005 21 MIC384 MIC384 Micrel MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com This information furnished by Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Pr Micrel for any damages resulting from such use or sale. © 2005 Micrel Incorporated MIC384 22 September 2005