Data Sheet

TEA1708T
GreenChip X capacitor discharge IC
Rev. 1 — 25 September 2013
Product data sheet
1. General description
The TEA1708 is an automatic discharge IC for X capacitors with a low power consumption
(typically 1 mW at 230 V (AC).
A 500 V clamping circuit is integrated, protecting the IC during mains surges. In a typical
application with only two 200 k resistors, the maximum differential mode mains surge
voltage allowed exceeds 6 kV. A metal oxide varistor is not required to protect the IC.
The X capacitor discharge current is internally limited to 2.3 mA. The discharge delay
timer is set externally using a low voltage capacitor.
The very low power consumption in combination with a large discharge current enables
the use of a large value X capacitor to reduce EMI while retaining the low standby power.
2. Features and benefits







1 mW power consumption at 230 V (AC)
Integrated 500 V clamp; no metal oxide varistor required to protect the IC
Self supplied, no external bias required
Discharge current internally limited
Adjustable discharge delay
Very high differential surge: 6 kV with two 200 k resistors
Easier application design, resolving EMI issues while retaining the efficiency level
3. Applications
 All AC connected power supplies with X capacitors > 100 nF requiring a low load
standby power.
4. Ordering information
Table 1.
Ordering information
Type number
TEA1708T
Package
Name
Description
Version
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
5. Block diagram
+9
9
—$
9
705
9
705
9
+9
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Fig 1.
TEA1708T block diagram
6. Pinning information
6.1 Pinning
QF
705
+9
QF
,&
QF
QF
705
+9
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Fig 2.
TEA1708T pinning diagram
6.2 Pin description
Table 2.
TEA1708T
Product data sheet
Pin description
Symbol
Pin
Description
n.c.
1
not connected
TMR2
2
timer pin 2
n.c.
3
not connected
TMR1
4
timer pin 1
HV2
5
high-voltage mains connection 2
n.c.
6
not connected
n.c.
7
not connected
HV1
8
high-voltage mains connection 1
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
2 of 11
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
7. Functional description
The TEA1708 incorporates a timer and a zero-crossing mains voltage detector. If a
positive or negative voltage above the threshold zero-crossing mains voltage (20 V) is
applied between the high-voltage pins, the timer charges the external capacitor on the
TMR1 and TMR2 pins. If the voltage between the TMR1 and TMR2 pins reaches 1.2 V, a
discharge current is activated. If the voltage applied between the high-voltage pins, is
below the threshold zero-crossing mains voltage, the external capacitor is discharged and
the discharging stops. The discharge current is internally limited.
When an AC mains voltage is applied, the timer capacitor is charged between the mains
zero crossings and discharged during the mains zero crossings. When the AC mains is
disconnected and a high voltage remains on the X capacitor, the timer charges the
external capacitor above its discharge activation threshold voltage point (1.2 V), switching
on the internally limited discharge current of the external X capacitor.
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Fig 3.
Functional behavior
To protect the IC during mains surges, a high voltage clamping circuit is integrated. The
clamping circuit is activated for > 500 V positive and negative voltages. The high-voltage
pins HV1 and HV2 are fully symmetrical.
TEA1708T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
3 of 11
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VTMR1-TMR2
voltage between pin TMR1
and pin TMR2
0 A > Idch(tmr) < 10 A
0.4
+3.5
V
VHV1-HV2
voltage between pin HV1
and pin HV2
normal operation, so no
mains surge
410
+410
V
current on pin HV
on both HV pins;
t < 2 ms, during mains
surge
15
+15
mA
Ptot
total power dissipation
Tamb < 75 C
-
0.5
W
Tstg
storage temperature
55
+150
C
Tj
junction temperature
40
+150
C
-
1000
V
-
4000
V
-
750
V
Voltages
Currents
IHV
General
ESD
VESD
electrostatic discharge
voltage
class 1
human body model;
pins HV1 and HV2
[1]
human body model;
all other pins
charged device
model; all pins
[2]
[1]
Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[2]
Equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10  resistor.
9. Thermal characteristics
Table 4.
TEA1708T
Product data sheet
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction
to ambient
in free air; JEDEC test
board
160
K/W
Rth(j-c)
thermal resistance from junction
to case
in free air; JEDEC test
board
72
K/W
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
4 of 11
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
10. Characteristics
Table 5.
Characteristics
Tamb = 25 C; currents are positive when flowing into the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VTMR < 1.2 V
2.5
3.5
4.5
A
current limited;
VTMR > 1.2 V
1.8
2.3
2.8
mA
475
500
525
V
threshold
zero-crossing mains
voltage
19
21
23
V
to discharge the X
capacitor
1.1
1.2
1.3
V
1.20
0.95
0.70
A
High voltage (pins HV1 and HV2)
IHV
current on pin HV
Vclamp
clamp voltage
Vth(ch)
charge threshold voltage
on both HV pins;
VHV1 > 50 V;
VHV2 > 50 V
Timer (pins TMR1 and TMR2)
Vth(act)dch
discharge activation threshold
voltage
Idch(tmr)
timer discharge current
11. Application information
The TEA1708 is typically connected across the X capacitor. A metal oxide varistor is not
required to protect the IC because the device incorporates a high-voltage clamping circuit.
The IC is sufficiently protected for differential mode surge voltages up to 4 kV with only
two 200 k resistors (see Figure 4).
The discharge delay time is set externally using a low-voltage capacitor connected
between the TMR1 and TMR2 pins. Select a value between 10 nF and 22 nF for a mains
frequency of 50 Hz or 60 Hz. The minimum value is 10 nF which gives the smallest delay
time. Do not use values < 10 nF. They can lead to unwanted discharge of the X capacitor.
The delay time (td) for discharge can be calculated with Equation 1:
V th  act dch
t d = C tmr  ------------------------I dch  tmr 
(1)
1.2 V
If the low-voltage capacitor value is 22 nF the delay time is: 22 nF  ------------- = 26 ms .
1 A
The discharge current is activated when the voltage across the device exceeds the
threshold zero-crossing mains voltage. The current is limited to 2.3 mA. When the
current < the current limit, IHV is calculated with Equation 2:
V xcap  t  –  V th  ch  + 4 V 
I HV1 = I HV2  ------------------------------------------------------------ R1 + R2 
(2)
When the X capacitor value is 330 nF and R1 = R2 = 200 k, the capacitor is discharged
to a voltage < 60 V at a mains of 230 V (AC) in 300 ms.
TEA1708T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
5 of 11
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
/
5
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Fig 4.
TEA1708T application diagram
Use R1 = R2 = 200 k for X-capacitor values < 1.8 F to ensure that the capacitor is
discharged to a voltage < 60 V within 2 seconds. Lowering R1 + R2, for faster discharge
or when a higher value for the X capacitor is required is possible but it decreases the
surge protection level.
TEA1708T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
6 of 11
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 5.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Package outline SOT96-1 (SO8)
TEA1708T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
7 of 11
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
13. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1708T v.1
20130925
product data sheet
-
-
TEA1708T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
8 of 11
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
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profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
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contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA1708T
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
9 of 11
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TEA1708T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
10 of 11
TEA1708T
NXP Semiconductors
GreenChip X capacitor discharge IC
16. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 September 2013
Document identifier: TEA1708T